EP0907308B1 - Methods for mounting terminals on a circuit board and circuit boards fitted with terminals - Google Patents
Methods for mounting terminals on a circuit board and circuit boards fitted with terminals Download PDFInfo
- Publication number
- EP0907308B1 EP0907308B1 EP97924262A EP97924262A EP0907308B1 EP 0907308 B1 EP0907308 B1 EP 0907308B1 EP 97924262 A EP97924262 A EP 97924262A EP 97924262 A EP97924262 A EP 97924262A EP 0907308 B1 EP0907308 B1 EP 0907308B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- regions
- solder paste
- connecting end
- terminal
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
Definitions
- the present invention relates to a method for installing terminals on a circuit board comprising desired electronic circuits and electrical circuits, and to a circuit board used in this method.
- a method of soldering a conductive element to a conductor pad is known from GB-A-2,132,538 .
- Solder is pre-applied to a conductor pad on a printed circuit board in a pattern of discrete areas e.g., by screen printing with solder paste which is melted and allowed to solidify.
- solder paste which is melted and allowed to solidify.
- a conductive element e.g., a component terminal, is brought into contact with said areas of solder which are then melted and allowed to solidify.
- Fig. 18 shows an example of a different but nevertheless conventional structure wherein terminals are installed on a circuit board.
- terminal 9 has a thin plate shape and is made from metal, and it comprises a connecting end 9a and a non-connecting end 9b.
- the connecting end 9a is soldered to the circuit board 1E, whilst the non-connecting end 9b projects externally from the circuit board 1E.
- This reflow soldering method comprises a step of coating solder paste onto the surface of the circuit board 1E, a step of superimposing the aforementioned connecting end 9a over the region of the board coated with the solder paste, and a step of heating and melting the aforementioned solder paste, and this sequence of steps can be automated.
- pins for registering the location of the terminal 9 may be provided on the circuit board 1E.
- the aforementioned pins present an obstacle when installing the terminal 9 on the aforementioned circuit board 1E, and there have been instances where automatic installation of the terminal 9 by means of an automatic mounting device has been difficult to implement.
- problems have also arisen in that the task of providing the aforementioned pins on the circuit board 1E in advance is complicated.
- a first aspect of the present invention is a method for installing a plurality of terminals respectively having a connecting end and a projecting non-connecting end onto a circuit board whereon a plurality of pad regions are formed, the method comprising: a coating step for coating solder paste onto each of said pad regions; a superimposing step for superimposing the connecting end of each terminal on said coated solder paste; and a heating step for heating and melting said solder paste in order that the connecting ends of said terminals are soldered to said pad regions; characterized in that , in said coating step, the solder paste coated onto each pad region is divided into a plurality of mutually separated solder paste regions; and, in said superimposing step, the connecting end of each terminal is superimposed such that the connecting end extends over said plurality of solder paste regions.
- a second aspect of the present invention is a circuit board fitted with terminals comprising: a plurality of pad regions; solder paste coated onto each of said pad regions; and a plurality of terminals each having a connecting end and a projecting non-connecting end, the terminals being soldered to said pad regions by means of the connecting end of each terminal, characterized in that the solder paste coated onto each pad region is divided into a plurality of mutually separated solder paste regions; and the plurality of solder paste regions are located in mutually proximate positions such that the connecting end of each terminal can be superimposed such that the connecting end extends over said plurality of solder paste regions.
- the solder paste coated onto each of said pad regions is divided into at least three solder paste regions, each of these solder paste regions being mutually separated by an interval in both the longitudinal direction and the lateral direction of the terminal.
- each of said pad regions has an approximate square shape comprising four corner regions, and solder paste regions are provided respectively in these corner regions.
- an additional solder paste region separate from said plurality of solder paste regions is provided in approximately the central portion of each of said pad regions.
- said plurality of solder paste coated regions is formed by providing a plurality of mutually separated metal surface regions in each of said pad regions and coating solder paste respectively onto each of this plurality of metal surface regions.
- a third aspect of the present invention is a method for installing a plurality of terminals respectively having a connecting end and a projecting non-connecting end onto a circuit board wherein a plurality of pad regions is formed, the method comprising: a coating step for coating solder paste onto each of said pad regions; a superimposing step for superimposing the connecting end of each terminal on said coated solder paste; and a heating step for heating and melting said solder paste in order that the connecting ends of said terminals are soldered to said pad regions, characterized in that , in said coating step, said solder paste is coated onto each pad region such that the solder paste comprises a plurality of protruding regions extending beyond the pad region, and, in said superimposing step, the connecting end of each terminal are superimposed on said coated solder paste in such a manner that each of said protruding regions projects beyond the connecting end of the terminal.
- a fourth aspect of the present invention is a circuit board fitted with terminals comprising: a plurality of pad regions; solder paste coated onto each of said pad regions; and a plurality of terminals each respectively having a connecting end and a projecting non-connecting end, the terminals being soldered to said pad regions by means of the connecting end of each terminal, characterized in that the solder paste coated onto each pad region is coated in a shape having a plurality of protruding regions which extend beyond the connecting end of said terminal when the connecting end of said terminal is superimposed on the relevant solder paste.
- each terminal comprises a first edge extending in the lateral direction of said terminal and two second edges extending in the longitudinal direction of said terminal and connecting with the first edge, and said plurality of protruding regions are provided in at least three locations in such a manner that they project beyond the first edge and the two second edges, respectively.
- the aforementioned printed circuit board 1 is, for example, made from glass epoxy resin, and a plurality of pad regions 2 made from copper foil are provided on the surface thereof. Each of these pad regions 2 has an approximate square shape in plan view. Although omitted from the drawings, a plurality of electrically conductive wiring patterns which connect to the aforementioned plurality of pad regions 2 is formed on the surface of the printed circuit board 1, and by installing prescribed electronic components on the aforementioned printed circuit board 1, it is possible to fabricate a protective circuit for a rechargeable cell.
- the aforementioned printed circuit board 1 has an elongated shape in the lateral direction in Fig. 1 .
- the aforementioned plurality of conductive wiring patterns and the aforementioned plurality of pad regions 2 are provided in the longitudinal direction of the printed circuit board 1, in such a manner that multiple protective circuits for a rechargeable cell can be fabricated on the aforementioned printed circuit board 1.
- the imaginary lines N, N' shown in Fig. 1 indicate positions for cutting the aforementioned printed circuit board 1, such that the plurality of protective circuits for a rechargeable cell fabricated on the aforementioned printed circuit board 1 can be separated into individual protective circuits.
- solder paste 3 is coated to an appropriate thickness onto each of the aforementioned pad regions 2 by screen printing.
- solder paste 3 by coating the solder paste 3 in a dispersed manner onto the respective four corners of each pad region 2, as illustrated in Fig. 3 , a total of four solder paste coating regions 3a - 3d are formed, each mutually separated by a prescribed gap.
- the task of coating the solder paste in this manner can be carried out simultaneously with the task of coating solder paste for soldering prescribed electronic components which constitute the aforementioned protective circuit onto other locations of the printed circuit board 1.
- a plurality of terminals 4 (4A, 4B) is positioned on the printed circuit board 1.
- the connecting end 4a of each of the aforementioned terminals 4 is superimposed over the whole of one of the aforementioned solder paste coated regions 3a - 3d.
- a thin metal plate made from nickel, for example, may be used for the aforementioned terminals 4.
- terminals 4 (4A) from the aforementioned plurality of terminals are positioned in a side edge region 1a of said printed circuit board 1 extending in the longitudinal direction thereof, then a one-sided configuration is obtained, wherein the corresponding non-connecting ends 4b project externally from the aforementioned first side edge regions 4b.
- the aforementioned solder paste coated regions 3a - 3d are viscous, and when the terminals 4 (4A) are mounted onto the printed circuit board 1 by means of a chip mounting device, their corresponding connecting ends 4a can be pressed into the solder paste coated region 3a - 3d by a uniform applied pressure.
- the connecting ends 4a of the aforementioned terminals 4 (4A) can be attached to the solder paste coated regions 3a - 3d, thereby making it possible to prevent the terminals 4 (4A) from detaching readily from the printed circuit board 1.
- the respective non-connecting ends 4b are mounted in the narrow region S between the aforementioned imaginary lines N, N'. This terminal mounting operation can be carried out with good efficiency in combination with the task of mounting prescribed electronic components constituting the aforementioned protective circuit onto the printed circuit board 1, by means of a chip mounting device.
- the aforementioned printed circuit board 1 is forwarded to a furnace for solder reflowing, where the solder paste 3 in the aforementioned solder paste coated regions 3a - 3d is heated and caused to melt.
- the solder paste 3 becomes molten, surface tension is generated in the molten solder in the respective solder paste coated regions 3a - 3d positioned in a vertical and lateral configuration, as illustrated in Fig. 5 , and a self-alignment effect is displayed, whereby this surface tension causes the position of the aforementioned terminals 4 to be aligned.
- solder paste coated regions 3a, 3b and the solder paste coated regions 3c, 3d are separated by an interval in the longitudinal direction of the terminal 4, the surface tension of the molten solder in these regions creates a self-alignment effect whereby the aforementioned connecting end 4a is displaced in the lateral direction of the terminal 4 (indicated by arrow N1).
- solder paste coated regions 3a, 3d and the solder paste coated regions 3b, 3c are separated by an interval in the lateral direction of the terminal 4, the surface tension of the molten solder in these regions creates a further self-alignment effect whereby aforementioned connecting end 4a is displaced in the longitudinal direction of the terminal 4 (indicated by arrow N2).
- the aforementioned connecting end 4a can be displaced to a position wherein it shows little or no distortion with respect to the positions of the solder paste coated regions 3a - 3d, and hence the terminal 4 can be located accurately at a desired position.
- the process of soldering the terminal 4 is completed when the molten solder cools and hardens.
- the dimension between the respective solder paste coated regions 3a - 3d is desirable for the dimension between the respective solder paste coated regions 3a - 3d to be made large.
- the gap therebetween can be set to a maximum size in such a way than the respective solder paste coated regions 3a - 3d do not project beyond the pad region 2. Therefore, the self-alignment effect relating to the terminal 4 can be obtained more reliably.
- the aforementioned printed circuit board 1 is cut at the position of the imaginary lines N, N'. Thereby, a plurality of electronic circuit devices can be obtained.
- Each of the aforementioned electronic circuit devices A has a composition wherein the aforementioned plurality of terminals 4 is soldered to a cut printed circuit board 1' and the respective non-connecting ends 4b of the terminals 4 project externally from the printed circuit board 1'.
- the terminals 4 can be used by bending them. More specifically, two terminals 4A can be placed in contact with two electrodes 50 of a rechargeable cell 5 and spot welded. Moreover, the two terminals 4B can be positioned along either side face 5a, 5a of the rechargeable cell 5, such that they are positioned either side of the rechargeable cell 5. The two terminals 4B can be used, for example, to make an electrical connection to prescribed electronic circuits contained in the main unit of a portable telephone, or the like, into which the aforementioned rechargeable cell 5 is fitted.
- each of the aforementioned terminals 4 is soldered accurately to a desired position on the printed circuit board 1' by means of the self-alignment effect, and therefore it is possible to place each of the terminals 4 suitably in electrical connection with a prescribed position in relation to the aforementioned rechargeable cell 5.
- the specific composition of the solder paste coated regions may be any of the compositions illustrated in Fig. 8 to Fig. 12 , for example.
- a further solder paste coated region 3e is provided in approximately the central portion of the aforementioned pad region 2A. This solder paste coated region 3e is mutually separated from the respective solder paste coated regions 3a - 3d.
- compositions illustrated in Fig. 9 to Fig. 11 a variety of different coating region shapes, sizes and configurations are adopted in coating solder paste 3 onto a pad region 2A. In each of these cases, a self-alignment effect is obtained, thereby enabling the position of the terminal 4C to be aligned. In this way, a variety of different modes can be adopted for the solder paste coated regions in the present invention.
- the position of the terminal is aligned in both the longitudinal direction and lateral direction thereof, and in order to achieve this, preferably, a composition is adopted whereby the solder paste 3 is coated onto at least three separate regions, as illustrated in Fig. 12 , for example, such that these coated regions are mutually separated by gaps in the longitudinal direction and lateral direction of the terminal 4C.
- the following method may be used for implementing the step of coating solder paste.
- processing for covering the surface thereof with a green resist layer is carried out. This is aimed at providing insulation for the aforementioned conductive wiring pattern.
- a plurality of openings 70 in the aforementioned green resist layer 7 to the upper portion of a pad region 2B made from copper foil, a plurality of metal surface regions 28 are formed wherein the metal surface of the copper foil is externally exposed.
- This plurality of meal surface regions 28 comprises the surfaces at the four corner regions of the aforementioned pad region 2, each region being demarcated and mutually separated by a portion of the aforementioned green resist layer 7.
- Each of the aforementioned openings 70 can be provided by forming the aforementioned green resist layer 7 and then carrying out etching on the green resist layer 7.
- solder paste 3 is coated separately onto the respective surfaces of the aforementioned plurality of metal surface regions 28, thereby providing a plurality of solder paste coated regions 3f - 3i.
- the surface area of each of this plurality of solder paste coated regions 3f - 3i is smaller than the surface area of each of the aforementioned metal surface regions 28.
- the solder paste in the solder paste coated regions 3f - 3i is heated and caused to melt, the molten solder will not be liable to flow outside each of the aforementioned metal surface regions 28. This is because the molten solder forms a more familiar contact with the metal surface than with the green resist layer 7. Moreover, due to similar reasons, an effect can be anticipated whereby, even if the aforementioned solder paste coated regions 3f - 3i have generated a degree of overflowing outside the aforementioned openings 70, when molten, the solder will collect onto the aforementioned metal surface regions 28.
- the actual method of forming the metal surface regions is of course not limited to the method described above. Furthermore, the actual configuration of the metal surface regions can be altered to a variety of different configurations, similarly to the modes of configuring the solder paste coated regions as illustrated in Fig. 8 to Fig. 12 .
- solder paste 3 is coated onto the surface of the aforementioned pad region 2C.
- the aforementioned solder paste 3 is coated onto the surface of the three projecting regions 20.
- a solder paste coated region 3j comprising a total of three protruding sections 30 having a semicircular shape in plan view are provided on the aforementioned pad region 2C.
- a terminal 4E is mounted onto the printed circuit board 1B, as shown in Fig. 17 , and the connecting end 4a thereof is laid onto the aforementioned solder paste coated region 3j.
- the connecting end 4a comprises a first edge 40a extending in the lateral direction of the terminal 4E and two edges 40b, 40c extending in the longitudinal direction of the terminal 4E and connected to the first edge 40a.
- the aforementioned connecting end 4a is laid onto the solder paste coated region 3j, the aforementioned three protruding regions 30 each project respectively beyond the first edge 40a and the second edges 40b, 40c.
- the task of superimposing the terminal 4E onto the solder paste coated region 3j can be carried out by means of a chip mounting device, similarly to the previous embodiment.
- the printed circuit board 1B is transported to a furnace for solder reflow processing, where the solder paste in the solder paste coated region 3j is heated and caused to melt.
- the surface tension of the molten solder in the aforementioned three protruding regions 30 acts upon the first edge 40a and the second edges 40b, 40c.
- the three protruding sections 30 are separated spatially in the lateral direction of the terminal 4E, and furthermore, one of the protruding sections 30 (30a) is separated spatially from the other protruding sections 30 (30b, 30c) in the longitudinal direction of the terminal 4E.
- the specific number of protruding regions provided in the solder paste coated region is not limited. More than three protruding regions may also be provided in the present invention. Furthermore, it is also possible, for example, to provide only two protruding regions 30b, 30c, omitting one of the protruding regions 30a of the three protruding regions 30 (30a - 30c) shown in Fig. 17 . Even if this composition is adopted, it is still possible to obtain a self-alignment effect by the action of the surface tension of molten solder in the aforementioned two protruding regions 30b, 30c. However, in the present invention, desirably, it should be made possible to align the position of the terminal in both the longitudinal direction and lateral direction thereof by providing at least three or more protruding regions.
- the present invention is not limited to the contents of the embodiments described above.
- solder paste and solder referred to in the present invention is not limited to Sn - Pb alloys, but rather is a concept which includes a variety of electronic engineering solders containing different components.
- the circuit board referred to in the present invention is not limited to a printed circuit board made from epoxy resin, or the like, but rather is a concept which includes flexible circuit boards, for example.
- the specific composition of the electronic circuitry and electrical circuitry fabricated on the circuit board is not limited.
- the method for installing terminals onto a circuit board, and the circuit board according to the present invention can be used for applications wherein terminals are installed on a variety of circuit boards comprising electrical circuits or electronic circuits.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
- The present invention relates to a method for installing terminals on a circuit board comprising desired electronic circuits and electrical circuits, and to a circuit board used in this method.
- A method of soldering a conductive element to a conductor pad is known from
GB-A-2,132,538 -
Fig. 18 shows an example of a different but nevertheless conventional structure wherein terminals are installed on a circuit board. In the structure illustrated in this diagram,terminal 9 has a thin plate shape and is made from metal, and it comprises a connectingend 9a and anon-connecting end 9b. The connectingend 9a is soldered to thecircuit board 1E, whilst thenon-connecting end 9b projects externally from thecircuit board 1E. By adopting a composition of this kind, it is possible to bend the aforementioned non-connecting end, if necessary, as indicated by the imaginary line in the diagram, and this is convenient for making thenon-connecting end 9b into the electrode of a cell, or the terminal of a further circuit board, or the like. - Since the task of soldering the
aforementioned terminal 9 to the circuit board is carried out manually by an operator, the work efficiency is poor. Therefore, conventionally, reflow soldering has been adopted as a method for soldering theaforementioned terminal 9. This reflow soldering method comprises a step of coating solder paste onto the surface of thecircuit board 1E, a step of superimposing the aforementioned connectingend 9a over the region of the board coated with the solder paste, and a step of heating and melting the aforementioned solder paste, and this sequence of steps can be automated. - However, in the prior art, the following problems occur when the connecting
end 9a is soldered to thecircuit board 1E by means of a reflow soldering method. - Namely, as shown in
Fig. 19 for example, in a case where the twoend regions terminal 9A of a set length are superimposed on tworegions regions end region terminal 9A with the aforementioned two solder paste coatedregions - However, in the structure illustrated in
Fig. 18 , only connectingend 9a of theaforementioned terminal 9 is soldered to thecircuit board 1E, and therefore the surface tension of the molten solder only acts on this portion of the terminal. Therefore, in the prior art, in a case where theaforementioned terminal 9 is installed on thecircuit board 1E, a problem arises in that no self-alignment effect is obtained and therefore positional accuracy of theterminal 9 declines. - Conventionally, as means for raising the positional accuracy of the
terminal 9, pins for registering the location of theterminal 9 may be provided on thecircuit board 1E. However, in the case of means of this kind, the aforementioned pins present an obstacle when installing theterminal 9 on theaforementioned circuit board 1E, and there have been instances where automatic installation of theterminal 9 by means of an automatic mounting device has been difficult to implement. Moreover, problems have also arisen in that the task of providing the aforementioned pins on thecircuit board 1E in advance is complicated. - It is an object of the present invention to provide a method for installing terminals on a circuit board, whereby the aforementioned problems can be resolved or alleviated. Moreover, it is a further object of the present invention to provide a circuit board on which the aforementioned method can be implemented appropriately.
- A first aspect of the present invention is a method for installing a plurality of terminals respectively having a connecting end and a projecting non-connecting end onto a circuit board whereon a plurality of pad regions are formed, the method comprising: a coating step for coating solder paste onto each of said pad regions; a superimposing step for superimposing the connecting end of each terminal on said coated solder paste; and a heating step for heating and melting said solder paste in order that the connecting ends of said terminals are soldered to said pad regions; characterized in that, in said coating step, the solder paste coated onto each pad region is divided into a plurality of mutually separated solder paste regions; and, in said superimposing step, the connecting end of each terminal is superimposed such that the connecting end extends over said plurality of solder paste regions.
- A second aspect of the present invention is a circuit board fitted with terminals comprising: a plurality of pad regions; solder paste coated onto each of said pad regions; and a plurality of terminals each having a connecting end and a projecting non-connecting end, the terminals being soldered to said pad regions by means of the connecting end of each terminal, characterized in that the solder paste coated onto each pad region is divided into a plurality of mutually separated solder paste regions; and the plurality of solder paste regions are located in mutually proximate positions such that the connecting end of each terminal can be superimposed such that the connecting end extends over said plurality of solder paste regions.
- Desirably, the solder paste coated onto each of said pad regions is divided into at least three solder paste regions, each of these solder paste regions being mutually separated by an interval in both the longitudinal direction and the lateral direction of the terminal.
- Desirably, each of said pad regions has an approximate square shape comprising four corner regions, and solder paste regions are provided respectively in these corner regions.
- Desirably, an additional solder paste region separate from said plurality of solder paste regions is provided in approximately the central portion of each of said pad regions.
- Desirably, said plurality of solder paste coated regions is formed by providing a plurality of mutually separated metal surface regions in each of said pad regions and coating solder paste respectively onto each of this plurality of metal surface regions.
- A third aspect of the present invention is a method for installing a plurality of terminals respectively having a connecting end and a projecting non-connecting end onto a circuit board wherein a plurality of pad regions is formed, the method comprising: a coating step for coating solder paste onto each of said pad regions; a superimposing step for superimposing the connecting end of each terminal on said coated solder paste; and a heating step for heating and melting said solder paste in order that the connecting ends of said terminals are soldered to said pad regions, characterized in that, in said coating step, said solder paste is coated onto each pad region such that the solder paste comprises a plurality of protruding regions extending beyond the pad region, and, in said superimposing step, the connecting end of each terminal are superimposed on said coated solder paste in such a manner that each of said protruding regions projects beyond the connecting end of the terminal.
- A fourth aspect of the present invention is a circuit board fitted with terminals comprising: a plurality of pad regions; solder paste coated onto each of said pad regions; and a plurality of terminals each respectively having a connecting end and a projecting non-connecting end, the terminals being soldered to said pad regions by means of the connecting end of each terminal, characterized in that the solder paste coated onto each pad region is coated in a shape having a plurality of protruding regions which extend beyond the connecting end of said terminal when the connecting end of said terminal is superimposed on the relevant solder paste.
- Desirably, the connecting end of each terminal comprises a first edge extending in the lateral direction of said terminal and two second edges extending in the longitudinal direction of said terminal and connecting with the first edge, and said plurality of protruding regions are provided in at least three locations in such a manner that they project beyond the first edge and the two second edges, respectively.
- The various characteristics and advantages of the present invention shall become apparent by means of the embodiments described hereinafter with reference to the accompanying drawings.
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Fig. 1 is a principal plan diagram showing one example of a printed circuit board to which the method for installing terminals on a circuit board relating to the present invention is applied; -
Fig. 2 is a principal plan diagram showing one example of a state wherein solder paste is coated onto the printed circuit board illustrated inFig. 1 ; -
Fig. 3 is a principal enlarged plan view and shows one example of regions onto which solder paste is coated; -
Fig. 4 is a principal plan view showing one example of a state where a terminal is installed on a printed circuit board; -
Fig. 5 is a principal enlarged plan view ofFig. 4 ;Fig. 6 is a plan view illustrating one example of a step of cutting a printed circuit board; -
Fig. 7 is an oblique view showing one applicational example of an electronic circuit device manufactured by installing terminals on a printed circuit board; -
Fig. 8 is an illustrative diagram showing a further example of regions onto which solder paste is coated; -
Fig. 9 is an illustrative diagram showing a further example of regions onto which solder paste is coated; -
Fig. 10 is an illustrative diagram showing a further example of regions onto which solder paste is coated; -
Fig. 11 is an illustrative diagram showing a further example of regions onto which solder paste is coated; -
Fig. 12 is an illustrative diagram showing a further example of regions onto which solder paste is coated; -
Fig. 13a is a principal plan view showing a further example of a printed circuit board, andFig. 13b is a sectional view of same along line X1 - X1; -
Fig. 14a is a principal plan view showing a state where solder paste is coated onto the printed circuit board illustrated inFig. 13a ; andFig. 14b is a sectional view of same along line X2 - X2; -
Fig. 15 is a principal plan view showing a further example of a printed circuit board to which the method for installing terminals on a printed circuit board relating to the present invention is applied; -
Fig. 16 is a principal plan view showing a state where solder paste is coated onto the printed circuit board illustrated inFig. 15 ; -
Fig. 17 is a principal plan view showing a state where a terminal is superimposed on the regions onto which solder paste is coated illustrated inFig. 16 ; -
Fig. 18 is a principal oblique view showing a conventional example of a structure wherein terminals are installed on a circuit board; and -
Fig. 19 is an illustrative diagram of self-alignment effects obtained by means of a reflow soldering method. - Below, embodiments of the present invention are described with reference to the drawings.
- These embodiments will be described by taking as an example a case where an electronic circuit device for protecting a rechargeable cell is manufactured using the printed
circuit board 1 illustrated inFig. 1 . The aforementioned printedcircuit board 1 is, for example, made from glass epoxy resin, and a plurality ofpad regions 2 made from copper foil are provided on the surface thereof. Each of thesepad regions 2 has an approximate square shape in plan view. Although omitted from the drawings, a plurality of electrically conductive wiring patterns which connect to the aforementioned plurality ofpad regions 2 is formed on the surface of the printedcircuit board 1, and by installing prescribed electronic components on the aforementioned printedcircuit board 1, it is possible to fabricate a protective circuit for a rechargeable cell. The aforementioned printedcircuit board 1 has an elongated shape in the lateral direction inFig. 1 . In principle, the aforementioned plurality of conductive wiring patterns and the aforementioned plurality ofpad regions 2 are provided in the longitudinal direction of the printedcircuit board 1, in such a manner that multiple protective circuits for a rechargeable cell can be fabricated on the aforementioned printedcircuit board 1. The imaginary lines N, N' shown inFig. 1 indicate positions for cutting the aforementioned printedcircuit board 1, such that the plurality of protective circuits for a rechargeable cell fabricated on the aforementioned printedcircuit board 1 can be separated into individual protective circuits. - In order to manufacture the aforementioned electronic circuit device using the aforementioned printed
circuit board 1, firstly, as illustrated inFig. 2 ,solder paste 3 is coated to an appropriate thickness onto each of theaforementioned pad regions 2 by screen printing. In this case, by coating thesolder paste 3 in a dispersed manner onto the respective four corners of eachpad region 2, as illustrated inFig. 3 , a total of four solderpaste coating regions 3a - 3d are formed, each mutually separated by a prescribed gap. The task of coating the solder paste in this manner can be carried out simultaneously with the task of coating solder paste for soldering prescribed electronic components which constitute the aforementioned protective circuit onto other locations of the printedcircuit board 1. - Thereupon, as illustrated in
Fig. 4 , a plurality of terminals 4 (4A, 4B) is positioned on the printedcircuit board 1. In this case, as depicted clearly inFig. 5 , the connectingend 4a of each of theaforementioned terminals 4 is superimposed over the whole of one of the aforementioned solder paste coatedregions 3a - 3d. A thin metal plate made from nickel, for example, may be used for theaforementioned terminals 4. In the present embodiment, as described later, it is not necessary to provide pins for locating each of theaforementioned terminals 4 onto the printedcircuit board 1 in order to obtain a self-alignment effect when theterminal 4 is soldered to the printedcircuit board 1. Therefore, the task of mounting theaforementioned terminal 4 can be carried out with good efficiency using a general chip mounting device as used to mount chip-shaped electronic components onto a printed circuit board. - If a portion of terminals 4 (4A) from the aforementioned plurality of terminals are positioned in a side edge region 1a of said printed
circuit board 1 extending in the longitudinal direction thereof, then a one-sided configuration is obtained, wherein the corresponding non-connecting ends 4b project externally from the aforementioned firstside edge regions 4b. The aforementioned solder paste coatedregions 3a - 3d are viscous, and when the terminals 4 (4A) are mounted onto the printedcircuit board 1 by means of a chip mounting device, their corresponding connectingends 4a can be pressed into the solder paste coatedregion 3a - 3d by a uniform applied pressure. Consequently, the connecting ends 4a of the aforementioned terminals 4 (4A) can be attached to the solder paste coatedregions 3a - 3d, thereby making it possible to prevent the terminals 4 (4A) from detaching readily from the printedcircuit board 1. On the other hand, the respective non-connecting ends 4b are mounted in the narrow region S between the aforementioned imaginary lines N, N'. This terminal mounting operation can be carried out with good efficiency in combination with the task of mounting prescribed electronic components constituting the aforementioned protective circuit onto the printedcircuit board 1, by means of a chip mounting device. - After the task of installing the aforementioned terminals has been completed, the aforementioned printed
circuit board 1 is forwarded to a furnace for solder reflowing, where thesolder paste 3 in the aforementioned solder paste coatedregions 3a - 3d is heated and caused to melt. When thesolder paste 3 becomes molten, surface tension is generated in the molten solder in the respective solder paste coatedregions 3a - 3d positioned in a vertical and lateral configuration, as illustrated inFig. 5 , and a self-alignment effect is displayed, whereby this surface tension causes the position of theaforementioned terminals 4 to be aligned. - More specifically, since the aforementioned solder paste coated
regions regions terminal 4, the surface tension of the molten solder in these regions creates a self-alignment effect whereby the aforementioned connectingend 4a is displaced in the lateral direction of the terminal 4 (indicated by arrow N1). Moreover, since the solder paste coatedregions regions terminal 4, the surface tension of the molten solder in these regions creates a further self-alignment effect whereby aforementioned connectingend 4a is displaced in the longitudinal direction of the terminal 4 (indicated by arrow N2). Therefore, when each solder paste area in the aforementioned solder paste coatedregions 3a - 3d becomes molten, the aforementioned connectingend 4a can be displaced to a position wherein it shows little or no distortion with respect to the positions of the solder paste coatedregions 3a - 3d, and hence theterminal 4 can be located accurately at a desired position. The process of soldering theterminal 4 is completed when the molten solder cools and hardens. - In order to obtain the self-alignment effect described above in a reliable manner, it is desirable for the dimension between the respective solder paste coated
regions 3a - 3d to be made large. However, in the present embodiment, since the solder paste coatedregions 3a - 3d are positioned respectively in the four corner regions of eachpad region 2, the gap therebetween can be set to a maximum size in such a way than the respective solder paste coatedregions 3a - 3d do not project beyond thepad region 2. Therefore, the self-alignment effect relating to theterminal 4 can be obtained more reliably. - After the process described above has been completed, the aforementioned printed
circuit board 1 is cut at the position of the imaginary lines N, N'. Thereby, a plurality of electronic circuit devices can be obtained. Each of the aforementioned electronic circuit devices A has a composition wherein the aforementioned plurality ofterminals 4 is soldered to a cut printed circuit board 1' and the respective non-connecting ends 4b of theterminals 4 project externally from the printed circuit board 1'. - As illustrated in
Fig. 7 , for example, in the aforementioned electronic circuit device A, theterminals 4 can be used by bending them. More specifically, twoterminals 4A can be placed in contact with twoelectrodes 50 of arechargeable cell 5 and spot welded. Moreover, the twoterminals 4B can be positioned along eitherside face rechargeable cell 5, such that they are positioned either side of therechargeable cell 5. The twoterminals 4B can be used, for example, to make an electrical connection to prescribed electronic circuits contained in the main unit of a portable telephone, or the like, into which the aforementionedrechargeable cell 5 is fitted. As stated previously, each of theaforementioned terminals 4 is soldered accurately to a desired position on the printed circuit board 1' by means of the self-alignment effect, and therefore it is possible to place each of theterminals 4 suitably in electrical connection with a prescribed position in relation to the aforementionedrechargeable cell 5. - In the present invention, the specific composition of the solder paste coated regions may be any of the compositions illustrated in
Fig. 8 to Fig. 12 , for example. - Specifically, in the composition in
Fig. 8 , as well as providing a total of four solder paste coatedregions 3a - 3d in the four corner regions of thepad region 2A having an approximate square shape in plan view, a further solder paste coatedregion 3e is provided in approximately the central portion of theaforementioned pad region 2A. This solder paste coatedregion 3e is mutually separated from the respective solder paste coatedregions 3a - 3d. By means of a composition of this kind, in addition to obtaining a self-alignment effect whereby theterminal 4C is aligned in its longitudinal direction and its lateral direction by means of the aforementioned solder paste coatedregions 3a - 3d, a self-alignment effect is also obtained, whereby theterminal 4C is aligned in the directions (indicated by arrows N3, N4) in which each of the aforementioned solder paste coatedregions 3a - 3d are located with respect to the solder paste coatedregion 3e. Therefore, this configuration is more desirable with regard to accurate alignment of the terminal. - In the compositions illustrated in
Fig. 9 to Fig. 11 , a variety of different coating region shapes, sizes and configurations are adopted incoating solder paste 3 onto apad region 2A. In each of these cases, a self-alignment effect is obtained, thereby enabling the position of the terminal 4C to be aligned. In this way, a variety of different modes can be adopted for the solder paste coated regions in the present invention. However, in the present invention, desirably, it is devised that the position of the terminal is aligned in both the longitudinal direction and lateral direction thereof, and in order to achieve this, preferably, a composition is adopted whereby thesolder paste 3 is coated onto at least three separate regions, as illustrated inFig. 12 , for example, such that these coated regions are mutually separated by gaps in the longitudinal direction and lateral direction of the terminal 4C. - Moreover, in the present invention, the following method may be used for implementing the step of coating solder paste. Specifically, as illustrated in
Fig. 13a and Fig. 13b , after forming prescribed electrically conductive wiring patterns (omitted from the drawings) onto the printedcircuit board 1A, processing for covering the surface thereof with a green resist layer is carried out. This is aimed at providing insulation for the aforementioned conductive wiring pattern. In this case, by providing a plurality ofopenings 70 in the aforementioned green resistlayer 7 to the upper portion of apad region 2B made from copper foil, a plurality ofmetal surface regions 28 are formed wherein the metal surface of the copper foil is externally exposed. This plurality ofmeal surface regions 28 comprises the surfaces at the four corner regions of theaforementioned pad region 2, each region being demarcated and mutually separated by a portion of the aforementioned green resistlayer 7. Each of theaforementioned openings 70 can be provided by forming the aforementioned green resistlayer 7 and then carrying out etching on the green resistlayer 7. Thereupon, as illustrated inFig. 14a and Fig. 14b ,solder paste 3 is coated separately onto the respective surfaces of the aforementioned plurality ofmetal surface regions 28, thereby providing a plurality of solder paste coatedregions 3f - 3i. Desirably, the surface area of each of this plurality of solder paste coatedregions 3f - 3i is smaller than the surface area of each of the aforementionedmetal surface regions 28. After the process of coating thesolder paste 3, the connectingend 4a of the terminal 4D is superimposed on the aforementioned solder paste coatedregions 3f - 3i. - Once the sequence of tasks described above has been completed, if the solder paste in the solder paste coated
regions 3f - 3i is heated and caused to melt, the molten solder will not be liable to flow outside each of the aforementionedmetal surface regions 28. This is because the molten solder forms a more familiar contact with the metal surface than with the green resistlayer 7. Moreover, due to similar reasons, an effect can be anticipated whereby, even if the aforementioned solder paste coatedregions 3f - 3i have generated a degree of overflowing outside theaforementioned openings 70, when molten, the solder will collect onto the aforementionedmetal surface regions 28. Therefore, it is possible to resolve the problem of molten solder in the solder paste coatedregions 3f - 3i solidifying in lumps, without raising the positional accuracy of the aforementioned solder paste coatedregions 3f - 3i to a great extent. Consequently, it is possible to obtain a suitable self-alignment effect by utilizing the surface tension of the molten solder located in a plurality of separate areas. In the present invention, the actual method of forming the metal surface regions is of course not limited to the method described above. Furthermore, the actual configuration of the metal surface regions can be altered to a variety of different configurations, similarly to the modes of configuring the solder paste coated regions as illustrated inFig. 8 to Fig. 12 . - Next, a further embodiment of the present invention is described with reference to
Fig. 15 to Fig. 17 . - In the present embodiment, firstly, in a case where a
pad region 2C made from copper foil is formed on the surface of a printedcircuit board 1B, as illustrated inFig. 15 , semicircular projectingregions 20 are formed respectively in the central portions, in the longitudinal direction, of threeside edges 2a - 2c of apad region 2C. Next, as illustrated inFig. 16 ,solder paste 3 is coated onto the surface of theaforementioned pad region 2C. In this case, theaforementioned solder paste 3 is coated onto the surface of the three projectingregions 20. Thereby, a solder paste coatedregion 3j comprising a total of three protrudingsections 30 having a semicircular shape in plan view are provided on theaforementioned pad region 2C. - After the task of coating the solder paste has been completed, a
terminal 4E is mounted onto the printedcircuit board 1B, as shown inFig. 17 , and the connectingend 4a thereof is laid onto the aforementioned solder paste coatedregion 3j. The connectingend 4a comprises afirst edge 40a extending in the lateral direction of the terminal 4E and twoedges 40b, 40c extending in the longitudinal direction of the terminal 4E and connected to thefirst edge 40a. When the aforementioned connectingend 4a is laid onto the solder paste coatedregion 3j, the aforementioned three protrudingregions 30 each project respectively beyond thefirst edge 40a and thesecond edges 40b, 40c. In this way, the task of superimposing the terminal 4E onto the solder paste coatedregion 3j can be carried out by means of a chip mounting device, similarly to the previous embodiment. - Thereupon, the printed
circuit board 1B is transported to a furnace for solder reflow processing, where the solder paste in the solder paste coatedregion 3j is heated and caused to melt. By so doing, the surface tension of the molten solder in the aforementioned three protrudingregions 30 acts upon thefirst edge 40a and thesecond edges 40b, 40c. In this case, the three protrudingsections 30 are separated spatially in the lateral direction of the terminal 4E, and furthermore, one of the protruding sections 30 (30a) is separated spatially from the other protruding sections 30 (30b, 30c) in the longitudinal direction of the terminal 4E. Consequently, a self-alignment effect can be obtained whereby, due to the action of the surface tension of the molten solder, the aforementioned connectingend 4a is displaced in the lateral direction and longitudinal direction of the terminal 4E, causing the connectingend 4a to be aligned centrally with respect to the three protrudingregions 30. Therefore, it is possible to solder the connectingend 4a onto thepad region 2C accurately. Furthermore, after soldering has been completed, the aforementioned protruding regions can be viewed readily from outside, thereby enabling accurate judgement to be made with regard to whether or not the terminal 4E has been soldered in position correctly. - In the present invention, the specific number of protruding regions provided in the solder paste coated region is not limited. More than three protruding regions may also be provided in the present invention. Furthermore, it is also possible, for example, to provide only two protruding
regions regions 30a of the three protruding regions 30 (30a - 30c) shown inFig. 17 . Even if this composition is adopted, it is still possible to obtain a self-alignment effect by the action of the surface tension of molten solder in the aforementioned two protrudingregions - The present invention is not limited to the contents of the embodiments described above.
- For example, the solder paste and solder referred to in the present invention is not limited to Sn - Pb alloys, but rather is a concept which includes a variety of electronic engineering solders containing different components. Furthermore, the circuit board referred to in the present invention is not limited to a printed circuit board made from epoxy resin, or the like, but rather is a concept which includes flexible circuit boards, for example. Naturally, the specific composition of the electronic circuitry and electrical circuitry fabricated on the circuit board is not limited.
- The method for installing terminals onto a circuit board, and the circuit board according to the present invention can be used for applications wherein terminals are installed on a variety of circuit boards comprising electrical circuits or electronic circuits.
Claims (14)
- A method for installing a plurality of terminals (4, 4A-4D) respectively having a connecting end (4a) and a projecting non-connecting end (4b) onto a circuit board (1, 1', 1A) whereon a plurality of pad regions (2, 2A, 2B) are formed, the method comprising:a coating step for coating solder paste (3) onto each of said pad regions (2, 2A, 2B);a superimposing step for superimposing the connecting end (4a) of each terminal (4, 4A-4D) on said coated solder paste (3); anda heating step for heating and melting said solder paste (3) in order that the connecting ends (4a) of said terminals (4, 4A-4D) are soldered to said pad regions (2, 2A, 2B);characterized in that, in said coating step, the solder paste (3) coated onto each pad region (2, 2A, 2B) is divided into a plurality of mutually separated solder paste regions (3a-3e; 3f-3i); and,in said superimposing step, the connecting end (4a) of each terminal (4, 4A-4D) is superimposed such that the connecting end (4a) extends over said plurality of solder paste regions (3a-3e, 3f-3i).
- The method according to claim 1, wherein the solder paste (3) coated onto each of said pad regions (2, 2A, 2B) is divided into at least three solder paste regions (3a-3e; 3f-3i), these solder paste regions (3a-3e, 3f-3i) being mutually separated by intervals in both the longitudinal direction and the lateral direction of the terminal (4, 4A-4D).
- The method according to claim 1 or claim 2, wherein each of said pad regions (2, 2A, 2B) has an approximate square shape comprising four corner regions, and the solder paste regions (3a-3d, 3f-3i) are provided respectively in these corner regions.
- The method according to claim 3, wherein an additional solder paste region (3e) separate from said plurality of solder paste regions (3a-3d) is provided in approximately the central portion of each of said pad regions (2A).
- The method according to any one of claims 1 to 4, wherein said plurality of solder paste regions (3f-3i) is formed by providing a plurality of mutually separated metal surface regions (28) in each of said pad regions (2B) and coating solder paste (3) respectively onto each of the plurality of metal surface regions (28).
- A circuit board fitted with terminals comprising:a plurality of pad regions (2, 2A, 2B);solder paste (3) coated onto each of said pad regions (2, 2A, 2B); anda plurality of terminals (4, 4A-4D) each having a connecting end (4a) and a projecting non-connecting end (4b), the terminals (4, 4A-4D) being soldered to said pad regions (2, 2A, 2B) by means of the connecting end (4a) of each terminal (4, 4A-4D),characterized in that the solder paste (3) coated onto each pad region (2, 2A, 2B) is divided into a plurality of mutually separated solder paste regions (3a-3e, 3f-3i); andthe plurality of solder paste regions (3a-3e, 3f-3i) are located in mutually proximate positions such that the connecting end (4a) of each terminal (4, 4A-4D) can be superimposed such that the connecting end (4a) extends over said plurality of solder paste regions (3a-3e, 3f-3i).
- The circuit board according to claim 6, wherein the solder paste (3) coated onto each of said pad regions (2, 2A, 2B) is divided into at least three solder paste regions (3a-3e, 3f-3i), each of these solder paste regions (3a-3e, 3f-3i) being mutually separated by an interval in both the longitudinal direction and the lateral direction of the terminal (4, 4A, 4D).
- The circuit board according to claim 6 or claim 7, wherein each of said pad regions (2, 2A, 2B) has an approximate square shape comprising four corner regions, and the solder paste regions (3a-3d, 3f-3i) are provided respectively in these corner regions.
- The circuit board according to claim 8, wherein an additional solder paste region (3e) separate from said plurality of solder paste regions (3a-3d) is provided in approximately the central portion of each of said pad regions (2A).
- The circuit board according to any one of claims 6 to 9, wherein said plurality of solder paste coated regions (3f-3i) is formed by providing a plurality of mutually separated metal surface regions (28) in each of said pad regions (2B) and coating solder paste (3) respectively onto each of this plurality of metal surface regions (28).
- A method for installing a plurality of terminals (4E) respectively having a connecting end (4a) and a projecting non-connecting end (4b) onto a circuit board (1B) wherein a plurality of pad regions (2C) is formed, the method comprising:a coating step for coating solder paste (3j) onto each of said pad regions (2C);a superimposing step for superimposing the connecting end (4a) of each terminal (4E) on said coated solder paste (3j); anda heating step for heating and melting said solder paste (3j) in order that the connecting ends (4a) of said terminals (4E) are soldered to said pad regions (2C),characterized in that, in said coating step, said solder paste (3j) is coated onto each pad region (2C) such that the solder paste (3j) comprises a plurality of protruding regions (30, 30a-30c) extending beyond the pad region (2C), and,in said superimposing step, the connecting end (4a) of each terminal .(4E) are superimposed on said coated solder paste (3j) in such a manner that each of said protruding regions (30, 30a-30c) projects beyond the connecting end (4a) of the terminal (4E).
- The method according to claim 11, wherein the connecting end (4a) of each terminal (4E) comprises a first edge (40a) extending in the lateral direction of said terminal and two second edges (40b, 40c) extending in the longitudinal direction of said terminal (4E) and connecting with the first edge (40a), and said plurality of protruding regions (30, 30a-30c) are provided in at least three locations in such a manner that they project beyond said first edge (40a) and said two second edges (40b, 40c), respectively.
- A circuit board fitted with terminals comprising:a plurality of pad regions (2C);solder paste (3j) coated onto each of said pad regions (2C) ; anda plurality of terminals (4E) each respectively having a connecting end (4a) and a projecting non-connecting end (4b), the terminals (4E) being soldered to said pad regions (2C) by means of the connecting end (4a) of each terminal (4E),characterized in that the solder paste (3j) coated onto each pad region (2C) is coated in a shape having a plurality of protruding regions (30, 30a-30c) which extend beyond the connecting end (4a) of said terminal (4E) when the connecting end (4a) of said terminal (4E) is superimposed on the relevant solder paste (3j).
- The circuit board according to claim 13, wherein the connecting end (4a) of each terminal (4E) comprises a first edge (40a) extending in the lateral direction of said terminal (4E) and two second edges (40b, 40c) extending in the longitudinal direction of said terminal (4E) and connecting with the first edge (40a), and said plurality of protruding regions (30, 30a-30c) are provided in at least three locations in such a manner that they project beyond said first edge (40a) and said two second edges (40b, 40c), respectively.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP134722/96 | 1996-05-29 | ||
JP13472296 | 1996-05-29 | ||
PCT/JP1997/001837 WO1997046059A1 (en) | 1996-05-29 | 1997-05-28 | Method for mounting terminal on circuit board and circuit board |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0907308A1 EP0907308A1 (en) | 1999-04-07 |
EP0907308A4 EP0907308A4 (en) | 2005-03-30 |
EP0907308B1 true EP0907308B1 (en) | 2011-01-26 |
Family
ID=15135078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP97924262A Expired - Lifetime EP0907308B1 (en) | 1996-05-29 | 1997-05-28 | Methods for mounting terminals on a circuit board and circuit boards fitted with terminals |
Country Status (7)
Country | Link |
---|---|
US (1) | US6175086B1 (en) |
EP (1) | EP0907308B1 (en) |
KR (1) | KR100329490B1 (en) |
CN (1) | CN1164153C (en) |
DE (1) | DE69740106D1 (en) |
TW (1) | TW360899B (en) |
WO (1) | WO1997046059A1 (en) |
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JP4346827B2 (en) * | 2001-03-06 | 2009-10-21 | パナソニック株式会社 | Electronic component mounting method |
JP4098556B2 (en) * | 2001-07-31 | 2008-06-11 | ローム株式会社 | Terminal board, circuit board provided with the terminal board, and method for connecting the terminal board |
JP2003174249A (en) * | 2001-12-06 | 2003-06-20 | Rohm Co Ltd | Circuit board and method for manufacturing the circuit board |
KR100542552B1 (en) | 2003-08-21 | 2006-01-11 | 삼성전자주식회사 | A Printed Circuit Board and an Image forming apparatus having the Printed Circuit Board |
JP3776907B2 (en) | 2003-11-21 | 2006-05-24 | ローム株式会社 | Circuit board |
JP4416616B2 (en) * | 2004-09-29 | 2010-02-17 | 株式会社リコー | Electronic component mounting body and electronic equipment |
JP5320391B2 (en) * | 2008-05-08 | 2013-10-23 | 太陽誘電株式会社 | Electrochemical device and its mounting structure |
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-
1997
- 1997-05-28 CN CNB971949298A patent/CN1164153C/en not_active Expired - Fee Related
- 1997-05-28 DE DE69740106T patent/DE69740106D1/en not_active Expired - Lifetime
- 1997-05-28 US US09/180,979 patent/US6175086B1/en not_active Expired - Lifetime
- 1997-05-28 EP EP97924262A patent/EP0907308B1/en not_active Expired - Lifetime
- 1997-05-28 TW TW086107370A patent/TW360899B/en not_active IP Right Cessation
- 1997-05-28 KR KR1019980709207A patent/KR100329490B1/en not_active IP Right Cessation
- 1997-05-28 WO PCT/JP1997/001837 patent/WO1997046059A1/en active IP Right Grant
Also Published As
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EP0907308A4 (en) | 2005-03-30 |
EP0907308A1 (en) | 1999-04-07 |
US6175086B1 (en) | 2001-01-16 |
DE69740106D1 (en) | 2011-03-10 |
TW360899B (en) | 1999-06-11 |
CN1220077A (en) | 1999-06-16 |
KR100329490B1 (en) | 2002-08-13 |
KR20000011055A (en) | 2000-02-25 |
CN1164153C (en) | 2004-08-25 |
WO1997046059A1 (en) | 1997-12-04 |
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