EP1411363A3 - Prüfanordnung - Google Patents
Prüfanordnung Download PDFInfo
- Publication number
- EP1411363A3 EP1411363A3 EP03023313A EP03023313A EP1411363A3 EP 1411363 A3 EP1411363 A3 EP 1411363A3 EP 03023313 A EP03023313 A EP 03023313A EP 03023313 A EP03023313 A EP 03023313A EP 1411363 A3 EP1411363 A3 EP 1411363A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- mounting
- card
- head
- prober
- types
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002304711 | 2002-10-18 | ||
JP2002304711A JP4548817B2 (ja) | 2002-10-18 | 2002-10-18 | プローブ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1411363A2 EP1411363A2 (de) | 2004-04-21 |
EP1411363A3 true EP1411363A3 (de) | 2005-12-07 |
Family
ID=32040867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03023313A Withdrawn EP1411363A3 (de) | 2002-10-18 | 2003-10-15 | Prüfanordnung |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1411363A3 (de) |
JP (1) | JP4548817B2 (de) |
TW (1) | TW200409264A (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6031238B2 (ja) | 2012-03-09 | 2016-11-24 | 東京エレクトロン株式会社 | ウエハ検査用インターフェース及びウエハ検査装置 |
JP5941713B2 (ja) | 2012-03-14 | 2016-06-29 | 東京エレクトロン株式会社 | ウエハ検査用インターフェース及びウエハ検査装置 |
JP5952645B2 (ja) | 2012-06-06 | 2016-07-13 | 東京エレクトロン株式会社 | ウエハ検査用インターフェース及びウエハ検査装置 |
JP6031292B2 (ja) | 2012-07-31 | 2016-11-24 | 東京エレクトロン株式会社 | プローブカードへの基板当接方法 |
JP5993649B2 (ja) | 2012-07-31 | 2016-09-14 | 東京エレクトロン株式会社 | プローブカードへの基板当接装置、基板当接装置を備えた基板検査装置、及びプローブカードへの基板当接方法 |
US11175309B2 (en) | 2014-12-24 | 2021-11-16 | Qualitau, Inc. | Semi-automatic prober |
JP6785186B2 (ja) | 2017-05-18 | 2020-11-18 | 東京エレクトロン株式会社 | 検査システムおよび検査システムにおける温度測定方法 |
JP6827380B2 (ja) | 2017-07-11 | 2021-02-10 | 東京エレクトロン株式会社 | 検査装置およびメンテナンスのガイダンス方法 |
JP7138004B2 (ja) * | 2018-09-28 | 2022-09-15 | 株式会社日本マイクロニクス | プローブカード保持具 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0737944A (ja) * | 1993-07-20 | 1995-02-07 | Tokyo Electron Ltd | プローブ装置 |
US5703494A (en) * | 1994-11-09 | 1997-12-30 | Tokyo Electron Limited | Probing test apparatus |
JP2000349128A (ja) * | 1999-06-04 | 2000-12-15 | Tokyo Seimitsu Co Ltd | プローバ装置のプローバ側とテスタ側との接続方法及びその構造 |
US6408500B1 (en) * | 2000-09-15 | 2002-06-25 | James Orsillo | Method of retrofitting a probe station |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3215475B2 (ja) * | 1991-12-20 | 2001-10-09 | 東京エレクトロン株式会社 | プローブ装置 |
JP3115112B2 (ja) * | 1992-08-18 | 2000-12-04 | 株式会社東京精密 | 半導体検査装置 |
US6166552A (en) * | 1996-06-10 | 2000-12-26 | Motorola Inc. | Method and apparatus for testing a semiconductor wafer |
-
2002
- 2002-10-18 JP JP2002304711A patent/JP4548817B2/ja not_active Expired - Lifetime
-
2003
- 2003-10-15 EP EP03023313A patent/EP1411363A3/de not_active Withdrawn
- 2003-10-16 TW TW92128730A patent/TW200409264A/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0737944A (ja) * | 1993-07-20 | 1995-02-07 | Tokyo Electron Ltd | プローブ装置 |
US5703494A (en) * | 1994-11-09 | 1997-12-30 | Tokyo Electron Limited | Probing test apparatus |
JP2000349128A (ja) * | 1999-06-04 | 2000-12-15 | Tokyo Seimitsu Co Ltd | プローバ装置のプローバ側とテスタ側との接続方法及びその構造 |
US6408500B1 (en) * | 2000-09-15 | 2002-06-25 | James Orsillo | Method of retrofitting a probe station |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 05 30 June 1995 (1995-06-30) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 15 6 April 2001 (2001-04-06) * |
Also Published As
Publication number | Publication date |
---|---|
EP1411363A2 (de) | 2004-04-21 |
JP4548817B2 (ja) | 2010-09-22 |
TWI318783B (de) | 2009-12-21 |
JP2004140241A (ja) | 2004-05-13 |
TW200409264A (en) | 2004-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR |
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AX | Request for extension of the european patent |
Extension state: AL LT LV MK |
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PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
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AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR |
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AX | Request for extension of the european patent |
Extension state: AL LT LV MK |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: 7G 01R 31/28 A |
|
17P | Request for examination filed |
Effective date: 20060607 |
|
17Q | First examination report despatched |
Effective date: 20060710 |
|
AKX | Designation fees paid |
Designated state(s): DE FR GB IT NL |
|
17Q | First examination report despatched |
Effective date: 20060710 |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: G01R 31/28 20060101AFI20091112BHEP |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20100427 |