EP0995205B1 - Bobine d'inductance planaire multicouche et son procede de production - Google Patents

Bobine d'inductance planaire multicouche et son procede de production Download PDF

Info

Publication number
EP0995205B1
EP0995205B1 EP98940208A EP98940208A EP0995205B1 EP 0995205 B1 EP0995205 B1 EP 0995205B1 EP 98940208 A EP98940208 A EP 98940208A EP 98940208 A EP98940208 A EP 98940208A EP 0995205 B1 EP0995205 B1 EP 0995205B1
Authority
EP
European Patent Office
Prior art keywords
substrate
multilayer
inductance coil
planar inductance
coil according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP98940208A
Other languages
German (de)
English (en)
Other versions
EP0995205A1 (fr
Inventor
Johann Milavec
Alain Chapuis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Power One AG
Original Assignee
Power One AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19802473A external-priority patent/DE19802473A1/de
Application filed by Power One AG filed Critical Power One AG
Publication of EP0995205A1 publication Critical patent/EP0995205A1/fr
Application granted granted Critical
Publication of EP0995205B1 publication Critical patent/EP0995205B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers

Definitions

  • the present invention relates to a multilayer Planarinduktterrorism according to the preamble of claim 1 and a method for producing such a multilayer Planarinduktivus.
  • Planar inductors of this type are used, for example, in switched-mode power supplies, voltage transformers or other power electronics devices which are realized on the basis of a multilayer carrier plate (so-called “multilayer” or “multilayer printed circuit board”) having a multiplicity of mutually electrically insulated conductor layers.
  • such a multilayer in addition to electronic components for the switching electronics, which are suitably connected by one or more tracks of the multilayer inductors such as transformers or chokes, for which (superimposed) conductor layers of the multilayer, the functions of the windings - ie the primary or secondary winding of a transformer - take over:
  • a transformer core is suitably inserted through a breakthrough in the multilayer, which then forms together with the windings formed on the multilayer conductor layers of the desired transformer.
  • a schematically shown transformer core 74 is mounted, which - approximately in the lateral cross-section E-shaped - with not shown in FIG. Legs through correspondingly sized apertures of the multilayer 70 extends.
  • the conductor layers form a corresponding primary or a secondary winding, so that in the manner shown, the inductance is embedded directly into the peripheral electronics indicated schematically by the further electronic components 76 or to the latter corresponding line layers 72 is connected.
  • one or more planar inductances can be realized on or in a multilayer in this manner, but usually the inductors only occupy a rather small part of the multilayer surface or mounting surface.
  • planar inductance is known, which is provided on a portion of a first plate-shaped carrier, wherein the carrier has a plurality of conductor layers and is designed for holding and contacting other electronic components. Planar inductance is assigned to a core.
  • Object of the present invention is therefore to provide a generic arrangement with a multilayer Planarinduktterrorism whose production can be simplified and made flexible in terms of possible variations of the inductance, in particular, the procurement and storage of expensive, realized as a multilayer plate-shaped carrier simplified can be.
  • the object is achieved by the multilayer Planarinduktirri with the features of claim 1 and the method with the features of claim 9.
  • the second multilayer provided in the subarea which is preferably limited in its dimensions to this area, enables the flexible, variable addition of additional conductor layers and
  • inductance windings to the base multilayer (the first plate-shaped support) already existing first conductor layers so that by appropriate placement and forming one or more locally limited multilayer required for a particular product variant inductance can be produced with little effort, without about this variant a special, separate multilayer complete design must be provided.
  • the peripheral electronics on the first carrier with a small number of conductor layers (With correspondingly low cost) to realize, while only in the region of the planar inductance, the required, additional conductor layers by placing one or more additional multilayer locally and selectively.
  • the expensive multilayer material is optimally utilized.
  • the invention is also particularly suitable when using the planar inductance as a transformer, since here primary and secondary winding can be assigned directly to the conductor layers of the second and the first carrier and thus the direct influence of the winding ratio is possible depending on the specification.
  • the second carrier in a suitable manner mechanically (and also electrically) to the underlying first carrier, with a solder connection in the lateral region of the second carrier having been found to be particularly suitable and preferred in terms of strength and mechanical strength.
  • Such an arrangement would also be advantageous to supplement or further stabilize by a (possibly additional) adhesive bond of the conductor layers.
  • a multi-layer card 10 such as in the outer format of a map of Europe, carries a pair of planar inductors in the form of planar transformers 12 located in the center of the card 10 and occupying about 20% of the card surface.
  • Each planar transformer 12 is realized electrically by means of a secondary winding provided by conductor layers 14 of the multilayer card 10 (base multilayer) and by a primary winding formed by conductor layers 16 and 18 of a first and second additional respectively provided on both sides of the base multilayer Multilayer piece 20 or 22 are provided.
  • the line layers 14 to 18 are penetrated by a lateral cross-section E-shaped transformer core 24 (see plan view of Fig. 2), which engages with its legs through the layered multilayer arrangement 20-10-22.
  • edge recesses 26 and a central recess 28 are formed, which are aligned with openings 30 of the base multilayer 10 so that the (in the illustration of FIG. 2, downwards into the plane directed) legs of the transformer core 24 pass through all three multilayer layers and can be connected on the bottom side by a correspondingly assigned, not shown in detail in the figure core element.
  • the additional multi-layer pieces 20, 22 extend over a portion of the multilayer card 10 (on both sides thereof), with the additional pieces 20, 22 by means of only a small gap 34 (see Fig. 3) on the Base card 10 rest, are connected by additional adhesive bonds 36 with this and so a layered arrangement of a plurality iw parallel line arrangements arises:
  • the base multilayer has four conductor layers and the additional multi-layer pieces 20, 22 each have five conductor layers,
  • there is a stratification of fourteen line layers which, with regard to their electrical or mechanical properties, are insignificantly impaired compared with a single, fourteen-layer multilayer, but only require a fraction of the procurement or production costs.
  • the additional multi-layer pieces 20, 22 can be fastened on the base multilayer 10.
  • the multilayer pieces 20, 22 are provided in the region of their narrow edges in each case with a pair of lateral recesses 38, which are realized as peripheral milling and metallized in this area.
  • the metallization also extends over an edge region of the upper or lower surface of a respective multi-layer piece.
  • FIGS. 4 and 5 show alternative possibilities for securing one or more additional multilayer pieces on a multilayer base card 10 in the region of the planar inductance and for variably forming the same.
  • an additional multi-layer piece 44 is connected to the base card 10 by means of a stapling element 46 acting on four points according to FIG. 2, the staple elements 46 being inserted into corresponding receiving openings 48 of the base card 10 and being there by means of a solder joint. like. are fixed.
  • the respective individual elements 50 may also be formed in the form of profiles which extend over a respective edge length of the multilayer pieces 54 shown.
  • a multilayer as the base plate, which has at least two conductor layers; Usually a practically usable multilayer will have about six conductor layers. Then, in a suitable manner and depending on the winding requirements, multilayer pieces in the region of the inductance to be formed are attached, which correspond to the required winding number or the required winding ratio.
  • the secondary winding of the base plate was preferably assigned, since this often requires fewer windings, of course - depending on the application - also a reversal or other design possible, such as the use of wiring layers of the base plate as a primary winding.
  • the present invention is not limited to the described mounting and contacting possibilities for the aufdinde (n) additional multilayer plate (s); in particular, it would also be possible to provide known contacting and fastening methods from hybrid technology, for example in the form of a connecting comb.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)

Claims (9)

  1. Inductance plane multicouche disposée sur une zone partielle d'un premier support (10) en forme de plaque, qui comporte une pluralité de premières couches conductrices (14) s'étendant de façon sensiblement parallèle les unes aux autres et qui est réalisée pour porter et assurer les contacts d'autres composants électroniques (32),
    - inductance dans laquelle une pluralité de premières couches conductrices (14) du premier support réalisant un premier enroulement électrique sont montées pour coopérer avec un noyau (24) disposé dans la zone partielle et prévu pour conduire un flux magnétique,
    - dans laquelle au moins un deuxième support (20 ; 22 ; 44 ; 54) comportant dans la zone partielle une pluralité de deuxièmes couches conductrices (16 ; 18) s'étendant de façon sensiblement parallèle les unes aux autres, est disposé parallèlement au premier support (10), de sorte qu'une pluralité de couches conductrices (16) du deuxième support réalisant un deuxième enroulement électrique puissent coopérer par induction avec le noyau (24) et le premier enroulement électrique, et inductance dans laquelle le deuxième support est relié au premier support par l'intermédiaire d'éléments de retenue agissant latéralement, de liaisons soudées ou d'autres procédés de mise en contact et de fixation.
  2. Inductance plane selon la revendication 1, caractérisée en ce que le deuxième support en forme de plaque présente une extension géométrique parallèle au premier support et qui se limite à la zone partielle.
  3. Inductance plane selon la revendication 1 ou 2, caractérisée en ce que, de chacun des deux côtés du premier support, est disposé un deuxième support aligné en superposition.
  4. Inductance plane selon l'une des revendications 1 à 3, caractérisée en ce que l'inductance est réalisée comme un transformateur dont l'enroulement secondaire est constitué par le premier enroulement électrique et dont l'enroulement primaire est constitué par le deuxième enroulement électrique.
  5. Inductance plane selon l'une des revendications 1 à 4, caractérisée en ce que le deuxième support est susceptible d'être fixé au premier support par au moins deux éléments de maintien (46, 50) agissant sur des côtés opposés et fixés au premier support.
  6. Inductance plane selon l'une des revendications 1 à 4, caractérisée en ce que le deuxième support est relié au premier support par au moins une liaison soudée agissant latéralement.
  7. Inductance plane selon l'une des revendications 1 à 6, caractérisée en ce que le deuxième support est susceptible d'être relié au premier support par une liaison collée.
  8. Inductance plane selon l'une des revendications 1 à 7, caractérisée en ce que le premier support et le deuxième support présentent à l'état superposé l'un sur l'autre, au moins une ouverture alignée (30) pour le guidage de traversée d'un tronçon du noyau (24).
  9. Procédé de fabrication d'une inductance plane multicouche selon l'une des revendications 1 à 8, caractérisé par les étapes consistant :
    - à fonder dans une zone partielle d'un premier support en forme de plaque une pluralité de premières couches conductrices s'étendant de façon sensiblement parallèle les unes aux autres pour recevoir un noyau prévu pour guider un flux magnétique,
    - à agencer parallèlement au premier support un deuxième support en forme de plaque avec une pluralité de deuxièmes couches conductrices s'étendant de façon sensiblement parallèle les unes aux autres, et
    - à agencer le noyau sur le premier support et sur le deuxième support, de sorte qu'un premier enroulement électrique du premier support, un deuxième enroulement électrique du deuxième support, ainsi que le noyau puissent coopérer par induction.
EP98940208A 1997-07-10 1998-07-10 Bobine d'inductance planaire multicouche et son procede de production Expired - Lifetime EP0995205B1 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE19729547 1997-07-10
DE19729547 1997-07-10
DE19802473A DE19802473A1 (de) 1997-07-10 1998-01-23 Multilayer-Planarinduktivität und Verfahren zum Herstellen einer solchen
DE19802473 1998-01-23
PCT/EP1998/004310 WO1999003117A1 (fr) 1997-07-10 1998-07-10 Bobine d'inductance planaire multicouche et son procede de production

Publications (2)

Publication Number Publication Date
EP0995205A1 EP0995205A1 (fr) 2000-04-26
EP0995205B1 true EP0995205B1 (fr) 2006-10-25

Family

ID=26038190

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98940208A Expired - Lifetime EP0995205B1 (fr) 1997-07-10 1998-07-10 Bobine d'inductance planaire multicouche et son procede de production

Country Status (4)

Country Link
US (1) US6369685B1 (fr)
EP (1) EP0995205B1 (fr)
DE (2) DE29824187U1 (fr)
WO (1) WO1999003117A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1230840C (zh) * 2000-11-21 2005-12-07 皇家菲利浦电子有限公司 ***、印刷电路板、充电器装置、用户装置及设备
DE10312284B4 (de) * 2003-03-19 2005-12-22 Sew-Eurodrive Gmbh & Co. Kg Übertragerkopf, System zur berührungslosen Energieübertragung und Verwendung eines Übertragerkopfes
US8144115B2 (en) * 2006-03-17 2012-03-27 Konicek Jeffrey C Flat panel display screen operable for touch position determination system and methods
US7859526B2 (en) * 2006-05-01 2010-12-28 Konicek Jeffrey C Active matrix emissive display and optical scanner system, methods and applications
DE102007014712B4 (de) * 2006-05-30 2012-12-06 Sew-Eurodrive Gmbh & Co. Kg Anlage
DE102007019111A1 (de) * 2007-04-23 2008-10-30 Osram Gesellschaft mit beschränkter Haftung Elektronisches Bauelement
CA2689672C (fr) * 2007-06-11 2016-01-19 Moog Limited Transformateur de faible epaisseur
US8243960B2 (en) * 2010-03-04 2012-08-14 Bose Corporation Planar audio amplifier output inductor with current sense
US8384478B2 (en) 2010-03-04 2013-02-26 Bose Corporation Versatile audio power amplifier
US8350537B2 (en) * 2010-03-04 2013-01-08 Bose Corporation Power supply transient response improving
US7986187B1 (en) 2010-03-04 2011-07-26 Bose Corporation Versatile audio power amplifier
ITTO20110295A1 (it) * 2011-04-01 2012-10-02 St Microelectronics Srl Dispositivo ad induttore integrato ad elevato valore di induttanza, in particolare per l'uso come antenna in un sistema di identificazione a radiofrequenza
US11213690B2 (en) 2012-06-15 2022-01-04 Medtronic, Inc. Wafer level packages of high voltage units for implantable medical devices
US8824161B2 (en) * 2012-06-15 2014-09-02 Medtronic, Inc. Integrated circuit packaging for implantable medical devices
DE102017215637A1 (de) * 2017-09-06 2019-03-07 Zf Friedrichshafen Ag Planartransformatorvorrichtung und Verfahren zur Herstellung einer Planartransformatorvorrichtung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4076356A (en) 1976-10-18 1978-02-28 Bell Telephone Laboratories, Incorporated Interconnection pin for multilayer printed circuit boards
US5321380A (en) 1992-11-06 1994-06-14 Power General Corporation Low profile printed circuit board
US5319342A (en) * 1992-12-29 1994-06-07 Kami Electronics Ind. Co., Ltd. Flat transformer
EP0741395A1 (fr) * 1995-05-04 1996-11-06 AT&T IPM Corp. Dispositif magnétique planaire montable sur les terminaux et sa méthode de fabrication
US5781093A (en) * 1996-08-05 1998-07-14 International Power Devices, Inc. Planar transformer
US6073339A (en) * 1996-09-20 2000-06-13 Tdk Corporation Of America Method of making low profile pin-less planar magnetic devices
US6211767B1 (en) * 1999-05-21 2001-04-03 Rompower Inc. High power planar transformer

Also Published As

Publication number Publication date
DE59813780D1 (de) 2006-12-07
EP0995205A1 (fr) 2000-04-26
US6369685B1 (en) 2002-04-09
DE29824187U1 (de) 2000-10-19
WO1999003117A1 (fr) 1999-01-21

Similar Documents

Publication Publication Date Title
DE69016187T2 (de) Niedrigprofil-Magnetkomponente mit mehreren Schichtwindungen.
EP0995205B1 (fr) Bobine d'inductance planaire multicouche et son procede de production
AT398254B (de) Chipträger sowie anordnung von solchen chipträgern
DE69823876T2 (de) Induktives bauelement und induktive bauelementanordnung
WO2003030189A1 (fr) Transformateur plat a bobines secondaires enfichees
EP1922738B1 (fr) Transformateur
EP2458598A1 (fr) Composant inductif pour flux élevés et son procédé de fabrication
DE19522172C1 (de) Leistungs-Halbleitermodul mit Anschlußstiften
DE3782380T2 (de) Elektrische bauteile mit angefuegten leitenden verbindungsstuecken.
DE19812836A1 (de) Induktives Miniatur-Bauelement für SMD-Montage
DE3323463A1 (de) Tastenschalter
DE9114783U1 (de) Flachform-Planar-Transformator zur Verwendung in Offline-Schaltnetzteilen
DE3722124A1 (de) Flachbaugruppe mit einer spule oder einem uebertrager
DE60130572T2 (de) Induktive bauelemente
DE69729127T2 (de) Induktives bauelement und verfahren zur herstellung eines solchen bauelements
WO2008128912A1 (fr) Composant électronique
DE4137776C2 (de) Hochfrequenzleistungsübertrager in Multilayer-Technik
WO2008128913A1 (fr) Composant électronique
DE19802473A1 (de) Multilayer-Planarinduktivität und Verfahren zum Herstellen einer solchen
DE10124117C2 (de) Leiterplatine mit kontaktiertem SMD-Baustein sowie zugehöriger SMD-Baustein
DE4337054B4 (de) Spule
EP1085535B1 (fr) Transformateur planaire
EP0246489A2 (fr) Assemblage de connexion par soudage de composants électriques et/ou électroniques
DE19941637A1 (de) Chipkarte und Verfahren zur Herstellung einer Chipkarte
EP1598839B1 (fr) Translateur pour dispositif à haute fréquence placé sur un circuit imprimé

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19991211

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE GB

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: POWER-ONE AG

17Q First examination report despatched

Effective date: 20040601

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE GB

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REF Corresponds to:

Ref document number: 59813780

Country of ref document: DE

Date of ref document: 20061207

Kind code of ref document: P

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 20070129

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20070719

Year of fee payment: 10

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

26N No opposition filed

Effective date: 20070726

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090203

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20110721

Year of fee payment: 14

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20120710

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120710