EP1268127B1 - Method and apparatus for shaping edges - Google Patents
Method and apparatus for shaping edges Download PDFInfo
- Publication number
- EP1268127B1 EP1268127B1 EP01920194A EP01920194A EP1268127B1 EP 1268127 B1 EP1268127 B1 EP 1268127B1 EP 01920194 A EP01920194 A EP 01920194A EP 01920194 A EP01920194 A EP 01920194A EP 1268127 B1 EP1268127 B1 EP 1268127B1
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- EP
- European Patent Office
- Prior art keywords
- range
- edge
- abrasive wheel
- resin
- abraded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/02—Wheels in one piece
Definitions
- the present invention relates to a method and an apparatus for shaping the edges of rigid, materials such as ceramic plates and rigid composite plates.
- Numerous glass plate components and rigid print-circuit boards are used for display windows or LCD panels, respectively, in precision devices such as portable phones, pagers, and hand-held computers. These glass plate components and printed circuit boards are disposed in a complex manner in a narrow space together with other precision components. Further, an LCD panel or the like is typically coupled with a glass faceplate and a flexible printed circuit board.
- glass fragments on the cut surfaces and/or the fine splitting, cracks, etc. present of the cut surface can lead to glass fragments separating from the glass plate into the assembly equipment and/or precision devices.
- the edge of component made of rigid, brittle materials such as ceramic plates and rigid composite plates are preferably finished so that they do not have comers, pits, or cracks.
- Conventional techniques for removing the comers, pits, and cracks from the edge of rigid, brittle materials such as ceramic plates and rigid composite plates include abrading and of the edge of the material using a metal-bonded diamond wheel.
- the metal-bonded diamond wheel is an abrasive wheel in which abrasive diamond particles are bonded together with a metal binder. Since rigid, brittle materials such as ceramic plates and rigid composite plates are brittle, the cutting mode of the conventional techniques, which utilize rigid, non-elastic materials such as diamond wheels, is typically a "tear-type" or a "crack-type". These cutting modes generally lead to the formation of numerous cracks and pits on the abraded surface, making it impossible to effectively remove the pits from the edge of the material.
- resin-bonded, diamond wheels have been used, for example, in place of metal-bonded diamond wheels, to shape the edge of glass plates (see, e.g., U.S. Pat. Nos. 5,975,992 (Raeder et al.) and 5,816,897 (Raeder et al.)).
- Advantages of resin-bonded, diamond wheels include increased wheel flexibility and elasticity.
- the amount of abrading that occurs with conventional chamfering processes that utilize metal-bonded or resin, diamond wheels, can be controlled by adjusting the position of the metal-bonded, diamond wheel relative to the surface of material to be abraded. Further with regard to the conventional chamfering process, the amount abraded is determined by the position of the diamond wheel relative to the material to be abraded. This process requires frequent and precise adjustment of the relative positions of the diamond wheel surface and the surface of the material to be abraded. Such frequent adjustments become cumbersome.
- the position adjustments are typically facilitated using computer control (sometimes called, NC (numerical control) machining system) (see, e.g., Japanese Patent Laid-Open Publication No. 11-221763, published August 17, 1999).
- NC numbererical control
- the input of position data typically requires a relatively long period of time (e.g., 60 to 120 minutes).
- US-A-4 525 958 discloses a method of shaping peripheral edge portions of a glass sheet to provide a sheet having a non circular peripheral configuration.
- the method comprises the steps of rotating the glass sheet about a sheet axis of rotation, rotating shaping means about a shaping axis of rotation, measuring current input to the shaping means, biasing peripheral edge portions of the sheet and shaping means toward one another to shape peripheral edge portions of the sheet to provide a sheet with a non-circular peripheral configuration.
- the peripheral speed of the sheet as it moves past the shaping means increases as the spaced distance between the sheet axis of rotation and shaping axis of rotation increases, resulting in an increase in the measured current input to the shaping means, and decreases as the spaced distance between the sheet axis of rotation and shaping axis of rotation decreases, resulting in a decrease in the measured current input to the shaping means.
- the method furthermore comprises the steps of monitoring the measured current input, and altering rotational speed of the glass sheet as a function of said monitoring step, wherein the rotational speed of the sheet is decreased to decrease the peripheral speed of the sheet in response to the increase in the measured current input, and the rotational speed of the sheet is increased to increase the peripheral speed of the sheet in response to the decrease in the measured current input.
- the present invention relates to a method and an apparatus for shaping an edge (i.e., providing a surface of edge being free of pits) of a rigid, brittle material such as ceramic (i.e., glass, crystalline ceramic, and combinations thereof) plates and rigid composite plates (including rigid printed circuit boards).
- a rigid, brittle material such as ceramic (i.e., glass, crystalline ceramic, and combinations thereof) plates and rigid composite plates (including rigid printed circuit boards).
- the present invention provides a method for shaping an edge of a material such as ceramic plates and rigid composite plates (including rigid printed circuit boards), the method comprising: abrading an edge of a material such as ceramic plates and rigid composite plates (including rigid printed circuit boards) in a predetermined abrasion amount, using a resin-bonded abrasive wheel under a load, and in contact with, the edge being abraded, wherein the abrasion amount is determined by controlling the load for pressing the material being abraded with the resin-bonded abrasive wheel, wherein the resin-bonded wheel has an elastic modulus in the range from 100 to 10,000 kg/cm 2 and has a Shore D hardness in the range from 10 to 95.
- the method according to the present invention is conducted such that the edge of the resulting abraded material is free of comers, pits, and cracks.
- the wheel has a width surface contacting the edge of the material being abraded, and during the abrading, at least one of (i) the width surface traverses along the edge of the material being abraded or (ii) the edge of the material being abraded traverses along said width surface.
- the present invention provides an apparatus for abrading an edge of a rigid, brittle materials such as ceramic plates and rigid composite plates in a predetermined abrasion amount using a resin-bonded abrasive wheel under a load and in contact with the edge being abraded, the apparatus comprising a resin-bonded abrasive wheel, wherein the resin-bonded wheel has an elastic modulus in the range from 100 to 10,000 kg/cm 2 and has a Shore D hardness in the range from 10 to 95, a mechanism for rotating the abrasive wheel, and a system for contacting and controlling, during the abrading, the load of the abrasive wheel on the material being abraded.
- Apparatus according to the present invention 200 comprises abrasive wheel 201, driving shaft 202, motor 203, and pressure cylinder 204.
- Apparatus 200 and material to be abraded e.g., glass plate 206 are arranged so that they can movable independently with respect to each other. Material to be abraded 206 may, for example, move in parallel to driving shaft 202 (the direction indicated by arrow) of the device during abrading).
- Advantages of the present invention include being able to provide materials such as ceramic plates and rigid composite plates free of corners, pits, and cracks in a relative short period oftime, as compared, for example, to conventional techniques.
- the present invention may be suitable for shaping the edge of a variety of rigid, brittle materials such as ceramic plates and rigid composite plates.
- glass plates include those used for precision device (e.g., portable phone or pager) display windows, LCD panels, or face plate.
- the thickness of the glass plate for such devices is typically from 0.2 to 1.4 mm, more typically for example, about 0.3 to 0.7 mm, or even about 0.3 to 0.5 mm.
- Rigid composite plates include those comprised ofbinder material such as polymer reinforced with fillers such as ceramic particles and fibers.
- Rigid composite plates include the substrate for rigid printed boards.
- Rigid printed circuit boards may have a mono-layered, or multi-layered, circuits (e.g., copper circuits).
- the rigid print-circuit board typically has a thickness of about 0.5 to 5 mm, more typically about 1 to 3 mm.
- Resin-bonded abrasive wheels utilized in the present invention are abrasive wheels in which abrasive grains are fixed with a resin binder. Resin-bonded abrasive wheels typically exhibit flexibility and elasticity characteristics such that than can substantially elastically conform to the shape of the surface being abraded.
- the cut mode is for abrading brittle glass plates according to the method and device of the present invention is typically a "shear-type". Although not wanting to be bound by theory, it is believed that the lack of cracking, pitting, etc. in the glass plate surfaces abraded according to the method and device of the present invention is facilitated by a "shear-type" cutting mode.
- shear plane is a smooth cut surface (mmirrror surface), and looks glossy.
- Suitable resin-bonded abrasive wheels have an elastic modulus in the range from 100 to 10,000 kg/cm 2 , more preferably, in the range from 500 to 7,000 kg/cm 2 .
- Use of resin-bonded wheels with an elastic modulus above about 10,000 kg/cm 2 tend to lead to the formulation of cracks or pits on the newly formed surfaces.
- the resin-bonded abrasive wheel has a Shore D hardness in the range from 10 to 95, more preferably, in the range from 40 to 80. If the Shore D hardness is below about 10, the abrasive wheel tends to wear out quickly. If the Shore D hardness is above about 95, there is a tendency for cracks or pits to be present on the newly formed surfaces.
- the density of the resin-bonded abrasive wheel is preferably in the range from about 0.4 to 2.5 g/cm 3 . If the density is below about 0.4 g/cm 3 , the abrasive wheel tends to wear out quickly. For densities above about 2.5 g/cm 3 , there is a tendency for cracks or pits to be present on newly formed surfaces.
- abrasive grains present in the resin-bonded abrasive wheels include conventional abrasive grains such as SiC, Al 2 O 3 , and CeO 2 .
- the abrasive grains are screened and graded using the well known techniques and standards for JIS (Japanese Industrial Standard) grade (e.g., JIS (R6001, 1987 ver.) JIS 100 to JIS 10,000, preferably, in the range from JIS 220 to JIS 2,000, or the like).
- the abrasive grains generally have particle sizes (in conformity with JIS) in the range from about 1 to 125 micrometers preferably in the range from about 6 to 50 micrometers. It is also within the scope of the present invention to use abrasive grain graded to other industry recognized standards, such as ANSI (American National Standard Institute) and FEPA (Federation Europeane de Products Abrasifs).
- the resin binder for the resin-bonded abrasive wheel is preferably polyurethane.
- a preferred polyurethane is a cross-linked polyurethane matrix such as disclosed in Japanese Patent Laid-Open Publication No. 294336/1990, published on December 5, 1990, the disclosure of which is incorporated herein by reference.
- the cross-linked polyurethane preferably has a glass transition temperature greater than about 10°C, more preferably, in the range from greater than about 10°C to 70°C.
- Suitable resin-bonded abrasive wheel are commercially available, and/or can be made by techniques known in the art (see e.g., Japanese Patent Laid-Open Publication No. 294336/1990, published on December 5, 1990, and U.S. Pat No. 4,933,373 (Moren).
- Abrasive wheels utilized in practicing the present invention typically have an outer diameter in the range from 50 to 500 mm, more typically, from 100 to 305 mm.
- the inner diameter of the wheels is typically in the range from 5 to 300 mm, more typically in the range from 10 to 127 mm.
- the width of the wheels is typically in the range from 10 to 500 mm, more typically in the range from 10 to 300 mm.
- FIG. 1 is a perspective view showing the edge of a material (e.g., a glass plate) being abraded by a method according to the present invention.
- Material 10 is fixed such that the width of the edge to be abraded is parallel to with the axial direction of resin-bonded abrasive wheel 102.
- the outer peripheral surface of abrasive wheel 102 is under a load, and is in contact with, edge 103 for a predetermined period of time.
- the load the abrasive wheel is under when in contact with the edge of the material being abraded is changed in accordance with the desired area and amount to be abraded. Since the resin-bonded abrasive wheel has flexibility and elasticity, the load for contacting the abrasive wheel with the surface to be abraded can be varied as desired over a range of loads. The load is correlated to the amount to be abraded per unit period of time. In other words, the amount to be abraded can be varied and controlled by adjusting the load. The amount to be abraded is also affected by, for example, by the abrading time and rotational speed of the abrasive wheel.
- a metal-bonded, diamond wheel which is not flexible and elastic, does not allow for a range of loading, but rather is maintained at a substantially single, optimal value. Since the diamond wheel is rigid and non-elastic, if the load is even a little above the (substantially single) optimal value, the material (e.g., glass plate) being abraded typically breaks. Similarly, the load is even a little below the (substantially single) optimal value, there is no or insufficient abrading of the material. Hence, in conventional methods of shaping a material using a diamond wheel, the amount to be abraded cannot effectively be controlled by adjusting the load, but rather the amount being abraded is determined by the position of the wheel with respect to the surface being abraded.
- the load for practicing the present invention is about 0.1 to 4 kg/50 mm (i.e., 0.1 to 4 kilograms based on a 50 mm wide wheel) (0.002 kg/mm to 0.08 kg/mm) , preferably from 0.5 to 2 kg/50 mm (0.01 kg/mm to 0.04 kg/mm).
- the abrading time is typically 0.5 to 5 seconds, preferably from 1 to 3 seconds.
- the rotation peripheral speed of the abrasive wheel is typically about 100 to 2000 m/min. preferably from 200 to 1000 m/min.
- the contact angle, ⁇ , of the abrasive wheel to the edge of the glass plate is typically from 0 to 60°, preferably from 30 to 60°.
- Device or apparatus 200 has resin-bonded abrasive wheel 201, driving shaft 202, motor 203, and pressure cylinder 204 placed on movable frame 205.
- Glass plate 206 which is to be abraded, is fixed to working table 207.
- Apparatus 200 and material to be abraded (e.g., glass plate) 206 are arranged so that they can movable independently with respect to each other. Material to be abraded 206 may, for example, move in parallel to driving shaft 202 (the direction indicated by arrow) of the device during abrading).
- the load can be applied, for example, using a pneumatic pressure cylinder, and controlled, for example, using a system moderated by control system such as that available from Mechanotron Co., Ltd., USA under the trade designation "ACTIVE FORCE CONTROL SYSTEM".
- TheMechanotron Co. device uses closed loop feedback to provide an adjustable constant force. It uses load cell or drive motor feedback to monitor force, and a microprocessor to continuously adjust the force to the desired setting. The device behaves similarly to passive devices, but is more effective at low forces, and exhibits faster response rates. It can be utilize linear or rotary bearings, with or without counterbalance weights. It can also be used for wrist mounted, or floor mounted devices. Further, the device can utilize any of a variety of actuators to control forces directly.
- a resin-bonded abrasive wheel (marketed under the trade designation "DLO WHEEL SERIES” by Sumitomo/3M Co., Ltd., Japan) was mounted on an abrasive apparatus as shown in FIG. 2.
- the elastic constant of the abrasive wheel was 1,000 kg/cm 2 , and the density 1.5g/cm 3 .
- the abrasive grains were JIS 600 graded SiC.
- the outer diameter of the wheel was 200 mm, the inner diameter 31.8 mm, and the width 50 mm.
- the glass plate (0.7mm thick) was fixed to a working table. The edge of the edge of the glass plate was abraded under the following conditions.
- the rotational speed of the wheel was 1,500 rpm, the contact angle 45°, and the load 2kg/50mm.
- the abrading time was 2 seconds. Water was used as a lubricant.
- FIG. 3 is a photograph at 100x of the edge surface of the abraded glass plate.
- the black area in the lower half of FIG. 3 was the edge surface of the glass plate.
- the appearance of the abraded edge was smooth.
- the edge of a glass plate having a thickness of 0.7 mm was abraded under the same abrasion condition as in the Example above, except the abrasive wheel was a resin-bonded abrasive wheel (marketed under the trade designation "DLO WHEEL SERIES” from Sumitomo/3M Co., Ltd.) having the following characteristics.
- the elastic constant of the wheel was 12,000 kg/cm 2 , and the density was 2.5 g/cm 3 .
- the abrasive grains were JIS 600 graded SiC.
- the outer diameter of the wheel was 200 mm, the inner diameter 31.8 mm, and the width 50 mm.
- FIG. 4 is a photograph at 100x of the edge surface of the abraded glass plate.
- the black area in the lower half of FIG. 4 was the edge surface of the glass plate. There were pits such as conchoidal defects or pits present on the abraded surface of the glass plate edge.
- a type FR4 printed circuit board i.e., a glass-epoxy resin printed circuit according to ASTM standard D1867-62T, the disclosure of which is incorporated herein by reference
- the edge of the print-circuit board was abraded with a resin-bonded abrasive wheel as described in Example 1 under the following conditions.
- the rotational speed of the wheel was 1,500 rpm, the contact angle 0 degree, and the load 2 kg/50 mm.
- the abrading time was 4 seconds. Water was used as a lubricant.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Meat And Fish (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Description
Claims (16)
- A method for shaping an edge of a ceramic plate or a rigid composite plate comprising:abrading an edge of a ceramic plate or a rigid composite plate in a predetermined abrasion amount, using an abrasive wheel under a load and in contact with the edge being abraded, wherein the abrasion amount is determined by controlling the load for pressing the ceramic plate or the rigid composite plate with the abrasive wheel, characterized in that the abrasive wheel is a resin-bonded abrasive wheel having elastic modulus in the range from 100 to 10,000 kg/cm2 and a Shore D hardness in the range from 10 to 95.
- The method according to claim 1, wherein the resin-bonded abrasive wheel has a density in the range from 0.4 to 2.5 g/cm3.
- The method according to claim 1, wherein the resin-bonded abrasive wheel has an outer diameter in the range from 50 to 500 mm.
- The method according to claim 1, wherein the resin-bonded abrasive wheel has a width in the range from 10 to 500 mm.
- The method according to claim 1, wherein the load is in the range from 0.002 kg/mm to 0.08 kg/mm.
- The method according to claim 1, wherein the resin-bonded abrasive wheel has an elastic modulus in the range from 500 to 7,000 kg/cm2, a density in the range from 0.4 to 2.5 g/cm3, a Shore D hardness in the range from 40 to 80, an outer diameter in the range from 100 to 305 mm, and has a width in the range from 10 to 300 mm.
- The method according to claim 6, wherein the load is in the range from 0.01 kg/mm to 0.04 kg/mm.
- The method according to claim 6, wherein the ceramic plate or rigid composite disc has a thickness in the range from 0.2 to 1.4 mm.
- The method according to claim 1, wherein the wheel has a width surface contacting the edge of the ceramic plate or the rigid composite plate being abraded, and wherein during said abrading, said width surface traverses along the edge of the ceramic plate or the rigid composite plate.
- The method according to claim 1, wherein the wheel has a width surface contacting the edge of the ceramic plate or the rigid composite plate being abraded, and wherein during said abrading, the edge of the ceramic plate or the rigid composite plate traverses along said width surface.
- The method according to claim 1, wherein the edge is an edge of a glass plate.
- An apparatus for abrading an edge of a ceramic plate or a rigid composite plate in a predetermined abrasion amount using a resin-bonded abrasive wheel under a load, and in contact with, the edge to be abraded, the apparatus comprising a resin-bonded abrasive wheel, a mechanism for rotating the abrasive wheel, and a system for contacting and controlling, during abrading, the load of the abrasive wheel on the ceramic plate or the rigid composite plate, wherein the resin-bonded abrasive wheel has an elastic modulus in the range from 100 to 10,000 kg/cm2 and has a Shore D hardness in the range from 10 to 95.
- The apparatus according to claim 12, wherein the resin-bonded abrasive wheel has a density in the range from 0.4 to 2.5 g/cm3, an outer diameter in the range from 50 to 500 mm, and has a width in the range from 10 to 500 mm.
- The apparatus according to claim 12, wherein the resin-bonded abrasive wheel has an elastic modulus in the range from 500 to 7,000 kg/cm2, a density in the range from 0.4 to 2.5 g/cm3, a Shore D hardness in the range from 40 to 80, an outer diameter in the range from 100 to 305 mm, and has a width in the range from 10 to 300 mm.
- The apparatus according to claim 12 further comprising a mechanism for traversing a width surface contacting the edge of the ceramic plate or rigid composite plate during operation of the device along the edge of the ceramic plate or rigid composite plate.
- The apparatus according to claim 12 further comprising a mechanism for traversing the edge of the ceramic plate or rigid composite plate to be abraded during operation of the device along a width surface of the wheel contacting the edge of the ceramic plate or rigid composite plate.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2000061915A JP2001259978A (en) | 2000-03-07 | 2000-03-07 | Chamfering method for end part of glass plate |
JP2000061915 | 2000-03-07 | ||
PCT/US2001/006940 WO2001066307A2 (en) | 2000-03-07 | 2001-03-06 | Method and apparatus for shaping edges |
Publications (2)
Publication Number | Publication Date |
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EP1268127A2 EP1268127A2 (en) | 2003-01-02 |
EP1268127B1 true EP1268127B1 (en) | 2005-06-01 |
Family
ID=18581991
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP01920194A Expired - Lifetime EP1268127B1 (en) | 2000-03-07 | 2001-03-06 | Method and apparatus for shaping edges |
Country Status (7)
Country | Link |
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US (1) | US20030017788A1 (en) |
EP (1) | EP1268127B1 (en) |
JP (2) | JP2001259978A (en) |
AT (1) | ATE296713T1 (en) |
AU (1) | AU2001247271A1 (en) |
DE (1) | DE60111203D1 (en) |
WO (1) | WO2001066307A2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005093948A1 (en) * | 2004-03-26 | 2005-10-06 | Hitachi Kokusai Electric Inc. | Amplifier |
US20070298240A1 (en) * | 2006-06-22 | 2007-12-27 | Gobena Feben T | Compressible abrasive article |
US7303464B1 (en) * | 2006-10-13 | 2007-12-04 | 3M Innovative Properties Company | Contact wheel |
DE102009030294B4 (en) * | 2009-06-24 | 2013-04-25 | Siltronic Ag | Process for polishing the edge of a semiconductor wafer |
CN102985386B (en) * | 2010-07-08 | 2015-09-02 | 旭硝子株式会社 | The evaluation method of glass substrate end face and the working method of glass substrate end face and glass substrate |
GB2482345A (en) * | 2010-07-30 | 2012-02-01 | Vestas Wind Sys As | Tapering an edge of a fibrous reinforcement sheet using a rotary tool |
US8721392B2 (en) * | 2011-06-28 | 2014-05-13 | Corning Incorporated | Glass edge finishing method |
SG192302A1 (en) * | 2012-01-18 | 2013-08-30 | Avanstrate Inc | Method of making glass sheet |
EP3099640B1 (en) * | 2014-01-27 | 2022-01-12 | Corning Incorporated | Edge chamfering by mechanically processing laser cut glass |
JP2019171520A (en) * | 2018-03-28 | 2019-10-10 | 株式会社ノリタケカンパニーリミテド | Resinoid grinding wheel |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2324616A1 (en) * | 1972-05-17 | 1973-12-06 | S P A M | GRINDING TOOLS |
CH559593A5 (en) * | 1973-01-26 | 1975-03-14 | Moon Star Chemical Corp | Helical honing tool for gear wheel - has abrasive particles embedded in polymer esp. mixt. of polyurethane and epoxy resin |
DE2730665A1 (en) * | 1977-07-07 | 1979-01-11 | Lippert H Gmbh | Grindstones for wet grinding - contg. curable hydrophilic satd. polyester or epoxy! resin binder |
EP0042932A3 (en) * | 1980-06-30 | 1984-07-25 | International Business Machines Corporation | A process for the manufacture of hollow tube-like members |
US4525958A (en) * | 1981-11-19 | 1985-07-02 | Ppg Industries, Inc. | Method of controlling article speed during edge grinding |
JPS6062464A (en) * | 1983-09-10 | 1985-04-10 | Kawasaki Steel Corp | Side end grinding attachment for metallic belt by rotary grinding wheel |
JPS6165762A (en) * | 1984-09-06 | 1986-04-04 | Nippon Sheet Glass Co Ltd | Grinding device for end face of a plate |
IT1190474B (en) * | 1986-03-04 | 1988-02-16 | Siv Soc Italiana Vetro | Edge grinding edge grinder for sheet glass |
JP2719855B2 (en) * | 1991-05-24 | 1998-02-25 | 信越半導体株式会社 | Mirror chamfering device around wafer |
JPH081493A (en) * | 1994-06-17 | 1996-01-09 | Shin Etsu Handotai Co Ltd | Mirror finished surface polishing method for wafer chamfering part and mirror finished surface polishing device |
TW383322B (en) * | 1994-11-02 | 2000-03-01 | Norton Co | An improved method for preparing mixtures for abrasive articles |
US5569062A (en) * | 1995-07-03 | 1996-10-29 | Speedfam Corporation | Polishing pad conditioning |
US5868603A (en) * | 1996-12-12 | 1999-02-09 | Corning Incorporated | Method for edge finishing glass sheets |
US6022268A (en) * | 1998-04-03 | 2000-02-08 | Rodel Holdings Inc. | Polishing pads and methods relating thereto |
KR20000076987A (en) * | 1999-03-31 | 2000-12-26 | 다구마시로오 | Method and apparatus for grinding a workpiece |
US6213855B1 (en) * | 1999-07-26 | 2001-04-10 | Speedfam-Ipec Corporation | Self-powered carrier for polishing or planarizing wafers |
US6267649B1 (en) * | 1999-08-23 | 2001-07-31 | Industrial Technology Research Institute | Edge and bevel CMP of copper wafer |
JP2001121430A (en) * | 1999-10-25 | 2001-05-08 | Noritake Co Ltd | Grinding wheel with bushing |
US6722964B2 (en) * | 2000-04-04 | 2004-04-20 | Ebara Corporation | Polishing apparatus and method |
-
2000
- 2000-03-07 JP JP2000061915A patent/JP2001259978A/en active Pending
-
2001
- 2001-03-06 AT AT01920194T patent/ATE296713T1/en not_active IP Right Cessation
- 2001-03-06 DE DE60111203T patent/DE60111203D1/en not_active Expired - Lifetime
- 2001-03-06 US US10/204,997 patent/US20030017788A1/en active Pending
- 2001-03-06 AU AU2001247271A patent/AU2001247271A1/en not_active Abandoned
- 2001-03-06 JP JP2001564946A patent/JP2003525759A/en not_active Withdrawn
- 2001-03-06 EP EP01920194A patent/EP1268127B1/en not_active Expired - Lifetime
- 2001-03-06 WO PCT/US2001/006940 patent/WO2001066307A2/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE60111203D1 (en) | 2005-07-07 |
JP2003525759A (en) | 2003-09-02 |
WO2001066307A3 (en) | 2002-03-28 |
JP2001259978A (en) | 2001-09-25 |
AU2001247271A1 (en) | 2001-09-17 |
ATE296713T1 (en) | 2005-06-15 |
EP1268127A2 (en) | 2003-01-02 |
WO2001066307A2 (en) | 2001-09-13 |
US20030017788A1 (en) | 2003-01-23 |
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