EP1389801A3 - Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads - Google Patents
Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads Download PDFInfo
- Publication number
- EP1389801A3 EP1389801A3 EP03254186A EP03254186A EP1389801A3 EP 1389801 A3 EP1389801 A3 EP 1389801A3 EP 03254186 A EP03254186 A EP 03254186A EP 03254186 A EP03254186 A EP 03254186A EP 1389801 A3 EP1389801 A3 EP 1389801A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- thermally conductive
- delivery
- surface layer
- layer film
- flexible surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US219210 | 1994-03-29 | ||
US10/219,210 US6657297B1 (en) | 2002-08-15 | 2002-08-15 | Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1389801A2 EP1389801A2 (en) | 2004-02-18 |
EP1389801A3 true EP1389801A3 (en) | 2007-01-24 |
EP1389801B1 EP1389801B1 (en) | 2010-04-07 |
Family
ID=29549660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03254186A Expired - Lifetime EP1389801B1 (en) | 2002-08-15 | 2003-07-01 | Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads |
Country Status (7)
Country | Link |
---|---|
US (1) | US6657297B1 (en) |
EP (1) | EP1389801B1 (en) |
JP (1) | JP2004080040A (en) |
AT (1) | ATE463841T1 (en) |
CA (1) | CA2437243C (en) |
DE (1) | DE60331992D1 (en) |
TW (1) | TWI264097B (en) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6841867B2 (en) * | 2002-12-30 | 2005-01-11 | Intel Corporation | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials |
TWI295095B (en) * | 2004-09-22 | 2008-03-21 | Fuji Polymer Ind | Thermally conductive sheet and method for producing the same |
JP4395753B2 (en) * | 2004-12-27 | 2010-01-13 | 信越化学工業株式会社 | Method of manufacturing heat conductive member, method of using the same, and heat dissipation structure |
US7436669B2 (en) * | 2005-05-11 | 2008-10-14 | Sung-Po Huang | 3D multi-layer heat conduction diffusion plate |
WO2007076014A2 (en) * | 2005-12-23 | 2007-07-05 | World Properties, Inc. | Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom |
US20070178255A1 (en) | 2006-01-31 | 2007-08-02 | Farrow Timothy S | Apparatus, system, and method for thermal conduction interfacing |
JP2009525614A (en) * | 2006-01-31 | 2009-07-09 | スリーエム イノベイティブ プロパティズ カンパニー | LED lighting assembly having compliant foil structure |
US7710045B2 (en) * | 2006-03-17 | 2010-05-04 | 3M Innovative Properties Company | Illumination assembly with enhanced thermal conductivity |
US8373195B2 (en) | 2006-04-12 | 2013-02-12 | SemiLEDs Optoelectronics Co., Ltd. | Light-emitting diode lamp with low thermal resistance |
US7863639B2 (en) * | 2006-04-12 | 2011-01-04 | Semileds Optoelectronics Co. Ltd. | Light-emitting diode lamp with low thermal resistance |
US7806560B2 (en) * | 2007-01-31 | 2010-10-05 | 3M Innovative Properties Company | LED illumination assembly with compliant foil construction |
US8445102B2 (en) * | 2007-11-05 | 2013-05-21 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
US8545987B2 (en) * | 2007-11-05 | 2013-10-01 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
US9795059B2 (en) * | 2007-11-05 | 2017-10-17 | Laird Technologies, Inc. | Thermal interface materials with thin film or metallization |
US8076773B2 (en) * | 2007-12-26 | 2011-12-13 | The Bergquist Company | Thermal interface with non-tacky surface |
US8007286B1 (en) | 2008-03-18 | 2011-08-30 | Metrospec Technology, Llc | Circuit boards interconnected by overlapping plated through holes portions |
US10334735B2 (en) | 2008-02-14 | 2019-06-25 | Metrospec Technology, L.L.C. | LED lighting systems and methods |
US8143631B2 (en) * | 2008-03-06 | 2012-03-27 | Metrospec Technology Llc | Layered structure for use with high power light emitting diode systems |
US8851356B1 (en) | 2008-02-14 | 2014-10-07 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
US11266014B2 (en) | 2008-02-14 | 2022-03-01 | Metrospec Technology, L.L.C. | LED lighting systems and method |
US20090208722A1 (en) * | 2008-02-18 | 2009-08-20 | John Francis Timmerman | Oriented Members for Thermally Conductive Interface Structures |
US8410720B2 (en) | 2008-04-07 | 2013-04-02 | Metrospec Technology, LLC. | Solid state lighting circuit and controls |
US8802505B2 (en) * | 2008-09-30 | 2014-08-12 | Stats Chippac, Ltd. | Semiconductor device and method of forming a protective layer on a backside of the wafer |
US8205766B2 (en) * | 2009-05-20 | 2012-06-26 | The Bergquist Company | Method for packaging thermal interface materials |
US8430264B2 (en) * | 2009-05-20 | 2013-04-30 | The Bergquist Company | Method for packaging thermal interface materials |
US8081468B2 (en) * | 2009-06-17 | 2011-12-20 | Laird Technologies, Inc. | Memory modules including compliant multilayered thermally-conductive interface assemblies |
US20100321897A1 (en) * | 2009-06-17 | 2010-12-23 | Laird Technologies, Inc. | Compliant multilayered thermally-conductive interface assemblies |
KR20110012780A (en) * | 2009-07-31 | 2011-02-09 | 엘지디스플레이 주식회사 | Liquid crystal display device |
US8492961B2 (en) | 2011-09-19 | 2013-07-23 | Osram Sylvania Inc. | Heat sink assembly |
JP5942641B2 (en) * | 2012-07-02 | 2016-06-29 | 日立化成株式会社 | Resin sheet and manufacturing method thereof, cured resin sheet, and member for heat dissipation |
CN102917574B (en) * | 2012-10-24 | 2015-05-27 | 华为技术有限公司 | Heat-conducting pad, method for manufacturing heat-conducting pad, radiating device and electronic device |
US9999158B2 (en) | 2013-01-03 | 2018-06-12 | Henkel IP & Holding GmbH | Thermally conductive EMI suppression compositions |
US9693481B2 (en) | 2013-06-25 | 2017-06-27 | Henkel IP & Holding GmbH | Thermally conductive dielectric interface |
JP2017504715A (en) | 2013-12-05 | 2017-02-09 | ハネウェル・インターナショナル・インコーポレーテッド | Stannous methanesulfonate solution with controlled pH |
US10068830B2 (en) | 2014-02-13 | 2018-09-04 | Honeywell International Inc. | Compressible thermal interface materials |
US20150334871A1 (en) * | 2014-05-19 | 2015-11-19 | Laird Technologies, Inc. | Thermal interface materials with thin film sealants |
WO2016004565A1 (en) | 2014-07-07 | 2016-01-14 | Honeywell International Inc. | Thermal interface material with ion scavenger |
JP6295238B2 (en) * | 2014-10-31 | 2018-03-14 | デクセリアルズ株式会社 | HEAT CONDUCTIVE SHEET, HEAT CONDUCTIVE SHEET MANUFACTURING METHOD, HEAT DISSIBLING MEMBER AND SEMICONDUCTOR DEVICE |
CN107250317A (en) | 2014-12-05 | 2017-10-13 | 霍尼韦尔国际公司 | High-performance thermal interfacial material with low thermal resistance |
CN107924908B (en) | 2015-07-13 | 2020-10-23 | 莱尔德电子材料(深圳)有限公司 | Thermal management and/or EMI mitigation materials with custom colored exterior surfaces |
CN106711535B (en) * | 2015-11-17 | 2019-12-17 | 上海比亚迪有限公司 | Heat conducting plate, preparation method thereof and battery pack device |
US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
KR102554661B1 (en) | 2016-03-08 | 2023-07-13 | 허니웰 인터내셔널 인코포레이티드 | phase change material |
JP6710828B2 (en) * | 2016-04-06 | 2020-06-17 | 北川工業株式会社 | HEAT CONDUCTIVE SHEET, AND METHOD FOR MANUFACTURING HEAT CONDUCTIVE SHEET |
US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
US10849200B2 (en) | 2018-09-28 | 2020-11-24 | Metrospec Technology, L.L.C. | Solid state lighting circuit with current bias and method of controlling thereof |
CN109616450B (en) * | 2018-11-08 | 2021-05-18 | 清华大学深圳研究生院 | Packaging material and application thereof |
US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
KR102565178B1 (en) * | 2020-11-12 | 2023-08-08 | 성균관대학교산학협력단 | Soft-rigid-soft multi layer Thermal InterFace material, preparing method of the same, and heat radiating system including the same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4869954A (en) * | 1987-09-10 | 1989-09-26 | Chomerics, Inc. | Thermally conductive materials |
JPH10183110A (en) * | 1996-11-06 | 1998-07-14 | Fuji Kobunshi Kogyo Kk | Formed sheet of heat conductive silicone gel and its production |
US6165612A (en) * | 1999-05-14 | 2000-12-26 | The Bergquist Company | Thermally conductive interface layers |
US6432497B2 (en) * | 1997-07-28 | 2002-08-13 | Parker-Hannifin Corporation | Double-side thermally conductive adhesive tape for plastic-packaged electronic components |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4938992A (en) * | 1988-01-07 | 1990-07-03 | Varian Associates, Inc. | Methods for thermal transfer with a semiconductor |
US5300809A (en) * | 1989-12-12 | 1994-04-05 | Sumitomo Special Metals Co., Ltd. | Heat-conductive composite material |
JP2882972B2 (en) * | 1993-06-15 | 1999-04-19 | 電気化学工業株式会社 | Heat dissipation sheet |
US6090484A (en) | 1995-05-19 | 2000-07-18 | The Bergquist Company | Thermally conductive filled polymer composites for mounting electronic devices and method of application |
US5679457A (en) | 1995-05-19 | 1997-10-21 | The Bergquist Company | Thermally conductive interface for electronic devices |
JP3280224B2 (en) * | 1996-02-06 | 2002-04-30 | 東レ・ダウコーニング・シリコーン株式会社 | Thermal conductive silicone gel sheet and method for producing the same |
US5950066A (en) | 1996-06-14 | 1999-09-07 | The Bergquist Company | Semisolid thermal interface with low flow resistance |
JPH106440A (en) * | 1996-06-19 | 1998-01-13 | Toray Dow Corning Silicone Co Ltd | Composite molded material composed of silicone gel formed product and releasable film and its manufacture |
US5738936A (en) * | 1996-06-27 | 1998-04-14 | W. L. Gore & Associates, Inc. | Thermally conductive polytetrafluoroethylene article |
JP3531785B2 (en) * | 1997-07-02 | 2004-05-31 | 電気化学工業株式会社 | Manufacturing method of heat dissipating member for electronic parts |
JP3434678B2 (en) * | 1997-09-12 | 2003-08-11 | 電気化学工業株式会社 | Rubber sheet manufacturing method |
JP3425521B2 (en) | 1998-01-09 | 2003-07-14 | 信越化学工業株式会社 | Method for reducing surface tackiness of low hardness thermally conductive silicone rubber sheet |
US6399209B1 (en) | 1999-04-16 | 2002-06-04 | The Bergquist Company | Integrated release films for phase-change interfaces |
US6359334B1 (en) * | 1999-06-08 | 2002-03-19 | Micron Technology, Inc. | Thermally conductive adhesive tape for semiconductor devices and method using the same |
JP2002026203A (en) * | 2000-07-05 | 2002-01-25 | Denki Kagaku Kogyo Kk | Radiating spacer |
-
2002
- 2002-08-15 US US10/219,210 patent/US6657297B1/en not_active Expired - Lifetime
-
2003
- 2003-07-01 DE DE60331992T patent/DE60331992D1/en not_active Expired - Lifetime
- 2003-07-01 EP EP03254186A patent/EP1389801B1/en not_active Expired - Lifetime
- 2003-07-01 AT AT03254186T patent/ATE463841T1/en not_active IP Right Cessation
- 2003-07-14 TW TW092119129A patent/TWI264097B/en not_active IP Right Cessation
- 2003-08-14 JP JP2003293265A patent/JP2004080040A/en active Pending
- 2003-08-14 CA CA002437243A patent/CA2437243C/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4869954A (en) * | 1987-09-10 | 1989-09-26 | Chomerics, Inc. | Thermally conductive materials |
JPH10183110A (en) * | 1996-11-06 | 1998-07-14 | Fuji Kobunshi Kogyo Kk | Formed sheet of heat conductive silicone gel and its production |
US6432497B2 (en) * | 1997-07-28 | 2002-08-13 | Parker-Hannifin Corporation | Double-side thermally conductive adhesive tape for plastic-packaged electronic components |
US6165612A (en) * | 1999-05-14 | 2000-12-26 | The Bergquist Company | Thermally conductive interface layers |
Also Published As
Publication number | Publication date |
---|---|
CA2437243A1 (en) | 2004-02-15 |
JP2004080040A (en) | 2004-03-11 |
TW200414464A (en) | 2004-08-01 |
TWI264097B (en) | 2006-10-11 |
EP1389801A2 (en) | 2004-02-18 |
US6657297B1 (en) | 2003-12-02 |
CA2437243C (en) | 2008-02-05 |
ATE463841T1 (en) | 2010-04-15 |
DE60331992D1 (en) | 2010-05-20 |
EP1389801B1 (en) | 2010-04-07 |
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