JPH03141690A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPH03141690A JPH03141690A JP1281368A JP28136889A JPH03141690A JP H03141690 A JPH03141690 A JP H03141690A JP 1281368 A JP1281368 A JP 1281368A JP 28136889 A JP28136889 A JP 28136889A JP H03141690 A JPH03141690 A JP H03141690A
- Authority
- JP
- Japan
- Prior art keywords
- footprint
- check pattern
- wiring board
- printed wiring
- positional deviation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011179 visual inspection Methods 0.000 abstract description 7
- 238000007689 inspection Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
プリント配線基板に係り、さらに詳しくは表面実装部品
を実装するフットプリントの形状に関し、フットプリン
トに実装した表面実装部品の位圓ずれの目視検査を容易
にすることを目的とし、表面実装部品を実装するフット
プリントを具備するプリント配線基板であって、前記フ
ットブリ〔産業上の利用分野〕
本発明はプリント配線基板に係り、さらに詳しくは、表
面実装部品を実装するフットプリントの形状に関する。[Detailed Description of the Invention] [Summary] This invention relates to a printed wiring board, more specifically, relates to the shape of a footprint on which a surface mount component is mounted, and facilitates visual inspection of misalignment of a surface mount component mounted on the footprint. The present invention relates to a printed wiring board, and more particularly, the present invention relates to a printed wiring board, and more particularly, the present invention relates to a printed wiring board, and more particularly, the present invention relates to a printed wiring board, and more particularly, the present invention relates to a printed wiring board, and more particularly, the present invention relates to a printed wiring board, and more particularly, the present invention relates to a printed wiring board, and more particularly, Regarding the shape of the footprint.
プリント配線基板のフットプリントに実装した表面実装
部品、例えばチップ抵抗器やチップコンデンサなどの半
田付は時に起きる位置ずれを簡単に目視検査できること
が要望されている。There is a demand for easy visual inspection of misalignment that sometimes occurs when soldering surface mount components such as chip resistors and chip capacitors mounted on the footprint of a printed wiring board.
従来のプリント配線基板１１は第４図の要部平面図に示
すように、２点鎖線で示す例えば、チップ抵抗器のよう
な表面実装部品１２の画電極１２ａを半田付は実装する
１対のフットプリン）ｌｌａを具備している。フットプ
リントｌｌａはチップ抵抗器の画電極１２ａの接合面よ
りやや大きい面積の長方形である。表面実装部品１２の
実装後の位置ずれ（第５図の位置ずれ状態を示す要部平
面図参照）の検査は目視に依っている。As shown in the main part plan view of FIG. 4, the conventional printed wiring board 11 has a pair of solder-mounted picture electrodes 12a of a surface-mounted component 12, such as a chip resistor, indicated by a two-dot chain line. footprint) lla. The footprint lla is a rectangle with an area slightly larger than the bonding surface of the picture electrode 12a of the chip resistor. Inspection of the positional deviation of the surface mount component 12 after mounting (see the plan view of the main part showing the positional deviation state in FIG. 5) relies on visual inspection.
しかしながら、このような上記プリント配線基板のフッ
トプリントの形状によれば、実装した表面実装部品の位
置ずれの目視検査は、位置ずれ許容範囲の物理的基準が
プリント配線基板上にないことから判定しに＜＜、誤判
定したり判定に気をつかい過ぎるといった問題があった
。However, according to the shape of the footprint of the printed wiring board, visual inspection of the positional deviation of mounted surface mount components cannot be determined because there is no physical reference for the tolerance range of positional deviation on the printed wiring board. <<, there were problems such as incorrect judgments and being too careful about judgments.
上記問題点に鑑み、本発明はフットプリントに実装した
表面実装部品の位置ずれの目視検査を容易にすることの
できるプリント配線基板を提供することを目的とする。In view of the above-mentioned problems, an object of the present invention is to provide a printed wiring board that can facilitate visual inspection of misalignment of surface mount components mounted on a footprint.
上記目的を達成するために、本発明のプリント配線基板
においては、フットプリントの周囲に該フットプリント
に実装する表面実装部品の位置すれ許容範囲を示すチエ
７り用パターンを付設して構成する。In order to achieve the above object, the printed wiring board of the present invention is constructed by attaching a check pattern around the footprint to indicate the permissible positional range of the surface mount component to be mounted on the footprint.
フットプリントの周囲に付設したチェック用パターンは
表面実装部品の位置ずれ許容範囲をプリント配線基板上
にフットプリントと関係し物理的に示しているため、フ
ットプリントに実装した表面実装部品の電極外形（角）
がチェック用パターンの範囲内にあるか否かを即座に比
較することができ、目視による位置ずれの合否判定が容
易になる。The check pattern attached around the footprint physically indicates the allowable misalignment range of the surface mount component in relation to the footprint on the printed wiring board, so the outer shape of the electrode of the surface mount component ( corner)
It is possible to immediately compare whether or not the positional deviation is within the range of the check pattern, making it easy to visually determine whether the positional deviation is acceptable or not.
以下図面に示した実施例に基づいて本発明の要旨を詳細
に説明する。The gist of the present invention will be explained in detail below based on embodiments shown in the drawings.
プリント配線基板ｌは第１図の要部平面図に示すように
、２点鎖線で示す表面実装部品２、即ちチップ抵抗器の
画電極２ａを半田付けする電極２ａの接合面よりやや大
きい面積の長方形で対をなすフットプリント１ａを備え
、さらにそれぞれのフットプリン）ｌａの周囲に表面実
装部品の位置ずれ許容範囲を示すチェック用パターン１
ｂをフットプリン目ａから一体突出して延びる形状で具
備する。即ち、このチェック用パターン１ｂは、フット
プリン）１ａのＸ方向の２辺それぞれにＸ方向の位置ず
れ許容範囲を２本の線（線幅０．２＋ｕＸ線長さ０ 、
２ ＋＋ｎ ）の内側間隔Ａで示すチェック用パターン
１ｂｘと、Ｙ方向の２辺それぞれにＹ方向の位置ずれ許
容範囲を２本の線（線幅０．２ｍｍＸ線長さ０．２ｍｍ
）の内側間隔Ｂで示すチェック用パターンｔｂｙとで構
成する。As shown in the main part plan view of FIG. 1, the printed wiring board l has an area slightly larger than the bonding surface of the surface mount component 2 shown by the two-dot chain line, that is, the electrode 2a to which the picture electrode 2a of the chip resistor is soldered. A check pattern 1 is provided with a pair of rectangular footprints 1a, and further includes a check pattern 1 that indicates the permissible misalignment range of the surface mount component around each footprint 1a.
b is provided in a shape that integrally projects and extends from the footprint eye a. That is, this check pattern 1b has two lines (line width 0.2+u
Check pattern 1bx shown by inner spacing A of 2 ++n ) and two lines (line width 0.2 mm,
) and a check pattern tby indicated by an inner interval B.
第２図は位置ずれ実装した状態を示す要部平面図であっ
て、フットプリント１ａからはみ出したチップ抵抗器２
の電極２ａ外形の外側角がチェック用パターンのＡＸＢ
の斜線部範囲内にあれば合格と判定する。図は左下の一
つの角２ａ−１が外れた不合格の場合を例示する。FIG. 2 is a plan view of the main part showing a state in which the chip resistor 2 is mounted out of position, and the chip resistor 2 protrudes from the footprint 1a.
The outer corner of the outer shape of the electrode 2a is the check pattern AXB
If it is within the shaded range, it is judged as passing. The figure exemplifies a case of failure in which one corner 2a-1 at the lower left is off.
このように、フットプリントの四辺に表面実装部品の位
置ずれ許容範囲を示すチェック用バク−ンを付設するこ
とにより、そのチェック用パターンを基準にしてフット
プリントに実装した表面実装部品の電極外形がチェック
用パターンの間、即ちＡＸＢ範囲内にあるか否かを直視
比較することができ、目視による合否判定を容易に行う
ことができる。In this way, by attaching check backs on the four sides of the footprint to indicate the allowable positional deviation range of the surface mount components, the outer shape of the electrodes of the surface mount components mounted on the footprint can be determined based on the check pattern. It is possible to directly compare the check patterns, that is, whether or not they are within the AXB range, and it is possible to easily make a visual pass/fail judgment.
また第３図は他の実施例の要部平面図であって、プリン
ト配線基板１”は広面積の接地ライン（あるいは電源ラ
イン）の配線パターンｌｃ （右下がり斜線部）内に一
対のフットプリント１ａ＋ の一方のフットプリントｌ
ａ’−１（右上がり斜線部）をアイランド状に設け、四
辺をチェック用パターン１ｂ”で導通連接する。他方の
フットプリントｌａ’−２は一辺に設けたチェック用パ
ターン１ｂ”を介し配線パターン１ｄに導通連接する。FIG. 3 is a plan view of the main part of another embodiment, in which the printed wiring board 1'' has a pair of footprints in the wiring pattern lc (shaded area downward to the right) of the wide-area ground line (or power line). One footprint l of 1a+
a'-1 (shaded portion upward to the right) is provided in an island shape, and the four sides are connected for conduction with a check pattern 1b''.The other footprint la'-2 is a wiring pattern via a check pattern 1b'' provided on one side. Conductive connection to 1d.
このチェック用パターン１ｂ’ は第１図で説明したと
同様に位置ずれ許容範囲を示し線幅は接地するのに（あ
るいは電源の場合、電流容量に見合う）十分な寸法とす
る。このチェック用パターンも第２図と同様に位置ずれ
の判定基準として用い、かつ他の配線パターンへの導通
連接を兼ねて半ＥＨ付は時の広面積の配線パターンへの
放熱を少なくし溶融半田の表面張力のバランスを両電極
間でとって表面実装部品の立ち上がり（マンハッタン現
象）を抑えることができる利点がある。This check pattern 1b' indicates the positional deviation tolerance range as explained in FIG. 1, and the line width is set to a size sufficient for grounding (or in the case of a power supply, commensurate with the current capacity). This check pattern is also used as a criterion for determining positional deviation in the same way as in Figure 2, and it also serves as a conductive connection to other wiring patterns. It has the advantage of being able to suppress the rise of surface-mounted components (Manhattan phenomenon) by balancing the surface tension between both electrodes.
以上、詳述したように本発明によれば、フッ）プリント
にチェック用パターンを付加することにより、目視検査
が容易となり誤判定を少なくし検査作業能率を上げるこ
とができるといった産業土掻めて有用な効果を発揮する
。As described in detail above, according to the present invention, by adding a check pattern to the footprint, visual inspection is facilitated, false judgments are reduced, and inspection work efficiency is increased. exert a useful effect.
要部平面図である。FIG.
図において、 １はプリント配線基板、 １ａはフットプリント、 １ｂはチェック用パターン、 ２は表面実装部品（チップ抵抗器） を示ず。In the figure, 1 is a printed wiring board, 1a is the footprint, 1b is a check pattern, 2 is a surface mount component (chip resistor) Not shown.
第１図は本発明による一実施例の要部平面図、第２図は
第１図に位置ずれ実装した状態を示す要部平面図、
第３図は本発明による他の実施例の要部平面図、第４図
は従来技術による要部平面図、
第５図は第４図に位置ずれ実装した状態を示すプリント
配線基板［
プリント配線基板旦
第 Ｚ
図FIG. 1 is a plan view of a main part of an embodiment according to the present invention, FIG. 2 is a plan view of a main part showing a state in which the position is shifted from that in FIG. 1, and FIG. 3 is a plan view of a main part of another embodiment according to the present invention. 4 is a plan view of the main part according to the prior art, and FIG. 5 is a printed wiring board showing a state where the position is shifted from that shown in FIG. 4.
Claims (1)
を具備するプリント配線基板であって、前記フットプリ
ント（１ａ）の周囲に該フットプリント（１ａ）に実装
する表面実装部品（２）の位置ずれ許容範囲を示すチェ
ック用パターン（１ｂ）を付設することを特徴とするプ
リント配線基板。Footprint (1a) for mounting surface mount components (2)
A printed wiring board comprising: a check pattern (1b) around the footprint (1a) indicating a permissible positional shift range of a surface mount component (2) to be mounted on the footprint (1a); A printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1281368A JPH03141690A (en) | 1989-10-26 | 1989-10-26 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1281368A JPH03141690A (en) | 1989-10-26 | 1989-10-26 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03141690A true JPH03141690A (en) | 1991-06-17 |
Family
ID=17638148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1281368A Pending JPH03141690A (en) | 1989-10-26 | 1989-10-26 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03141690A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0907308A1 (en) * | 1996-05-29 | 1999-04-07 | Rohm Co., Ltd. | Method for mounting terminal on circuit board and circuit board |
| EP0971569A1 (en) * | 1998-06-08 | 2000-01-12 | Ford Motor Company | Enhanced mounting pads for printed circuit boards |
| JP2016018845A (en) * | 2014-07-07 | 2016-02-01 | 三菱電機株式会社 | Wiring board, electric motor, electric apparatus and air conditioner |
-
1989
- 1989-10-26 JP JP1281368A patent/JPH03141690A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0907308A1 (en) * | 1996-05-29 | 1999-04-07 | Rohm Co., Ltd. | Method for mounting terminal on circuit board and circuit board |
| EP0907308A4 (en) * | 1996-05-29 | 2005-03-30 | Rohm Co Ltd | Method for mounting terminal on circuit board and circuit board |
| EP0971569A1 (en) * | 1998-06-08 | 2000-01-12 | Ford Motor Company | Enhanced mounting pads for printed circuit boards |
| JP2016018845A (en) * | 2014-07-07 | 2016-02-01 | 三菱電機株式会社 | Wiring board, electric motor, electric apparatus and air conditioner |
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