EP1217873B1 - Temperature of cooking vessels sensing method and device - Google Patents

Temperature of cooking vessels sensing method and device Download PDF

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Publication number
EP1217873B1
EP1217873B1 EP01128793A EP01128793A EP1217873B1 EP 1217873 B1 EP1217873 B1 EP 1217873B1 EP 01128793 A EP01128793 A EP 01128793A EP 01128793 A EP01128793 A EP 01128793A EP 1217873 B1 EP1217873 B1 EP 1217873B1
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EP
European Patent Office
Prior art keywords
measuring element
cooking
hotplate
temperature
cooking vessel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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EP01128793A
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German (de)
French (fr)
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EP1217873A2 (en
EP1217873A3 (en
Inventor
Ralf Dr. Dorwarth
Martin Baier
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EGO Elektro Geratebau GmbH
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EGO Elektro Geratebau GmbH
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Publication of EP1217873A3 publication Critical patent/EP1217873A3/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/02Induction heating
    • H05B6/06Control, e.g. of temperature, of power
    • H05B6/062Control, e.g. of temperature, of power for cooking plates or the like
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24CDOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00Details
    • F24C15/08Foundations or supports plates; Legs or pillars; Casings; Wheels
    • F24C15/083Anti-tip arrangements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/68Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H05B3/746Protection, e.g. overheat cutoff, hot plate indicator
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2213/00Aspects relating both to resistive heating and to induction heating, covered by H05B3/00 and H05B6/00
    • H05B2213/07Heating plates with temperature control means

Definitions

  • the invention relates to a method and a device for detecting the temperature of a cooking vessel according to the preamble of claim 1 and 8 and claim 9.
  • the cooking vessel is advantageously on a cooking or heating plate, for example a glass ceramic plate, preferably a thermally operated heating device in the region of a heating zone of the heater set up.
  • Heating appliances are commonly used today with usually consisting of glass ceramic cooking plates on which one or more cooking or heating zones are defined, each arranged below the cooking plate Heating devices are heated.
  • the heating devices may, for example, in the form of electric radiant heaters or in the form of induction devices with one or more induction coils for inductive Be heated the set up on the associated cooking zone cooking vessels be formed.
  • a cooking operation is controlled by pre-set by means of a cooking zone associated control element for the desired cooking performance level of the cooking zone and the cooking process is then monitored by an operator.
  • the quality of the cooking result depends essentially on the experience of the operator, which usually no accurate detection of the temperature of the cooking vessel or the heating material contained therein is performed.
  • US-A-3 742 179 shows a temperature sensor which may be formed as a thermistor and is arranged in a mobile, portable mat.
  • the mat contains a complex electrical structure with a resonant circuit, a rectifier and coils and. It is to be regarded as an active device with a power supply via the coil.
  • the mat is placed on a cooktop with inductive heating so that it is in good thermal contact with an installed inductively heated cooking vessel.
  • the signal of the temperature detection of the sensor is transmitted through a coil to a further coil arranged below the cooktop, from which the signals for temperature evaluation can be tapped.
  • GB-A 2 072 334 describes how, by means of an IR-sensitive photodiode, which is connected via light guides to a reflector on which an IR-transparent glass plate can rest, the temperature at the bottom of a cooking vessel can be interrogated. Measuring elements or the like are not present here at all, since the bottom of the cooking vessel is queried directly.
  • the invention has for its object to provide a method and an apparatus for detecting the temperature of cooking plates set on cooking plates, which avoid the disadvantages of the prior art. In particular, should be possible without restriction in the handling of the cooking vessels accurate temperature detection.
  • the invention proposes a device with the features of claim 1 and 8 and a method with the features of claim 9. Preferred developments are specified in the dependent claims. The wording of all claims is incorporated by express reference into the content of the description.
  • At least one flat measuring element is provided in the region of a heating zone to be monitored on the top of the cooking vessel facing the top of a cooking vessel to be set up and in contact with the bottom of the cooking vessel, whose surface is normally a fraction of the total area corresponds to the associated heating zone.
  • the temperature of this measuring element is determined, for which purpose usually at least one sensor is provided for detecting the temperature of the measuring element. Since the measuring element is formed so that the normally largely flat or slightly curved bottom of a raised cooking vessel under the influence of the cooking vessel weight over a large area on the measuring element is pressed, the temperature of the measuring element is due to heat conduction usually quickly on the temperature of the cooking vessel bottom.
  • the measuring element expediently consists of a good heat-conducting material and has a low heat capacity.
  • a certain wear resistance or scratch resistance or abrasion resistance is advantageous so that even after many years of operation no wear-related functional impairments are to be feared.
  • the determination of the temperature of the measuring element is carried out from below through the cooking plate.
  • This makes it possible to accommodate devices for detecting the temperature of the external measuring elements protected, for example, in the largely hermetically sealed space below the glass ceramic plate of a cooktop.
  • On lines or the like, which lead to the top of the plate to the measuring element can be dispensed with.
  • a measuring resistor element for example by printing, with the utilization of the heat conduction through the hotplate, the Meßelementtemperatur can be determined.
  • At least one infrared sensor below the cooking plate possibly at a distance therefrom be arranged, with the aid of which the temperature of the cooking plate facing bottom of the measuring element can be detected.
  • the material of the cooking plate in this case should have sufficient transmission for the heat radiation used for the measurement. Since the Meßelementunterseite regardless of the Kochgefäßeigenschaften a certain of the type of the measuring element and possibly the hob surface, defined emissivity for thermal radiation, such a system with any type of cooking vessels can work exactly without the cooking vessel itself special precautions to secure a particular Abstrahldite must be made. This allows users of such systems without special investment in the purchase of cooking vessels to take advantage of a temperature measurement using infrared sensors.
  • a measuring element according to the invention is formed either by a material layer applied to the top of the hotplate in a self-adhesive manner, for example by a material layer applied in a thin-layer process or thick-film process, in particular a temperature-resistant ink layer.
  • a material layer applied in a thin-layer process or thick-film process in particular a temperature-resistant ink layer.
  • a particularly good adhesion of the measuring element can be achieved on the cooking plate top, also shape and / or thickness of the measuring element can be adapted by the process control in the coating in a simple manner to the desired Meßelementdesign.
  • suitable color layers can be used, as they are also used in the conventional decoration of glass ceramic surfaces. The order can be made in the same process step. If necessary, metal particles can be added.
  • At least one measuring element is formed by a separate piece of material, for example a piece of a metal foil, which by means of suitable fastening means, for example by gluing, on the hotplate top side can be attached.
  • suitable fastening means for example by gluing
  • the top of the measuring element slightly surmounted the top of the cooking plate, that is raised relative to the cooking plate top.
  • small protrusion heights of less than about 0.2 mm are preferred in order to keep the height of any resulting air gap between the top of the cooking plate and cooking vessel underside low.
  • the supernatant heights between about 0.05 mm and about 0.2 mm, in particular about 0.1 mm.
  • the cooking zone may be expedient if several, laterally spaced measuring elements are provided in the cooking zone, which can be ensured that even at Kochgefäßstiln that are not optimally suitable for the size of the cooking zone, always at least one measuring element accurate Temperaturmeßhong supplies.
  • a triangular arrangement of three normally identical measuring elements by which it can be ensured that a cooking vessel sufficient floor space is supported tip over three points and can not wobble.
  • an arrangement of several measuring elements on a circle will be advantageous, the diameter of which is slightly smaller or approximately equal to the diameter of typical alsforder cooking vessels on the corresponding heating zone, so that a support in the outer edge region of a cooking vessel bottom is ensured.
  • the invention which proposes in preferred embodiments, one or more Referenzmeß vom for infrared temperature measurement from the inside of a glass ceramic hob out, also relates to heat appliances, which are equipped with a temperature detection device according to the invention, in particular electric heaters. It is particularly advantageous for use in induction cookers, where the heat for heating up-arranged cooking vessels in the wall material of the cooking vessel itself, in particular in the cooking vessel bottom, is carried out by inductively generated eddy currents. Especially in such electric heaters, the accurate determination of the cooking vessel temperature is useful because an indirect temperature monitoring, for example, by monitoring the cooking plate temperature, may be inaccurate, possibly because of large temperature differences between cooking plate and cooking vessel exist.
  • Inductive cooking systems are compared to also possible radiation heating systems also particularly suitable because in radiant heating systems normally the at least one measuring element is heated directly from below by thermal radiation, so that, if necessary, temperature differences can result to the cooking vessel temperature. Furthermore, it is usually easier in inductive cooking systems, below the hot plate, for example in the vicinity of an induction coil to install protected one or more heat-sensitive infrared sensors, since in this area compared to radiant heating systems normally prevail significantly lower temperatures, which the functionality and life of Can improve infrared sensors.
  • the material of the hotplate can be chosen so that it can be at a maximum of 250 ° C to 300 ° C, especially in the temperature range of typical pot bottom temperatures, which are normally below 140 ° for cooking, and for example when frying for the appropriate heat radiation especially is permeable.
  • a transmission capability at higher temperatures, ie at shorter wavelengths of heat radiation, as required, for example, for glass ceramic panels in radiant heating systems, is not absolutely necessary, so that the hob material can be optimally matched to the requirements of temperature detection in terms of its transmission properties.
  • FIG. 1 shows a schematic representation of a preferred embodiment of a temperature detecting device according to the invention, which is installed at an induction cooking.
  • Fig. 2 shows a plan view of the induction cooking on Fig. 1st
  • the schematic vertical section of Fig. 1 shows a section of an electric cooker whose top or work surface is defined by a horizontal glass ceramic plate 2, which may have a single or more spaced cooking or cooking or heating zones 3.
  • the heaters 4 provided for the individual heating zones are arranged opposite the inside or underside 5 of the plate 2 and are shown in the inductive Electric heater formed by Mowindige in the example shown, planar induction coils 6, which are each secured at a small distance below the glass ceramic plate 2.
  • the induction coil 6 shown by way of example is connected to a high-frequency generator, not shown, of the cooking appliance.
  • cylindrical and downwardly funnel-shaped widening heat shields 7 are attached in their plate-facing area, which ensure that the electromagnetic alternating field generated by the coil 6 is strongly attenuated inside and below the shield 7 and the area the plate 2 is largely shielded down radiant heat.
  • the shielded area 5 are shown with visual contact to the underside of the plate schematically illustrated infrared sensors 8, for example, with an infrared-sensitive diode arranged, which are connected to a transmitter 9 for processing the voltage provided by the infrared sensors voltage signals.
  • the transmitter 9 may be arranged on a printed circuit board which is fixed in the hermetically sealed space below the glass ceramic plate 2 and carries the electronic components of an electronic control device for the electrical device 1.
  • the shape and size of the induction coil 6 associated, in the example circular heating zone 3 is defined in the interior of the cooktop by a induction coil with radial distance surrounding, reaching down to the bottom 5 of the glass ceramic plate 2 ring 10, which consists of a electromagnetic radiation of the coil. 2 shielding, electrically conductive material, such as aluminum may exist.
  • the outer boundary of the round heating zone 3 may be marked by a ring of printed decorative ink, not shown, in order to provide a correct position for a user, To allow the most centric installation of cooking vessels.
  • hotplates 2 made of a transparent material for light in the visible spectrum material, the boundary of the cooking zone can be seen through the visible in this case from above ring 10.
  • three flat, circular ink layer areas 15, 16, 17 are applied on the hotplate top side 11, the diameter of which is in each case a fraction, for example about one tenth of the diameter of the cooking zone.
  • the color layer circuits can be used, for example, in thin-film or thick-film technology, e.g. be applied by printing and have typical thicknesses in the range of about 0.1 mm, so that the substantially flat top sides 18, 19, 20 of the color circles relative to the top plate 11 are evenly raised.
  • the centers of the color circles 15, 16, 17 lie evenly spaced on a circle whose diameter may be about 10% to 30% smaller than the cooking zone diameter.
  • the raised color layers form a triangular arrangement, to which a cooking vessel 25, adapted in size to the size of the cooking zone 3, can be set up in a tilt-proof and wobble-free manner. If the cooking vessel 25 is placed more or less centrally in the cooking zone, the largely flat or slightly dome-shaped curved cooking vessel bottom 26, the tops 18, 19, 20 of the color dots 15, 16, 17 respectively over substantially the entire surface, so that under the weight of the cooking vessel and the cooking material therein a surface contact pressure between the ink layer elements 15, 16, 17 and the cooking vessel bottom 26 is ensured.
  • the ink layer circuits 15, 16, 17, which can be reliably adhered in a cost-effective manner, form measuring elements of a temperature-detecting device, which allows the temperature of the cooking vessel, in particular of the cooking vessel bottom 26, to be reduced in a cost-effective manner reliable and accurate.
  • at least one of the measuring elements 15, 16, 17 with respect to the located below the plate 2 infrared sensor 8 is arranged so that the standing in contact with the top plate 11 underside of the measuring element is in visual communication with the infrared sensor 8.
  • a heat radiation-conducting connection between the infrared sensor and the measuring element underside can also be created with the aid of one or more mirrors suitable for the reflection of infrared radiation and / or with the aid of heat radiation-conducting optical fibers.
  • a temperature detection according to the invention is particularly well suited for automatic, sensor-assisted cooking systems in which the heating power of the respective cooking zones associated heating devices depending on the Kochgut- or Cooking vessel temperature is controllable.
  • the detected temperature can also be displayed only to allow an operator a cooking food gently and effectively cooking, frying, frying o.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Ceramic Engineering (AREA)
  • Electric Stoves And Ranges (AREA)
  • Induction Heating Cooking Devices (AREA)
  • Control Of Resistance Heating (AREA)
  • Cookers (AREA)
  • Control Of High-Frequency Heating Circuits (AREA)

Abstract

The device has at least one flat measurement element (15,17) near a heating zone (3) on the upper side of the cooking plate (2) with an upper side for contact with the bottom of the cooking vessel (25) and a device (8) for determining the temperature of the measurement element in the form of one or more infrared sensors. Independent claims are also included for the following: an electric heating device with as cooking plate and a method of detecting temperature of cooking vessel.

Description

Anwendungsgebiet und Stand der TechnikField of application and state of the art

Die Erfindung betrifft ein Verfahren sowie eine Vorrichtung zur Erfassung der Temperatur eines Kochgefäßes gemäß dem Oberbegriff des Anspruchs 1 und 8 sowie Anspruchs 9. Das Kochgefäß wird vorteilhaft auf eine Koch- oder Heizplatte, beispielsweise eine Glaskeramikplatte, eines vorzugsweise elektrisch betriebenen Wärmegerätes im Bereich einer Heizzone des Wärmegerätes aufgestellt.The invention relates to a method and a device for detecting the temperature of a cooking vessel according to the preamble of claim 1 and 8 and claim 9. The cooking vessel is advantageously on a cooking or heating plate, for example a glass ceramic plate, preferably a thermally operated heating device in the region of a heating zone of the heater set up.

Zum Erhitzen von Speisen und anderem Erwärmungsgut beim Kochen, Braten, Fritieren o. dgl. werden heutzutage häufig Wärmegeräte mit in der Regel aus Glaskeramikwerkstoff bestehenden Kochplatten eingesetzt, auf denen eine oder mehrere Koch- oder Heizzonen definiert sind, die jeweils durch unterhalb der Kochplatte angeordnete Heizeinrichtungen beheizbar sind. Die Heizeinrichtungen können beispielsweise in Form elektrischer Strahlungsheizkörper oder in Form von Induktionseinrichtungen mit einer oder mehreren Induktionsspulen zum induktiven Beheizen der auf der zugeordneten Kochzone aufgestellten Kochgefäße ausgebildet sein.For heating food and other food to be heated during cooking, frying, frying o. The like. Heating appliances are commonly used today with usually consisting of glass ceramic cooking plates on which one or more cooking or heating zones are defined, each arranged below the cooking plate Heating devices are heated. The heating devices may, for example, in the form of electric radiant heaters or in the form of induction devices with one or more induction coils for inductive Be heated the set up on the associated cooking zone cooking vessels be formed.

Bei den meisten der herkömmlichen Kochherde wird ein Kochvorgang gesteuert, indem mittels eines der Kochzone zugeordneten Bedienelementes eine für den gewünschten Kochvorgang geeignete Leistungsstufe der Kochzone voreingestellt und der Kochvorgang dann von einem Bediener überwacht wird. Die Qualität des Kochergebnisses hängt dabei wesentlich von der Erfahrung des Bedieners ab, wobei in der Regel keine genaue Erfassung der Temperatur des Kochgefäßes oder des darin enthaltenen Erwärmungsgutes durchgeführt wird.In most of the conventional cookers, a cooking operation is controlled by pre-set by means of a cooking zone associated control element for the desired cooking performance level of the cooking zone and the cooking process is then monitored by an operator. The quality of the cooking result depends essentially on the experience of the operator, which usually no accurate detection of the temperature of the cooking vessel or the heating material contained therein is performed.

Es sind auch schon automatische Kochsysteme vorgeschlagen worden, die eine mehr oder weniger genaue Temperaturerfassung der aufgestellten Kochgefäße ermöglichen, um beispielsweise ein automatisches, durch die Temperaturerfassung gesteuertes Kochen zuzulassen. Bei einem bekannten System werden spezielle Kochgefäße verwendet, bei denen seitlich wenig oberhalb der Kochgefäß-Bodenfläche eine schwarze Farbmarkierung angebracht ist. Durch einen von der Seite auf diese Farbmarkierung gerichteten Infrarotsensor kann das von der Farbmarkierung abgestrahlte Strahlungsspektrum erfaßt und daraus die Temperatur des Kochgefäßes abgeleitet werden. Der Meßwert kann zur Steuerung der der Kochzone zugeordneten Heizeinrichtung benutzt werden, um beispielsweise bei einer Überhitzung die Heizleistung der zugeordneten Heizeinrichtung herunterzufahren oder die Kochstelle abzuschalten. Das Kochsystem erfordert spezielle, mit entsprechenden Farbmarkierungen ausgestattete Kochgefäße. Wird auf Farbmarkierungen verzichtet, so steht man vor dem Problem, daß in der Regel die bzgl. ihrer Wärmeabstrahlung beobachteten Oberflächenbereiche des Kochgefäßes in Struktur und Farbe unterschiedlich sind, so daß sich die Oberflächenemissionsfähigkeit in unkontrollierbarer Weise ändern kann, was eine ungenaue Messung zur Folge hat. Zudem ergeben sich durch die seitliche Kochgefäßbeobachtung in der Regel Einschränkungen hinsichtlich der Aufstellung und Handhabung der auf der Kochplatte aufgestellten Kochgefäße.There have also been proposed automatic cooking systems that allow a more or less accurate temperature detection of the established cooking vessels, for example, to allow an automatic, controlled by the temperature sensing cooking. In a known system special cooking vessels are used in which laterally above the cooking vessel bottom surface a black color marking is attached. By an infrared sensor directed from the side to this color marking, the radiation spectrum emitted by the color marking can be detected and from this the temperature of the cooking vessel can be derived. The measured value can be used to control the heating zone associated with the heating device, for example, to shut down the heating power of the associated heater or to turn off the hotplate in case of overheating. The cooking system requires special, equipped with appropriate color markings cooking vessels. If color markings are omitted, the problem arises that the surface areas of the cooking vessel observed in terms of their heat radiation are generally different in structure and color, so that the surface emissivity can change in an uncontrollable manner, resulting in an inaccurate measurement , In addition, arise by the lateral cooking vessel observation usually restrictions on the installation and handling of the cooking vessels placed on the cooking plate.

Die US-A 3 742 179 zeigt einen Temperatursensor, welcher als Thermistor ausgebildet sein kann und in einer mobilen, tragbaren Matte angeordnet ist. Die Matte enthält einen aufwendigen elektrischen Aufbau mit einem Schwingkreis, einem Gleichrichter und Spulen und. Sie ist mit einer Energieversorgung über die Spule als aktive Einrichtung anzusehen. Die Matte wird auf ein Kochfeld mit induktiver Beheizung gelegt, so dass sie in gutem thermischen Kontakt mit einem aufgestellten induktiv beheizten Kochgefäß steht. Das Signal der Temperaturerfassung des Sensors wird durch eine Spule zu einer unterhalb des Kochfeldes angeordneten weiteren Spule übertragen, von welcher aus die Signale zur Temperaturauswertung abgegriffen werden können.US-A-3 742 179 shows a temperature sensor which may be formed as a thermistor and is arranged in a mobile, portable mat. The mat contains a complex electrical structure with a resonant circuit, a rectifier and coils and. It is to be regarded as an active device with a power supply via the coil. The mat is placed on a cooktop with inductive heating so that it is in good thermal contact with an installed inductively heated cooking vessel. The signal of the temperature detection of the sensor is transmitted through a coil to a further coil arranged below the cooktop, from which the signals for temperature evaluation can be tapped.

Die GB-A 2 072 334 beschreibt, wie mittels einer IR-empfindlichen Photodiode, die über Lichtleiter mit einem Reflektor verbunden ist, auf welchem eine IR-durchlässige Glasplatte aufliegen kann, die Temperatur an der Unterseite eines Kochgefäßes abgefragt werden kann. Messelemente oder dergleichen sind hier überhaupt nicht vorhanden, da die Unterseite des Kochgefäßes direkt abgefragt wird.GB-A 2 072 334 describes how, by means of an IR-sensitive photodiode, which is connected via light guides to a reflector on which an IR-transparent glass plate can rest, the temperature at the bottom of a cooking vessel can be interrogated. Measuring elements or the like are not present here at all, since the bottom of the cooking vessel is queried directly.

Aufgabe und LösungTask and solution

Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren sowie eine Vorrichtung zur Erfassung der Temperatur von auf Kochplatten aufgestellten Kochgefäßen zu schaffen, die die Nachteile des Standes der Technik vermeiden. Insbesondere soll ohne Einschränkung bei der Handhabung der Kochgefäße eine genaue Temperaturerfassung ermöglicht werden.The invention has for its object to provide a method and an apparatus for detecting the temperature of cooking plates set on cooking plates, which avoid the disadvantages of the prior art. In particular, should be possible without restriction in the handling of the cooking vessels accurate temperature detection.

Zur Lösung dieser Aufgabe schlägt die Erfindung eine Vorrichtung mit den Merkmalen von Anspruch 1 und 8 sowie ein Verfahren mit den Merkmalen von Anspruch 9 vor. Bevorzugte Weiterbildungen sind in den abhängigen Ansprüchen angegeben. Der Wortlaut sämtlicher Ansprüche wird durch ausdrückliche Bezugnahme zum Inhalt der Beschreibung gemacht.To solve this problem, the invention proposes a device with the features of claim 1 and 8 and a method with the features of claim 9. Preferred developments are specified in the dependent claims. The wording of all claims is incorporated by express reference into the content of the description.

Erfindungsgemäß ist im Bereich einer zu überwachenden Heizzone auf der dem aufgestellten Kochgefäß zugewandten Oberseite der Kochplatte mindestens ein flaches Meßelement vorgesehen, das eine dem Boden eines aufzustellenden Kochgefäßes zugewandte und zum Berührungskontakt mit dem Boden des Kochgefäßes vorgesehene Oberseite hat, deren Fläche normalerweise einen Bruchteil der Gesamtfläche der zugeordneten Heizzone entspricht. Die Temperatur dieses Meßelementes wird bestimmt, wozu in der Regel mindestens ein Sensor zur Erfassung der Temperatur des Meßelementes vorgesehen ist. Da das Meßelement so ausgebildet ist, daß der normalerweise weitgehend ebene oder leicht gewölbte Boden eines aufgestellten Kochgefäßes unter Einwirkung des Kochgefäßgewichtes großflächig auf das Meßelement aufgedrückt wird, stellt sich die Temperatur des Meßelementes aufgrund von Wärmeleitung in der Regel schnell auf die Temperatur des Kochgefäßbodens ein. Um eine schnelle, zuverlässige Temperaturangleichung zu gewährleisten, besteht das Meßelement zweckmäßig aus einem gut wärmeleitenden Material und hat eine geringe Wärmekapazität. Darüber hinaus ist eine gewisse Verschleißfestigkeit bzw. Kratzfestigkeit oder Abriebsfestigkeit vorteilhaft, damit auch nach langjährigem Betrieb keine verschleißbedingten Funktionsbeeinträchtigungen zu befürchten sind. Durch die Bereitstellung mindestens eines hinsichtlich seiner Eigenschaften definierten Meßelementes im Bereich der Heizzone wird eine genaue Temperaturmessung am Kochgefäß möglich, solange dieses so aufgestellt wird, daß ein hinreichend guter Berührungskontakt zum Meßelement besteht. Die Messung kann in diesem Fall weitgehend unabhängig von anderen Eigenschaften des Kochgefäßes sein, beispielsweise von der Wärmeabstrahlfähigkeit seiner Oberfläche. Durch erfindungsgemäße Meßelemente werden weitgehend normierte Meßstellen für die temperaturgenaue Ermittlung der Kochgefäßtemperatur im Bodenbereich des Kochgefäßes geschaffen.According to the invention, at least one flat measuring element is provided in the region of a heating zone to be monitored on the top of the cooking vessel facing the top of a cooking vessel to be set up and in contact with the bottom of the cooking vessel, whose surface is normally a fraction of the total area corresponds to the associated heating zone. The temperature of this measuring element is determined, for which purpose usually at least one sensor is provided for detecting the temperature of the measuring element. Since the measuring element is formed so that the normally largely flat or slightly curved bottom of a raised cooking vessel under the influence of the cooking vessel weight over a large area on the measuring element is pressed, the temperature of the measuring element is due to heat conduction usually quickly on the temperature of the cooking vessel bottom. To ensure a fast, reliable temperature adjustment, the measuring element expediently consists of a good heat-conducting material and has a low heat capacity. In addition, a certain wear resistance or scratch resistance or abrasion resistance is advantageous so that even after many years of operation no wear-related functional impairments are to be feared. By providing at least one measuring element defined in terms of its properties in the region of the heating zone, an accurate temperature measurement on the cooking vessel becomes possible as long as it is set up in such a way that there is sufficiently good physical contact with the measuring element. The measurement in this case can be largely independent of other properties of the cooking vessel, for example, the heat radiating ability of its surface. By measuring elements according to the invention largely standardized measuring points for the temperature-accurate determination of the cooking vessel temperature in the bottom region of the cooking vessel are created.

Erfindungsgemäß erfolgt die Bestimmung der Temperatur des Meßelementes von unten durch die Kochplatte hindurch. Dadurch wird es möglich, Einrichtungen zur Temperaturerfassung der außen liegenden Meßelemente beispielsweise im weitgehend hermetisch abgedichteten Raum unterhalb der Glaskeramikplatte einer Kochmulde geschützt unterzubringen. Auf Leitungen oder dergleichen, die auf der Plattenoberseite zum Meßelement führen, kann verzichtet werden. Beispielsweise kann direkt unterhalb eines Meßelementes an der Innenseite der Kochplatte ein Meßwiderstandselement beispielsweise durch Aufdrucken angebracht sein, mit dem unter Ausnutzung der Wärmeleitung durch die Kochplatte die Meßelementtemperatur bestimmt werden kann. Insbesondere kann aber unterhalb der Kochplatte, ggf. im Abstand zu dieser, mindestens ein Infrarotsensor angeordnet sein, mit dessen Hilfe die Temperatur der kochplattenzugewandten Unterseite des Meßelementes erfaßt werden kann. Das Material der Kochplatte sollte in diesem Fall eine ausreichende Durchlässigkeit bzw. Transmission für die zur Messung verwendete Wärmestrahlung aufweisen. Da die Meßelementunterseite unabhängig von den Kochgefäßeigenschaften eine von der Art des Meßelementes und ggf. der Kochplattenoberfläche bestimmte, definierte Emissionsfähigkeit für Wärmestrahlung hat, kann ein derartiges System mit jeder Art von Kochgefäßen genau arbeiten, ohne daß am Kochgefäß selbst besondere Vorkehrungen zur Sicherung einer bestimmten Abstrahlfähigkeit vorgenommen werden müssen. Dadurch können Nutzer derartiger Systeme ohne besondere Investitionen bei der Anschaffung von Kochgefäßen die Vorteile einer Temperaturmessung mittels Infrarotsensoren nutzen.According to the determination of the temperature of the measuring element is carried out from below through the cooking plate. This makes it possible to accommodate devices for detecting the temperature of the external measuring elements protected, for example, in the largely hermetically sealed space below the glass ceramic plate of a cooktop. On lines or the like, which lead to the top of the plate to the measuring element can be dispensed with. For example, can be mounted directly below a measuring element on the inside of the cooking plate a measuring resistor element, for example by printing, with the utilization of the heat conduction through the hotplate, the Meßelementtemperatur can be determined. In particular, however, at least one infrared sensor below the cooking plate, possibly at a distance therefrom be arranged, with the aid of which the temperature of the cooking plate facing bottom of the measuring element can be detected. The material of the cooking plate in this case should have sufficient transmission for the heat radiation used for the measurement. Since the Meßelementunterseite regardless of the Kochgefäßeigenschaften a certain of the type of the measuring element and possibly the hob surface, defined emissivity for thermal radiation, such a system with any type of cooking vessels can work exactly without the cooking vessel itself special precautions to secure a particular Abstrahlfähigkeit must be made. This allows users of such systems without special investment in the purchase of cooking vessels to take advantage of a temperature measurement using infrared sensors.

Ein Meßelement ist erfindungsgemäß entweder durch eine auf die Oberseite der Kochplatte selbsthaftend aufgebrachte Materialschicht gebildet, beispielsweise durch eine in einem Dünnschichtverfahren oder Dickschichtverfahren aufgebrachte Materialschicht, insbesondere eine temperaturbeständige Farbschicht. Hierdurch kann eine besonders gute Haftung des Meßelementes auf der Kochplattenoberseite erreicht werden, zudem können Form und/oder Dicke des Meßelementes durch die Verfahrensführung bei der Beschichtung auf einfache Weise an das gewünschte Meßelementdesign angepaßt werden. Beispielsweise können geeignete Farbschichten verwendet werden, wie sie auch bei der üblichen Dekorierung von Glaskeramikoberflächen verwendet werden. Der Auftrag kann im selben Verfahrensschritt erfolgen. Bei Bedarf können Metallpartikel zugemischt werden.A measuring element according to the invention is formed either by a material layer applied to the top of the hotplate in a self-adhesive manner, for example by a material layer applied in a thin-layer process or thick-film process, in particular a temperature-resistant ink layer. In this way, a particularly good adhesion of the measuring element can be achieved on the cooking plate top, also shape and / or thickness of the measuring element can be adapted by the process control in the coating in a simple manner to the desired Meßelementdesign. For example, suitable color layers can be used, as they are also used in the conventional decoration of glass ceramic surfaces. The order can be made in the same process step. If necessary, metal particles can be added.

Alternativ ist erfindungsgemäß mindestens ein Meßelement durch ein gesondertes Materialstück, beispielsweise ein Stück einer Metallfolie, gebildet, das mit Hilfe geeigneter Befestigungsmittel, beispielsweise durch Kleben, auf der Kochplattenoberseite befestigt werden kann. Dabei ist besonders im Falle der Infrarot-Temperaturmessung von der Unterseite der Kochplatte auf eine ausreichende Emissionsfähigkeit und/oder Wärmestrahlungstransparenz des Klebermaterials zu achten.Alternatively, according to the invention, at least one measuring element is formed by a separate piece of material, for example a piece of a metal foil, which by means of suitable fastening means, for example by gluing, on the hotplate top side can be attached. In particular, in the case of the infrared temperature measurement from the underside of the cooking plate to ensure sufficient emissivity and / or thermal radiation transparency of the adhesive material.

Zur Sicherstellung eines ausreichenden, möglichst großflächigen Berührungskontaktes zwischen Meßelement und Kochgefäßunterseite ist es zweckmäßig, wenn die Oberseite des Meßelementes die Oberseite der Kochplatte geringfügig überragt, also gegenüber der Kochplattenoberseite erhaben ist. Hierbei sind geringe Überstandshöhen von weniger als ca. 0,2 mm bevorzugt, um die Höhe eines ggf. entstehenden Luftspaltes zwischen Kochplattenoberseite und Kochgefäßunterseite gering zu halten. Zweckmäßig liegen die Überstandshöhen zwischen ca. 0,05 mm und ca. 0,2 mm, insbesondere bei ca. 0,1 mm.To ensure sufficient, as large as possible touch contact between the measuring element and cooking vessel underside, it is expedient if the top of the measuring element slightly surmounted the top of the cooking plate, that is raised relative to the cooking plate top. In this case, small protrusion heights of less than about 0.2 mm are preferred in order to keep the height of any resulting air gap between the top of the cooking plate and cooking vessel underside low. Suitably, the supernatant heights between about 0.05 mm and about 0.2 mm, in particular about 0.1 mm.

Weiterhin kann es zweckmäßig, sein, wenn im Bereich der Kochzone mehrere, mit lateralem Abstand zueinander angeordnete Meßelemente vorgesehen sind, wodurch sichergestellt werden kann, daß auch bei Kochgefäßgrößen, die nicht optimal für die Größe der Kochzone geeignet sind, immer mindestens ein Meßelement genaue Temperaturmeßwerte liefert. Bevorzugt ist eine Dreiecksanordnung von drei normalerweise idenitschen Meßelementen, durch die sichergestellt werden kann, daß ein Kochgefäß ausreichender Bodenfläche auf drei Punkten kippsicher abgestützt ist und nicht wackeln kann. Um zu vermeiden, daß ein aufgestellter Topf o. dgl. sich beim Rühren nicht um eine durch ein Meßelement gebildete Abstützfläche dreht, ist es vorteilhaft, wenn sich kein Meßelement im Zentralbereich der Heizzone befindet. In der Regel wird eine Anordnung von mehreren Meßelementen auf einem Kreis vorteilhaft sein, dessen Durchmesser geringfügig kleiner oder etwa gleich dem Durchmesser typischer, auf der entsprechenden Heizzone aufzustellender Kochgefäße entspricht, so daß eine Abstützung im äußeren Randbereich eines Kochgefäßbodens gewährleistet ist.Furthermore, it may be expedient if several, laterally spaced measuring elements are provided in the cooking zone, which can be ensured that even at Kochgefäßgrößen that are not optimally suitable for the size of the cooking zone, always at least one measuring element accurate Temperaturmeßwerte supplies. Preferably, a triangular arrangement of three normally identical measuring elements, by which it can be ensured that a cooking vessel sufficient floor space is supported tip over three points and can not wobble. In order to avoid that an erect pot or the like does not rotate during stirring by a support surface formed by a measuring element, it is advantageous if there is no measuring element in the central region of the heating zone. In general, an arrangement of several measuring elements on a circle will be advantageous, the diameter of which is slightly smaller or approximately equal to the diameter of typical aufzustellender cooking vessels on the corresponding heating zone, so that a support in the outer edge region of a cooking vessel bottom is ensured.

Die Erfindung, die bei bevorzugten Ausführungsformen eine oder mehrere Referenzmeßflächen zur Infrarottemperaturmessung vom Inneren einer Glaskeramikkochmulde heraus vorschlägt, betrifft auch Wärmegeräte, die mit einer erfindungsgemäßen Temperaturerfassungseinrichtung ausgestattet sind, insbesondere Elektrowärmegeräte. Sie ist besonders für den Einsatz bei Induktionskochstellen vorteilhaft, bei denen die Wärme zur Beheizung aufgestellter Kochgefäße im Wandmaterial des Kochgefäßes selbst, insbesondere im Kochgefäßboden, durch induktiv erzeugte Wirbelströme erfolgt. Besonders bei derartigen Elektrowärmegeräten ist die genaue Ermittlung der Kochgefäßtemperatur nützlich, da eine indirekte Temperaturüberwachung, beispielsweise durch Überwachung der Kochplattentemperatur, ungenau sein kann, weil ggf. große Temperaturunterschiede zwischen Kochplatte und Kochgefäß existieren. Induktive Kochsysteme sind gegenüber ebenfalls möglichen Strahlungsheizungssystemen auch deshalb besonders geeignet, weil bei Strahlungsheizungssystemen normalerweise das mindestens eine Meßelement direkt von unten durch Wärmestrahlung aufgeheizt wird, so daß sich ggf. Temperaturunterschiede zur Kochgefäßtemperatur ergeben können. Weiterhin ist es bei induktiven Kochsystemen in der Regel einfacher, unterhalb der Kochplatte, beispielsweise in der Nähe einer Induktionsspule, eine oder mehrere wärmeempfindliche Infrarotsensoren geschützt anzubringen, da in diesem Bereich im Vergleich zu Strahlungsheizungssystemen normalerweise deutlich niedrigere Temperaturen herrschen, was die Funktionsfähigkeit und Lebensdauer von Infrarotsensoren verbessern kann.The invention, which proposes in preferred embodiments, one or more Referenzmeßflächen for infrared temperature measurement from the inside of a glass ceramic hob out, also relates to heat appliances, which are equipped with a temperature detection device according to the invention, in particular electric heaters. It is particularly advantageous for use in induction cookers, where the heat for heating up-arranged cooking vessels in the wall material of the cooking vessel itself, in particular in the cooking vessel bottom, is carried out by inductively generated eddy currents. Especially in such electric heaters, the accurate determination of the cooking vessel temperature is useful because an indirect temperature monitoring, for example, by monitoring the cooking plate temperature, may be inaccurate, possibly because of large temperature differences between cooking plate and cooking vessel exist. Inductive cooking systems are compared to also possible radiation heating systems also particularly suitable because in radiant heating systems normally the at least one measuring element is heated directly from below by thermal radiation, so that, if necessary, temperature differences can result to the cooking vessel temperature. Furthermore, it is usually easier in inductive cooking systems, below the hot plate, for example in the vicinity of an induction coil to install protected one or more heat-sensitive infrared sensors, since in this area compared to radiant heating systems normally prevail significantly lower temperatures, which the functionality and life of Can improve infrared sensors.

Zudem kann bei induktiven Systemen das Material der Kochplatte so gewählt werden, daß es besonders im Temperaturbereich typischer Topfbodentemperaturen, die normalerweise beim Kochen unterhalb von ca. 140° liegen und beispielsweise beim Fritieren bei maximal 250°C bis 300°C liegen können, für die entsprechende Wärmestrahlung besonders durchlässig ist. Eine Transmissionsfähigkeit bei höheren Temperaturen, also bei kürzeren Wellenlängen der Wärmestrahlung, wie sie beispielsweise für Glaskeramikplatten bei Strahlungsheizungssystemen erforderlich ist, ist nicht unbedingt notwendig, so daß das Kochplattenmaterial hinsichtlich seiner Transmissionseigenschaften optimal auf die Erfordernisse bei der Temperaturerfassung abgestimmt werden kann.In addition, in inductive systems, the material of the hotplate can be chosen so that it can be at a maximum of 250 ° C to 300 ° C, especially in the temperature range of typical pot bottom temperatures, which are normally below 140 ° for cooking, and for example when frying for the appropriate heat radiation especially is permeable. A transmission capability at higher temperatures, ie at shorter wavelengths of heat radiation, as required, for example, for glass ceramic panels in radiant heating systems, is not absolutely necessary, so that the hob material can be optimally matched to the requirements of temperature detection in terms of its transmission properties.

Diese und weitere Merkmale gehen außer aus den Ansprüchen auch aus der Beschreibung und den Zeichnungen hervor, wobei die einzelnen Merkmale jeweils für sich allein oder zu mehreren in Form von Unterkombinationen bei einer Ausführungsform der Erfindung und auf anderen Gebieten verwirklicht sein und vorteilhafte sowie für sich schutzfähige Ausführungen darstellen können.These and other features will become apparent from the claims but also from the description and drawings, wherein the individual features each alone or more in the form of sub-combinations in an embodiment of the invention and in other fields be realized and advantageous and protectable Can represent versions.

Kurzbechreibung der ZeichnungenShort description of the drawings

Ein Ausführungsbeispiel der Erfindung ist in den Zeichnungen dargestellt und wird im folgenden näher erläutert. Die erste Zeichnungsfigur Fig. 1 zeigt in schematischer Darstellung eine bevorzugte Ausführungsform einer erfindungsgemäßen Temperaturerfassungsvorrichtung, die bei einer Induktionskochstelle eingebaut ist. Fig. 2 zeigt eine Draufsicht auf die Induktionskochstelle auf Fig. 1.An embodiment of the invention is illustrated in the drawings and will be explained in more detail below. The first drawing figure Fig. 1 shows a schematic representation of a preferred embodiment of a temperature detecting device according to the invention, which is installed at an induction cooking. Fig. 2 shows a plan view of the induction cooking on Fig. 1st

Detaillierte Beschreibung des AusführungsbeispielsDetailed description of the embodiment

Der schematische Vertikalschnitt der Fig. 1 zeigt einen Ausschnitt eines elektrischen Kochherdes, dessen Oberseite bzw. Arbeitsfläche durch eine horizontale Glaskeramikplatte 2 definiert wird, die eine einzige oder mehrere im Abstand voneinander liegende Kochstellen bzw. Koch- oder Heizzonen 3 aufweisen kann. Die für die einzelnen Heizzonen vorgesehenen Heizeinrichtungen 4 sind gegenüber der Innenseite bzw. Unterseite 5 der Platte 2 angeordnet und werden bei dem gezeigten, induktiven Elektrowärmegerät durch im gezeigten Beispiel mehrwindige, ebene Induktionsspulen 6 gebildet, die jeweils mit geringem Abstand unterhalb der Glaskeramikplatte 2 befestigt sind. Die beispielhaft gezeigte Induktionsspule 6 ist an einen nicht dargestellten Hochfrequenzgenerator des Kochgerätes angeschlossen. Im radial äußeren Bereich der ebenen Induktionsspule 6 sind in ihrem plattenzugewandten Bereich zylindrische und sich nach unten trichterförmig erweiternde Wärmeabschirmungen 7 befestigt, die dafür sorgen, daß im Inneren sowie unterhalb der Abschirmung 7 das durch die Spule 6 erzeugte elektromagnetische Wechselfeld stark abgeschwächt ist und vom Bereich der Platte 2 nach unten strahlende Wärme weitgehend abgeschirmt ist.The schematic vertical section of Fig. 1 shows a section of an electric cooker whose top or work surface is defined by a horizontal glass ceramic plate 2, which may have a single or more spaced cooking or cooking or heating zones 3. The heaters 4 provided for the individual heating zones are arranged opposite the inside or underside 5 of the plate 2 and are shown in the inductive Electric heater formed by mehrwindige in the example shown, planar induction coils 6, which are each secured at a small distance below the glass ceramic plate 2. The induction coil 6 shown by way of example is connected to a high-frequency generator, not shown, of the cooking appliance. In the radially outer region of the planar induction coil 6 cylindrical and downwardly funnel-shaped widening heat shields 7 are attached in their plate-facing area, which ensure that the electromagnetic alternating field generated by the coil 6 is strongly attenuated inside and below the shield 7 and the area the plate 2 is largely shielded down radiant heat.

Im abgeschirmten Bereich sind mit Sichtkontakt zur Plattenunterseite 5 schematisch dargestellte Infrarotsensoren 8, beispielsweise mit einer infrarotempfindlichen Diode, angeordnet, die an eine Auswerteelektronik 9 zur Verarbeitung des durch die Infrarotsensoren bereitgestellten Spannungssignale angeschlossen sind. Die Auswerteelektronik 9 kann auf einer Leiterplatte angeordnet sein, die im hermetisch abgeschlossenen Raum unterhalb der Glaskeramikplatte 2 befestigt ist und die elektronischen Bauteile einer elektronischen Steuereinrichtung für das Elektrogerät 1 trägt.In the shielded area 5 are shown with visual contact to the underside of the plate schematically illustrated infrared sensors 8, for example, with an infrared-sensitive diode arranged, which are connected to a transmitter 9 for processing the voltage provided by the infrared sensors voltage signals. The transmitter 9 may be arranged on a printed circuit board which is fixed in the hermetically sealed space below the glass ceramic plate 2 and carries the electronic components of an electronic control device for the electrical device 1.

Die Form und Größe der der Induktionsspule 6 zugeordneten, im Beispiel kreisrunden Heizzone 3 wird im Inneren der Kochmulde durch einen die Induktionsspule mit Radialabstand umgebenden, bis an die Unterseite 5 der Glaskeramikplatte 2 heranreichenden Ring 10 definiert, der aus einem die elektromagnetische Strahlung der Spule 2 abschirmenden, elektrisch leitfähigem Material, beispielsweise Aluminium bestehen kann. Auf der ebenen Oberseite 11 der ca. ein Zentimeter dicken, planparallelen Kochplatte 2 kann die äußere Begrenzung der runden Heizzone 3 durch einen nicht näher dargestellten Ring aus aufgedruckter Dekorfarbe markiert sein, um für einen Benutzer eine lagerichtige, möglichst zentrische Aufstellung von Kochgefäßen zu ermöglichen. Im Falle von Kochplatten 2 aus einem für Licht im sichtbaren Spektrum transparenten Material kann die Berandung der Kochzone durch den in diesem Falle von oben sichtbaren Ring 10 erkennbar sein.The shape and size of the induction coil 6 associated, in the example circular heating zone 3 is defined in the interior of the cooktop by a induction coil with radial distance surrounding, reaching down to the bottom 5 of the glass ceramic plate 2 ring 10, which consists of a electromagnetic radiation of the coil. 2 shielding, electrically conductive material, such as aluminum may exist. On the flat top 11 of approximately one centimeter thick, plane-parallel cooking plate 2, the outer boundary of the round heating zone 3 may be marked by a ring of printed decorative ink, not shown, in order to provide a correct position for a user, To allow the most centric installation of cooking vessels. In the case of hotplates 2 made of a transparent material for light in the visible spectrum material, the boundary of the cooking zone can be seen through the visible in this case from above ring 10.

Im Inneren der Heizzone 3 sind auf der Kochplattenoberseite 11 drei flache, kreisrunde Farbschichtbereiche 15, 16, 17 aufgebracht, deren Durchmesser jeweils einen Bruchteil, beispielsweise etwa ein Zehntel des Durchmessers der Kochzone beträgt. Die Farbschichtkreise können beispielsweise in Dünnschicht- oder Dickschichttechnik z.B. durch Aufdrucken aufgebracht sein und haben typische Dicken im Bereich von ca. 0,1 mm, so daß die weitgehend ebenen Oberseiten 18, 19, 20 der Farbkreise gegenüber der Plattenoberseite 11 gleichmäßig erhaben sind. Mit ihren Unterseiten 21, 22, 23 haften die Farbschichten fest auf der Plattenoberseite 11. Die Zentren der Farbkreise 15, 16, 17 liegen mit gleichmäßigem Abstand zueinander auf einem Kreis, dessen Durchmesser etwa 10% bis 30% kleiner sein kann als der Kochzonendurchmesser. Dadurch bilden die erhabenen Farbschichten eine Dreiecksanordnung, auf die ein in seiner Größe an die Größe der Kochzone 3 angepaßtes Kochgefäß 25 kippsicher und wackelfrei aufstellbar ist. Wird das Kochgefäß 25 mehr oder weniger zentrisch im Bereich der Kochzone aufgestellt, so berührt der weitgehend ebene oder leicht kalottenförmig gekrümmte Kochgefäßboden 26 die Oberseiten 18, 19, 20 der Farbpunkte 15, 16, 17 jeweils über im wesentlichen die gesamte Fläche, so daß unter dem Gewicht des Kochgefäßes und des darin befindlichen Kochgutes ein flächiger Anpreßkontakt zwischen den Farbschichtelementen 15, 16, 17 und der Kochgefäßunterseite 26 sichergestellt ist.Inside the heating zone 3, three flat, circular ink layer areas 15, 16, 17 are applied on the hotplate top side 11, the diameter of which is in each case a fraction, for example about one tenth of the diameter of the cooking zone. The color layer circuits can be used, for example, in thin-film or thick-film technology, e.g. be applied by printing and have typical thicknesses in the range of about 0.1 mm, so that the substantially flat top sides 18, 19, 20 of the color circles relative to the top plate 11 are evenly raised. The centers of the color circles 15, 16, 17 lie evenly spaced on a circle whose diameter may be about 10% to 30% smaller than the cooking zone diameter. As a result, the raised color layers form a triangular arrangement, to which a cooking vessel 25, adapted in size to the size of the cooking zone 3, can be set up in a tilt-proof and wobble-free manner. If the cooking vessel 25 is placed more or less centrally in the cooking zone, the largely flat or slightly dome-shaped curved cooking vessel bottom 26, the tops 18, 19, 20 of the color dots 15, 16, 17 respectively over substantially the entire surface, so that under the weight of the cooking vessel and the cooking material therein a surface contact pressure between the ink layer elements 15, 16, 17 and the cooking vessel bottom 26 is ensured.

Die auf kostengünstige Weise zuverlässig haftend anbringbaren Farbschichtkreise 15, 16, 17 bilden Meßelemente einer Temperaturerfassungsvorrichtung, die es gestattet, die Temperatur des Kochgefäßes, insbesondere des Kochgefäßbodens 26, auf kostengünstige Weise zuverlässig und genau zu bestimmen. Hierzu ist mindestens eines der Meßelemente 15, 16, 17 in Bezug auf den unterhalb der Platte 2 befindlichen Infrarotsensor 8 so angeordnet, daß die in Kontakt mit der Plattenoberseite 11 stehende Unterseite des Meßelementes in Sichtverbindung mit dem Infrarotsensor 8 steht. Alternativ zu der skizzierten direkten Sichtverbindung kann eine wärmestrahlungsleitende Verbindung zwischen Infrarotsensor und Meßelementunterseite auch mit Hilfe eines oder mehrerer für die Reflexion von Infrarotstrahlung geeigneter Spiegel und/oder mit Hilfe wärmestrahlungsleitender Lichtleitfasern geschaffen werden.The ink layer circuits 15, 16, 17, which can be reliably adhered in a cost-effective manner, form measuring elements of a temperature-detecting device, which allows the temperature of the cooking vessel, in particular of the cooking vessel bottom 26, to be reduced in a cost-effective manner reliable and accurate. For this purpose, at least one of the measuring elements 15, 16, 17 with respect to the located below the plate 2 infrared sensor 8 is arranged so that the standing in contact with the top plate 11 underside of the measuring element is in visual communication with the infrared sensor 8. As an alternative to the sketched direct line of sight, a heat radiation-conducting connection between the infrared sensor and the measuring element underside can also be created with the aid of one or more mirrors suitable for the reflection of infrared radiation and / or with the aid of heat radiation-conducting optical fibers.

Wird nun ein Topf o. dgl. auf die Meßelemente 15, 16, 17 aufgestellt und durch Einschalten der Induktionsheizung erwärmt, so werden aufgrund der zweckmäßig hohen Wärmeleitfähigkeit und geringen Wärmekapazität der Meßelemente und aufgrund des großflächigen Anpreßkontaktes zwischen Topfunterseite und Meßelementen die Unterseiten der Meßelemente mit nur geringer Zeitverzögerung weitgehend die Temperatur annehmen, die der in Kontakt mit dem jeweiligen Meßelement stehende Bereich des Topfbodens hat. Ein besonderer Vorteil der Erfindung liegt nun darin, daß diese weitgehend der Topfbodentemperatur entsprechende Temperatur an einer bzgl. ihrer Emissionseigenschaften genau definierten Referenzfläche vorliegt, nämlich an der in Kontakt mit der Kochplattenoberseite stehenden Meßelementunterseite 21, 22, 23. Dadurch ist es möglich, mit Hilfe des Infrarotsensors 8 durch die infrarottransparente Platte 2 hindurch von unten eine sehr genaue Temperaturmessung durchzuführen, da sich Unterschiede bei der Abstrahlungsfähigkeit verschiedener Kochgefäßböden bei dieser Art der Temperaturmessung nicht oder nur in vernachlässigbarer Weise auswirken. Das Meßergebnis dieses Temperaturmeßverfahrens ist daher weitgehend unabhängig von der Emissionsfähigkeit des Topfbodens, so daß Kochgefäße beliebiger Oberflächenbeschaffenheit ohne Beeinträchtigung der Temperaturmessung verwendet werden können, solange die Topfbodenform einen hinreichend großflächigen Berührungskontakt zu dem für die Messung verwendeten Meßelement erlaubt. Dieser Berührungskontakt ist zweckmäßig um sicherzustellen, daß das Meßelement durch Wärmeleitung sich schnell an die Topfbodentemperatur angleicht.Now, if a pot o. The like. On the measuring elements 15, 16, 17 and heated by switching on the induction heating, so are due to the expediently high thermal conductivity and low heat capacity of the measuring elements and due to the large contact pressure between bottom of the pot and measuring elements, the undersides of the measuring elements Only a small time delay largely assume the temperature that has the standing in contact with the respective measuring element range of the pot bottom. A particular advantage of the invention lies in the fact that this largely corresponds to the pot bottom temperature corresponding temperature with respect to their emission properties precisely defined reference surface, namely on the standing in contact with the hotplate top Meßelementunterseite 21, 22, 23. This makes it possible with the help of the infrared sensor 8 through the infrared transparent plate 2 from below to perform a very accurate temperature measurement, since differences in the radiating ability of various cooking vessels soils in this type of temperature measurement or only negligible effect. The measurement result of this temperature measuring is therefore largely independent of the emissivity of the pot bottom, so that cooking vessels of any surface finish without affecting the temperature measurement can be used as long as the pot bottom shape allowed a sufficiently large-area physical contact with the measuring element used for the measurement. This contact is convenient to ensure that the measuring element by heat conduction quickly adapts to the pot bottom temperature.

Da es die Erfindung ermöglicht, die Topfbodentemperatur oder die Bodentemperatur anderer Kochgefäße zeitnah und relativ genau zu bestimmen, eignet sich eine erfindungsgemäße Temperaturerfassung besonders gut für automatische, sensorunterstützte Kochsysteme, bei denen die Heizleistung der jeweils den Kochzonen zugeordneten Heizeinrichtungen in Abhängigkeit von der Kochgut- bzw. Kochgefäßtemperatur steuerbar ist. Jedoch kann die erfaßte Temperatur auch lediglich zur Anzeige gebracht werden, um einem Bediener ein das Kochgut schonendes und effektives Kochen, Braten, Fritieren o. dgl. zu ermöglichen. Since the invention makes it possible to determine the pot base temperature or the bottom temperature of other cooking vessels in a timely and relatively accurate manner, a temperature detection according to the invention is particularly well suited for automatic, sensor-assisted cooking systems in which the heating power of the respective cooking zones associated heating devices depending on the Kochgut- or Cooking vessel temperature is controllable. However, the detected temperature can also be displayed only to allow an operator a cooking food gently and effectively cooking, frying, frying o.

Claims (10)

  1. Device for determining the temperature of a cooking vessel (25) placed on a hotplate, in particular a glass ceramic plate (2), of a heating appliance (1) in the vicinity of a heating zone (3), at least one flat measuring element (15, 16, 17), having a top surface (18, 19, 20) for contact with a bottom (26) of the cooking vessel (25), being arranged on the top (11) of the hotplate (2) in the vicinity of the heating zone (3), and a device (8) being provided for determining the temperature of the measuring element, characterised in that at least one measuring element (15, 16, 17) is formed by a material coating applied in self-adhesive manner to the top (11) of the hotplate (2) or by a separate material portion fixed to the top (11) of the hotplate, at least one sensor for determining the temperature of the measuring element (15, 16, 17) being arranged below the hotplate (2).
  2. Device according to claim 1, characterised in that the at least one sensor is an infrared sensor (8).
  3. Device according to either claim 1 or claim 2, characterised in that at least one measuring element (15, 16, 17) is formed by a printed-on colour coating.
  4. Device according to any one of the preceding claims, characterised in that at least one measuring element (15, 16, 17) is formed by a separate metal foil fixed to the top (11) of the hotplate.
  5. Device according to any one of the preceding claims, characterised in that the top (18, 19, 20) of the measuring element (15, 16, 17) projects slightly over the top (11) of the hotplate, preferably by less than 0.2 mm, in particular by between 0.05 mm and 0.15 mm.
  6. Device according to any one of the preceding claims, characterised in that a plurality of measuring elements (15, 16, 17), in particular three measuring elements positioned in a triangular arrangement, are provided in the vicinity of the cooking zone (3).
  7. Device according to any one of the preceding claims, characterised in that at least one measuring element (15, 16, 17) is positioned eccentrically to a centre of the cooking zone (3) and/or in that no measuring element is positioned in the centre of the cooking zone.
  8. Electric heating appliance with a hotplate, in particular a glass ceramic plate, on said hotplate being defined at least one heating zone, heatable by a heating device positioned below said hotplate, and with a device for determining the temperature of a cooking vessel placed on the heating zone, characterised in that the device for determining the temperature of the cooking vessel (25) is constructed according to any one of claims 1 to 7.
  9. Method for determining the temperature of a cooking vessel (25) placed on a hotplate, in particular a glass ceramic plate (2), of a preferably electrical heating appliance (1) in the vicinity of a heating zone (3), characterised by the following steps:
    - provision of at least one flat measuring element (15, 16, 17), having a top surface (18, 19, 20) in the vicinity of the cooking zone (3) for contact with a bottom (26) of the cooking vessel (25), at least one measuring element (15, 16, 17) being formed by a material coating applied in self-adhesive manner to the top (11) of the hotplate (2) or by a separate material portion fixed to the top (11) of the hotplate and at least one sensor for determining the temperature of the measuring element (15, 16, 17) being arranged below the hotplate (2);
    - setting down a cooking vessel (25) in the vicinity of the cooking zone in such a way that an underside of the cooking vessel comes into contact with said top of the measuring element; and
    - determination of the temperature of the measuring element.
  10. Method according to claim 9, characterised in that the temperature of the measuring element (15, 16, 17) is determined from below and through the hotplate, the heat radiation emitted by the underside (21, 22, 23) of the measuring element through the hotplate preferably being detected.
EP01128793A 2000-12-21 2001-12-04 Temperature of cooking vessels sensing method and device Expired - Lifetime EP1217873B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10064621 2000-12-21
DE10064621A DE10064621A1 (en) 2000-12-21 2000-12-21 Method and device for recording the temperature of a cooking vessel

Publications (3)

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EP1217873A2 EP1217873A2 (en) 2002-06-26
EP1217873A3 EP1217873A3 (en) 2003-11-05
EP1217873B1 true EP1217873B1 (en) 2006-06-28

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EP01128793A Expired - Lifetime EP1217873B1 (en) 2000-12-21 2001-12-04 Temperature of cooking vessels sensing method and device

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US (1) US20030206572A1 (en)
EP (1) EP1217873B1 (en)
AT (1) ATE332071T1 (en)
AU (1) AU781345B2 (en)
DE (2) DE10064621A1 (en)
ES (1) ES2267657T3 (en)

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ES2356442B1 (en) * 2009-01-13 2012-03-13 Bsh Electrodomesticos España, S.A COOKING FIELD WITH A COVER PLATE.
ES2361106B1 (en) * 2009-04-17 2012-04-20 Bsh Electrodomesticos España S.A COVER PLATE FOR A COOKING FIELD.
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GB2517633B (en) * 2012-06-07 2016-09-14 Oy Halton Group Ltd Fire suppression systems, devices, and methods
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ES2526622B1 (en) * 2013-07-09 2015-10-26 Bsh Electrodomésticos España, S.A. Home Appliance Device
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Also Published As

Publication number Publication date
AU9725901A (en) 2002-08-22
EP1217873A2 (en) 2002-06-26
ES2267657T3 (en) 2007-03-16
EP1217873A3 (en) 2003-11-05
DE10064621A1 (en) 2002-06-27
US20030206572A1 (en) 2003-11-06
ATE332071T1 (en) 2006-07-15
AU781345B2 (en) 2005-05-19
DE50110327D1 (en) 2006-08-10

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