EP1068640A1 - Use of the constructional characteristics of an electronic component as a reference for positioning the component - Google Patents

Use of the constructional characteristics of an electronic component as a reference for positioning the component

Info

Publication number
EP1068640A1
EP1068640A1 EP99923397A EP99923397A EP1068640A1 EP 1068640 A1 EP1068640 A1 EP 1068640A1 EP 99923397 A EP99923397 A EP 99923397A EP 99923397 A EP99923397 A EP 99923397A EP 1068640 A1 EP1068640 A1 EP 1068640A1
Authority
EP
European Patent Office
Prior art keywords
lead frame
component
extension
housing body
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99923397A
Other languages
German (de)
French (fr)
Inventor
Christian Hauser
Ulrich Vidal
Harald Widner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of EP1068640A1 publication Critical patent/EP1068640A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention lies in the field of assembly technology for semiconductor components, in particular memory elements, with a housing or housing body which is formed around the component which has previously been contacted with a lead frame.
  • the invention relates to the use of the structural nature of an electronic component as a reference in the positioning of a component with at least one electronic component, a housing body and a lead frame, in which the component is mounted on the lead frame and for external electrical connection with conductor tracks of the lead frame leading to the outside is contacted and in which the component and the central region of the lead frame are enclosed with a molding compound to form the housing body.
  • a lead frame (also referred to as a leadframe) is used for contacting and optionally also for distributing and dissipating the energy converted into heat in an electronic component.
  • a lead frame is usually produced with a large number of further lead frames in a coherent band and in particular comprises a support area (island) for the component and the supply and discharge lines serving for the electrical contacting, which are subsequently also referred to as conductor tracks or 2 leads are referred to.
  • the lead frame can also be designed to implement the so-called “lead on chip” (LOC) technology. Only in the advanced assembly stage are the lead frames initially connected in the strip and thus the individual components separated.
  • LOC lead on chip
  • the conductor tracks are usually connected to one another by connecting webs formed between them in the form of a so-called dambar.
  • the top and bottom of the dambar serves as a defined sealing surface for the injection molds (molds).
  • the molding tools seal on the dambar a housing volume to be filled with a molding compound, in which the housing body is created with the inclusion of the component and the central regions of the leadframe when the molding compound is introduced.
  • the dambar i.e. the webs or intermediate sections connecting the individual conductor tracks to one another
  • the conductor tracks are bent into predetermined geometries in order to enable operational contacting, for example by means of soldering, after previous function tests.
  • the components must be inserted into the respective component-specific test bases and electrically contacted.
  • a very precise alignment and centering of the component in the respective test base is required.
  • the narrow tolerances to be observed in the case of previously known components are not always possible due to considerable scattering of the outer dimensions of the housing body 3 be guaranteed.
  • the conductor track ends may be bent and the component may be damaged, which can make the component unusable.
  • the object of the invention is to use the structural nature of an electronic component as a reference when positioning the component, with which a reliable, highly precise and reproducible positioning of the conductor track ends is made possible.
  • the lead frame first has an extension, the extension can be separated from the lead frame after formation of the housing body and the extension is removable from the housing body, so that an externally accessible separating surface between the Extension and the housing body arises, the separating surface serving as a reference when positioning the component.
  • a major advantage of the method according to the invention is that no molding compound burr can remain on the housing body at the points critical for alignment and centering and / or is broken out undefined, but rather a highly accurate reference surface or reference edge is generated on the housing body.
  • the reference surface or reference edge is advantageously produced in a simple manner in that when the extension is removed from the housing body, the separating surface originally formed between the extension and the molding compound of the housing body is exposed.
  • the separating surface is created with high precision in relation to the lead frame and thus in relation to the positions of the conductor tracks or conductor track ends.
  • the tolerance of the indirect positioning of the conductor tracks over the separating surface of the housing body thus essentially corresponds to the extremely tight manufacturing tolerance of the lead frame.
  • a preferred embodiment of the method according to the invention provides that, in a manner known per se, a plurality of conductor tracks for forming a dambar initially remain connected to one another via intermediate sections, the extension being formed on at least one of the intermediate sections.
  • This has the particular advantage that the insulation of the extension from the lead frame and the subsequent removal can be done in the course of the so-called dambar cutting (removal of the intermediate sections between the conductor tracks). It is regarded as particularly advantageous if the isolation and removal of the extension is carried out in a common operation with the dambar cutting.
  • the steps for the assembly of the lead frames (for example dambar cutting), which are already well mastered, can be maintained in the known manner and in the usual order. 5
  • a further development of the method according to the invention which is particularly preferred in terms of production technology is that the extension is designed as a tab which extends towards the center of the lead frame.
  • an embodiment of the invention is particularly preferred, according to which an extension is provided in a corner region of the lead frame in such a way that the extension is located in a housing corner after the housing body has been formed.
  • FIG. 1 shows a lead frame for use in the method according to the invention
  • Figure 2 shows the lead frame of Figure 1 after encasing with a molding compound
  • FIG. 3 shows section B from FIG. 2 immediately before a cutting tool for dambar cutting is attacked;
  • Figure 4 shows the section B after cutting dambar;
  • Figure 5 is a flow chart;
  • FIG. 6 alignment problems occurring with previous components
  • FIGS. 7 and 8 the situation in the case of dambar cutting in the case of components manufactured according to conventional methods.
  • FIGS. 1 and 2 show a lead frame which is part of a band 3 comprising a plurality of identical lead frames 1.
  • the individual lead frames 1 pass through a large number of production steps together with the belt, until finally the lead frames are separated. 6
  • the lead frame 1 points in a manner known per se (cf. for example
  • the lead frame additionally has at least one extension 14, which is preferably in the plane of the other lead frame parts and is easy to separate from the rest of the lead frame.
  • an intermediate piece 8 is formed between the uppermost conductor track 4 and an upper connecting track 12 of the lead frame. This area is shown again in a greatly enlarged illustration of section A at the top in FIG. 1.
  • the extension 14 is designed as a tab extending towards the central axis of symmetry of the lead frame. In the exemplary embodiment, three further extensions 14 are provided in a corner region 16 of the lead frame 1 in a corresponding manner.
  • an electronic component 20 which is only indicated in FIG. 2, is first mounted on the lead frame 1 and with it for 7 electrical connection provided electrical contact surfaces with the inner ends 4b ( Figure 1) of the conductor tracks 4 electrically contacted.
  • the semi-finished component is then introduced into an injection mold (mold), the upper and lower mold halves interacting with sealing surfaces on the top and bottom of the dambars 10.
  • suitable molding compound 24 is pressed into the cavity formed by the tool, and thereby the component 20 and the inner region of the lead frame 1 are encased to form a housing body 25.
  • the component removed from the molding tool has the shape shown in FIG. 2.
  • As the detail B shown in FIG. 2 and the section II-II through the detail B show, once the housing body 25 has been formed, one of the extensions 14 is located in each housing corner 26.
  • the housing body 25 with its right side faces is at the top in FIG 7, 28 can be seen.
  • FIGS. 3 and 4 show a very large enlargement on the basis of detail B according to FIG. 2, the extensions 14 are first isolated from the remaining components of the lead frame 1 during the subsequent dambar cutting with a cutting punch 30.
  • the remaining intermediate sections 8 of the dambar 10 are simultaneously removed by correspondingly assigned cutting punches (FIG. 3 shows a further punch 30 a) with insulation of the conductor tracks 4.
  • FIG. 3 shows the state shortly before the fall of the dambar and
  • FIG. 4 shows the plane of the (former) dambar 10 by means of an urgent stamp 30.
  • the extension is advantageously separated and removed in a common operation.
  • the extension 14 is first isolated by the fact that its connection with the adjacent intermediate 8 cut 8 or with the conductor track 4 from an upper 34 and lower cutting edge 35 of the punch 30 is separated.
  • the extension 14 protrudes toward the center of the lead frame under the stamp 30.
  • the extension 14 is separated from the housing body 25 by the movement of the stamp 30 downward.
  • the previous contact surface 36 between the extension 14 and the molding compound 24 of the housing body 25 is thus transferred into a separating surface 38.
  • This separating surface 38 serves as a reference during the subsequent positioning of the component, for example for test purposes.
  • a separating surface 38 is thus created which can be used excellently for reference purposes, the relative position of which is e.g. with respect to the ends 4a of the conductor tracks 4 is essentially determined only by the manufacturing precision of the lead frame 1.
  • the reference surface 38 can also be used for other positioning purposes of the component, for example during assembly.
  • FIGS. 3 and 4 show, in the area of the extension 14 no burr of the housing body 25 is broken out undefined, but when the dambar is cut the extension is pressed out in such a way that a precisely defined edge 39 or surface is created.
  • step a it is essential to use a lead frame with defined extensions (step a)), which after assembly (step b), c)) and overmolding of the component and the lead frame (step d)) preferably cut together with the dambar (step e)) and then removed from the housing body to form the interface 9 (step f)). Finally (step g) the interface is used to position the component.
  • FIG. 6 schematically shows a component 50 produced by previous methods, which is inserted into a test base 52 for an electrical function test. Because of the relatively small dimensions and spacing of the conductor tracks 53, very precise centering of the component 50 in the base 52 is required. Corner stops 54 of the base 52 are provided for aligning the component 50. These cooperate with the corners 56 of the housing body 58 of the component 50. As the enlarged illustration of the section C shows particularly clearly, there can be a burr 60 of the housing body 58 between the centering stop 54 of the test base 52 and the housing corner 56, which is a correct stop between the Prevents housing 58 and the centering stop 54. In addition, the housing corners 56 generally have relatively large position tolerances with respect to the position of the ends of the conductor tracks. When the conductor track ends are subsequently pressed down onto contact points (not shown) on the test base, the conductor tracks can be bent in unfavorable cases and the component can thus become unusable.
  • the undefined burr arises in the processing of the conventionally produced housing body 58 shown in FIGS. 7 and 8 in that a thin burr skin is formed between the dambar 64 and the molding compound of the housing 58 during the pressing process. 10 gear emerges.
  • the punch 70 then cuts out the intermediate piece 72 of the dambar to be removed, but between the punch 70 and the left-hand wall 74 of the housing body 58 the remaining mold burr breaks in an uncontrolled manner (arrow P).
  • selected locations are configured in a manner that is simple to manufacture using a design of the lead frame that can be modified only slightly, in such a way that there is no undefined breakout on the housing body. Rather, the dambar is cut and expressed in such a way that separating surfaces or separating edges result in the areas defined by the extensions, which are used for the highly precise positioning of the component.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

According to the invention, a lead frame (1) is configured with conductors (4), intermediate segments forming a connecting bar (10), and extensions (14). An electronic component (20) is mounted on the lead frame (1) and contacted with the inner ends of the conductors (4b). The component (20) and the lead frame (1) are injection-moulded as far as the connecting bar (10). The extension is then isolated from the remaining lead frame and removed from the housing body (25). This produces a dividing surface (38) between the housing body (25) and the extension (14) which can be used as a reference for positioning the component.

Description

Beschreibungdescription
Verwendung der baulichen Beschaffenheit eines elektronischen Bauteils als Referenz bei der Positionierung des BauteilsUse of the structural condition of an electronic component as a reference when positioning the component
Die Erfindung liegt auf dem Gebiet der Montagetechnik für Halbleiterbauelemente, insbesondere Speicherelemente, mit einem Gehäuse oder Gehäusekörper, das bzw. der um das zuvor mit einem Leiterrahmen kontaktierte Bauelement gebildet wird.The invention lies in the field of assembly technology for semiconductor components, in particular memory elements, with a housing or housing body which is formed around the component which has previously been contacted with a lead frame.
Die Erfindung betrifft die Verwendung der baulichen Beschaffenheit eines elektronischen Bauteils als Referenz bei der Positionierung eines Bauteils mit mindestens einem elektronischen Bauelement, einem Gehäusekörper und einem Leiterrahmen, bei dem das Bauelement an dem Leiterrahmen montiert und zum externen elektrischen Anschluß mit nach außen führenden Leiterbahnen des Leiterrahmens kontaktiert wird und bei dem das Bauteil und der zentrale Bereich des Leiterrahmens unter Bildung des Gehäusekörpers mit einer Preßmasse umschlossen werden.The invention relates to the use of the structural nature of an electronic component as a reference in the positioning of a component with at least one electronic component, a housing body and a lead frame, in which the component is mounted on the lead frame and for external electrical connection with conductor tracks of the lead frame leading to the outside is contacted and in which the component and the central region of the lead frame are enclosed with a molding compound to form the housing body.
Ein Verfahren zum Herstellen eines solchen Bauteils und ein derartiger Leiterrahmen sind aus der DE 196 25 384 AI bekannt. Bei dem bekannten Verfahren wird zur Kontaktierung und gegebenenfalls auch zur Verteilung und Ableitung der in einem elektronischen Bauelement in Wärme umgesetzten Energie ein (auch als Leadframe bezeichneter) Leiterrahmen verwendet. Ein solcher Leiterrahmen wird üblicherweise mit einer Vielzahl weiterer Leiterrahmen in einem zusammenhängenden Band erzeugt und umfaßt insbesondere einen Trägerbereich (Insel) für das Bauelement und der elektrischen Kontaktierung dienende Zu- bzw. Ableitungen, die nachfolgend auch als Leiterbahnen oder 2 Leads bezeichnet werden. Der Leiterrahmen kann grundsätzlich auch zur Realisierung der an sich bekannten sog. „Lead on Chip" (LOC) -Technik ausgebildet sein. Erst im fortgeschrittenen Montagestadium werden die zunächst im Band zusammenhängenden Leiterrahmen und damit die individuellen Bauteile vereinzelt.A method for producing such a component and such a lead frame are known from DE 196 25 384 AI. In the known method, a lead frame (also referred to as a leadframe) is used for contacting and optionally also for distributing and dissipating the energy converted into heat in an electronic component. Such a lead frame is usually produced with a large number of further lead frames in a coherent band and in particular comprises a support area (island) for the component and the supply and discharge lines serving for the electrical contacting, which are subsequently also referred to as conductor tracks or 2 leads are referred to. In principle, the lead frame can also be designed to implement the so-called “lead on chip” (LOC) technology. Only in the advanced assembly stage are the lead frames initially connected in the strip and thus the individual components separated.
Während der Bauteilmontage sind die Leiterbahnen üblicherweise durch zwischen ihnen ausgebildete Verbindungsstege in Form eines sogenannten Dambars miteinander verbunden. Der Dambar dient neben der Erhöhung der mechanischen Steifigkeit während des Fertigungsprozesses mit seiner Ober- bzw. Unterseite als definierte Dichtfläche für die Spritzgußformen (Moldwerkzeu- ge) . Die Moldwerkzeuge dichten an dem Dambar ein mit einer Preßmasse zu füllendes Gehäusevolumen ab, in dem unter Einschluß des Bauelementes und der zentralen Bereiche des Leiterrahmens mit Einbringen der Preßmasse der Gehäusekörper entsteht. Nach Bildung des Gehäusekörpers wird der Dambar (d.h. die die einzelnen Leiterbahnen miteinander verbindenden Stege oder Zwischenabschnitte) entfernt, so daß die Leiterbahnen elektrisch voneinander isoliert werden. Ferner werden die Leiterbahnen in vorgegebene Geometrien gebogen, um - nach vorhergehenden Funktionstests - eine betriebsgemäße Kontaktierung zum Beispiel mittels Lötung zu ermöglichen.During component assembly, the conductor tracks are usually connected to one another by connecting webs formed between them in the form of a so-called dambar. In addition to increasing the mechanical rigidity during the manufacturing process, the top and bottom of the dambar serves as a defined sealing surface for the injection molds (molds). The molding tools seal on the dambar a housing volume to be filled with a molding compound, in which the housing body is created with the inclusion of the component and the central regions of the leadframe when the molding compound is introduced. After the housing body has been formed, the dambar (i.e. the webs or intermediate sections connecting the individual conductor tracks to one another) is removed, so that the conductor tracks are electrically insulated from one another. Furthermore, the conductor tracks are bent into predetermined geometries in order to enable operational contacting, for example by means of soldering, after previous function tests.
Zu den genannten Funktionstests müssen die Bauteile in jeweilige bauteilspezifische Testsockel eingebracht und elektrisch kontaktiert werden. Bei den zunehmend kleineren Abmessungen der Leiterbahnen und der Leiterbahnabstände ist eine sehr genaue Ausrichtung und Zentrierung des Bauteils im jeweiligen Testsockel erforderlich. Die dabei einzuhaltenden engen Toleranzen können jedoch bei bisher bekannten Bauteilen wegen erheblicher Streuungen der Gehäusekörper-Außenmaße nicht immer 3 gewährleistet sein. Üblicherweise erfolgt das Ausrichten undFor the above-mentioned functional tests, the components must be inserted into the respective component-specific test bases and electrically contacted. With the increasingly smaller dimensions of the conductor tracks and the conductor track spacing, a very precise alignment and centering of the component in the respective test base is required. However, the narrow tolerances to be observed in the case of previously known components are not always possible due to considerable scattering of the outer dimensions of the housing body 3 be guaranteed. Alignment and
Zentrieren der Bauteile nämlich über testsockelseitige Anschläge, die mit Gehäusekörperkanten -insbesondere den Ecken des Gehäusekörpers - kooperieren. Die Lage der Gehäusekörperkanten oder Ecken variiert erheblich in Bezug auf die zu kontaktierenden Leiterbahnen. Ursächlich dafür sind insbesondere die vergleichsweise hohen Fertigungstoleranzen hinsichtlich der Gehäusekörper- Außenmessungen und beim Bilden des Gehäusekörpers entstehender Preßmassengrat.Centering of the components namely via test base-side stops, which cooperate with the edges of the housing body, in particular the corners of the housing body. The position of the housing body edges or corners varies considerably in relation to the conductor tracks to be contacted. The reason for this is, in particular, the comparatively high manufacturing tolerances with regard to the outer dimensions of the housing body and the molding mass burr that occurs when the housing body is formed.
Bei der Fixierung der Bauteile in den Testsockeln durch auf die Leiterbahnenden wirkende Niederhalter kann es ungünstig- stenfalls zu einem Verbiegen der Leiterbahnenden und damit zu einer Schädigung des Bauteils kommen, wodurch das Bauteil sogar unbrauchbar werden kann.In the worst case, when the components are fixed in the test bases by hold-downs acting on the conductor track ends, the conductor track ends may be bent and the component may be damaged, which can make the component unusable.
Die Aufgabe die Erfindung besteht in der Verwendung der baulichen Beschaffenheit eines elektronischen Bauteils als Referenz bei der Positionierung des Bauteils, mit der eine zuverlässige, hochgenaue und reproduzierbare Positionierung der Leiterbahnenden ermöglicht wird.The object of the invention is to use the structural nature of an electronic component as a reference when positioning the component, with which a reliable, highly precise and reproducible positioning of the conductor track ends is made possible.
Diese Aufgabe wird erfindungsgemäß bei einem Verfahren der eingangsgenannten Art dadurch gelöst, daß der Leiterrahmen zunächst einen Fortsatz aufweist, der Fortsatz nach Bildung des Gehäusekörpers von dem Leiterrahmen trennbar ist und der Fortsatz von dem Gehäusekörper entfernbar ist, so daß eine von außen zugängliche Trennfläche zwischen dem Fortsatz und dem Gehäusekörper entsteht, wobei die Trennfläche als Referenz bei der Positionierung des Bauteils dient. 4 Ein wesentlicher Vorteil des erfindungsgemäßen Verfahrens besteht darin, daß an dem Gehäusekörper an den für die Ausrichtung und Zentrierung kritischen Stellen kein Preßmassengrat verbleiben kann und/oder Undefiniert ausgebrochen wird, sondern an dem Gehäusekörper eine hochgenaue Referenzfläche oder Referenzkante erzeugt wird. Das Erzeugen der Referenzfläche oder Referenzkante geschieht in vorteilhaft einfacher Weise dadurch, daß beim Entfernen des Fortsatzes an dem Gehäusekörper die ursprünglich zwischen dem Fortsatz und der Preßmasse des Gehäusekörpers gebildete Trennfläche freigelegt wird. Die Trennfläche entsteht hochpräzise in Bezug auf den Leiterrahmen und damit in Bezug auf die Positionen der Leiterbahnen bzw. Leiterbahnenden. Die Toleranz der mittelbaren Positionierung der Leiterbahnen über die Trennfläche des Gehäusekörpers entspricht damit im wesentlichen der äußerst engen Fertigungstoleranz des Leiterrahmens.This object is achieved in a method of the type mentioned above in that the lead frame first has an extension, the extension can be separated from the lead frame after formation of the housing body and the extension is removable from the housing body, so that an externally accessible separating surface between the Extension and the housing body arises, the separating surface serving as a reference when positioning the component. 4 A major advantage of the method according to the invention is that no molding compound burr can remain on the housing body at the points critical for alignment and centering and / or is broken out undefined, but rather a highly accurate reference surface or reference edge is generated on the housing body. The reference surface or reference edge is advantageously produced in a simple manner in that when the extension is removed from the housing body, the separating surface originally formed between the extension and the molding compound of the housing body is exposed. The separating surface is created with high precision in relation to the lead frame and thus in relation to the positions of the conductor tracks or conductor track ends. The tolerance of the indirect positioning of the conductor tracks over the separating surface of the housing body thus essentially corresponds to the extremely tight manufacturing tolerance of the lead frame.
Eine bevorzugte Ausgestaltung des erfindungsgemäßen Verfahrens sieht vor, daß in an sich bekannter Weise mehrere Leiterbahnen zur Bildung eines Dambars über Zwischenabschnitte zunächst miteinander verbunden bleiben, wobei der Fortsatz an zumindest einem der Zwischenabschnitte ausgebildet wird. Dies hat insbesondere den Vorteil, daß das Isolieren des Fortsatzes von dem Leiterrahmen und das anschließende Entfernen im Zuge des sogenannten Dambarschneidens (entfernen der Zwischenabschnitte zwischen den Leiterbahnen) erfolgen kann. Als besonderes vorteilhaft wird es angesehen, wenn das Isolieren und Entfernen des Fortsatzes in einem gemeinsamen Arbeitsgang mit dem Dambarschneiden erfolgt. Die an sich bereits gut beherrschten Schritte zur Konfektionierung der Leiterrahmen (zum Beispiel Dambarschneiden) können dadurch in der bekannten Weise und üblichen Reihenfolge beibehalten werden. 5 Eine herstellungstechnisch besonders bevorzugte Fortbildung des erfindungsgemäßen Verfahrens besteht darin, daß der Fortsatz als eine sich zum Leiterrahmenzentrum hin erstreckende Lasche ausgebildet wird.A preferred embodiment of the method according to the invention provides that, in a manner known per se, a plurality of conductor tracks for forming a dambar initially remain connected to one another via intermediate sections, the extension being formed on at least one of the intermediate sections. This has the particular advantage that the insulation of the extension from the lead frame and the subsequent removal can be done in the course of the so-called dambar cutting (removal of the intermediate sections between the conductor tracks). It is regarded as particularly advantageous if the isolation and removal of the extension is carried out in a common operation with the dambar cutting. The steps for the assembly of the lead frames (for example dambar cutting), which are already well mastered, can be maintained in the known manner and in the usual order. 5 A further development of the method according to the invention which is particularly preferred in terms of production technology is that the extension is designed as a tab which extends towards the center of the lead frame.
Hinsichtlich der Positionierung des Bauteils z.B. in einem Testsockel ist eine Ausgestaltung der Erfindung besonders bevorzugt, nach der jeweils ein Fortsatz in einem Eckbereich des Leiterrahmens derart vorgesehen wird, daß der Fortsatz sich nach Bildung des Gehäusekörpers in einer Gehäuseecke befindet.With regard to the positioning of the component e.g. In a test base, an embodiment of the invention is particularly preferred, according to which an extension is provided in a corner region of the lead frame in such a way that the extension is located in a housing corner after the housing body has been formed.
Die Erfindung wird nachfolgend anhand einer Zeichnung beispielhaft weiter erläutert; es zeigen z.T. sehr stark vergrößert:The invention is further explained below using a drawing as an example; some of them show very much enlarged:
Figur 1 einen Leiterrahmen zur Verwendung bei dem erfindungsgemäßen Verfahren;1 shows a lead frame for use in the method according to the invention;
Figur 2 den Leiterrahmen gemäß Figur 1 nach dem Umschließen mit einer Preßmasse;Figure 2 shows the lead frame of Figure 1 after encasing with a molding compound;
Figur 3 den Ausschnitt B aus Figur 2 unmittelbar vor Angriff eines Schneidwerkzeuges für das Dambarschneiden; Figur 4 den Ausschnitt B nach dem Dambarschneiden; Figur 5 ein Flußdiagramm;FIG. 3 shows section B from FIG. 2 immediately before a cutting tool for dambar cutting is attacked; Figure 4 shows the section B after cutting dambar; Figure 5 is a flow chart;
Figur 6 bei bisherigen Bauteilen auftretende Ausrichtungsprobleme; undFIG. 6 alignment problems occurring with previous components; and
Figuren 7 und 8 die Situation beim Dambarschneiden bei nach bisher üblichen Verfahren hergestellten Bauteile.FIGS. 7 and 8 the situation in the case of dambar cutting in the case of components manufactured according to conventional methods.
Die Figuren 1 und 2 zeigen einen Leiterrahmen, der Bestandteil eines eine Vielzahl gleicher Leiterrahmen 1 umfassenden Bandes 3 ist. Die einzelnen Leiterrahmen 1 durchlaufen gemeinsam mit dem Band eine Vielzahl von Fertigungsschritten, bis schließlich eine Vereinzelung der Leiterrahmen erfolgt. 6 Der Leiterrahmen 1 weist in an sich bekannter Weise (vgl. z.B.FIGS. 1 and 2 show a lead frame which is part of a band 3 comprising a plurality of identical lead frames 1. The individual lead frames 1 pass through a large number of production steps together with the belt, until finally the lead frames are separated. 6 The lead frame 1 points in a manner known per se (cf. for example
DE 196 25 384 AI) eine Vielzahl von Leiterbahnen 4 auf, die sich von äußeren Leiterbahnenden 4a („outer Leads") zum Zentrum 6 des Leiterrahmens bis zu sogenannten inneren Leiterbahnenden 4b („inner Leads") erstrecken. Die inneren Leiterbahnenden 4b werden in bekannter und nicht näher dargestellter Weise mit einem elektronischen Bauelement, beispielsweise einem Halbleiterspeicher, kontaktiert. Bei der Konfiguration des Leiterrahmens 1 bleiben die Leiterbahnen 4 zunächst über Zwischenstücke 8 seitlich miteinander verbunden. Durch die in einer Linie liegenden Zwischenstücke 8 wird zusammen mit dem jeweiligen Material angrenzender Leiterbahnen 4 eine Bahn erzeugt, die auch als Dambar 10 bezeichnet wird.DE 196 25 384 AI) has a multiplicity of conductor tracks 4 which extend from outer conductor track ends 4a (“outer leads”) to the center 6 of the lead frame up to so-called inner conductor track ends 4b (“inner leads”). The inner conductor track ends 4b are contacted in a known and not shown manner with an electronic component, for example a semiconductor memory. When the leadframe 1 is configured, the conductor tracks 4 initially remain connected to one another laterally via intermediate pieces 8. The intermediate pieces 8 lying in a line, together with the respective material of adjacent conductor tracks 4, produce a track which is also referred to as dambar 10.
Ein wesentlicher Aspekt der Erfindung besteht darin, daß der Leiterrahmen zusätzlich zumindest einen Fortsatz 14 aufweist, der vorzugsweise in der Ebene der übrigen Leiterrahmenteile liegt und einfach von dem übrigen Leiterrahmen zu trennen ist. Im Ausführungsbeispiel ist ein Zwischenstück 8 zwischen der obersten Leiterbahn 4 und einer oberen Verbindungsbahn 12 des Leiterrahmens ausgebildet. Dieser Bereich ist in stark vergrößerter Darstellung des Ausschnitts A oben in Figur 1 nochmals gezeigt.An essential aspect of the invention is that the lead frame additionally has at least one extension 14, which is preferably in the plane of the other lead frame parts and is easy to separate from the rest of the lead frame. In the exemplary embodiment, an intermediate piece 8 is formed between the uppermost conductor track 4 and an upper connecting track 12 of the lead frame. This area is shown again in a greatly enlarged illustration of section A at the top in FIG. 1.
Der Fortsatz 14 ist als eine sich zur zentralen Symmetrieachse des Leiterrahmens hin erstreckende Lasche ausgebildet. Bei dem Ausführungsbeispiel sind in entsprechender Weise drei weitere Fortsätze 14 in jeweils einem Eckbereich 16 des Leiterrahmens 1 vorgesehen.The extension 14 is designed as a tab extending towards the central axis of symmetry of the lead frame. In the exemplary embodiment, three further extensions 14 are provided in a corner region 16 of the lead frame 1 in a corresponding manner.
Im Zuge des weiteren Fertigungsganges wird zunächst ein in Figur 2 nur andeutungsweise dargestelltes elektronisches Bauelement 20 auf dem Leiterrahmen 1 montiert und mit seinen zum 7 elektrischen Anschluß vorgesehenen elektrischen Kontaktflächen mit den inneren Enden 4b (Figur 1) der Leiterbahnen 4 elektrisch kontaktiert. Anschließend wird das halbfertige Bauteil in eine Spritzgußform (Moldwerkzeug) eingebracht, wobei die obere und untere Formhälfte mit Dichtflächen auf der Oberseite bzw. Unterseite der Dambars 10 zusammenwirken. Bei geschlossenem Spritzgußwerk wird geeignete Preßmasse 24 in den vom Werkzeug gebildeten Hohlraum eingepreßt und dadurch das Bauelement 20 und der innere Bereich des Leiterrahmens 1 unter Bildung eines Gehäusekörpers 25 umhüllt. Das aus dem Moldwerkzeug entnommene Bauteil hat die in Figur 2 gezeigte Gestalt. Wie die in Figur 2 oben dargestellte Einzelheit B und der Schnitt II - II durch die Einzelheit B zeigen, befindet sich nach Bildung des Gehäusekörpers 25 in je einer Gehäuseecke 26 einer der Fortsätze 14. Oben in Figur 2 ist der Gehäusekörper 25 mit seinen rechten Seitenflächen 7, 28 zu erkennen.In the course of the further manufacturing process, an electronic component 20, which is only indicated in FIG. 2, is first mounted on the lead frame 1 and with it for 7 electrical connection provided electrical contact surfaces with the inner ends 4b (Figure 1) of the conductor tracks 4 electrically contacted. The semi-finished component is then introduced into an injection mold (mold), the upper and lower mold halves interacting with sealing surfaces on the top and bottom of the dambars 10. When the injection molding unit is closed, suitable molding compound 24 is pressed into the cavity formed by the tool, and thereby the component 20 and the inner region of the lead frame 1 are encased to form a housing body 25. The component removed from the molding tool has the shape shown in FIG. 2. As the detail B shown in FIG. 2 and the section II-II through the detail B show, once the housing body 25 has been formed, one of the extensions 14 is located in each housing corner 26. The housing body 25 with its right side faces is at the top in FIG 7, 28 can be seen.
Wie die Figuren 3 und 4 anhand der Einzelheit B gemäß Figur 2 in sehr starker Vergrößerung zeigen, werden die Fortsätze 14 beim nachfolgenden Dambarschneiden mit einem Schneidstempel 30 zunächst von den übrigen verbleibenden Bestandteilen des Leiterrahmens 1 isoliert. Die übrigen Zwischenabschnitte 8 des Dambars 10 werden gleichzeitig von entsprechend zugeordneten Schneidstempeln (Figur 3 zeigt andeutungsweise einen weiteren Stempel 30a) unter Isolation der Leiterbahnen 4 entfernt. Figur 3 zeigt den Zustand kurz vor dem Dambarscheiden und Figur 4 zeigt den bereits die Ebene des (ehemaligen) Dambars 10 durch dringenden Stempel 30. Bei dieser Ausgestaltung des erfindungsgemäßen Verfahrens erfolgt vorteilhafterweise das Abtrennen und Entfernen des Fortsatzes in einem gemeinsamen Arbeitsgang. Der Fortsatz 14 wird zunächst dadurch isoliert, daß seine Verbindung mit dem angrenzenden Zwischenab- 8 schnitt 8 bzw. mit der Leiterbahn 4 von einer oberen 34 und unteren Schneidkante 35 des Stempels 30 aufgetrennt wird. Dabei ragt der Fortsatz 14 zum Zentrum des Leiterrahmens hin unter dem Stempel 30 hervor. Nachfolgend wird der Fortsatz 14 durch die Bewegung des Stempels 30 nach unten von dem Gehäusekörper 25 getrennt. Die bisherige Kontaktfläche 36 zwischen Fortsatz 14 und Preßmasse 24 des Gehäusekörpers 25 wird damit in eine Trennfläche 38 überführt. Diese Trennfläche 38 dient als Referenz bei der anschließenden Positionierung des Bauteils, beispielsweise zu Testzwecken.As FIGS. 3 and 4 show a very large enlargement on the basis of detail B according to FIG. 2, the extensions 14 are first isolated from the remaining components of the lead frame 1 during the subsequent dambar cutting with a cutting punch 30. The remaining intermediate sections 8 of the dambar 10 are simultaneously removed by correspondingly assigned cutting punches (FIG. 3 shows a further punch 30 a) with insulation of the conductor tracks 4. FIG. 3 shows the state shortly before the fall of the dambar and FIG. 4 shows the plane of the (former) dambar 10 by means of an urgent stamp 30. In this embodiment of the method according to the invention, the extension is advantageously separated and removed in a common operation. The extension 14 is first isolated by the fact that its connection with the adjacent intermediate 8 cut 8 or with the conductor track 4 from an upper 34 and lower cutting edge 35 of the punch 30 is separated. The extension 14 protrudes toward the center of the lead frame under the stamp 30. Subsequently, the extension 14 is separated from the housing body 25 by the movement of the stamp 30 downward. The previous contact surface 36 between the extension 14 and the molding compound 24 of the housing body 25 is thus transferred into a separating surface 38. This separating surface 38 serves as a reference during the subsequent positioning of the component, for example for test purposes.
Mit dem erfindungsgemäßen Verfahren ist damit eine zu Referenzzwecken hervorragend heranzuziehende Trennfläche 38 geschaffen, deren relative Lage z.B. in Bezug auf die Enden 4a der Leiterbahnen 4 im wesentlichen nur durch die Herstellungspräzision des Leiterrahmens 1 bestimmt ist. Selbstverständlich kann die Referenzfläche 38 auch zu anderen Positionierungszwecken des Bauteils, beispielsweise bei der Montage, herangezogen werden. Wie die Figuren 3 und 4 zeigen, wird im Bereich des Fortsatzes 14 kein Grat des Gehäusekörpers 25 Undefiniert herausgebrochen, sondern beim Dambarschneiden der Fortsatz so herausgedrückt, daß eine genau definierte Kante 39 oder Fläche entsteht.With the method according to the invention, a separating surface 38 is thus created which can be used excellently for reference purposes, the relative position of which is e.g. with respect to the ends 4a of the conductor tracks 4 is essentially determined only by the manufacturing precision of the lead frame 1. Of course, the reference surface 38 can also be used for other positioning purposes of the component, for example during assembly. As FIGS. 3 and 4 show, in the area of the extension 14 no burr of the housing body 25 is broken out undefined, but when the dambar is cut the extension is pressed out in such a way that a precisely defined edge 39 or surface is created.
Das vorstehend beschriebene Verfahren ist mit seinen Schritten in Figur 5 in einem Flußdiagramm nochmals stichwortartig zusammengefaßt. Wesentlich ist dabei die Verwendung eines Leiterrahmens mit definierten Fortsätzen (Schritt a) ) , die nach Montage (Schritt b),c)) und Umspritzen des Bauteils und des Leiterrahmens (Schritt d) ) vorzugsweise zusammen mit dem Dambar geschnitten (Schritt e) ) und anschließend von dem Gehäusekörper unter Bildung der Trennfläche entfernt werden 9 (Schritt f) ) . Schließlich wird (Schritt g) die Trennfläche zur Positionierung des Bauteils verwendet.The above-described method and its steps in FIG. 5 are summarized again in a flow chart. It is essential to use a lead frame with defined extensions (step a)), which after assembly (step b), c)) and overmolding of the component and the lead frame (step d)) preferably cut together with the dambar (step e)) and then removed from the housing body to form the interface 9 (step f)). Finally (step g) the interface is used to position the component.
Zur Verdeutlichung der mit dem erfindungsgemäßen Verfahren und unter Verwendung des erfindungsgemäßen Leiterrahmens erzielbaren Vorteile wird anhand der Figuren 6 bis 8 die Problematik bei nach bisherigen Verfahren gefertigten Bauteilen erläutert.To clarify the advantages that can be achieved with the method according to the invention and using the lead frame according to the invention, the problem with components manufactured according to previous methods is explained with reference to FIGS. 6 to 8.
Figur 6 zeigt schematisch ein nach bisherigen Verfahren hergestelltes Bauteil 50, das zu einem elektrischen Funktionstest in einen Testsockel 52 eingebracht ist. Wegen der relativ geringen Abmessungen und Beabstandungen der Leiterbahnen 53 ist eine sehr genaue Zentrierung des Bauteils 50 im Sockel 52 gefordert. Zum Ausrichten des Bauteils 50 sind Eckanschläge 54 des Sockels 52 vorgesehen. Diese kooperieren mit den Ecken 56 des Gehäusekörpers 58 des Bauteils 50. Wie die vergrößerte Darstellung des Ausschnitts C besonders deutlich zeigt, kann zwischen dem Zentrieranschlag 54 des Testsockels 52 und der Gehäuseecke 56 Grat 60 des Gehäusekörpers 58 verblieben sein, der einen korrekten Anschlag zwischen dem Gehäuse 58 und dem Zentrieranschlag 54 verhindert. Außerdem sind die Gehäuseecken 56 in der Regel selbst mit vergleichsweise großen Lagetoleranzen in Bezug auf die Lage der Enden der Leiterbahnen behaftet. Beim anschließenden Niederdrücken der Leiterbahnenden auf nicht dargestellte Kontaktstellen des Testsockels können in ungünstigen Fällen die Leiterbahnen verbogen und das Bauteil damit unbrauchbar werden.FIG. 6 schematically shows a component 50 produced by previous methods, which is inserted into a test base 52 for an electrical function test. Because of the relatively small dimensions and spacing of the conductor tracks 53, very precise centering of the component 50 in the base 52 is required. Corner stops 54 of the base 52 are provided for aligning the component 50. These cooperate with the corners 56 of the housing body 58 of the component 50. As the enlarged illustration of the section C shows particularly clearly, there can be a burr 60 of the housing body 58 between the centering stop 54 of the test base 52 and the housing corner 56, which is a correct stop between the Prevents housing 58 and the centering stop 54. In addition, the housing corners 56 generally have relatively large position tolerances with respect to the position of the ends of the conductor tracks. When the conductor track ends are subsequently pressed down onto contact points (not shown) on the test base, the conductor tracks can be bent in unfavorable cases and the component can thus become unusable.
Der Undefinierte Grat entsteht bei der in den Figuren 7 und 8 dargestellten Bearbeitung des herkömmlich hergestellten Gehäusekörpers 58 dadurch, daß zwischen dem Dambar 64 und der Preßmasse des Gehäuses 58 eine dünne Grathaut beim Preßvor- 10 gang entsteht. Der Stempel 70 schneidet dann beim Dambarschneiden zwar das zu entfernende Zwischenstück 72 des Dambars heraus, zwischen dem Stempel 70 und der linksseitigen Wand 74 des Gehäusekörpers 58 bricht aber der verbliebene Moldgrat unkontrolliert (Pfeil P) .The undefined burr arises in the processing of the conventionally produced housing body 58 shown in FIGS. 7 and 8 in that a thin burr skin is formed between the dambar 64 and the molding compound of the housing 58 during the pressing process. 10 gear emerges. The punch 70 then cuts out the intermediate piece 72 of the dambar to be removed, but between the punch 70 and the left-hand wall 74 of the housing body 58 the remaining mold burr breaks in an uncontrolled manner (arrow P).
Demgegenüber sind bei dem erfindungsgemäßen Verfahren in fertigungstechnisch einfacher Weise unter Verwendung eines nur geringfügig zu modifizierenden Designs des Leiterrahmens ausgesuchte Stellen derart konfiguriert, daß kein Undefinierter Gratausbruch am Gehäusekörper erfolgt. Vielmehr wird der Dambar so geschnitten und ausgedrückt, daß sich an dem durch die Fortsätze definierten Bereichen Trennflächen oder Trennkanten ergeben, die zur hochpräzisen Positionierung des Bauteils herangezogen werden. In contrast, in the method according to the invention, selected locations are configured in a manner that is simple to manufacture using a design of the lead frame that can be modified only slightly, in such a way that there is no undefined breakout on the housing body. Rather, the dambar is cut and expressed in such a way that separating surfaces or separating edges result in the areas defined by the extensions, which are used for the highly precise positioning of the component.

Claims

11 Patentansprüche 11 claims
1. Verwendung der baulichen Beschaffenheit eines elektronischen Bauteils als Referenz bei der Positionierung des Bauteils, wobei1. Use of the structural nature of an electronic component as a reference when positioning the component, wherein
- das Bauteil mindestens ein elektronisches Bauelement (20) , einen Gehäusekörper (25) und einen Leiterrahmen (1) aufweist,- The component has at least one electronic component (20), a housing body (25) and a lead frame (1),
- bei dem das Bauelement (20) an dem Leiterrahmen (1) montiert und zum externen elektrischen Anschluß mit nach außen führenden Leiterbahnen (4) des Leiterrahmens (1) kontaktiert ist und- In which the component (20) is mounted on the lead frame (1) and is contacted for external electrical connection with outwardly leading conductor tracks (4) of the lead frame (1) and
- bei dem das Bauteil (20) und der zentrale Bereich des Leiterrahmens (1) unter Bildung des Gehäusekörpers (25) mit einer Preßmasse umschlossen sind, und- In which the component (20) and the central region of the lead frame (1) are enclosed with a molding compound to form the housing body (25), and
- der Leiterrahmen (1) zunächst einen Fortsatz (14) aufweist,- The lead frame (1) initially has an extension (14),
- der Fortsatz (14) nach Bildung des Gehäusekörpers (25) von dem Leiterrahmen (1) trennbar ist und- The extension (14) after formation of the housing body (25) from the lead frame (1) is separable and
- der Fortsatz (14) von dem Gehäusekörper (25) entfernbar ist, so daß eine von außen zugängliche Trennfläche (38) zwischen dem Fortsatz (14) und dem Gehäusekörper (25) entsteht, dadurch gekennzeichnet , daß- The extension (14) from the housing body (25) is removable, so that an externally accessible separating surface (38) between the extension (14) and the housing body (25) is formed, characterized in that
- die Trennfläche (38) als Referenz bei der Positionierung des Bauteils dient.- The separating surface (38) serves as a reference when positioning the component.
2. Verfahren nach Anspruch 1,2. The method according to claim 1,
- wobei mehrere Leiterbahnen (4) zur Bildung eines Dambars (10) über Zwischenabschnitte (8) zunächst miteinander verbunden bleiben, dadurch ge kennzeichnet , daß- With several conductor tracks (4) to form a dambar (10) via intermediate sections (8) initially remain connected to one another, characterized in that
- der Fortsatz (14) an zumindest einem der Zwischenabschnitte (8) ausgebildet wird. 12- The extension (14) is formed on at least one of the intermediate sections (8). 12
3. Verfahren nach Anspruch 1 oder 2, d a d u r c h g e k e n n z e i c h n e t , d a ß der Fortsatz (14) als eine sich zum Leiterrahmenzentrum hin erstreckende Lasche ausgebildet wird.3. The method according to claim 1 or 2, d a d u r c h g e k e n n z e i c h n e t, d a ß the extension (14) is formed as a tab extending towards the lead frame center.
4. Verfahren nach Anspruch 1, 2 oder 3, d a d u r c h g e k e n n z e i c h n e t , d a ß jeweils ein Fortsatz (14) in einem Eckbereich des Leiterrahmens (16) derart vorgesehen wird, daß der Fortsatz (14) sich nach Bildung des Gehäusekörpers (25) in einer Gehäuseecke befindet.4. The method according to claim 1, 2 or 3, characterized in that ß in each case an extension (14) in a corner region of the lead frame (16) is provided such that the extension (14) after formation of the housing body (25) in a housing corner located.
5. Verfahren nach einem der Ansprüche 1 bis 4, d a d u r c h g e k e n n z e i c h n e t , d a ß5. The method according to any one of claims 1 to 4, d a d u r c h g e k e n n z e i c h n e t
- die Trennfläche (38) zur Positionierung des Bauteils in einem Testsockel verwendet wird. - The separating surface (38) is used to position the component in a test base.
EP99923397A 1998-04-06 1999-03-24 Use of the constructional characteristics of an electronic component as a reference for positioning the component Withdrawn EP1068640A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19815405 1998-04-06
DE19815405 1998-04-06
PCT/DE1999/000886 WO1999052149A1 (en) 1998-04-06 1999-03-24 Use of the constructional characteristics of an electronic component as a reference for positioning the component

Publications (1)

Publication Number Publication Date
EP1068640A1 true EP1068640A1 (en) 2001-01-17

Family

ID=7863776

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99923397A Withdrawn EP1068640A1 (en) 1998-04-06 1999-03-24 Use of the constructional characteristics of an electronic component as a reference for positioning the component

Country Status (3)

Country Link
US (1) US6541311B1 (en)
EP (1) EP1068640A1 (en)
WO (1) WO1999052149A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19908186C2 (en) * 1999-02-25 2001-08-09 Infineon Technologies Ag Integrated circuit, method for its production, mold for carrying out the method and method for functional testing of the integrated circuit
DE10058608A1 (en) * 2000-11-25 2002-05-29 Vishay Semiconductor Gmbh Conductor strip arrangement for a molded electronic component and method for molding
JP4489100B2 (en) * 2007-06-18 2010-06-23 株式会社東芝 Semiconductor package
JP5032623B2 (en) * 2010-03-26 2012-09-26 株式会社東芝 Semiconductor memory device
RU2503086C1 (en) * 2012-07-27 2013-12-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана) Method for encapsulation of electronic components

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571047A (en) 1978-11-24 1980-05-28 Hitachi Ltd Lead frame for resin mold
JPS6035550A (en) * 1984-07-25 1985-02-23 Hitachi Ltd Manufacture of resin-mold device
JPS6265445A (en) * 1985-09-18 1987-03-24 Hitachi Hokkai Semiconductor Ltd Lead frame
JPS63131557A (en) * 1986-11-21 1988-06-03 Hitachi Ltd Lead frame for resin seal type semiconductor device and resin type semiconductor device
JPS63152162A (en) 1986-12-16 1988-06-24 Nec Corp Semiconductor device
JPS63164251A (en) * 1986-12-26 1988-07-07 Hitachi Ltd Lead frame
JPS63202947A (en) * 1987-02-18 1988-08-22 Mitsubishi Electric Corp Lead frame for semiconductor device
JPS63228656A (en) * 1987-03-17 1988-09-22 Mitsubishi Electric Corp Lead frame for semiconductor device
US5070039A (en) * 1989-04-13 1991-12-03 Texas Instruments Incorporated Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal
JPH0493057A (en) 1990-08-09 1992-03-25 Goto Seisakusho:Kk Manufacture of electronic parts lead frame and electronic parts using the same
JP2933105B2 (en) * 1991-10-17 1999-08-09 富士通株式会社 Semiconductor device
JPH0661631A (en) * 1992-02-12 1994-03-04 Fujitsu Ltd Semiconductor device and fabrication thereof, carrier, carrier tape, and test jig
JPH0621274A (en) * 1992-07-02 1994-01-28 Seiko Epson Corp Ic socket
JPH06132449A (en) 1992-10-20 1994-05-13 Hitachi Ltd Semiconductor device
CH686325A5 (en) * 1992-11-27 1996-02-29 Esec Sempac Sa Electronic module and chip card.
US5521427A (en) * 1992-12-18 1996-05-28 Lsi Logic Corporation Printed wiring board mounted semiconductor device having leadframe with alignment feature
JPH08279585A (en) 1995-04-06 1996-10-22 Mitsui High Tec Inc Lead frame and its semiconductor device
DE19625384A1 (en) * 1996-06-25 1998-01-02 Siemens Ag Compound lead frame

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9952149A1 *

Also Published As

Publication number Publication date
US6541311B1 (en) 2003-04-01
WO1999052149A1 (en) 1999-10-14

Similar Documents

Publication Publication Date Title
EP0931343B1 (en) Chip module especially for implantation in chip card body
DE69534483T2 (en) Leadframe and semiconductor device
DE1564334A1 (en) Plastic encapsulated transistor and process for its manufacture
DE2920028A1 (en) ELECTRICAL CONTACT FOR A SWITCH AND PROCEDURE FOR MAKING SUCH CONTACT
DE102017221223B4 (en) TERMINAL PROCESSING DEVICE AND SEMICONDUCTOR DEVICE PRODUCED BY THEM
DE4326816A1 (en) Electronic module for cards and manufacture of such a module
EP1199913A2 (en) Method for making units comprising a circuit foil and a carrier housing
DE1279799B (en) Process for the production of an insulating body with connections leading to the outside
DE19503823C2 (en) Method of manufacturing a semiconductor device
EP1068640A1 (en) Use of the constructional characteristics of an electronic component as a reference for positioning the component
DE69636853T2 (en) Production method of a plastic package for electronic assemblies with a heat sink
WO2010066410A1 (en) Method and mold for producing an electronic component having a plastic insert molded carrier
DE112015007004B4 (en) MANUFACTURING METHOD FOR A SEMICONDUCTOR DEVICE
DE10063041B4 (en) A method of manufacturing an integrated leadless package circuit and integrated leadless package circuit
DE19736082C1 (en) Method and manufacture of a chip card and device for carrying out the method
EP1794787B1 (en) Lead frame for an electronic component and method for the production thereof
DE3809451A1 (en) LADDER FRAME AND METHOD FOR MAKING SEMICONDUCTOR DEVICES, INTENSELY BURL-FREE
EP0271163B1 (en) Manufacturing method of electrical circuit boards
DE112020004809T5 (en) Apparatus for manufacturing a semiconductor, method of manufacturing a semiconductor device using the apparatus, and semiconductor device
DE102020117341A1 (en) HOUSING LADDER DESIGN WITH GROOVES FOR IMPROVED ROCK BEAM SEPARATION
DE19738588B4 (en) Electrical component with a sheath and with a connection area arranged in the sheath and method for producing such an electrical component
EP3411903B1 (en) Molded module, method for producing a molded module and mold for injection molding a molded module
DE2150432B2 (en) Contact strips for the assembly of semiconductor components and its use in a casting mold
EP0184608A2 (en) Process for the manufacture of mechanically separable multiconnectors for the electrical connection of micro-electronic components, and multiconnectors manufactured by this process
DE3323346A1 (en) Process for manufacturing a plastics part and device for carrying out the process

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20001106

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE FR GB IT

17Q First examination report despatched

Effective date: 20011108

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20081001