EP1176808A3 - Bildaufnahmevorrichtung - Google Patents

Bildaufnahmevorrichtung Download PDF

Info

Publication number
EP1176808A3
EP1176808A3 EP01306425A EP01306425A EP1176808A3 EP 1176808 A3 EP1176808 A3 EP 1176808A3 EP 01306425 A EP01306425 A EP 01306425A EP 01306425 A EP01306425 A EP 01306425A EP 1176808 A3 EP1176808 A3 EP 1176808A3
Authority
EP
European Patent Office
Prior art keywords
image sensing
sensing apparatus
signals
photoelectric conversion
adding circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01306425A
Other languages
English (en)
French (fr)
Other versions
EP1176808A2 (de
Inventor
Osamu Yuki
Noriyuki Kaifu
Kazuaki Tashiro
Tetsunobu Kochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000227333A external-priority patent/JP3715873B2/ja
Priority claimed from JP2000234829A external-priority patent/JP2002051262A/ja
Application filed by Canon Inc filed Critical Canon Inc
Priority to EP20100181875 priority Critical patent/EP2290952A3/de
Publication of EP1176808A2 publication Critical patent/EP1176808A2/de
Publication of EP1176808A3 publication Critical patent/EP1176808A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/30—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from X-rays
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/30—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming X-rays into image signals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/41—Extracting pixel data from a plurality of image sensors simultaneously picking up an image, e.g. for increasing the field of view by combining the outputs of a plurality of sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/46—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N3/00—Scanning details of television systems; Combination thereof with generation of supply voltages
    • H04N3/10—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical
    • H04N3/14—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
    • H04N3/15—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices for picture signal generation
    • H04N3/155—Control of the image-sensor operation, e.g. image processing within the image-sensor
    • H04N3/1562—Control of the image-sensor operation, e.g. image processing within the image-sensor for selective scanning, e.g. windowing, zooming
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/32—Transforming X-rays

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
EP01306425A 2000-07-27 2001-07-26 Bildaufnahmevorrichtung Withdrawn EP1176808A3 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP20100181875 EP2290952A3 (de) 2000-07-27 2001-07-26 Bildaufnahmevorrichtung

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000227333A JP3715873B2 (ja) 2000-07-27 2000-07-27 撮像装置、放射線撮像装置及びそれを用いた放射線撮像システム
JP2000227333 2000-07-27
JP2000234829 2000-08-02
JP2000234829A JP2002051262A (ja) 2000-08-02 2000-08-02 撮像装置、放射線撮像装置及びそれを用いた放射線撮像システム

Publications (2)

Publication Number Publication Date
EP1176808A2 EP1176808A2 (de) 2002-01-30
EP1176808A3 true EP1176808A3 (de) 2003-01-02

Family

ID=26596828

Family Applications (2)

Application Number Title Priority Date Filing Date
EP20100181875 Withdrawn EP2290952A3 (de) 2000-07-27 2001-07-26 Bildaufnahmevorrichtung
EP01306425A Withdrawn EP1176808A3 (de) 2000-07-27 2001-07-26 Bildaufnahmevorrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP20100181875 Withdrawn EP2290952A3 (de) 2000-07-27 2001-07-26 Bildaufnahmevorrichtung

Country Status (2)

Country Link
US (5) US7071980B2 (de)
EP (2) EP2290952A3 (de)

Families Citing this family (43)

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Publication number Priority date Publication date Assignee Title
EP2290952A3 (de) 2000-07-27 2011-08-17 Canon Kabushiki Kaisha Bildaufnahmevorrichtung
JP3750502B2 (ja) * 2000-08-03 2006-03-01 ソニー株式会社 固体撮像装置およびカメラシステム
JP3667214B2 (ja) * 2000-08-25 2005-07-06 キヤノン株式会社 固体撮像装置およびその駆動方法
JP2002330349A (ja) * 2001-04-26 2002-11-15 Fujitsu Ltd Ｘｙアドレス型固体撮像装置
EP3388784B1 (de) * 2001-05-04 2019-07-17 Vexcel Imaging GmbH Verfahren und grossformatige kamera zur aufnahme eines grossformatigen bildes eines grossflächigen objektes
US7138696B2 (en) * 2001-10-19 2006-11-21 Canon Kabushiki Kaisha Image pickup apparatus, radiation image pickup apparatus and radiation image pickup system
JP3992504B2 (ja) * 2002-02-04 2007-10-17 富士通株式会社 Ｃｍｏｓイメージセンサ
JP4240917B2 (ja) * 2002-06-13 2009-03-18 コニカミノルタホールディングス株式会社 走査回路
US20040012688A1 (en) * 2002-07-16 2004-01-22 Fairchild Imaging Large area charge coupled device camera
US20040012684A1 (en) * 2002-07-16 2004-01-22 Fairchild Imaging Image reconstruction techniques for charge coupled devices
US20040012689A1 (en) * 2002-07-16 2004-01-22 Fairchild Imaging Charge coupled devices in tiled arrays
US7408195B2 (en) * 2003-09-04 2008-08-05 Cypress Semiconductor Corporation (Belgium) Bvba Semiconductor pixel arrays with reduced sensitivity to defects
JP2005130382A (ja) * 2003-10-27 2005-05-19 Matsushita Electric Ind Co Ltd 固体撮像装置
US7564019B2 (en) 2005-08-25 2009-07-21 Richard Ian Olsen Large dynamic range cameras
US8124929B2 (en) * 2004-08-25 2012-02-28 Protarius Filo Ag, L.L.C. Imager module optical focus and assembly method
US7916180B2 (en) * 2004-08-25 2011-03-29 Protarius Filo Ag, L.L.C. Simultaneous multiple field of view digital cameras
WO2006026354A2 (en) 2004-08-25 2006-03-09 Newport Imaging Corporation Apparatus for multiple camera devices and method of operating same
US7795577B2 (en) * 2004-08-25 2010-09-14 Richard Ian Olsen Lens frame and optical focus assembly for imager module
JP4306603B2 (ja) * 2004-12-20 2009-08-05 ソニー株式会社 固体撮像装置および固体撮像装置の駆動方法
KR100680469B1 (ko) 2005-01-31 2007-02-08 매그나칩 반도체 유한회사 인접한 화소들 사이의 센싱노드들이 공유된 씨모스 이미지센서
JP4561439B2 (ja) * 2005-03-30 2010-10-13 株式会社デンソー 撮像装置
US20070102622A1 (en) * 2005-07-01 2007-05-10 Olsen Richard I Apparatus for multiple camera devices and method of operating same
US7214998B2 (en) * 2005-07-26 2007-05-08 United Microelectronics Corp. Complementary metal oxide semiconductor image sensor layout structure
US7964835B2 (en) 2005-08-25 2011-06-21 Protarius Filo Ag, L.L.C. Digital cameras with direct luminance and chrominance detection
US20070258006A1 (en) * 2005-08-25 2007-11-08 Olsen Richard I Solid state camera optics frame and assembly
JP4194633B2 (ja) * 2006-08-08 2008-12-10 キヤノン株式会社 撮像装置及び撮像システム
US7760258B2 (en) * 2007-03-07 2010-07-20 Altasens, Inc. Apparatus and method for stabilizing image sensor black level
US20080266444A1 (en) * 2007-04-27 2008-10-30 Micron Technology, Inc. Method, apparatus, and system for continuous autofocusing
JP4582205B2 (ja) * 2008-06-12 2010-11-17 トヨタ自動車株式会社 電動車両
US7777171B2 (en) * 2008-08-26 2010-08-17 Eastman Kodak Company In-pixel summing of charge generated by two or more pixels having two reset transistors connected in series
US8913166B2 (en) * 2009-01-21 2014-12-16 Canon Kabushiki Kaisha Solid-state imaging apparatus
CN101901818B (zh) * 2009-05-26 2013-06-05 鸿富锦精密工业（深圳）有限公司 影像感测器、侦测物体运动方向的装置及方法
US8723827B2 (en) 2009-07-28 2014-05-13 Cypress Semiconductor Corporation Predictive touch surface scanning
JP2012034350A (ja) * 2010-07-07 2012-02-16 Canon Inc 固体撮像装置及び撮像システム
JP5751766B2 (ja) 2010-07-07 2015-07-22 キヤノン株式会社 固体撮像装置および撮像システム
JP5671890B2 (ja) * 2010-08-31 2015-02-18 株式会社ニコン 撮像装置
TWI424746B (zh) * 2011-02-14 2014-01-21 Ind Tech Res Inst 影像感測器及其感測方法
US9357972B2 (en) 2012-07-17 2016-06-07 Cyber Medical Imaging, Inc. Intraoral radiographic sensors with cables having increased user comfort and methods of using the same
JP6063160B2 (ja) * 2012-07-20 2017-01-18 株式会社堀場製作所 放射線検出器
JP6537838B2 (ja) * 2015-01-30 2019-07-03 ルネサスエレクトロニクス株式会社 撮像素子
JP6988796B2 (ja) * 2016-04-22 2022-01-05 ソニーグループ株式会社 Ｘ線検出装置
JP7046698B2 (ja) * 2018-04-24 2022-04-04 浜松ホトニクス株式会社 放射線検出器、放射線検出器の製造方法、及び画像処理方法
CN109545810A (zh) * 2018-11-20 2019-03-29 京东方科技集团股份有限公司 一种平板探测器及其制备方法

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US5464984A (en) * 1985-12-11 1995-11-07 General Imaging Corporation X-ray imaging system and solid state detector therefor
EP0346102A2 (de) * 1988-06-08 1989-12-13 Nippon Hoso Kyokai Festkörperbildaufnahmegerät
WO1999031874A1 (en) * 1997-12-16 1999-06-24 Photobit Corporation Three-sided buttable cmos image sensor
WO2000017930A1 (fr) * 1998-09-22 2000-03-30 Shimadzu Corporation Dispositif de reproduction d'images a vitesse elevee

Also Published As

Publication number Publication date
US7920195B2 (en) 2011-04-05
US8531568B2 (en) 2013-09-10
US20060077270A1 (en) 2006-04-13
US7071980B2 (en) 2006-07-04
US20020024606A1 (en) 2002-02-28
EP1176808A2 (de) 2002-01-30
EP2290952A2 (de) 2011-03-02
US7639295B2 (en) 2009-12-29
US7630010B2 (en) 2009-12-08
US20110157443A1 (en) 2011-06-30
US20060081766A1 (en) 2006-04-20
EP2290952A3 (de) 2011-08-17
US20090230310A1 (en) 2009-09-17

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