EP1654125A2 - Method for producing rfid labels - Google Patents

Method for producing rfid labels

Info

Publication number
EP1654125A2
EP1654125A2 EP04763368A EP04763368A EP1654125A2 EP 1654125 A2 EP1654125 A2 EP 1654125A2 EP 04763368 A EP04763368 A EP 04763368A EP 04763368 A EP04763368 A EP 04763368A EP 1654125 A2 EP1654125 A2 EP 1654125A2
Authority
EP
European Patent Office
Prior art keywords
printing
ink
antenna
printed
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04763368A
Other languages
German (de)
French (fr)
Inventor
Thomas Walther
Edgar Weber
Bernd Lomp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Manroland AG
Original Assignee
MAN Roland Druckmaschinen AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MAN Roland Druckmaschinen AG filed Critical MAN Roland Druckmaschinen AG
Publication of EP1654125A2 publication Critical patent/EP1654125A2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/18—Surface bonding means and/or assembly means with handle or handgrip

Definitions

  • the invention relates to a method for producing RFID labels according to the preamble of claim 1.
  • the invention describes various methods for producing RFID (radio frequency identification) labels, also called smart labels.
  • RFID radio frequency identification
  • Smart Labels The basis of the intelligent labels (RFID, Smart Labels) is the so-called transponder technology. Their great advantage is the radio connection between the label and a reader. This can extremely speed up the mechanical data acquisition process because the readers no longer need an optical connection to the labels. With this e.g. the contents of a box or an entire pallet are recorded correctly.
  • Security codes can also be stored in the intelligent labels, which means that counterfeit packaging (e.g. pharmaceutical industry) or theft can be clearly identified.
  • a system for wireless identification consists of two components: The RFID labels (Smart Labels) that are attached to the goods and the read / write device that can be used to read or transfer data from the label.
  • the transponders store simple identification numbers up to complex data (e.g. expiry date, place and date of manufacture, sales prices etc.). Measurement data can also be saved.
  • the transponders usually consist of an integrated circuit, an antenna and other passive components.
  • active and passive transponders in the type of energy supply. If the label has an energy supply, e.g. in the form of a battery, one speaks of an active system.
  • a transponder is referred to as passive if it is supplied with energy via an external, magnetic or electrical field.
  • the transponder IC which is connected to the antenna of the mobile data carrier, takes over the sending / receiving of the data.
  • passive RFID transponders the entire intelligence and functionality is usually integrated in this circuit.
  • Some types also contain an on-chip resonance capacitor for the resonant circuit, so that no other external components are required apart from an antenna coil.
  • the capacitor or capacitors required can also be produced by printing technology.
  • Classic and known 5 methods for the production of the RFID labels are the lamination of a coated film on the label, the printing of the antenna by means of the screen printing method or the production by means of the ink jet method.
  • the object of the present invention is to put the required parts on the label in a simple manner and preferably also to protect the antenna against mechanical or chemical damage.
  • the antenna and / or the resonant circuit required for the function are applied in offset printing on the printed material or that at least some of the antenna and the resonant circuit required for the function are applied directly or indirectly with a high pressure plate is applied.
  • the chip which is mostly unhoused, has to be applied using an adhesive or soldering process. 5
  • the following sizes are of interest when designing the antenna: the inductance, the coil area, the ohmic resistance and the coupling capacitance between the turns. Deviations from the characteristic values can result in the contact between the reader / writer and the transponder not being established.
  • the resonance frequency must be achieved with a high quality, so that the highest demands are placed on the print quality.
  • a metal ink or conductive paste is transferred via a waterless offset plate or a wet offset plate via the rubber blanket to the printing material within a sheet-fed or web offset printing machine.
  • the printed lines form the antenna and possibly the entire resonant circuit, the chip is later soldered or glued on if necessary.
  • the printing material on which the components of the resonant circuit are printed can be a fibrous material (paper, fleece, etc.), a woven fabric made of natural or synthetic fibers or a plastic film.
  • a plan view of a label produced according to the invention is shown in drawing 1.
  • a striking substrate e.g. if this is paper or other fibrous material, it may be pretreated to avoid knocking away the conductive ink or paste.
  • the pretreatment can be a lacquer application or an application of a pre-printing ink via a flexographic printing unit or an offset printing unit. It is also possible that a film is laminated on the back of the label or that the label on the back has already been pretreated by the manufacturer. If the printing ink swings very strongly into the substrate, the inductance can change due to the third level.
  • the application by means of a printing plate for waterless printing is preferred over wet offset, since the dampening solution required in wet offset can corrode the ink and the precision of the print is also higher. Higher resolutions or finer line widths can also be printed in waterless offset.
  • a capacitor which is required for the production of an oscillating circuit, can be produced by printing two lines closely next to one another (drawing 2), which are reconnected at the ends of the shorter line.
  • the baseline can be printed first, then an insulating material is printed over it and then the opposing line is printed in a third printing unit (drawing 3).
  • the capacitor can also be integrated in the chip.
  • Other circuit elements can also be printed, for example resistances due to a tapering of the line thickness.
  • the capacitor lines could be printed opposite on both sides of the substrate. To do this, the printing material would have to be perforated beforehand so that a connection between two opposite lines is created when the ink is applied.
  • the antenna and the resonant circuit can be coated with a protective lacquer that protects the print against mechanical, chemical or oxidative damage.
  • a protective film can be put on.
  • an adhesive is pre-printed via a printing unit, the sheet printed with the adhesive is brought into contact with a transfer film which is coated with a metallic or other conductive substance. At the points with the applied adhesive, the conductive substance detaches from the carrier film and is transferred to the printing material. This then forms the resonant circuit, antenna or components thereof.
  • the third method is to apply the lines of the antenna / resonant circuit using the flexographic printing method.
  • flexographic printing plates can lead to crushing edges if the adjustment is not exactly adjusted. These crushing edges would lead to a change due to a change in capacitance, a change in the characteristics of the resonant circuit.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Printing Methods (AREA)
  • Making Paper Articles (AREA)

Abstract

The invention relates to a method for producing a RFID label (Radio Frequency Identification) according to a printing process. The aim of said invention is to apply necessary elements on the label in a simple manner and, preferably to protect an antenna against mechanical or chemical damages. The aim is attained by that at least one part of the antenna required for the operation thereof and of an oscillation circuit is applied to a print substrate by an offset machine, eventually, directly or indirectly by means of a high pressure printing plate.

Description

VERFAHREN ZUR HERSTELLUNG VON RFID ETIKETTEN METHOD FOR PRODUCING RFID LABELS
Die Erfindung betrifft ein Verfahren zur Herstellung von RFID Etiketten gemäß dem Oberbegriff von Anspruch 1.The invention relates to a method for producing RFID labels according to the preamble of claim 1.
[Stand der Technik] Die Erfindung beschreibt verschiedene Verfahren zur Herstellung von RFID (Radio Frequency Identification) Etiketten, auch Smart Labels genannt. Basis der intelligenten Etiketten (RFID, Smart Labels) ist die sogenannte Transponder Technologie. Ihr großer Vorteil liegt in der Funkverbindung zwischen dem Etikett und einem Lesegerät. Das kann den maschinellen Datenerfassungsvorgang extrem be- schleunigen, weil die Lesegeräte keine optische Verbindung zu den Etiketten mehr brauchen. Damit kann z.B. der Inhalt einer Schachtel oder einer ganzen Palette fehlerfrei erfasst werden. Auch können in den intelligenten Etiketten Sicherheitscodes hinterlegt werden, wodurch Packungsfälschungen (z.B. Pharmaindustrie) oder Diebstähle eindeutig identifiziert werden können.PRIOR ART The invention describes various methods for producing RFID (radio frequency identification) labels, also called smart labels. The basis of the intelligent labels (RFID, Smart Labels) is the so-called transponder technology. Their great advantage is the radio connection between the label and a reader. This can extremely speed up the mechanical data acquisition process because the readers no longer need an optical connection to the labels. With this e.g. the contents of a box or an entire pallet are recorded correctly. Security codes can also be stored in the intelligent labels, which means that counterfeit packaging (e.g. pharmaceutical industry) or theft can be clearly identified.
Ein System zur drahtlosen Identifikation besteht aus zwei Komponenten: Den RFID Etiketten (Smart Labels), die an den Waren angebracht werden und dem Schreib- / Lesegerät mit dem Daten aus dem Etikett ausgelesen oder übertragen werden können. Die Transponder speichern je nach Ausführung einfache Identifi- kationsnummer bis zu komplexen Daten (z.B. Verfallsdatum, Herstellungsort und - tag, Verkaufspreise etc.). Auch können Meßdaten gespeichert werden. Die Transponder bestehen meist aus einer integrierten Schaltung, einer Antenne und weiteren passiven Komponenten. In der Art der Energieversorgung wird zwischen aktive und passive Transponder unterschieden. Besitzt das Etikett eine Energie- Versorgung, z.B. in Form einer Batterie, so spricht man von einem aktiven System. Als passive wird ein Transponder bezeichnet, wenn er über ein externes, magnetisches oder elektrisches, Feld mit Energie versorgt wird.A system for wireless identification consists of two components: The RFID labels (Smart Labels) that are attached to the goods and the read / write device that can be used to read or transfer data from the label. Depending on the version, the transponders store simple identification numbers up to complex data (e.g. expiry date, place and date of manufacture, sales prices etc.). Measurement data can also be saved. The transponders usually consist of an integrated circuit, an antenna and other passive components. A distinction is made between active and passive transponders in the type of energy supply. If the label has an energy supply, e.g. in the form of a battery, one speaks of an active system. A transponder is referred to as passive if it is supplied with energy via an external, magnetic or electrical field.
Der Transponder IC, der mit der Antenne des mobilen Datenträgers verbunden ist, übernimmt das Senden / Empfangen der Daten. Bei passiven RFID Transpondern ist in der Regel die gesamte Intelligenz und Funktionalität in diesem Schaltkreis integriert. Einige Typen enthalten darüber hinaus einen On- Chip Resonanz Kondensator für den Schwingkreis, so dass außer einer Antennenspule keine weiteren externen Komponenten erforderlich sind. Der oder die benötigten Kondensatoren können auch durch drucktechnische Verfahren erzeugt werden. Klassische und bekannte 5 Verfahren für die Herstellung der RFID Etiketten sind die Lamination einer beschichten Folie auf das Etikett, das Drucken der Antenne mittels Siebdruckverfahren oder die Herstellung mittels Tintenstrahlverfahren.The transponder IC, which is connected to the antenna of the mobile data carrier, takes over the sending / receiving of the data. With passive RFID transponders, the entire intelligence and functionality is usually integrated in this circuit. Some types also contain an on-chip resonance capacitor for the resonant circuit, so that no other external components are required apart from an antenna coil. The capacitor or capacitors required can also be produced by printing technology. Classic and known 5 methods for the production of the RFID labels are the lamination of a coated film on the label, the printing of the antenna by means of the screen printing method or the production by means of the ink jet method.
[Aufgabe der Erfindung]0 Aufgabe der vorliegenden Erfindung ist es, die benötigten Teile in einfacher Weise auf das Etikett zu bringen und vorzugsweise die Antenne auch gegen mechanische oder chemische Beschädigungen zu schützen.The object of the present invention is to put the required parts on the label in a simple manner and preferably also to protect the antenna against mechanical or chemical damage.
Gelöst wird diese Aufgabe durch die kennzeichnenden Merkmale von Anspruch 15 bzw. 12. Weiterbildungen der Erfindung ergeben sich aus den jeweiligen Unteransprüchen.This object is achieved by the characterizing features of claims 15 and 12 respectively. Further developments of the invention result from the respective subclaims.
[Beispiele] Erfindungsgemäß ist vorgesehen, dass zumindestens Teile der für die Funktion benötigten Antenne und/oder des Schwingkreises im Offsetdruck auf dem Be- o druckstoff appliziert werden bzw. dass zumindest ein Teil der für die Funktion benötigten Antenne und des Schwingkreises direkt oder indirekt mit einer Hochdruckplatte appliziert wird. Nach dem Druck muss dann nur noch der Chip, der meist ungehaust ist, durch ein Klebe- oder Lötverfahren aufgebracht werden. 5 Beim Design der Antenne sind folgende Größen von Interesse: Die Induktivität, die Spulenfläche, der ohmsche Widerstand und die Koppelkapazität zwischen den Windungen. Abweichungen von den Kennwerten können dazu führen, dass der Kontakt zwischen dem Lese- / Schreibgerät und dem Transponder nicht zustande o kommt. Die Resonanzfrequenz muss mit einer hohen Güte erreicht werden, so dass höchste Ansprüche an die Druckqualität gestellt werden. Nach der Erfindung wird eine Metallfarbe oder leitfähige Paste über eine wasserlos Offsetplatte oder eine Nassoffsetplatte über das Gummituch auf den Bedruck- stoff innerhalb einer Bogen- oder Rollenoffsetdruckmaschine übertragen wird. Die gedruckten Linien bilden die Antenne und gegebenenfalls dem gesamten Schwingkreis, der Chip wird später erforderlichenfalls aufgelötet oder aufgeklebt. Der Bedruckstoff, auf den die Bestandteile des Schwingkreises aufgedruckt werden, kann ein Faserstoff (Papier, Vlies u.a.), ein Gewebe aus Natur- oder Kunstfasern oder eine Kunststofffolie sein. Eine Draufsicht auf ein nach der Erfindung hergestelltes Etikett zeigt die Zeichnung 1.[Examples] According to the invention it is provided that at least parts of the antenna and / or the resonant circuit required for the function are applied in offset printing on the printed material or that at least some of the antenna and the resonant circuit required for the function are applied directly or indirectly with a high pressure plate is applied. After printing, only the chip, which is mostly unhoused, has to be applied using an adhesive or soldering process. 5 The following sizes are of interest when designing the antenna: the inductance, the coil area, the ohmic resistance and the coupling capacitance between the turns. Deviations from the characteristic values can result in the contact between the reader / writer and the transponder not being established. The resonance frequency must be achieved with a high quality, so that the highest demands are placed on the print quality. According to the invention, a metal ink or conductive paste is transferred via a waterless offset plate or a wet offset plate via the rubber blanket to the printing material within a sheet-fed or web offset printing machine. The printed lines form the antenna and possibly the entire resonant circuit, the chip is later soldered or glued on if necessary. The printing material on which the components of the resonant circuit are printed can be a fibrous material (paper, fleece, etc.), a woven fabric made of natural or synthetic fibers or a plastic film. A plan view of a label produced according to the invention is shown in drawing 1.
Ein wegschlagender Bedruckstoff, z.B. wenn es sich bei diesem um ein Papier oder einen anderen Faserstoff handelt, kann vorbehandelt sein, um ein Wegschlagen der leitfähigen Druckfarbe oder Paste zu vermeiden. Die Vorbehandlung kann ein Lackauftrag oder eine Auftrag einer Vordruckfarbe über ein Flexodruck- werk oder ein Offsetdruckwerk sein. Möglich ist auch, dass auf den Etikettenrücken eine Folie kaschiert ist oder das Etikett auf den Rücken schon durch den Hersteller vorbehandelt ist. Bei einem sehr starken Wegschlagen der Druckfarbe in den Bedruckstoff kann es zu einer Veränderung der Induktivität durch die dritte Ebene kommen. Der Auftrag mittels Druckplatte für den Wasserlosen Druck wird gegenüber dem Nassoffset bevorzugt, da das im Nassoffset benötigte Feuchtmittel zu einem Korrodieren der Farbe führen kann und auch die Präzision des Druckes höher ist. Auch können im wasserlosen Offset höhere Auflösungen bzw. feinere Linienstärken gedruckt werden.A striking substrate, e.g. if this is paper or other fibrous material, it may be pretreated to avoid knocking away the conductive ink or paste. The pretreatment can be a lacquer application or an application of a pre-printing ink via a flexographic printing unit or an offset printing unit. It is also possible that a film is laminated on the back of the label or that the label on the back has already been pretreated by the manufacturer. If the printing ink swings very strongly into the substrate, the inductance can change due to the third level. The application by means of a printing plate for waterless printing is preferred over wet offset, since the dampening solution required in wet offset can corrode the ink and the precision of the print is also higher. Higher resolutions or finer line widths can also be printed in waterless offset.
Ein Kondensator, der für die Herstellung eines Schwingkreises benötigt wird, kann erzeugt werden, dass zwei Linien eng nebeneinander gedruckt werden (Zeichnung 2), die an den Enden der kürzeren Linie wieder miteinander verbunden sind. Alternativ kann zuerst die Grundlinie gedruckt werden, dann wird ein isolierender Stoff darüber gedruckt und in einem dritten Druckwerk dann die Gegenlinie aufgedruckt (Zeichnung 3). Der Kondensator kann auch in den Chip integriert sein. Andere Schaltkreiselemente können auch gedruckt werden, z.B. Widerstände durch eine Verjüngung der Linienstärke. Theoretisch könnte die Kondensatorlinien auf beide Seite des Bedruckstoff gegenüberliegend aufgedruckt werden. Dazu müsste der Bedruckstoff vorher perforiert werden, dass eine Verbindung zwischen zwei gegenüberliegenden Linien beim Farbauftrag entsteht.A capacitor, which is required for the production of an oscillating circuit, can be produced by printing two lines closely next to one another (drawing 2), which are reconnected at the ends of the shorter line. Alternatively, the baseline can be printed first, then an insulating material is printed over it and then the opposing line is printed in a third printing unit (drawing 3). The capacitor can also be integrated in the chip. Other circuit elements can also be printed, for example resistances due to a tapering of the line thickness. Theoretically, the capacitor lines could be printed opposite on both sides of the substrate. To do this, the printing material would have to be perforated beforehand so that a connection between two opposite lines is created when the ink is applied.
Abschließend kann die Antenne und der Schwingkreis mit einem Schutzlack überzogen werden, der den Aufdruck gegen mechanische, chemische oder oxidative Beschädigungen schützt. Alternativ dazu kann eine Schutzfolie aufgezogen werden.Finally, the antenna and the resonant circuit can be coated with a protective lacquer that protects the print against mechanical, chemical or oxidative damage. Alternatively, a protective film can be put on.
In einem zweiten Verfahren wird ein Klebstoff über ein Druckwerk vorgedruckt, der mit dem Klebstoff bedruckte Bogen mit einer Transferfolie in Kontakt gebracht, die mit einem metallischen oder anderen leitfähigen Stoff beschichtet ist. An den Stellen mit dem aufgebrachten Klebstoff löst sich der leitfähige Stoff von der Trägerfolie und wird auf den Bedruckstoff übertragen. Dieser bildet dann den Schwingkreis, Antenne oder Bestandteile davon.In a second method, an adhesive is pre-printed via a printing unit, the sheet printed with the adhesive is brought into contact with a transfer film which is coated with a metallic or other conductive substance. At the points with the applied adhesive, the conductive substance detaches from the carrier film and is transferred to the printing material. This then forms the resonant circuit, antenna or components thereof.
Als drittes Verfahren kommt ein Auftrag der Linien der Antenne / des Schwingkreises mittels des Flexodruckverfahrens in Betracht. Nachteilig ist jedoch, dass Flexodruckplatte bei nicht exakt justierter Beistellung zu Quetschrändern führen können. Diese Quetschränder würden zu einer Veränderung durch Kapazitätsänderung zu einer Veränderung der Charakteristik des Schwingkreises führen. The third method is to apply the lines of the antenna / resonant circuit using the flexographic printing method. However, it is disadvantageous that flexographic printing plates can lead to crushing edges if the adjustment is not exactly adjusted. These crushing edges would lead to a change due to a change in capacitance, a change in the characteristics of the resonant circuit.

Claims

[Patentansprüche][Claims]
Verfahren zur Herstellung eines RFID Etiketts unter Verwendung einesMethod for producing an RFID label using a
Druckverfahrens, gekennzeichnet dadurch, dass zumindest ein Teil der für die Funktion benötigten Antenne und desPrinting process, characterized in that at least part of the antenna required for the function and the
Schwingkreises durch Bogenoffsetdruck auf den Bedruckstoff appliziert wird.Resonant circuit is applied to the substrate by sheetfed offset printing.
Verfahren nach Anspruch 1 , gekennzeichnet dadurch, dass für den Druck der Leiterbahnen eine leitfähige Paste oder Druckfarbe verwendet wird.A method according to claim 1, characterized in that a conductive paste or printing ink is used for printing the conductor tracks.
Verfahren nach Anspruch 1 und 2, gekennzeichnet dadurch, dass es sich bei der leitfähigen Druckfarbe um eine Farbe mit metallischenA method according to claim 1 and 2, characterized in that the conductive printing ink is a color with metallic
Partikel handelt.Particle.
Verfahren nach Anspruch 1 und 2, gekennzeichnet dadurch, dass die ieitfähige Farbe Russ oder Kohlefasern beinhaltet.A method according to claims 1 and 2, characterized in that the conductive ink contains carbon black or carbon fibers.
Verfahren nach Anspruch 1 und 2, gekennzeichnet dadurch, dass der Farbauftrag in einer Bogenoffsetmaschine mit Greifertransport erfolgt.A method according to claim 1 and 2, characterized in that the ink is applied in a sheetfed offset machine with gripper transport.
Verfahren nach Anspruch 1 und 2, gekennzeichnet dadurch, dass der Farbauftrag innerhalb einer Rollenoffsetmaschine erfolgt. Verfahren nach Anspruch 5, gekennzeichnet dadurch, dass die Bestandteile der Antenne / des Schwingkreis auf die Bogenrückseite appliziert werden und der Bogen danach in einer Wendeeinrichtung umstülpt wird.A method according to claim 1 and 2, characterized in that the ink is applied within a web offset machine. A method according to claim 5, characterized in that the components of the antenna / the resonant circuit are applied to the back of the sheet and the sheet is then turned inside out in a turning device.
Verfahren nach Anspruch 1 , gekennzeichnet dadurch, dass nach dem Druck der Bestandteile der Antenne / des Schwingkreises ein Schutzlack oder eine Schutzfarbe aufgetragen wird.A method according to claim 1, characterized in that a protective lacquer or a protective color is applied after printing the components of the antenna / the resonant circuit.
Verfahren nach Anspruch 8, gekennzeichnet dadurch, dass der Schutzlack oder Schutzfarbe über ein Bogenoffsetdruckwerk übertragen wird.A method according to claim 8, characterized in that the protective lacquer or protective ink is transferred via a sheet-fed offset printing unit.
Verfahren nach Anspruch 8, gekennzeichnet dadurch, dass der Schutzlack über ein Flexodruckwerk mit Kammerrakel und Rasterwalze übertragen wird.A method according to claim 8, characterized in that the protective lacquer is transferred via a flexographic printing unit with chamber doctor blade and anilox roller.
Verfahren nach Anspruch 8, gekennzeichnet dadurch, dass der Schutzlack über ein Zweiwalzenflexodruckwerk appliziert wird.A method according to claim 8, characterized in that the protective lacquer is applied via a two-roller flexographic printing unit.
Verfahren zur Herstellung eines RFID Etiketts unter Verwendung einesMethod for producing an RFID label using a
Druckverfahrens, gekennzeichnet dadurch, dass zumindest ein Teil der für die Funktion benötigten Antenne und des Schwingkreises direkt oder indirekt mit einer Hochdruckplatte appliziert wird.Printing process, characterized in that at least part of the antenna and the oscillating circuit required for the function is applied directly or indirectly with a high-pressure plate.
Verfahren nach Anspruch 12, gekennzeichnet dadurch, dass die Hochdruckplatte auf einen Plattenzylinder einer Bogendruckmaschine oder Rollendruckmaschine aufgespannt wird und er Farbübertrag indirekt über einen Gummizylinder auf den Bedruckstoff erfolgt.A method according to claim 12, characterized in that the high-pressure plate is clamped onto a plate cylinder of a sheet-fed printing press or web-fed printing press and it transfers ink indirectly a rubber cylinder on the substrate.
Verfahren nach Anspruch 12, gekennzeichnet dadurch, dass die Hochdruckplatte in einer Bogen- oder Rollendruckmaschine im direkten Kontakt mit dem Bedruckstoff steht.A method according to claim 12, characterized in that the high-pressure plate is in direct contact with the printing material in a sheet-fed or web printing machine.
Verfahren nach Anspruch 13 oder 14, gekennzeichnet dadurch, dass die Hochdruckplatte in einer Druckmaschine eingesetzt wird, die auchA method according to claim 13 or 14, characterized in that the high-pressure plate is used in a printing press, which also
Offsetdruckwerke beinhaltet.Includes offset printing units.
Verfahren nach Anspruch 1 oder 12, gekennzeichnet dadurch, dass es sich bei dem Bedruckstoff um einen Faserstoff handelt.A method according to claim 1 or 12, characterized in that the printing material is a fibrous material.
Verfahren nach Anspruch 1 oder 12, gekennzeichnet dadurch, dass es sich bei dem Bedruckstoff um eine Folie handelt.A method according to claim 1 or 12, characterized in that the printing material is a film.
Verfahren nach Anspruch 1 oder 12, gekennzeichnet dadurch, dass es sich beim dem Bedruckstoff um eine Gewebe aus Natur- und / oderA method according to claim 1 or 12, characterized in that the printing material is a fabric made of natural and / or
Kunstfasern handelt.Synthetic fibers.
Verfahren nach Anspruch 1 oder 12, gekennzeichnet dadurch, dass bei wegschlagenden Bedruckstoffen ein Vorstrich, Vorlackierung oder ein Vordruck mit einem Lack oder einer Vordruckfarbe erfolgt, der die Wegschla- geeigenschaften verringert.A method according to claim 1 or 12, characterized in that a pre-coating, pre-coating or a preprint with a lacquer or a pre-printing ink takes place in the case of impacting printing materials, which reduces the knock-off properties.
Verfahren nach Anspruch 19, gekennzeichnet dadurch, dass der Vorstrich, die Vorlackierung oder der Vordruck mittels eines direkten Hochdruckwerkes erfolgt. Verfahren nach Anspruch 19, gekennzeichnet dadurch, dass der Vorstrich, die Vorlackierung oder die Vordruckfarbe mittels einerA method according to claim 19, characterized in that that the pre-coating, pre-painting or pre-printing is done by a direct high-pressure unit. A method according to claim 19, characterized in that the primer, the pre-coating or the pre-printing ink by means of a
Hochdruckplatte indirekt über einen Gummizylinder appliziert wird.High pressure plate is applied indirectly via a rubber cylinder.
Verfahren nach Anspruch 19, gekennzeichnet dadurch, dass der Vorstrich, die Vorlackierung oder die Vordruckfarbe über ein Offsetdruckwerk appliziert wird.A method according to claim 19, characterized in that the primer, the pre-coating or the pre-printing ink is applied via an offset printing unit.
Verfahren nach Anspruch 1 oder 12, gekennzeichnet dadurch, dass zur Herstellung eines kapazitiven Elements (Kondensator) zwei Linien streckenweise nebeneinander gedruckt werden, die an den Enden der kürzeren Linien miteinander verbunden sind.A method according to claim 1 or 12, characterized in that in order to produce a capacitive element (capacitor) two lines are printed side by side in sections, which are connected to one another at the ends of the shorter lines.
Verfahren nach Anspruch 1 oder 12, gekennzeichnet dadurch, dass zur Herstellung eines kapazitiven Elements (Kondensator) erst die Grundlinie gedruckt wird, dann partiell in einem Verfahren nach Anspruch 1 oder 12 ein Isolator aufgedruckt wird und in einem dritten Arbeitsschritt dann die Gegenlinie in einem Verfahren nach Anspruch 1 oder 12 aufgedruckt wird. A method according to claim 1 or 12, characterized in that to produce a capacitive element (capacitor), first the base line is printed, then an insulator is partially printed in a method according to claim 1 or 12 and then in a third step the opposite line in a method is printed according to claim 1 or 12.
EP04763368A 2003-08-01 2004-07-21 Method for producing rfid labels Withdrawn EP1654125A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10335230A DE10335230A1 (en) 2003-08-01 2003-08-01 Process for the production of RFID labels
PCT/EP2004/008126 WO2005013189A2 (en) 2003-08-01 2004-07-21 Method for producing rfid labels

Publications (1)

Publication Number Publication Date
EP1654125A2 true EP1654125A2 (en) 2006-05-10

Family

ID=34072017

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04763368A Withdrawn EP1654125A2 (en) 2003-08-01 2004-07-21 Method for producing rfid labels

Country Status (5)

Country Link
US (1) US20070039694A1 (en)
EP (1) EP1654125A2 (en)
JP (2) JP2006528803A (en)
DE (1) DE10335230A1 (en)
WO (1) WO2005013189A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT1699637E (en) 2003-08-01 2015-02-25 Manroland Web Systems Gmbh Method for further printing with electrical conductivity
DE102004007458A1 (en) * 2004-02-13 2005-09-01 Man Roland Druckmaschinen Ag Process for the production of RFID labels
DE102005026127B4 (en) * 2005-06-07 2007-02-08 Koenig & Bauer Ag Printing machine and a method for producing a printed product
DE102005041221A1 (en) * 2005-08-31 2007-03-01 Krones Ag Label manufacturing device for making labels used in containers e.g. bottles, has radio frequency identification (RFID) manufacturing unit for attaching RFID transponder to label during production of label
DE102007027473A1 (en) 2007-06-14 2008-12-18 Manroland Ag Technically produced functional components
FR2918485B1 (en) * 2007-07-04 2010-09-10 Arjowiggins Licensing Sas FIBROUS INSERT MEDIUM WITH ANTENNA
DE102008039660A1 (en) * 2007-09-06 2009-03-12 Heidelberger Druckmaschinen Ag Substrate processing machine and process in a substrate processing machine
DE102008001922A1 (en) 2008-05-21 2009-11-26 Manroland Ag Integration of an RFID transponder in packaging

Family Cites Families (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2756485A (en) * 1950-08-28 1956-07-31 Abramson Moe Process of assembling electrical circuits
NL254880A (en) * 1959-08-17
GB1095814A (en) * 1965-05-26 1967-12-20 Formica Int Improvements in colour printing
CH548866A (en) * 1971-11-17 1974-05-15 Battelle Memorial Institute PRINTING DEVICE WITH LIQUID INK, CONDUCTING ELECTRICITY.
US3913219A (en) * 1974-05-24 1975-10-21 Lichtblau G J Planar circuit fabrication process
US4783646A (en) * 1986-03-07 1988-11-08 Kabushiki Kaisha Toshiba Stolen article detection tag sheet, and method for manufacturing the same
DE3623405A1 (en) * 1986-07-11 1988-02-04 Miller Johannisberg Druckmasch BOW GRIPPER FOR BOW-PROCESSING MACHINES
DE3632769A1 (en) * 1986-09-26 1988-04-07 Roland Man Druckmasch CLAMP GRIPPER FOR ARC ROTATION PRINTING MACHINES
FR2610571B1 (en) * 1987-02-10 1989-07-13 Sarda Jean Claude OFFSET PRINTING PRESS FOR PRINTING SIMULTANEOUSLY OR SUCCESSIVELY IN SHEET SHEET OR CONTINUOUS TAPE
JPS63276191A (en) * 1987-05-07 1988-11-14 Ricoh Co Ltd Manufacture of conductive circuit pattern
US4933123A (en) * 1987-06-29 1990-06-12 Material Engineering Technology Laboratory, Incorporated Surface treatment method
JP2648315B2 (en) * 1987-12-25 1997-08-27 村上スクリーン株式会社 Intaglio for forming printed circuit pattern, method of manufacturing the same, and method of forming printed circuit pattern
KR0153260B1 (en) * 1989-06-16 1998-11-02 기다지마 요시도시 Method of printing fine patterns
DE69121449T2 (en) * 1990-04-12 1997-02-27 Matsushita Electric Ind Co Ltd Conductive ink composition and method of making a thick layer pattern
US5362513A (en) * 1990-05-10 1994-11-08 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a pattern of conductive fine-line films and setting ink used for the same
IT1252949B (en) * 1991-09-30 1995-07-06 Gisulfo Baccini PROCEDURE FOR THE PROCESSING OF GREEN-TAPE TYPE CIRCUITS AND DEVICE ADOPTING THIS PROCEDURE
US5352634A (en) * 1992-03-23 1994-10-04 Brody Thomas P Process for fabricating an active matrix circuit
NL9200835A (en) * 1992-05-11 1993-12-01 Nedap Nv FLEXIBLE COIL CONSTRUCTION IN IDENTIFICATION CARD.
JPH05327185A (en) * 1992-05-22 1993-12-10 Tanaka Kikinzoku Kogyo Kk Manufacture of flexible circuit board
ZA941671B (en) * 1993-03-11 1994-10-12 Csir Attaching an electronic circuit to a substrate.
JP3074105B2 (en) * 1993-05-13 2000-08-07 株式会社桜井グラフィックシステムズ Sheet reversing mechanism of sheet-fed printing press
JPH06320714A (en) * 1993-05-14 1994-11-22 Toshiba Mach Co Ltd Switchover type printer for continuous operation and operation thereof
DE4424591C1 (en) * 1994-07-13 1995-12-14 Roland Man Druckmasch Device for feeding printing ink from an ink dispenser into an ink fountain
US5695908A (en) * 1994-12-27 1997-12-09 Mitsubishi Paper Mills, Limited Process for preparing printing plate
US5656081A (en) * 1995-06-07 1997-08-12 Img Group Limited Press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid
US5817207A (en) * 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
US5867102C1 (en) * 1997-02-27 2002-09-10 Wallace Comp Srvices Inc Electronic article surveillance label assembly and method of manufacture
US5963134A (en) * 1997-07-24 1999-10-05 Checkpoint Systems, Inc. Inventory system using articles with RFID tags
US5973598A (en) * 1997-09-11 1999-10-26 Precision Dynamics Corporation Radio frequency identification tag on flexible substrate
DE69722403T2 (en) * 1997-09-23 2004-01-15 St Microelectronics Srl Banknote with an integrated circuit
US6037879A (en) * 1997-10-02 2000-03-14 Micron Technology, Inc. Wireless identification device, RFID device, and method of manufacturing wireless identification device
WO2000016286A1 (en) * 1998-09-11 2000-03-23 Motorola Inc. Radio frequency identification tag apparatus and related method
AU1116900A (en) * 1998-10-15 2000-05-01 Identity Group, Inc. Printer and method of using same to print on thermoplastic medium
US6366260B1 (en) * 1998-11-02 2002-04-02 Intermec Ip Corp. RFID tag employing hollowed monopole antenna
US6262692B1 (en) * 1999-01-13 2001-07-17 Brady Worldwide, Inc. Laminate RFID label and method of manufacture
EP1035503B2 (en) * 1999-01-23 2010-03-03 X-ident technology GmbH RFID-Transponder with printable surface
JP2000293652A (en) * 1999-04-06 2000-10-20 Tokyo Film Kako Kk Antenna circuit for ic card
FI105118B (en) * 1999-05-12 2000-06-15 Valmet Corp Method for manufacture of paper or cardboard web and a paper or cardboard making machine
JP2001034732A (en) * 1999-07-16 2001-02-09 Toppan Forms Co Ltd Formation of antenna for non-contact ic module
US6147662A (en) * 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
US6259369B1 (en) * 1999-09-30 2001-07-10 Moore North America, Inc. Low cost long distance RFID reading
DE29918488U1 (en) * 1999-10-20 1999-12-30 Roland Man Druckmasch Sheet-fed rotary printing machine with printing units for multi-color printing and at least one coating unit
DE19955214B4 (en) * 1999-11-17 2006-05-11 Stork Gmbh Method for producing conductor structures
US6259408B1 (en) * 1999-11-19 2001-07-10 Intermec Ip Corp. RFID transponders with paste antennas and flip-chip attachment
US6641860B1 (en) * 2000-01-03 2003-11-04 T-Ink, L.L.C. Method of manufacturing printed circuit boards
US6343550B1 (en) * 2000-01-24 2002-02-05 Douglas W. Feesler Flexographic printing apparatus and method
US6281795B1 (en) * 2000-02-08 2001-08-28 Moore North America, Inc. RFID or EAS label mount with double sided tape
JP2001229357A (en) * 2000-02-18 2001-08-24 Dainippon Printing Co Ltd Non-contact ic form
US6593853B1 (en) * 2000-02-18 2003-07-15 Brady Worldwide, Inc. RFID label printing system
US6603400B1 (en) * 2000-05-04 2003-08-05 Telxon Corporation Paper capacitor
DE10057644A1 (en) * 2000-11-16 2002-05-23 Koenig & Bauer Ag Printing press for preparing labels and wrapping has the colour prints fixed by applying a binder followed by applying a coating lacquer to the printed areas
JP2002197921A (en) * 2000-12-26 2002-07-12 Toppan Forms Co Ltd Electron beam curing conductive paste, conductor circuit using it, and ic media having antenna part formed with electron beam curing conductive paste
FI121415B (en) * 2001-01-22 2010-11-15 Avantone Oy Layer structure, detector as well as the same manufacturing method and use
JP2002308257A (en) * 2001-04-10 2002-10-23 Oji Paper Co Ltd Data carrier mounted corrugated fiberboard
JP4694735B2 (en) * 2001-08-21 2011-06-08 住友ゴム工業株式会社 Method for producing conductive pattern
JP2003147252A (en) * 2001-08-27 2003-05-21 Toyo Ink Mfg Co Ltd Water-based printing ink composition and printing method
DK1424210T3 (en) * 2001-09-05 2008-09-15 Asahi Kasei Chemicals Corp Photosensitive resin composition and laser engraving printing element
ATE298286T1 (en) * 2001-09-24 2005-07-15 Gather Formulare FORM AND METHOD FOR PRODUCING A FORM WITH AN INTEGRATED RFID TRANSPONDER
US7088304B2 (en) * 2001-09-28 2006-08-08 Mitsubishi Materials Corporation Antenna coil, and RFID-use tag using it, transponder-use antenna
US6614392B2 (en) * 2001-12-07 2003-09-02 Delaware Capital Formation, Inc. Combination RFID and GPS functionality on intelligent label
JP3898610B2 (en) * 2002-09-18 2007-03-28 本田技研工業株式会社 Torque sensor
US6966232B2 (en) * 2002-12-06 2005-11-22 Honda Motor Co., Ltd. Torque sensor
JP4516281B2 (en) * 2003-04-02 2010-08-04 本田技研工業株式会社 Torque sensor
DE102004005082B4 (en) * 2004-02-02 2006-03-02 Infineon Technologies Ag A capacitor comprising a self-assembled monolayer organic compound dielectric and a method of making the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2005013189A2 *

Also Published As

Publication number Publication date
WO2005013189A3 (en) 2005-08-18
JP2011054207A (en) 2011-03-17
DE10335230A1 (en) 2005-02-17
JP2006528803A (en) 2006-12-21
WO2005013189A2 (en) 2005-02-10
US20070039694A1 (en) 2007-02-22

Similar Documents

Publication Publication Date Title
EP1719073B1 (en) Method for producing rfid labels
EP1716521B1 (en) Application of rfid labels
EP1920388B1 (en) Production of labels with rfid transponders
DE60035058T2 (en) Process for printing on packaging with RFID read / write capability
EP2722796B1 (en) Method for producing a printed product comprising an RFID transponder
EP1987476B1 (en) Security and/or valuable document
JP2011054207A (en) Method for producing rfid label
EP2350928B1 (en) Method for producing an rfid transponder product, and rfid transponder product produced using the method
DE602005003555T2 (en) Parts set for an RFID tag and RFID tag
EP2079653A2 (en) Printed product rfid
DE102005016511B4 (en) Method for producing a conductor structure on a substrate
DE202010014408U1 (en) Assembly with at least one UHF dipole antenna
EP1862953B1 (en) Method for contactless data and/or energy transmission between a terminal and at least one transponder
EP3485431A1 (en) Method and device for producing a transponder, printing forme and transponder
EP2187335B1 (en) Code system on an information storage card
US20200287286A1 (en) Multilayer inductor
EP4061643B1 (en) Method for producing banknotes having at least one integrated circuit
DE102004056238B3 (en) Method and arrangement for the production of RFID tags
DE202005021190U1 (en) Container`s e.g. bottle, label manufacturing device for use in labeling machine, has radio frequency identification manufacturing equipment, which is designed to form part of transponder during manufacturing of label
DE102007011914A1 (en) Multi-dimensional radio frequency identification transponder i.e. tag, readability improving method for e.g. book, involves extending antenna structure over two dimensions, where structure has three-dimensional form in finished condition

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20060301

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: MANROLAND AG

17Q First examination report despatched

Effective date: 20110505

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Effective date: 20110704