EP1110243A1 - Element integre, corps composite constitue d'un element integre et d'une structure conductrice, carte a puce et procede de production de l'element integre - Google Patents

Element integre, corps composite constitue d'un element integre et d'une structure conductrice, carte a puce et procede de production de l'element integre

Info

Publication number
EP1110243A1
EP1110243A1 EP99947214A EP99947214A EP1110243A1 EP 1110243 A1 EP1110243 A1 EP 1110243A1 EP 99947214 A EP99947214 A EP 99947214A EP 99947214 A EP99947214 A EP 99947214A EP 1110243 A1 EP1110243 A1 EP 1110243A1
Authority
EP
European Patent Office
Prior art keywords
component
contact
integrated
integrated component
contact element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99947214A
Other languages
German (de)
English (en)
Inventor
Achim Neu
Thies Janczek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of EP1110243A1 publication Critical patent/EP1110243A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to an integrated component with at least one contact surface for connecting the component with a fastening means.
  • the invention relates to a composite body made of an integrated component and a conductor structure and a chip card.
  • the invention also relates to a method for producing an integrated component, in which at least one contact element is produced for connecting the component to a fastening means.
  • the passivation layer usually consists of a double layer of plasma oxide and plasma nitride in typical thicknesses of 200 nm to 500 nm. Furthermore, a further passivation layer made of polyimide in a thickness of 3 ⁇ m to 5 ⁇ m, a so-called soft passivation, is known.
  • the invention has for its object to provide an integrated component through which the disadvantages of the prior art are overcome.
  • the component should be able to be manufactured in the simplest and most reliable way possible and should ensure the longest possible service life of the contacts even under thermal and / or mechanical loads.
  • this object is achieved in a generic circuit in that the contact element is arranged in an edge region of the integrated component in such a way that the contact element has at least one contact surface which is inclined with respect to a main surface of the component.
  • the invention therefore provides to create an integrated component which has contacts which are located in one or more of its edge regions.
  • integrated component is meant here in a broad sense. It includes, for example, individual functional elements, integrated circuits with or without housing as well as ready-to-install modules. In addition to active elements that usually occur in circuits, the individual functional elements can also be sensors or actuators.
  • contact element is also to be understood in a broad sense. In particular, it is not limited to the known contact areas (pads), but expressly also relates to those contacts which serve to connect any other structural level of an integrated electronic circuit.
  • the contact element is arranged in an edge region of the integrated component in such a way that it is at least in sections in contact with an edge region of a main surface of the component and that the contact element ment in an installed state of the component in contact with at least two, at an angle different from 0 0 arranged surfaces of a fastener can be brought.
  • fastener is meant in its broadest meaning. On the one hand, it contains known lead frames and lead structures and, on the other hand, it also includes all other possible holders for the component.
  • the two surfaces of the housing, with which the contact element can be brought into contact can be arranged at any angle to one another, an angle of 90 ° merely representing an example.
  • An angle different from 90 ° has the advantage that a larger effective contact surface can be achieved with such inclined surfaces.
  • a particularly advantageous embodiment of this component is characterized in that the inner surface area is printed and / or coated.
  • the invention further relates to designing a composite body from a conductor structure and at least one integrated component such that the component is designed in one of the ways shown in this application.
  • a generic method is also carried out such that the component is produced in such a way that the contact element is produced in an edge region of the integrated component in such a way that the contact element has at least one contact surface which is inclined with respect to a main surface of the component.
  • the illustrated method for producing the component preferably represents a sub-step of a method for producing a composite from a component and a fastening means carrying it.
  • This embodiment combines a fast and rational method of producing one or, which is particularly preferred, multiple integrated electronic circuits in the area of a main surface of a semiconductor substrate, with the production of contacts for connecting the integrated circuit or the integrated circuits.
  • the individual integrated circuits are separated out using a suitable separation method, with sawing being particularly expedient.
  • Carrying out the sawing with a saw blade that is aligned during the sawing process in a plane that is orthogonal to the main surface of the semiconductor substrate leads to defined cutting edges.
  • An oblique guidance of the saw blade compared to the orthogonal position is associated with the advantage that a larger contact area of the contact elements is exposed in the area of the saw surface.
  • an inventive moderate separation process has the advantage that the separation process, for example the sawing process, and the exposure of surfaces of the contact elements takes place with the same process step.
  • 1 is a plan view of a main surface of a semiconductor substrate containing integrated electrical circuits
  • FIG. 4 shows a cross section through the semiconductor substrate after a sawing process, in which the saw blade has been placed at an angle different from 90 °
  • FIG. 6 shows a side view of a lead frame 90 with another embodiment of the integrated component 35
  • FIG. 7 is a plan view of the lead frame shown in FIG. 6 with built-in integrated component 35,
  • FIG. 8 is a plan view of a conductor structure on which a component 135 with multiple planes is arranged. th integrated circuit is attached, wherein several levels of the integrated circuit are connected to the conductor structure,
  • FIG. 9 shows a plan view of another embodiment of a composite body according to the invention comprising an integrated circuit and a fastening means 200 carrying it,
  • FIG. 10 shows a cross section through a further fastening means 230 according to the invention, which is designed as a housing for an integrated component,
  • FIG. 11 shows a fastening means 290, which likewise has a base body and two projections 310 and 320,
  • a fastening means 350 which has a base body 360 and two projections 370 and 380,
  • suitable fastening option for an integrated component 400 for example a surface wave filter with contact elements 410 and 420 located in the edge region of its lower main surface
  • FIG. 15 shows a cross section through a composite body composed of a fastening means 630 and a component 600 designed as a sensor
  • 16 is a plan view of a composite body made of a component 700, likewise designed as a sensor, and a carrier plate 740 made of a flexible material, 17 shows an area of a chip card in which a component 800 in the form of an integrated electronic circuit and connection areas 810, 820, 830, 840, 850 and 860 for a contact of the integrated component 800 with a card reading or writing unit are located,
  • 19 is a plan view of an area of the chip card in which a functional element, for example an inductive coil 960, is applied to the surface of the integrated component 800.
  • a functional element for example an inductive coil 960
  • the plan view of a semiconductor substrate shown in FIG. 1 is a section of a wafer that contains a large number of integrated electronic circuits 10.
  • the integrated electronic circuits 10 form first examples of integrated components according to the invention or a preliminary stage of further integrated components according to the invention.
  • the integrated electronic circuits 10 are each provided with contact elements 20 in their edge region. Regions 30 of the semiconductor substrate which are not provided with switching elements are located between the integrated circuits 10. The areas 30 are arranged in the form of a grid.
  • Circuits 10 are isolated, is explained below with reference to FIGS. 2 and 3.
  • a saw blade 40 separates two integrated circuits 10, 10 ′ from one another by removing the region 30 lying between them.
  • the saw blade 40 has a greater width A than it corresponds to a mutual distance B between the contact elements 20, 20 ', so that the contact elements 20, 20' are exposed.
  • the width A of the saw blade 40 is chosen to be smaller than the width of an area x in which there are no functional elements in order to prevent damage to functional elements located in areas y.
  • Sawing creates micro-cracks (damage) that can expand.
  • the area x is provided between the areas y.
  • the area x can be used for example for test structures.
  • FIG. 4 shows components 45, the structure of which essentially corresponds to the components shown in FIG. 3.
  • integrated electronic circuits 50, 50 'shown in FIG. 4 have contact surfaces 62, 62' arranged at an oblique angle in the region of contact elements 60, 60 '.
  • FIG. 4 The component shown in FIG. 4 is shown by way of example in the case of the lead frame shown in detail in a cross section in FIG. 5.
  • a conductive adhesive 80 for example a silver conductive lacquer, in particular around an epoxy silver conductive lacquer, such as is manufactured by Sumitomo and sold under the product name CRM1033B, through which the integrated component 45 with the lead frame is both electrical as well as being mechanically connected.
  • the lead frame 70 is merely an advantageous embodiment of a fastening means according to the invention.
  • FIG. 6 An installation of the integrated component 35 according to the invention shown in FIG. 3 in a lead frame 90 is shown as an example in FIG. 6.
  • the lead frame 90 is merely an advantageous exemplary embodiment of a fastening means according to the invention.
  • the integrated component 35 is connected to an edge region of the lead frame 90 by a conductive adhesive, preferably with silver conductive lacquer, in particular an epoxy silver conductive lacquer, such as the aforementioned silver conductive lacquer from the manufacturer Sumitomo.
  • the lead frame 90 contains lead strips 110, 120, which are connected by regions of the conductive adhesive 100 to a contact element 20 of the integrated component 35 are.
  • An insulating insulating material 130 is applied between the areas in which the conductive adhesive 100 is located.
  • the insulating insulation material is designed so that it not only provides electrical insulation, but also prevents moisture from penetrating in the areas covered with it.
  • FIG. 7 A top view of the conductor structure in FIG. 6 is shown in FIG. 7. It can be seen here that the integrated component 35 is connected to conductor tracks 110, 120 on four side surfaces.
  • the component 8 shows a preferred fastening of a component 135.
  • the component 135 contains a layer stack of a plurality of integrated circuits arranged one above the other.
  • the component 135 is also referred to as a cubic stacked packet because of its shape.
  • the individual integrated circuits are connected to one another within the layer stack by a thermally conductive adhesive.
  • the contact elements 170, 180 are located in a surface that is suitably inclined with respect to this contact surface, the angle being approximately 90 ° C. in the simple case of a cubic structure.
  • the component 135 is located on a conductor structure 140, which is also an advantageous exemplary embodiment of a fastening means that can be used according to the invention.
  • Conductor tracks 150, 160 are arranged on the conductor structure 140 for connecting contact elements 170, 180 located in the integrated circuit.
  • the contact elements 170 arranged in a low structural level are essentially connected to the conductor tracks 150 in the manner illustrated with reference to FIG. 5 or FIG. 6.
  • To connect the con Clock elements 180 serve as adhesive strips 190 arranged on the conductor tracks 160.
  • the contact elements 170, 180 consist of a material which has both a high conductivity and a sufficiently low diffusion during the manufacturing process of the integrated component 135, preferably of aluminum.
  • the adhesive strips 190 consist of a conductive adhesive which contains a sufficiently high concentration of an electrically conductive substance.
  • the composite body shown in FIGS. 5, 6, 7 and 8 from an integrated circuit and the supporting structure carrying it can be produced in a variety of ways.
  • the integrated electronic circuits are first separated, as is explained, for example, with reference to FIGS. 1, 2, 3 and 4. Subsequently, the integrated component 35, 45 or 135 is contacted on the conductor structure, that is to say in particular the conductor frame 70, 90 or a conductor structure 140 designed as a printed circuit board, and is simultaneously fixed. Particular advantages of such an assembly system can be seen, for example, in a front-end process or in a back-end process.
  • a polyimide layer is applied as evenly as possible.
  • the polyimide layer is applied by means of a process which is as possible as possible ensures uniform thickness of the polyimide layer. Since a lateral contact surface of the contact elements 20, 20 ', 60, 60', 170 and 180 is exposed, no photochemical process for exposing the contacts (aluminum pads) is necessary.
  • the contact elements are connected to the conductor tracks in one step, so that the throughput times are reduced compared to a front-end process.
  • the yield of the process is also increased.
  • FIG. 9 shows a top view of a further embodiment of a composite body according to the invention comprising an integrated circuit and a fastening means carrying it.
  • the fastening means is in turn a carrier plate 200.
  • a spacer layer 210 Between the carrier plate 200 and the integrated component 35 there is a spacer layer 210, which is referred to as underfiller due to its property of filling up the entire volume of space located below the integrated component 35.
  • An upper surface of the carrier plate 200 forms a lower boundary for the spacer layer 210.
  • the spacer layer 210 is laterally delimited by connection elements 220.
  • Such a composite body can be produced, for example, by first producing the integrated component 35, for example using the method described in accordance with FIGS. 1 to 3. Subsequently, the integrated component 35 is brought into contact with the carrier plate 200 such that the spacer layer 210 is produced between the carrier plate 200 and the integrated component 35. Because 35 projections, in particular projections on the main surfaces, are avoided when designing the integrated component, the spacer layer can be pour in a uniform thickness that is not disturbed by elevations.
  • connection elements 220 are then produced by a suitable method, for example by means of a printing technique, preferably by means of screen printing.
  • the avoidance of protrusions on the main surfaces of the integrated component 35 has the advantage that corrosion is avoided by completely filling the space between the integrated component 35 and the carrier plate 200 with the spacer layer 210.
  • Such a structure of the integrated circuit, or of a component containing it, has the further
  • the inner surface area can be coated.
  • the arrangement of the contact elements according to the invention can be used with very different components. It is therefore possible, in particular, for the integrated components 35, 45, 135 to be replaced by other components in the aforementioned exemplary embodiments. Various embodiments which can be combined with several different embodiments of the component are also expedient for the fastening means with which the component can be connected. ,
  • Fastening means is designed so that a component can be placed in it while maintaining its dimensions.
  • 10 shows a cross section through a fastening means 230, which is designed as a housing for an integrated component.
  • the fastening means 230 has a base body 240 and two projections 250, 260 which extend vertically to the base body 240.
  • the protrusions 250, 260 are designed so that a component can be placed between them.
  • Conductor tracks 270, 280 are designed such that they penetrate the base body 240 in the area of the projections 250 or 260.
  • the fastening means 290 shown in FIG. 11 likewise has a base body and two projections 310 and 320.
  • the projections 310 and 320 are in turn arranged such that an integrated component can be arranged between them.
  • Conductors 330 and 340 penetrate the projections 310 and 320, respectively.
  • the conductor tracks 330 and 340 also have a section which runs essentially parallel to the main surface of the base body 300 and which is used for contacting is determined by contact elements of a suitably designed component.
  • the fastening means 230 and 290 are preferably designed such that the component to be fastened in them is fixed in them by means of a suitable adhesive. However, it is also possible to modify these fasteners in such a way that a suitably designed component can be connected to them in a non-positive or positive manner. An example of such a form-fitting fastening variant that enables a plug connection is explained in FIG. 12.
  • the fastening means 350 shown in FIG. 12 has a base body 360 and two projections 370 and 380. Between a base 365 of the base body 360 and the projection 370 there is a conductor track 390 which extends in a region intended for contacting the component on an upper surface of the base 365 parallel to the latter.
  • FIGS. 13 and 14 Suitable fastening options for an integrated component 400, for example a surface acoustic wave filter with contact elements 410 and 420 located in the edge region of its lower main surface, are shown in FIGS. 13 and 14.
  • the fastenings shown can of course not only be used with a surface acoustic wave filter, but with any component that has an essentially comparable topological structure.
  • the component 400 is located on a fastening means 430, which is essentially designed like the fastening means 230 shown in FIG. 10. It also has a base body 440, projections 450 and 460 and conductor tracks 470 and 480. In contrast to the exemplary embodiment shown in FIG. 10, the conductor tracks 470 and 480 end flush with side edges of bases 445 and 448 of the main body 440. Otherwise, the regions of the conductor tracks 470 and 480 facing the component 400 are essentially parallel to the upper surfaces of the Socket 445 and 448.
  • the conductor tracks 470 and 480 are in direct mechanical and electrical contact with the contact elements 410 and 420, respectively.
  • the gap 405 has a defined thickness d that remains constant over its entire longitudinal extent.
  • spacers 510 which are present in another sectional plane and are shown below in FIG. 14. Spacers of this type are produced, for example, by means of an injection molding process and are arranged between adjacent conductor strips.
  • FIG. 14 shows later processing steps of the composite of fastening means 430 and component 400 arranged in it, as shown in FIG. 13.
  • the left side of FIG. 14 shows a spacer 510, which is used to clamp the component 400 to the projection 415.
  • the spacer 510 is preferably applied by casting after the component 400 has been introduced into the fastening means 430. Such an attachment is shown as partially potted.
  • a completely encapsulated variant is shown in the right part of FIG. 14.
  • a potting compound 520 is located between the projection 460 and the side surface of the component 400 facing it as well as on an upper surface of the component 400.
  • the fasteners shown with reference to FIGS. 10 to 14 are characterized in that they form a pre-housed lead frame.
  • the use of pre-housed lead frames is associated with the advantage that one or more components can be installed in them particularly poorly at mechanical stresses.
  • the finished composite body consisting of component and fastening means are characterized in that they contain only a few different chemical substances, so that a mutual chemical influence is reduced. Furthermore, the materials used have increased chemical resistance.
  • the selected exemplary embodiments of the assembly of the component can be expediently used in particular where a defined distance d 'between the component and an area of the fastening means is expedient.
  • FIGS. 13 and 14 Fastening options for an integrated component 400, for example a surface acoustic wave filter with contact elements 410 and 420 located in the edge region of its lower main surface, are shown in FIGS. 13 and 14.
  • the fastenings shown can of course not only be used with a surface acoustic wave filter, but with any component that has an essentially comparable topological structure.
  • FIG. 15 shows a composite body composed of a component 600 formed by a sensor and a fastening means 630 carrying it.
  • the fastening means 630 is essentially designed like the fastening means 230 shown in FIG. 10. It also has a base body 640, projections 650 and 660 and conductor tracks 670 and 680. In contrast to the exemplary embodiment shown in FIG. 10, the conductor tracks 670 and 680 end flush with the side edges of bases 645 and 648 of the base body 640. Otherwise, the areas facing the component 600 are located. before traces 670 and 680 are substantially parallel to upper surfaces of pedestals 645 and 648.
  • the conductor tracks 670 or 680 are in direct mechanical and electrical contact with the contact elements 610 or 620.
  • the contact elements 610, 620 are additionally connected to the conductor tracks 670, 680 via conductive adhesive 690, 695.
  • the preferred, low-stress assembly in a pre-housed lead frame is also advantageous when assembling the component 600.
  • the component 600 is preferably any sensor, for example for a mechanical, chemical or biological variable. Because of the low-tension assembly, it is particularly expedient to design the component 600 in such a way that it is expanded with suitable micromechanical components to form a microsystem and can thus be used, for example, as a motion or pressure sensor. Instead of the component 600 designed as a sensor, a suitable microsystem can also be provided.
  • a particularly advantageous composite body with a component 700 designed as a sensor is explained below with reference to FIG. 16.
  • 16 shows a plan view of a composite body made of a component 700 and a carrier plate 740 made of a flexible material.
  • the component 700 has contact elements 720 in an edge region, which are flush both with a main surface and with a side surface of the component 700.
  • the contact elements 720 are in direct mechanical and electrical contact with conductor tracks 750.
  • sections of a conductive adhesive 780 are arranged such that they bring about a further connection between the contact elements 720 and the conductor tracks 750.
  • FIG. 17 shows an area of a chip card in which the integrated component 800 and connection areas 810, 820, 830, 840, 850 and 860 for a contact of the integrated component 800 with a card reading or writing unit are located.
  • Contact areas 870, 880, 890, 900, 910 and 920 are located between the connection areas 810, 820, 830, 840, 850 and 860 and subsequently shown in FIG. 18 and arranged in an edge area of the integrated component 800.
  • the installation of the integrated component 800 in a base body 930 of the chip card is illustrated in the cross section of the chip card in the region of the contact area 870 shown in detail in FIG. 18.
  • a contact surface 807 of a contact element 805 of the integrated component 800 is located in a recess of the chip card and in direct mechanical and electrical contact with the contact area 870.
  • the rear of the component 800 faces outwards.
  • the rear side 940 is preferably at the same level as a surface 950 of the chip card.
  • the chip card described can be produced in a particularly expedient manner as follows: first the card including connection areas 810 to 860 or contact areas 870 to 920 is manufactured and then tested. After this test was successful, the integrated electronic circuit is then applied.
  • This method has the advantage that the integrated component 800 is only applied to card carriers which have been prepared without errors. Since the manufacture of the integrated component 800 is much more complex than the manufacture of the card carrier and since a certain reject cannot be technically avoided in the manufacture of the connection areas 810 to 860 or the contact areas 870 to 920, this method variant is particularly expedient .
  • the chip card shown is characterized in that the contact elements are particularly well protected against external influences, in particular mechanical loads or chemical reaction processes, and that the underside of the internal tegried component 800 ends flush with a conductor 815.
  • the rear-facing side of the component 800 that is to say in particular the corresponding integrated electronic circuit, in accordance with a desired use.
  • a shape can consist, for example, of printing, lettering, for example by means of a laser, or an accident with a suitable material, for example a protective lacquer.
  • a protective lacquer which may be overprinted if necessary, has the further advantage that the component, that is to say in particular the corresponding integrated electronic circuit, the conductor track 850 and the contact area 870 are protected even further.
  • the layer can have a variety of functions.
  • a particularly advantageous exemplary embodiment of a chip card in which the free designability of the surface 940 of the integrated component 800 is used, results from the supervision of an area of the chip card shown below with reference to FIG integrated component 800, a functional element, for example an inductive coil 960, is applied.
  • the coil 960 is preferably made using a lamination technique.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne un élément intégré (35) comportant au moins un élément de contact (20) servant à raccorder ledit élément (35) à un moyen de fixation (90). Selon l'invention, l'élément intégré (35) est conçu de sorte que l'élément de contact (20) est placé dans une zone de bordure de l'élément intégré (35) et l'élément de contact (20) présente au moins une surface de contact (22) inclinée par rapport à une surface principale de l'élément (35). L'invention concerne en outre un procédé de production de cet élément.
EP99947214A 1998-07-28 1999-07-14 Element integre, corps composite constitue d'un element integre et d'une structure conductrice, carte a puce et procede de production de l'element integre Withdrawn EP1110243A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19833929 1998-07-28
DE19833929 1998-07-28
PCT/DE1999/002190 WO2000007239A1 (fr) 1998-07-28 1999-07-14 Element integre, corps composite constitue d'un element integre et d'une structure conductrice, carte a puce et procede de production de l'element integre

Publications (1)

Publication Number Publication Date
EP1110243A1 true EP1110243A1 (fr) 2001-06-27

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EP99947214A Withdrawn EP1110243A1 (fr) 1998-07-28 1999-07-14 Element integre, corps composite constitue d'un element integre et d'une structure conductrice, carte a puce et procede de production de l'element integre

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Country Link
US (1) US6400006B2 (fr)
EP (1) EP1110243A1 (fr)
WO (1) WO2000007239A1 (fr)

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US6828663B2 (en) * 2001-03-07 2004-12-07 Teledyne Technologies Incorporated Method of packaging a device with a lead frame, and an apparatus formed therefrom
JP4141340B2 (ja) * 2003-07-16 2008-08-27 三洋電機株式会社 半導体装置の製造方法
US7612443B1 (en) 2003-09-04 2009-11-03 University Of Notre Dame Du Lac Inter-chip communication
DE102005003371A1 (de) * 2005-01-24 2006-08-03 Kiersch Composite Gmbh Anordnung zum Erzeugen eines elektrischen Stromflusses durch Kohlenstofffasern
DE602006020179D1 (de) 2005-11-28 2011-03-31 Nxp Bv Ransponder
US8587125B2 (en) * 2010-01-22 2013-11-19 Headway Technologies, Inc. Method of manufacturing layered chip package
US9620473B1 (en) 2013-01-18 2017-04-11 University Of Notre Dame Du Lac Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment
US9202660B2 (en) 2013-03-13 2015-12-01 Teledyne Wireless, Llc Asymmetrical slow wave structures to eliminate backward wave oscillations in wideband traveling wave tubes
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Publication number Publication date
WO2000007239A1 (fr) 2000-02-10
US6400006B2 (en) 2002-06-04
US20010021543A1 (en) 2001-09-13

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