EP1745888A4 - Linearly advancing polishing method and apparatus - Google Patents
Linearly advancing polishing method and apparatusInfo
- Publication number
- EP1745888A4 EP1745888A4 EP05727544A EP05727544A EP1745888A4 EP 1745888 A4 EP1745888 A4 EP 1745888A4 EP 05727544 A EP05727544 A EP 05727544A EP 05727544 A EP05727544 A EP 05727544A EP 1745888 A4 EP1745888 A4 EP 1745888A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- work
- surface plates
- pair
- flat plane
- plane surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000005498 polishing Methods 0.000 title 1
- 238000007517 polishing process Methods 0.000 abstract 2
- 239000006061 abrasive grain Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
In a rotating type polishing process method, it is difficult to continuously send works to an apparatus and to effectively use a space in the periphery of the apparatus. A linearly advancing polishing process method and an apparatus having a novel concept for solving such problems are provided. Each of a pair of parallel flat plane surface plates adjacent to each other in parallel makes a linear movement in a direction opposite to each other. A work is pressed to both of the surface plates to apply a couple to the work for a rotary movement. The work is polished by abrasive grains by a relative movement of the rotation of the work and the pair of surface plates making the linear movements. The pair of parallel flat plane surface plates are opposed to another pair of parallel flat plane surface plates. Then the work can be sandwiched between the pairs and one plane or both planes can be polished. Instead of using the flat plane surface plates, a belt-type polisher that passes through on a work supporting table may be used.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004105655 | 2004-03-31 | ||
PCT/JP2005/005858 WO2005095053A1 (en) | 2004-03-31 | 2005-03-29 | Linearly advancing polishing method and apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1745888A1 EP1745888A1 (en) | 2007-01-24 |
EP1745888A4 true EP1745888A4 (en) | 2008-01-02 |
Family
ID=35063594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05727544A Withdrawn EP1745888A4 (en) | 2004-03-31 | 2005-03-29 | Linearly advancing polishing method and apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070202777A1 (en) |
EP (1) | EP1745888A4 (en) |
JP (1) | JP4472694B2 (en) |
KR (1) | KR100806949B1 (en) |
CN (1) | CN1929954B (en) |
TW (1) | TWI271261B (en) |
WO (1) | WO2005095053A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101249632B (en) * | 2008-03-20 | 2010-06-09 | 沈阳材佳机械设备有限公司 | Reciprocating straight-line and rotating motion grinding polishing device |
US8684791B2 (en) * | 2011-11-09 | 2014-04-01 | Alvin Gabriel Stern | Linear, automated apparatus and method for clean, high purity, simultaneous lapping and polishing of optics, semiconductors and optoelectronic materials |
US9950404B1 (en) | 2012-03-29 | 2018-04-24 | Alta Devices, Inc. | High throughput polishing system for workpieces |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0696495A1 (en) * | 1994-08-09 | 1996-02-14 | Ontrak Systems, Inc. | Linear polisher and method for semiconductor wafer planarization |
US6422929B1 (en) * | 2000-03-31 | 2002-07-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing pad for a linear polisher and method for forming |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2144354B (en) * | 1983-07-15 | 1987-03-11 | Helical Springs Limited | Grinding apparatus |
JPS6080559A (en) | 1983-10-12 | 1985-05-08 | Mitsubishi Metal Corp | Polishing device |
US5371973A (en) * | 1992-09-30 | 1994-12-13 | Western Atlas Inc. | Grinding machine utilizing multiple, parallel, abrasive belts simultaneously grinding surfaces on a workpiece |
US5575707A (en) * | 1994-10-11 | 1996-11-19 | Ontrak Systems, Inc. | Polishing pad cluster for polishing a semiconductor wafer |
JPH10249720A (en) | 1997-03-13 | 1998-09-22 | Kobe Steel Ltd | Polishing work method of flat workpiece |
US6241583B1 (en) * | 1999-02-04 | 2001-06-05 | Applied Materials, Inc. | Chemical mechanical polishing with a plurality of polishing sheets |
US6626744B1 (en) * | 1999-12-17 | 2003-09-30 | Applied Materials, Inc. | Planarization system with multiple polishing pads |
US20040137830A1 (en) * | 2002-12-24 | 2004-07-15 | Kazumasa Ohnishi | Lapping method and lapping machine |
-
2005
- 2005-03-29 JP JP2006511668A patent/JP4472694B2/en not_active Expired - Fee Related
- 2005-03-29 US US10/599,562 patent/US20070202777A1/en not_active Abandoned
- 2005-03-29 CN CN2005800079883A patent/CN1929954B/en not_active Expired - Fee Related
- 2005-03-29 KR KR1020067019958A patent/KR100806949B1/en active IP Right Grant
- 2005-03-29 WO PCT/JP2005/005858 patent/WO2005095053A1/en active Application Filing
- 2005-03-29 EP EP05727544A patent/EP1745888A4/en not_active Withdrawn
- 2005-03-30 TW TW094110147A patent/TWI271261B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0696495A1 (en) * | 1994-08-09 | 1996-02-14 | Ontrak Systems, Inc. | Linear polisher and method for semiconductor wafer planarization |
JPH0852652A (en) * | 1994-08-09 | 1996-02-27 | Ontrak Syst Inc | Method of smoothing linear polisher and semiconductor wafer |
US6422929B1 (en) * | 2000-03-31 | 2002-07-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing pad for a linear polisher and method for forming |
Non-Patent Citations (1)
Title |
---|
See also references of WO2005095053A1 * |
Also Published As
Publication number | Publication date |
---|---|
KR20060132954A (en) | 2006-12-22 |
CN1929954A (en) | 2007-03-14 |
JP4472694B2 (en) | 2010-06-02 |
WO2005095053A1 (en) | 2005-10-13 |
EP1745888A1 (en) | 2007-01-24 |
US20070202777A1 (en) | 2007-08-30 |
JPWO2005095053A1 (en) | 2008-07-31 |
TWI271261B (en) | 2007-01-21 |
TW200531781A (en) | 2005-10-01 |
KR100806949B1 (en) | 2008-02-22 |
CN1929954B (en) | 2011-12-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20061019 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE |
|
DAX | Request for extension of the european patent (deleted) | ||
RBV | Designated contracting states (corrected) |
Designated state(s): DE |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20071203 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: YASUI, HEIJI |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: YASUI, HEIJI |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20121002 |