EP1224067A1 - Device and method for separating materials - Google Patents
Device and method for separating materialsInfo
- Publication number
- EP1224067A1 EP1224067A1 EP01984580A EP01984580A EP1224067A1 EP 1224067 A1 EP1224067 A1 EP 1224067A1 EP 01984580 A EP01984580 A EP 01984580A EP 01984580 A EP01984580 A EP 01984580A EP 1224067 A1 EP1224067 A1 EP 1224067A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- cutting
- cutting disc
- supplied
- cooling lubricant
- lubricant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
Definitions
- the invention relates to a device and a method for separating materials, in particular single crystals.
- FIG. 1 is a schematic representation of the inner hole cutting in a plan view seen in the direction of the central longitudinal axis M of a single crystal 1.
- the single crystal 1 which is substantially cylindrical with a central longitudinal axis M, is on a not shown Mounted bracket and together with this movable in a direction perpendicular to the central longitudinal axis M via a feed device, not shown.
- a cutting disc 2 For cutting or cutting the wafers, a cutting disc 2 is provided, which consists of a core sheet 2a having a concentric inner hole, the edge 3 of which surrounds the inner hole is occupied by diamond grains and thus forms a cutting edge.
- the width of the core Sheet between its outer edge and its inner edge is larger than the diameter of the single crystal, which is why only the inner edge is shown schematically in the figure.
- the cutting disc 2 can be rotated about its central axis R via a drive in the direction A shown in FIG. 1.
- the cutting disc and the single crystal are arranged with respect to one another such that the axis of rotation R of the cutting disc 2 and the central longitudinal axis M of the single crystal 1 run parallel to one another at a distance.
- the single crystal 1 can be moved by means of the feed device perpendicular to its central longitudinal axis M in the direction of the cutting disc 2 so that the cutting disc completely rotates through the single crystal 1 in a plane perpendicular to its central longitudinal axis M, and away from the cutting disc 2 into a position movable in which a separated wafer can be removed.
- a coolant-lubricant supply device 4 for supplying coolant-lubricant to the cutting edge intended.
- a second supply device for cooling lubricants is provided in the direction of rotation A after the position P2 of the exit of the cutting disc from the single crystal 1, hereinafter referred to as the exit side.
- the cooling lubricant is applied to the cutting edge or the cutting disc 2 via the feed device 4, which is then transported by the rotation of the cutting disc 2 into the separation gap formed during the cutting.
- cooling lubricant is again applied by the second feed device 5. brings, so that the cleaning and removal of removed material is ensured through the separation gap. Additives are added to the cooling lubricant, which reduce the surface tension and thus improve the wetting of the cutting disc.
- the known device also has a device for interval flushing of the core sheet and the clamping system.
- the known device has the problem that effective cleaning and the removal of the removed material during the cut requires so much cooling lubricant that the separation gap is filled with cooling lubricant and removed material. This can lead to contact between the core plate of the cutting disc 2 and the wafer section in the case of narrow separation gaps. The wafer section is pulled onto the core sheet by adhesion, and the quality of the separated wafer is adversely affected. With large contact areas, the wafer can tear away. If, on the other hand, the amount of coolant lubricant is too low, the cleaning and transport effect is no longer sufficient. In addition, surface-relaxing additives lead to better wetting of the core sheet, which promotes the evaporation and drying of the sawing sludge on the core sheet.
- the device according to the invention and the method according to the invention have the particular advantage that less cooling lubricant is required during the separation process than in the known device. This creates a high quality cut.
- Figure 1 is a schematic representation seen in plan view in the direction of a single crystal longitudinal axis of a known device.
- Figure 2 is a schematic representation of an embodiment of the device according to the invention seen in plan view in the direction of the single crystal central longitudinal axis.
- FIG. 3 shows a schematic illustration of the cooling step of the method according to the invention
- Fig. 4 is a schematic representation of a step of
- Fig. 6 is a schematic representation of the cleaning step in the method according to the invention.
- the device according to the invention has, in a known manner, the holder and the feed device for the single crystal 1, as well as the cutting disc 2 with the core sheet 2a and the diamond-grained edge 3 of the inner hole of the cutting disc.
- the device according to the invention has a first supply device 10 for supplying cooling lubricant to the edge 3 of the inner hole and to the cutting disc 2, which seen in the direction of rotation of the cutting disc 2 on the outlet side at position P2 after passing through the Single crystal 1 is provided.
- the first supply device 10 for cooling lubricants is designed, for example, as a nozzle.
- a second feed device 11 for cleaning agents is provided on the outlet side in the region of the inner hole.
- a device 12 for supplying a gaseous medium, in particular compressed air, to the cutting disc 2 and in particular the edge 3 is also provided on the outlet side.
- FIGS. 3 to 6 The operation of the device according to the invention and the method according to the invention can be seen from FIGS. 3 to 6.
- the cutting disc 2 and the single crystal 1 are separated from one another before the cutting or cutting process.
- the single crystal 1 is moved relative to the cutting disc 2 and this enters the material of the single crystal 1 in a rotating manner for cutting.
- cooling lubricant with a low volume flow ie at low speed v and low pressure p
- a cooling lubricant with an additive is used as the cooling lubricant, which increases the surface tension ⁇ of the cooling lubricant and thus worsens the wetting of the core sheet 2a.
- the core sheet 2a of the cutting disc 2 is poorly wetted, and droplets 20 of the cooling lubricant form on the surface of the core sheet 2a.
- compressed air is blown onto the edge 3 via the compressed air source 12, whereby the poor wetting is compensated for.
- the compressed air further contributes to the formation and distribution of droplets 20.
- FIG. 5 during the cutting process, the cutting disc 2 with the edge 3 and the droplets 20 of the cooling lubricant formed on the surface of the core sheet 2a penetrate into the single crystal 1 in order to separate a wafer section 1a. Air and coolant lubricant of low pressure p are constantly supplied.
- the droplets 20 of the cooling lubricant on the core sheet 2a absorb the removed material for the time of the cut and distribute it on the core sheet without the wafer drying up or being touched.
- the single crystal 1 and the separated wafer are moved away from the cutting disc 2 via the feed device, so that the cutting disc and the single crystal or the separated wafer are separated from one another, as shown in FIG. 6.
- the cleaning and the removal of the material accumulated on the core sheet and enclosed in the droplets 20 is carried out by supplying compressed air at high pressure p via the feed device 12 and at the same time supplying detergent in sufficient quantity and at a higher speed v via the feed device 11 ,
- the method according to the invention is a two-stage method, in which during the cutting process the cooling of the cutting tool, the swirling of the coolant, the inclusion of the removed material in the coolant-lubricant droplets and the distribution and storage of the coolant-lubricant droplets with the removed material under the influence of the Centrifugal force.
- the removed material is removed and removed using high air pressure and a sufficient supply of coolant and lubricant.
- the cleaning agent used in the second stage can be identical to the cooling lubricant, but it can also be another substance, such as water. Cooling lubricants and cleaning agents can therefore have different properties.
- cooling lubricant is required for cooling and lubricating than for cleaning and removing the removed material.
- a high quality cut can only be made with such a small amount of coolant and lubricant.
- the amount of cooling lubricant is set to the minimum required to guarantee cooling and lubrication.
- the separation gap is free and contact between the core sheet and the wafer section is avoided.
- a container 30 is provided for supplying cooling lubricant to the supply device 10, which dispenses the small amount of cooling lubricant during the separation process, and is in a constant position in the working position Distance is located above the feed device 10 and which is connected to it via a line 31.
- cooling lubricant which is fed to the feed device 10 via the line only under the influence of gravity or the hydrostatic pressure. Air bubbles in the line are discharged upwards. This ensures that a constant and bubble-free supply is ensured even with small quantities of coolant to be supplied.
- the invention is suitable for cutting a wide variety of materials, e.g. for optical glasses, plastics and others.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
A method and a device for the division of materials, in particular of single crystals, in particular by inner hole cutting is provided, with a cutting disk (2) having a concentric hole whose edge (3) forms a cutting edge and wherein the cutting disk (2) is rotatable about its central axis in order to cut the single crystal (1), a positioning device for positioning the single crystal (1) to be cut relative to the cutting disk in such a way that the cutting disk moves in rotating manner through the single crystal in order to separate off a part (1a) of the single crystal (1), and a device for the supply of coolant-lubricant onto the cutting disk (2), wherein the device (10) for the supply of coolant-lubricant is arranged in such a way that viewed in the direction of rotation it supplies the coolant-lubricant on the exit side behind the passage of the cutting disk (2) through the single crystal (1), and a device for the supply of compressed air (12).
Description
Vorrichtung μnd Verfahren zum Trennen von Werkstoffen Device and method for separating materials
Die Erfindung betrifft eine Vorrichtung und ein Verfahren zum Trennen von Werkstoffen, insbesondere von Einkristallen.The invention relates to a device and a method for separating materials, in particular single crystals.
Ein bekanntes Verfahren zum Trennen von Einkristallen, das insbesondere zur Erzeugung von Halbleiterwafern eingesetzt wird, ist das Innenlochtrennen. Fig. 1 ist eine schematische Darstellung zum Innenlochtrennen in einer Draufsicht gesehen in Richtung der Mittenlängsachse M eines Einkristalls 1. Wie aus Fig. 1 ersichtlich ist, ist der Einkristall 1, der im wesentlichen zylinderförmig mit einer Mittenlängsachse M ausgebildet ist, auf einer nicht dargestellten Halterung angebracht und zusammen mit dieser in einer Richtung senkrecht zur Mittenlängsachse M über eine nicht dargestellte Vorschubeinrichtung verfahrbar. Zum Trennen bzw. Schneiden der Wafer ist eine Trennscheibe 2 vorgesehen, die aus einem ein konzentrisches Innenloch aufweisenden Kernblech 2a besteht, dessen das Innenloch umgebender Rand 3 mit Diamantkörnern besetzt ist und somit einen Schneidrand bildet. Die Breite des Kern-
bleches zwischen seinem äußeren Rand und seinem inneren Rand ist größer als der Durchmesser des Einkristalls, weshalb in der Figur schematisch nur der innere Rand dargestellt ist. Die Trennscheibe 2 ist um ihre zentrale Achse R über einen Antrieb in der in Fig. 1 gezeigten Richtung A drehbar. Die Trennscheibe und der Einkristall sind so zueinander angeordnet, dass die Rotationsachse R der Trennscheibe 2 und die Mittenlängsachse M des Einkristalls 1 in einem Abstand parallel zueinander verlaufen. Ferner ist der Einkristall 1 mittels der Vorschubeinrichtung senkrecht zu seiner Mittenlängsachse M in Richtung auf die Trennscheibe 2 hin bewegbar so daß die Trennscheibe beim Rotieren den Einkristall 1 vollständig in einer Ebene senkrecht zu seiner Mittenlängsachse M durchschneidet, und von der Trennscheibe 2 weg in eine Stellung bewegbar in der ein abgetrennter Wafer entnommen werden kann.A known method for separating single crystals, which is used in particular for the production of semiconductor wafers, is inner hole separation. Fig. 1 is a schematic representation of the inner hole cutting in a plan view seen in the direction of the central longitudinal axis M of a single crystal 1. As can be seen from Fig. 1, the single crystal 1, which is substantially cylindrical with a central longitudinal axis M, is on a not shown Mounted bracket and together with this movable in a direction perpendicular to the central longitudinal axis M via a feed device, not shown. For cutting or cutting the wafers, a cutting disc 2 is provided, which consists of a core sheet 2a having a concentric inner hole, the edge 3 of which surrounds the inner hole is occupied by diamond grains and thus forms a cutting edge. The width of the core Sheet between its outer edge and its inner edge is larger than the diameter of the single crystal, which is why only the inner edge is shown schematically in the figure. The cutting disc 2 can be rotated about its central axis R via a drive in the direction A shown in FIG. 1. The cutting disc and the single crystal are arranged with respect to one another such that the axis of rotation R of the cutting disc 2 and the central longitudinal axis M of the single crystal 1 run parallel to one another at a distance. Furthermore, the single crystal 1 can be moved by means of the feed device perpendicular to its central longitudinal axis M in the direction of the cutting disc 2 so that the cutting disc completely rotates through the single crystal 1 in a plane perpendicular to its central longitudinal axis M, and away from the cutting disc 2 into a position movable in which a separated wafer can be removed.
Innerhalb des das Innenloch umgebenden Randes 3 der Trennscheibe 2 ist in Drehrichtung A vor der Position Pl des Eintritts der Trennscheibe in den Einkristall 1, nachfolgend als eintrittsseitig bezeichnet, eine Kühl-Schmiermittel-Zuführ- Vorrichtung 4 zum Zuführen von Kühl-Schmiermittel auf den Schneidrand vorgesehen. In Drehrichtung A nach der Position P2 des Austritts der Trennscheibe aus dem Einkristall 1, nachfolgend als austrittsseitig bezeichnet, ist eine zweite Zuführeinrichtung für Kühl-Schmiermittel vorgesehen. Im Betrieb wird vor dem Eintritt der Trennscheibe 2 in den Einkristall 1 über die Zuführvorrichtung 4 das Kühl-Schmiermittel auf den Schneidrand bzw. die Trennscheibe 2 aufgebracht, welches dann durch die Rotation der Trennscheibe 2 in den beim Trennen entstehenden Trennspalt transportiert wird. Beim Austritt der Trennscheibe 2 aus dem Einkristall 1 wird durch die zweite Zuführeinrichtung 5 erneut Kühl-Schmiermittel aufge-
bracht, so daß die Reinigung und der Abtransport von abgetragenem Material durch den Trennspalt gewährleistet ist. Dem Kühl-Schmiermittel werden Zusätze zugegeben, die die Oberflächenspannung herabsetzen und damit die Benetzung der Trennscheibe verbessern. Die bekannte Vorrichtung weist ferner eine Vorrichtung zur IntervallSpülung des Kernbleches und des Spannsystems auf .Within the edge 3 of the cutting disc 2 surrounding the inner hole, in the direction of rotation A, before the position Pl of the cutting disc entering the single crystal 1, hereinafter referred to as the entry side, there is a coolant-lubricant supply device 4 for supplying coolant-lubricant to the cutting edge intended. In the direction of rotation A after the position P2 of the exit of the cutting disc from the single crystal 1, hereinafter referred to as the exit side, a second supply device for cooling lubricants is provided. In operation, before the cutting disc 2 enters the single crystal 1, the cooling lubricant is applied to the cutting edge or the cutting disc 2 via the feed device 4, which is then transported by the rotation of the cutting disc 2 into the separation gap formed during the cutting. When the cutting disc 2 emerges from the single crystal 1, cooling lubricant is again applied by the second feed device 5. brings, so that the cleaning and removal of removed material is ensured through the separation gap. Additives are added to the cooling lubricant, which reduce the surface tension and thus improve the wetting of the cutting disc. The known device also has a device for interval flushing of the core sheet and the clamping system.
Bei der bekannten Vorrichtung besteht das Problem, daß ein effektives Reinigen und der Abtransport des abgetragenen Materials während des Schnittes so viel Kühl-Schmiermittel erfordert, daß der Trennspalt mit Kühl-Schmiermittel und abgetragenem Material angefüllt wird. Dadurch kann es bei schmalen Trennspalten zur Berührung zwischen dem Kernblech der Trennscheibe 2 und dem Waferabschnitt kommen. Der Waferab- schnitt wird durch Adhäsion an das Kernblech gezogen, und die Qualität des abgetrennten Wafers wird negativ beeinflußt. Bei großen Berührungsflächen kann es zum Wegreißen des Wafers kommen. Ist dagegen die Kühl-Schmiermittelmenge zu niedrig, reicht die Reinigungs- und Transportwirkung nicht mehr aus. Außerdem führen oberflächenentspannende Zusätze zu einer besseren Benetzung des Kernblechs, was die Verdunstung und das Eintrocknen des Sägeschlammes auf dem Kernblech fördert.The known device has the problem that effective cleaning and the removal of the removed material during the cut requires so much cooling lubricant that the separation gap is filled with cooling lubricant and removed material. This can lead to contact between the core plate of the cutting disc 2 and the wafer section in the case of narrow separation gaps. The wafer section is pulled onto the core sheet by adhesion, and the quality of the separated wafer is adversely affected. With large contact areas, the wafer can tear away. If, on the other hand, the amount of coolant lubricant is too low, the cleaning and transport effect is no longer sufficient. In addition, surface-relaxing additives lead to better wetting of the core sheet, which promotes the evaporation and drying of the sawing sludge on the core sheet.
Es ist Aufgabe der Erfindung, eine Vorrichtung und ein Verfahren zum Trennen von Wafern mittels Innenlochtrennen bereitzustellen, welche bzw. welches die oben beschriebenen Nachteile vermeidet.It is an object of the invention to provide a device and a method for cutting wafers by means of inner hole cutting, which or which avoids the disadvantages described above.
Die Aufgabe wird gelöst durch eine Vorrichtung nach Patentanspruch 1 bzw. 14 bzw. ein Verfahren nach Patentanspruch 8 bzw. 16.
Weiterbildungen der Erfindung sind in den Unteransprüchen angegeben.The object is achieved by a device according to patent claims 1 and 14 and a method according to patent claims 8 and 16, respectively. Developments of the invention are specified in the subclaims.
Die erfindungsgemäße Vorrichtung und das erfindungsgemäße Verfahren weisen insbesondere den Vorteil auf, daß während des Trennvorgangs weniger Kühl-Schmiermittel benötigt wird als bei der bekannten Vorrichtung. Dadurch wird ein qualitativ hochwertiger Schnitt erzeugt.The device according to the invention and the method according to the invention have the particular advantage that less cooling lubricant is required during the separation process than in the known device. This creates a high quality cut.
Weitere Merkmale und Zweckmäßigkeiten der Erfindung ergeben sich aus der Beschreibung von Ausführungsbeispielen anhand der Figuren.Further features and advantages of the invention result from the description of exemplary embodiments with reference to the figures.
Von den Figuren zeigen:From the figures show:
Fig. 1 eine schematische Darstellung gesehen in Draufsicht in Richtung einer Einkristall-Längsachse einer bekannten Vorrichtung;Figure 1 is a schematic representation seen in plan view in the direction of a single crystal longitudinal axis of a known device.
Fig. 2 eine schematische Darstellung einer Ausführungsform der erfindungsgemäßen Vorrichtung gesehen in Draufsicht in Richtung der Einkristall-Mittenlängsachse;Figure 2 is a schematic representation of an embodiment of the device according to the invention seen in plan view in the direction of the single crystal central longitudinal axis.
Fig. 3 eine schematische Darstellung des Kühlungsschrittes des erfindungsgemäßen Verfahrens;3 shows a schematic illustration of the cooling step of the method according to the invention;
Fig. 4 eine schematische Darstellung eines Schrittes desFig. 4 is a schematic representation of a step of
Verteilens des Kühl-Schmiermittels auf dem Trennwerkzeug vor dem Schnitt;Distributing the cooling lubricant on the cutting tool before cutting;
Fig. 5 eine schematische Darstellung des Schrittes des Tren- nens; und
Fig. 6 eine schematische Darstellung des Reinigungsschrittes bei dem erfindungsgemäßen Verfahren.5 shows a schematic illustration of the separation step; and Fig. 6 is a schematic representation of the cleaning step in the method according to the invention.
Wie aus den Fig. 2 ersichtlich ist, weist die erfindungsgemäße Vorrichtung in bekannter Weise die Halterung und die Vorschubeinrichtung für den Einkristall 1, sowie die Trennscheibe 2 mit dem Kernblech 2a und dem diamantkornbesetzten Rand 3 des Innenloches der Trennscheibe. Im Unterschied zu der bekannten Vorrichtung weist die erfindungsgemäße Vorrichtung eine erste Zuführeinrichtung 10 zum Zuführen von Kühl- Schmiermittel auf den Rand 3 des Innenloches und auf die Trennscheibe 2 auf, welche in Rotationsrichtung der Trennscheibe 2 gesehen austrittsseitig an der Position P2 nach dem Durchtritt durch den Einkristall 1 vorgesehen ist. Die erste Zuführeinrichtung 10 für Kühl-Schmiermittel ist beispielsweise als Düse ausgebildet. Ferner ist eine zweite Zuführeinrichtung 11 für Reinigungsmittel austrittsseitig im Bereich des Innenlochs vorgesehen. Außerdem ist ebenfalls austrittsseitig eine Einrichtung 12 zum Zuführen von eines gasförmigen Mediums, insbesondere von Druckluft, auf die Trennscheibe 2 und insbesondere den Rand 3 vorgesehen.As can be seen from FIG. 2, the device according to the invention has, in a known manner, the holder and the feed device for the single crystal 1, as well as the cutting disc 2 with the core sheet 2a and the diamond-grained edge 3 of the inner hole of the cutting disc. In contrast to the known device, the device according to the invention has a first supply device 10 for supplying cooling lubricant to the edge 3 of the inner hole and to the cutting disc 2, which seen in the direction of rotation of the cutting disc 2 on the outlet side at position P2 after passing through the Single crystal 1 is provided. The first supply device 10 for cooling lubricants is designed, for example, as a nozzle. Furthermore, a second feed device 11 for cleaning agents is provided on the outlet side in the region of the inner hole. In addition, a device 12 for supplying a gaseous medium, in particular compressed air, to the cutting disc 2 and in particular the edge 3 is also provided on the outlet side.
Der Betrieb der erfindungsgemäßen Vorrichtung und das erfindungsgemäße Verfahren ist aus den Figuren 3 bis 6 ersichtlich. Vor dem Schneid- bzw. Trennvorgang sind die Trennscheibe 2 und der Einkristall 1 voneinander getrennt. Dann wird der Einkristall 1 relativ zu der Trennscheibe 2 bewegt und diese tritt rotierend in das Material des Einkristalls 1 zum Trennen ein. Wie in Fig. 3 gezeigt ist, wird während des Trennvorganges über die Zuführeinrichtung 10 Kühl-Schmiermittel mit einem geringen Volumenstrom, d.h. mit geringer Geschwindigkeit v und geringem Druck p dem Rand 3 , der den Schneidrand bildet, über die Zuführeinrichtung 10 zugeführt.
Als Kühl-Schmiermittel wird ein Kühl-Schmiermittel mit einem Zusatz verwendet, der die Oberflächenspannung σ des Kühl- Schmiermittels erhöht und somit die Benetzung des Kernbleches 2a verschlechtert. Dadurch kommt es zu einer schlechten Benetzung des Kernblechs 2a der Trennscheibe 2, und es bilden sich Tröpfchen 20 des Kühl-Schmiermittels an der Oberfläche des Kernbleches 2a. Ebenfalls während des Trennvorganges wird, wie in Fig. 4 gezeigt ist, Druckluft über die Druckluftquelle 12 auf den Rand 3 geblasen, wodurch die schlechte Benetzung ausgeglichen wird. Die Druckluft trägt weiterhin zur Bildung von Tröpfchen 20 und zur Verteilung derselben bei. Wie in Fig. 5 gezeigt ist, dringt während des Trennvorgangs die Trennscheibe 2 mit dem Rand 3 und den auf der Oberfläche des Kernblechs 2a entstandenen Tröpfchen 20 des Kühl- Schmiermittels in den Einkristall 1 zum Abtrennen eines Wa- ferabschnitts la ein. Es wird ständig Luft und Kühl-Schmiermittel geringen Drucks p zugeführt. Die Tröpfchen 20 des Kühl-Schmiermittels auf dem Kernblech 2a nehmen für die Zeit des Schnittes das abgetragene Material auf und verteilen es auf dem Kernblech, ohne daß es zu einem Eintrocknen oder zu einer Berührung des Wafers kommt.The operation of the device according to the invention and the method according to the invention can be seen from FIGS. 3 to 6. The cutting disc 2 and the single crystal 1 are separated from one another before the cutting or cutting process. Then the single crystal 1 is moved relative to the cutting disc 2 and this enters the material of the single crystal 1 in a rotating manner for cutting. As shown in FIG. 3, cooling lubricant with a low volume flow, ie at low speed v and low pressure p, is fed to the edge 3, which forms the cutting edge, via the feed device 10 during the separation process. A cooling lubricant with an additive is used as the cooling lubricant, which increases the surface tension σ of the cooling lubricant and thus worsens the wetting of the core sheet 2a. As a result, the core sheet 2a of the cutting disc 2 is poorly wetted, and droplets 20 of the cooling lubricant form on the surface of the core sheet 2a. Also during the separation process, as shown in FIG. 4, compressed air is blown onto the edge 3 via the compressed air source 12, whereby the poor wetting is compensated for. The compressed air further contributes to the formation and distribution of droplets 20. As shown in FIG. 5, during the cutting process, the cutting disc 2 with the edge 3 and the droplets 20 of the cooling lubricant formed on the surface of the core sheet 2a penetrate into the single crystal 1 in order to separate a wafer section 1a. Air and coolant lubricant of low pressure p are constantly supplied. The droplets 20 of the cooling lubricant on the core sheet 2a absorb the removed material for the time of the cut and distribute it on the core sheet without the wafer drying up or being touched.
Nach dem Trennvorgang wird der Einkristall 1 und der abgetrennte Wafer über die Vorschubeinrichtung von der Trennscheibe 2 wegbewegt, so daß Trennscheibe und Einkristall bzw. der getrennte Wafer voneinander getrennt sind, wie in Fig. 6 gezeigt ist. Jetzt wird die Reinigung und der Abtransport des auf dem Kernblech aufgestauten und in den Tröpfchen 20 eingeschlossenen Materials durchgeführt, indem Druckluft mit hohem Druck p über die Zuführeinrichtung 12 zugeführt wird und gleichzeitig Reinigungsmittel in ausreichender Menge und mit größerer Geschwindigkeit v über die Zuführeinrichtung 11 zugeführt wird.
Somit ist das erfindungsgemäße Verfahren ein zweistufiges Verfahren, bei dem während des Trennvorgangs die Kühlung des Trennwerkzeugs, das Verwirbeln des Kühlmittels, das Einschließen des abgetragenen Materials in die Kühl-Schmiermitteltröpfchen und das Verteilen und Speichern der Kühl- Schmiermitteltröpfchen mit dem abgetragenen Material unter Einwirkung der Fliehkraft erfolgt. In einer zweiten Stufe wird, nachdem der Einkristall von der Trennscheibe weggefahren ist, die Reinigung und der Abtransport abgetragenen Materials über hohen Luftdruck und ausreichend Kühl-Schmiermittelzufuhr vorgenommen. Das in der zweiten Stufe verwendete Reinigungsmittel kann identisch mit dem Kühl-Schmiermittel sein, es kann jedoch auch eine andere Substanz, wie z.B. Wasser sein. Somit können Kühl-Schmiermittel und Reinigungsmittel unterschiedliche Eigenschaften haben.After the cutting process, the single crystal 1 and the separated wafer are moved away from the cutting disc 2 via the feed device, so that the cutting disc and the single crystal or the separated wafer are separated from one another, as shown in FIG. 6. Now the cleaning and the removal of the material accumulated on the core sheet and enclosed in the droplets 20 is carried out by supplying compressed air at high pressure p via the feed device 12 and at the same time supplying detergent in sufficient quantity and at a higher speed v via the feed device 11 , Thus, the method according to the invention is a two-stage method, in which during the cutting process the cooling of the cutting tool, the swirling of the coolant, the inclusion of the removed material in the coolant-lubricant droplets and the distribution and storage of the coolant-lubricant droplets with the removed material under the influence of the Centrifugal force. In a second stage, after the single crystal has moved away from the cutting disc, the removed material is removed and removed using high air pressure and a sufficient supply of coolant and lubricant. The cleaning agent used in the second stage can be identical to the cooling lubricant, but it can also be another substance, such as water. Cooling lubricants and cleaning agents can therefore have different properties.
Bei dem erfindungsgemäßen Verfahren wird zum Kühlen und Schmieren sehr viel weniger Kühl-Schmiermittel benötigt als zum Reinigen und Abtransport des abgetragenen Materials. Ein qualitativ hochwertiger Schnitt läßt sich nur mit einer solch geringen Kühl-Schmiermittelmenge durchführen. Während des eigentlichen Trennvorganges wird die Kühl-Schmiermittelmenge auf die minimal erforderliche Menge eingestellt, um die Kühlung und Schmierung zu garantieren. Der Trennspalt ist frei und die Berührung zwischen Kernblech und Waferabschnitt wird vermieden. Bei der Reinigung ist jedoch ein wesentlich höherer Volumenstrom optimal . Diese Erfordernisse widersprechen sich. Die Kühlung und Reinigung wird daher zeitlich voneinander getrennt, da für beide Schritte unterschiedliche Volumenströme optimal sind.
Anstelle der Zuführung von Druckluft ist es auch möglich ein anderes Gas, z.B. Stickstoff zuzuführen.In the method according to the invention, much less cooling lubricant is required for cooling and lubricating than for cleaning and removing the removed material. A high quality cut can only be made with such a small amount of coolant and lubricant. During the actual separation process, the amount of cooling lubricant is set to the minimum required to guarantee cooling and lubrication. The separation gap is free and contact between the core sheet and the wafer section is avoided. When cleaning, however, a significantly higher volume flow is optimal. These requirements contradict each other. The cooling and cleaning are therefore separated in time, since different volume flows are optimal for both steps. Instead of supplying compressed air, it is also possible to supply another gas, for example nitrogen.
In einer bevorzugten Ausführungsform ist, wie in Fig. 2 gezeigt ist, zur Zuführung von Kühl-Schmiermittel zu der Zuführeinrichtung 10, die die geringe Menge an Kühl-Schmier- mittel während des Trennvorgangs abgibt, ein Behälter 30 vorgesehen der sich in Arbeitsstellung in konstantem Abstand oberhalb der Zuführeinrichtung 10 befindet und der über eine Leitung 31 mit dieser verbunden ist. In dem Behälter befindet sich Kühl-Schmiermittel, welches der Zuführeinrichtung 10 über die Leitung nur unter dem Einfluß der Gravitation bzw. dem hydrostatischen Druck zugeführt wird. Luftblasen in der Leitung werden nach oben abgeführt. Somit wird gewährleistet, dass auch bei geringen zuzuführenden Mengen an Kühl-Schmier- mittel die konstante und blasenfreie Zufuhr gewährleistet ist.In a preferred embodiment, as shown in FIG. 2, a container 30 is provided for supplying cooling lubricant to the supply device 10, which dispenses the small amount of cooling lubricant during the separation process, and is in a constant position in the working position Distance is located above the feed device 10 and which is connected to it via a line 31. In the container there is cooling lubricant which is fed to the feed device 10 via the line only under the influence of gravity or the hydrostatic pressure. Air bubbles in the line are discharged upwards. This ensures that a constant and bubble-free supply is ensured even with small quantities of coolant to be supplied.
Die Erfindung ist zum Trennen verschiedenster Werkstoffe geeignet, z.B. für optische Gläser, Kunststoffe und andere.
The invention is suitable for cutting a wide variety of materials, e.g. for optical glasses, plastics and others.
Claims
1. Vorrichtung zum Trennen von Werkstoffen, insbesondere von Einkristallen, mit einer Trennscheibe (2) mit einem konzentrischen Loch dessen Rand (3) einen Schneidrand bildet, wobei die Trennscheibe (2) um ihre zentrale Achse drehbar ist zum Trennen des Werkstoffes (1) , einer Positioniereinrichtung zum Positionieren des zu trennenden Werkstoffes (1) derart zu der Trennscheibe, dass sich die Trennscheibe beim Trennen rotierend durch den Werkstoff bewegt zum Abtrennen eines Teiles (la) des Werkstoffes (1) , und einer Einrichtung zum Zuführen von Kühl-Schmiermittel auf die Trennscheibe (2) , gekennzeichnet durch, eine Einrichtung (12) zum Zuführen eines gasförmigen Mediums auf die Trennscheibe .1. Device for separating materials, in particular single crystals, with a cutting disc (2) with a concentric hole whose edge (3) forms a cutting edge, the cutting disc (2) being rotatable about its central axis for separating the material (1) , a positioning device for positioning the material (1) to be separated in such a way that the cutting disc rotates through the material during separation to separate a part (la) of the material (1), and a device for supplying cooling lubricant on the cutting disc (2), characterized by a device (12) for supplying a gaseous medium to the cutting disc.
2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß die Einrichtung (10) zum Zuführen von Kühl-Schmiermittel und die Einrichtung (12) zum Zuführen eines gasförmigen Mediums derart angeordnet sind, dass das Kühl-Schmiermittel und das gasförmige Medium austrittsseitig hinter dem Durchtritt der Trennscheibe (2) durch den Werkstoff (1) zugeführt werden.2. Device according to claim 1, characterized in that the device (10) for supplying cooling lubricant and the device (12) for supplying a gaseous medium are arranged such that the cooling lubricant and the gaseous medium on the outlet side behind the passage the cutting disc (2) through the material (1) are supplied.
3. Vorrichtung nach Anspruch 1 oder 2 , dadurch gekennzeichnet, daß austrittsseitig eine Einrichtung (11) zum Zuführen eines Reinigungsmittels, insbesondere von Kühl-Schmiermittel, vorgesehen ist.3. Apparatus according to claim 1 or 2, characterized in that a device (11) for supplying a cleaning agent, in particular cooling lubricant, is provided on the outlet side.
4. Vorrichtung nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass die die Einrichtung (12) zum Zuführen eines gasförmigen Mediums und/oder die Einrichtungen (10, 11) jeweils eine Düse aufweisen, die so ausgebildet ist, dass das gasförmige Medium bzw. das Kühl-Schmiermittel auf den Rand (3) aufgebracht werden.4. Device according to one of claims 1 to 3, characterized in that the device (12) for feeding of a gaseous medium and / or the devices (10, 11) each have a nozzle which is designed such that the gaseous medium or the cooling lubricant are applied to the edge (3).
5. Vorrichtung nach einem der Ansprüche 1 bis 4, gekennzeichnet durch eine Steuerung, die die Zuführeinrichtung (10) während des Trennvorgangs derart betätigt, dass nur eine geringe Menge an Kühl-Schmiermittel zugeführt wird.5. Device according to one of claims 1 to 4, characterized by a controller that actuates the feed device (10) during the separation process such that only a small amount of cooling lubricant is supplied.
6. Vorrichtung nach einem der Ansprüche 1 bis 5, gekennzeichnet durch eine Steuerung, die die weitere Zuführeinrichtung (11) zum Zuführen von Reinigungsmittel nach dem Trennvorgang derart betätigt, dass eine relativ zur Zufuhr von Kühl-Schmiermittel während des Trennvorgangs größere Menge an Reinigungsmittel, insbesondere von Kühl-Schmiermittel, zugeführt wird.6. Device according to one of claims 1 to 5, characterized by a control which actuates the further feed device (11) for feeding cleaning agent after the separation process in such a way that a relatively large amount of cleaning agent relative to the supply of cooling lubricant during the separation process, especially coolant lubricant.
7. Vorrichtung nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass in Arbeitsstellung oberhalb der Zuführeinrichtung (10) ein Vorratsbehälter (30) für Kühl-Schmier- mittel vorgesehen ist, der mit der Zuführeinrichtung über eine Leitung (31) verbunden ist, wobei die Zufuhr unter Einfluß der Gravitation erfolgt.7. Device according to one of claims 1 to 6, characterized in that in the working position above the feed device (10) a reservoir (30) for cooling lubricant is provided, which is connected to the feed device via a line (31), the supply takes place under the influence of gravity.
8. Verfahren zum Trennen von Werkstoffen, insbesondere zum Innenlochtrennen von Einkristallen, wobei der Werkstoff (1) mittels einer beim Trennvorgang rotierend in den Werkstoff eindringenden Trennscheibe (2) getrennt wird, dadurch gekennzeichnet, dass ein Kühl-Schmiermittel in Rotationsrichtung gesehen nur austrittsseitig hinter dem Durchtritt der Trennscheibe (2) durch den Werkstoff (1) zugeführt wird. 8. A method for separating materials, in particular for the internal hole cutting of single crystals, the material (1) being separated by means of a cutting disc (2) penetrating the material during the cutting process, characterized in that a cooling lubricant seen in the direction of rotation only behind on the exit side the passage of the cutting disc (2) through the material (1) is supplied.
9. Verfahren nach Anspruch 8, dadurch gekennzeichnet, dass die Trennscheibe (2) während des Trennvorgangs, gekühlt wird und nach dem Trennvorgang gereinigt wird.9. The method according to claim 8, characterized in that the cutting disc (2) is cooled during the cutting process and cleaned after the cutting process.
10. Verfahren nach Anspruch 9, dadurch gekennzeichnet, dass beim Kühlen Kühl-Schmiermittel in einer bestimmten Menge zugeführt wird und beim Reinigen Kühl-Schmiermittel in einer relativ dazu größeren Menge zugeführt wird.10. The method according to claim 9, characterized in that cooling lubricant is supplied in a certain amount during cooling and cooling lubricant is supplied in a relatively large amount during cleaning.
11. Verfahren nach einem der Ansprüche 8 bis 10, dadurch gekennzeichnet, dass der Trennscheibe (2) ein gasförmiges Medium, insbesondere Druckluft, zugeführt wird.11. The method according to any one of claims 8 to 10, characterized in that the cutting disc (2) is supplied with a gaseous medium, in particular compressed air.
12. Verfahren nach Anspruch 11, dadurch gekennzeichnet, daß das gasförmige Medium in Rotationsrichtung der Trennscheibe nach dem Austritt der Trennscheibe aus dem Werkstoff zugeführt wird.12. The method according to claim 11, characterized in that the gaseous medium is supplied in the direction of rotation of the cutting disc after the cutting disc emerges from the material.
13. Verfahren nach einem der Ansprüche 8 bis 12, dadurch gekennzeichnet, dass ein Kühl-Schmiermittel mit einem Zusatz verwendet wird, der die Oberflächenspannung erhöht.13. The method according to any one of claims 8 to 12, characterized in that a cooling lubricant is used with an additive that increases the surface tension.
14. Vorrichtung zum Trennen von Werkstoffen, insbesondere von Einkristallen, mit einer Trennscheibe (2) mit einem konzentrischen Loch dessen Rand (3) einen Schneidrand bildet, wobei die Trennscheibe (2) um ihre zentrale Achse drehbar ist zum Trennen des Werkstoffes (1) , einer Positioniereinrichtung zum Positionieren des zu trennenden Werkstoffes (1) derart relativ zu der Trennscheibe, dass sich die Trennscheibe beim Trennen rotierend durch den Werkstoff bewegt zum Abtrennen eines Teiles (la) des Werkstoffes (1) , einer Einrichtung (10) zum Zuführen von Kühl-Schmiermittel auf die Trennscheibe (2) , einer Einrichtung (11) zum Zuführen von Reinigungsmittel auf die Trennscheibe (2) , wobei eine Steuerung vorgesehen ist, die die Einrichtung (10) und die Einrichtung (11) derart steuert, daß Kühl-Schmiermittel während des Trennvorgangs zugeführt und Reinigungsmittel nach dem Trennvorgang zugeführt wird.14. Device for cutting materials, in particular single crystals, with a cutting disc (2) with a concentric hole whose edge (3) forms a cutting edge, the cutting disc (2) being rotatable about its central axis for separating the material (1) , a positioning device for positioning the material (1) to be separated in such a way relative to the cutting disc that the cutting disc rotates through the Material moves to separate a part (la) of the material (1), a device (10) for supplying cooling lubricant to the cutting disc (2), a device (11) for supplying cleaning agent to the cutting disc (2), whereby a controller is provided which controls the device (10) and the device (11) in such a way that coolant lubricant is supplied during the separation process and cleaning agent is supplied after the separation process.
15. Vorrichtung nach Anspruch 14, wobei die Steuerung so ausgebildet ist, daß das KühlSchmiermittel mit einem geringen Volumenstrom zugeführt wird und das Reinigungsmittel mit einem relativ dazu größeren Volumenstrom zugeführt wird.15. The apparatus of claim 14, wherein the controller is designed so that the cooling lubricant is supplied with a low volume flow and the cleaning agent is supplied with a relatively large volume flow.
16. Verfahren zum Trennen von Werkstoffen, insbesondere zum Innenlochtrennen von Einkristallen, wobei der Werkstoff (1) mittels einer beim Trennvorgang rotierend in den Werkstoff eindringenden Trennscheibe (2) getrennt wird, dadurch gekennzeichnet, dass ein Kühl-Schmiermittel während des Trennvorgangs zugeführt wird und ein Reinigungsmittel nach dem Trennvorgang zugeführt wird.16. A method for separating materials, in particular for the inner hole cutting of single crystals, the material (1) being separated by means of a cutting disc (2) penetrating the material during the cutting process, characterized in that a cooling lubricant is supplied during the cutting process and a cleaning agent is supplied after the separation process.
17. Verfahren nach Anspruch 16, dadurch gekennzeichnet, daß das KühlSchmiermittel mit einem geringen Volumenstrom zugeführt wird und das Reinigungsmittel mit einem relativ dazu größeren Volumenstrom zugeführt wird. 17. The method according to claim 16, characterized in that the cooling lubricant is supplied with a low volume flow and the cleaning agent is supplied with a relatively large volume flow.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10055286 | 2000-11-08 | ||
| DE10055286A DE10055286A1 (en) | 2000-11-08 | 2000-11-08 | Monocrystal separating device based on annular sawing has device to supply gas to cutting disk |
| PCT/EP2001/012032 WO2002038349A1 (en) | 2000-11-08 | 2001-10-17 | Device and method for separating materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1224067A1 true EP1224067A1 (en) | 2002-07-24 |
| EP1224067B1 EP1224067B1 (en) | 2004-07-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP01984580A Expired - Lifetime EP1224067B1 (en) | 2000-11-08 | 2001-10-17 | Device and method for separating materials |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20030005919A1 (en) |
| EP (1) | EP1224067B1 (en) |
| JP (2) | JP4302979B2 (en) |
| CN (2) | CN100396460C (en) |
| AT (1) | ATE271962T1 (en) |
| CZ (1) | CZ301194B6 (en) |
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| SK (1) | SK286415B6 (en) |
| TW (1) | TW590842B (en) |
| WO (1) | WO2002038349A1 (en) |
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| CN105049843B (en) * | 2010-09-30 | 2018-02-06 | 三星电子株式会社 | Enter the method and apparatus of row interpolation to image by using smooth interpolation wave filter |
| KR20120037576A (en) * | 2010-10-12 | 2012-04-20 | 주식회사 엘지실트론 | Sawing apparatus of single crystal and sawing method of single crystal |
| DE102011008400B4 (en) * | 2011-01-12 | 2014-07-10 | Siltronic Ag | Method for cooling a workpiece made of semiconductor material during wire sawing |
| JP6722917B2 (en) * | 2016-04-26 | 2020-07-15 | 三星ダイヤモンド工業株式会社 | Scribe head unit |
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| FR1301500A (en) * | 1960-08-19 | 1962-08-17 | Hydrol Chemical Company Ltd | Grinding machine |
| FR2557000B1 (en) * | 1983-12-23 | 1987-08-07 | Essilor Int | GRINDING STATION FOR GRINDING MACHINE, PARTICULARLY FOR THE BEVELING OR GROOVING OF AN OPHTHALMIC LENS |
| DE3640645A1 (en) * | 1986-11-28 | 1988-06-09 | Wacker Chemitronic | METHOD FOR SAWING CRYSTAL RODS OR BLOCKS BY MEANS OF INTERNAL HOLE SAWS IN THIN WINDOWS |
| JP2979870B2 (en) * | 1992-11-27 | 1999-11-15 | 信越半導体株式会社 | Method of cutting cone-shaped end of semiconductor ingot |
| DE4309134C2 (en) * | 1993-03-22 | 1999-03-04 | Wilfried Wahl | Process for the lubrication and cooling of cutting edges and / or workpieces in machining processes |
| JPH06328433A (en) * | 1993-05-20 | 1994-11-29 | Tokyo Seimitsu Co Ltd | Slicing machine |
| JPH07304028A (en) * | 1994-05-13 | 1995-11-21 | Nippon Steel Corp | Slicing machine |
| SG70097A1 (en) * | 1997-08-15 | 2000-01-25 | Disio Corp | Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface |
| US6386948B1 (en) * | 1999-06-01 | 2002-05-14 | Sumitomo Special Metals Co., Ltd. | Magnet member cutting method and magnet member cutting |
-
2000
- 2000-11-08 DE DE10055286A patent/DE10055286A1/en not_active Withdrawn
-
2001
- 2001-10-17 US US10/181,099 patent/US20030005919A1/en not_active Abandoned
- 2001-10-17 CZ CZ20022365A patent/CZ301194B6/en not_active IP Right Cessation
- 2001-10-17 DE DE50102989T patent/DE50102989D1/en not_active Expired - Fee Related
- 2001-10-17 JP JP2002540914A patent/JP4302979B2/en not_active Expired - Fee Related
- 2001-10-17 CN CNB018034896A patent/CN100396460C/en not_active Expired - Fee Related
- 2001-10-17 AT AT01984580T patent/ATE271962T1/en not_active IP Right Cessation
- 2001-10-17 CN CNA2007101065817A patent/CN101066616A/en active Pending
- 2001-10-17 WO PCT/EP2001/012032 patent/WO2002038349A1/en active IP Right Grant
- 2001-10-17 EP EP01984580A patent/EP1224067B1/en not_active Expired - Lifetime
- 2001-10-17 SK SK978-2002A patent/SK286415B6/en not_active IP Right Cessation
- 2001-10-17 RU RU2002118120/03A patent/RU2271927C2/en not_active IP Right Cessation
- 2001-11-02 TW TW090127230A patent/TW590842B/en not_active IP Right Cessation
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2007
- 2007-10-03 JP JP2007260189A patent/JP2008135712A/en not_active Withdrawn
Non-Patent Citations (1)
| Title |
|---|
| See references of WO0238349A1 * |
Also Published As
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| JP2008135712A (en) | 2008-06-12 |
| CN100396460C (en) | 2008-06-25 |
| SK9782002A3 (en) | 2002-12-03 |
| TW590842B (en) | 2004-06-11 |
| EP1224067B1 (en) | 2004-07-28 |
| JP2004512989A (en) | 2004-04-30 |
| RU2002118120A (en) | 2004-01-20 |
| DE10055286A1 (en) | 2002-05-23 |
| CN1394161A (en) | 2003-01-29 |
| CN101066616A (en) | 2007-11-07 |
| SK286415B6 (en) | 2008-09-05 |
| CZ301194B6 (en) | 2009-12-02 |
| US20030005919A1 (en) | 2003-01-09 |
| WO2002038349A1 (en) | 2002-05-16 |
| CZ20022365A3 (en) | 2002-10-16 |
| RU2271927C2 (en) | 2006-03-20 |
| JP4302979B2 (en) | 2009-07-29 |
| ATE271962T1 (en) | 2004-08-15 |
| DE50102989D1 (en) | 2004-09-02 |
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