EP1276016A3 - Exposure apparatus - Google Patents

Exposure apparatus Download PDF

Info

Publication number
EP1276016A3
EP1276016A3 EP02254504A EP02254504A EP1276016A3 EP 1276016 A3 EP1276016 A3 EP 1276016A3 EP 02254504 A EP02254504 A EP 02254504A EP 02254504 A EP02254504 A EP 02254504A EP 1276016 A3 EP1276016 A3 EP 1276016A3
Authority
EP
European Patent Office
Prior art keywords
exposure apparatus
master
substrate
pure water
linear motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP02254504A
Other languages
German (de)
French (fr)
Other versions
EP1276016A2 (en
EP1276016B1 (en
Inventor
Keiji c/o Canon Kabushiki Kaisha Emoto
Hirohide C/O Canon Kabushiki Kaisha Matsuhisa
Kotaro C/O Canon Kabushiki Kaisha Akutsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27347109&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP1276016(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP2001207363A external-priority patent/JP2003022955A/en
Priority claimed from JP2001208961A external-priority patent/JP2003022963A/en
Priority claimed from JP2001274762A external-priority patent/JP2003086486A/en
Application filed by Canon Inc filed Critical Canon Inc
Priority to EP08168735A priority Critical patent/EP2017675A1/en
Publication of EP1276016A2 publication Critical patent/EP1276016A2/en
Publication of EP1276016A3 publication Critical patent/EP1276016A3/en
Application granted granted Critical
Publication of EP1276016B1 publication Critical patent/EP1276016B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Abstract

Pure water (3) with a resistivity of 1 MΩ ·cm or more is externally supplied in an exposure apparatus in which a master and substrate are relatively moved and aligned by a stage driven by a linear motor (1) and a pattern on the master is transferred onto the substrate. While being adjusted to a predetermined temperature, the pure water (3) undergoes deoxidation processing and UV sterilization processing and is circulated to cool the linear motor (1).
EP02254504A 2001-07-09 2002-06-26 Exposure apparatus Expired - Lifetime EP1276016B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP08168735A EP2017675A1 (en) 2001-07-09 2002-06-26 Exposure apparatus

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2001207363 2001-07-09
JP2001207363A JP2003022955A (en) 2001-07-09 2001-07-09 Aligner
JP2001208961A JP2003022963A (en) 2001-07-10 2001-07-10 Aligner
JP2001208961 2001-07-10
JP2001274762 2001-09-11
JP2001274762A JP2003086486A (en) 2001-09-11 2001-09-11 Aligner

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP08168735A Division EP2017675A1 (en) 2001-07-09 2002-06-26 Exposure apparatus

Publications (3)

Publication Number Publication Date
EP1276016A2 EP1276016A2 (en) 2003-01-15
EP1276016A3 true EP1276016A3 (en) 2005-06-15
EP1276016B1 EP1276016B1 (en) 2009-06-10

Family

ID=27347109

Family Applications (2)

Application Number Title Priority Date Filing Date
EP02254504A Expired - Lifetime EP1276016B1 (en) 2001-07-09 2002-06-26 Exposure apparatus
EP08168735A Withdrawn EP2017675A1 (en) 2001-07-09 2002-06-26 Exposure apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP08168735A Withdrawn EP2017675A1 (en) 2001-07-09 2002-06-26 Exposure apparatus

Country Status (4)

Country Link
US (3) US7038759B2 (en)
EP (2) EP1276016B1 (en)
KR (1) KR100492476B1 (en)
DE (1) DE60232568D1 (en)

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EP1276016B1 (en) * 2001-07-09 2009-06-10 Canon Kabushiki Kaisha Exposure apparatus
JP2004146492A (en) * 2002-10-23 2004-05-20 Canon Inc Euv aligner
US7282821B2 (en) * 2002-01-28 2007-10-16 Canon Kabushiki Kaisha Linear motor, stage apparatus, exposure apparatus, and device manufacturing apparatus
JP2004134566A (en) * 2002-10-10 2004-04-30 Canon Inc Device manufacturing apparatus
AU2003289236A1 (en) * 2002-12-10 2004-06-30 Nikon Corporation Exposure apparatus and method for manufacturing device
JP2004247688A (en) * 2003-02-17 2004-09-02 Canon Inc Refrigerant supplying device
KR101728664B1 (en) * 2003-05-28 2017-05-02 가부시키가이샤 니콘 Exposure method, exposure device, and device manufacturing method
JP3748559B2 (en) * 2003-06-30 2006-02-22 キヤノン株式会社 Stage apparatus, exposure apparatus, charged beam drawing apparatus, device manufacturing method, substrate potential measuring method, and electrostatic chuck
WO2005006415A1 (en) 2003-07-09 2005-01-20 Nikon Corporation Exposure apparatus and method for manufacturing device
TWI245163B (en) * 2003-08-29 2005-12-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
JP3894562B2 (en) * 2003-10-01 2007-03-22 キヤノン株式会社 Substrate adsorption apparatus, exposure apparatus, and device manufacturing method
JP3814598B2 (en) * 2003-10-02 2006-08-30 キヤノン株式会社 Temperature adjustment apparatus, exposure apparatus, and device manufacturing method
EP1531362A3 (en) * 2003-11-13 2007-07-25 Matsushita Electric Industrial Co., Ltd. Semiconductor manufacturing apparatus and pattern formation method
JP4418699B2 (en) * 2004-03-24 2010-02-17 キヤノン株式会社 Exposure equipment
JP4418710B2 (en) * 2004-05-17 2010-02-24 キヤノン株式会社 Stage equipment
KR101440746B1 (en) * 2004-06-09 2014-09-17 가부시키가이샤 니콘 Exposure system and device production method
JP3981682B2 (en) * 2004-07-14 2007-09-26 ファナック株式会社 Laser equipment
CN100349333C (en) * 2004-07-14 2007-11-14 发那科株式会社 Laser unit
CN100434830C (en) * 2004-09-29 2008-11-19 周庆龙 Refrigerating system with deionization to prevent oxidation
KR101151575B1 (en) * 2004-10-01 2012-06-01 가부시키가이샤 니콘 Linear motor, stage apparatus and exposure apparatus
US6973958B1 (en) * 2004-10-19 2005-12-13 Ching-Lung Chou Heat transfer apparatus having anti-oxidization device
JP4326461B2 (en) * 2004-11-15 2009-09-09 Ｓｍｃ株式会社 Temperature control system for small flow rate liquid
JP4576270B2 (en) * 2005-03-29 2010-11-04 昭和電工株式会社 Method for manufacturing solder circuit board
JP2006287014A (en) * 2005-04-01 2006-10-19 Canon Inc Positioning apparatus and linear motor
WO2007007865A1 (en) * 2005-07-11 2007-01-18 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
WO2007029866A1 (en) * 2005-09-09 2007-03-15 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
KR100870791B1 (en) * 2006-02-15 2008-11-27 캐논 가부시끼가이샤 Exposure apparatus, exposure method, and exposure system
US20070257563A1 (en) * 2006-05-06 2007-11-08 Lieh-Feng Huang Heat Dissipating Arrangement for a Linear Motor
JP5020662B2 (en) * 2006-05-26 2012-09-05 キヤノン株式会社 Stage apparatus, exposure apparatus, and device manufacturing method
EP2998983B1 (en) * 2006-12-27 2018-03-21 Nikon Corporation Stage apparatus, exposure apparatus and device fabricating method
US8339573B2 (en) * 2009-05-27 2012-12-25 3M Innovative Properties Company Method and apparatus for photoimaging a substrate
JP6404110B2 (en) * 2014-12-18 2018-10-10 信越化学工業株式会社 Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound and cured product thereof
JP2016186998A (en) * 2015-03-27 2016-10-27 株式会社東芝 Semiconductor manufacturing device and semiconductor manufacturing method
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Also Published As

Publication number Publication date
US7391496B2 (en) 2008-06-24
KR20030007041A (en) 2003-01-23
EP2017675A1 (en) 2009-01-21
DE60232568D1 (en) 2009-07-23
EP1276016A2 (en) 2003-01-15
EP1276016B1 (en) 2009-06-10
US20050213062A1 (en) 2005-09-29
KR100492476B1 (en) 2005-06-03
US20060028629A1 (en) 2006-02-09
US7057703B2 (en) 2006-06-06
US20030007136A1 (en) 2003-01-09
US7038759B2 (en) 2006-05-02

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