EP0839360B1 - Verfahren und Vorrichtung zur Herstelliung eines IC-Kartenmoduls - Google Patents

Verfahren und Vorrichtung zur Herstelliung eines IC-Kartenmoduls Download PDF

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Publication number
EP0839360B1
EP0839360B1 EP96920698A EP96920698A EP0839360B1 EP 0839360 B1 EP0839360 B1 EP 0839360B1 EP 96920698 A EP96920698 A EP 96920698A EP 96920698 A EP96920698 A EP 96920698A EP 0839360 B1 EP0839360 B1 EP 0839360B1
Authority
EP
European Patent Office
Prior art keywords
winding
carrier layer
carrier
coil
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP96920698A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0839360A1 (de
Inventor
David Finn
Manfred Rietzler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7766991&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP0839360(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Individual filed Critical Individual
Publication of EP0839360A1 publication Critical patent/EP0839360A1/de
Application granted granted Critical
Publication of EP0839360B1 publication Critical patent/EP0839360B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07775—Antenna details the antenna being on-chip
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process

Definitions

  • the present invention relates to a method for Manufacture of an IC card module according to the preamble of Claim 1 and an apparatus for producing an IC card module according to claim 4.
  • IC cards for example in cashless payments Find use, generally consist of a so-called "IC card module", with an approximately formed from a film carrier Carrier layer and a transponder unit arranged thereon with a coil acting as an antenna and at least an IC, as well as cover laminate layers applied on both sides, for example as an advertising medium or for Image identification of the card holder.
  • An IC card module is known from EP 0 481 776 A2, which has a coil structure on a film carrier, which next to an IC with other electronic components is.
  • a coil structure on a film carrier, which next to an IC with other electronic components is.
  • an appropriately shaped Metallization for example electrogalvanic or in the etching process, or generate by a winding spool with their winding wire turns applied to the carrier layer becomes.
  • DE, A, 44 10 732 describes a method for producing a IC card module known in which the arrangement of a Wire coil on a thermoplastic carrier layer Laying the wire on the backing with at least the wire is embedded in places in the carrier layer he follows.
  • WO, A, 94/22 111 describes a method for producing a IC card known in which a winding spool between two Material layers arranged and completely in the two Material layers is embedded.
  • the present invention is based on the object an IC card module as well as a method and a device to propose its manufacture, the manufacture an IC card module simplified.
  • This task is accomplished by a method of manufacturing a IC card module with the features of claim 1 and a Device for producing an IC card module with the Features of claim 4 solved.
  • the coil is after Production on a winding tool by means of this Exposure to temperature in the carrier layer pressed in, so that a transfer of the finished wound coil from the winding tool to a separate application device there is no need to apply the coil to the carrier layer and an immediate handover of the winding tool to the Carrier layer is possible.
  • connection of the coil with the winding tool is special easily executable when the coil is on after its manufacture the winding tool by means of a parallel to the coil plane Winding wire system element of the winding tool in the carrier layer is pressed in, and a return movement of a winding core receiving the winding wire system element he follows.
  • the return movement of the winding core can be done by a corresponding Infeed movement of the carrier layer can be effected.
  • the inventive device for producing an IC card module has a heatable winding tool with a Winding core and a winding wire system element arranged thereon as well as a carrier layer pressing device with a receiving plane for flat, based on the winding wire system element parallel arrangement of the support layer, the Carrier layer pressing device against the winding wire contact element or vice versa and the winding core relative to the winding wire contact element are movable.
  • thermoplastic carrier layer damage to the thermoplastic carrier layer to avoid in the case when the return movement of the winding core through the carrier layer or through the one below arranged carrier layer pressing device is effected, can the winding core at least in the region of the carrier layer pressing device facing end face thermally be designed to be insulating.
  • the Winding core is smaller than its cross-sectional area Has end face. This can be done, for example, by a concave formation of the corresponding end of the winding core be achieved so that the end face essentially consists of a circular surface.
  • Both of the above Measures for thermal protection of the carrier layer can of course can also be combined with each other.
  • the carrier layer pressing device provided with a vacuum device is to adhere the backing layer to the receiving plane cause.
  • Protection of the carrier layer against thermal overload can also be achieved in that the carrier layer pressing device made of a material with high thermal conductivity is formed.
  • the transponder unit 12 consists of a winding spool 14 made of winding wire 13, the winding wire ends 18, 19 of which have connection surfaces 16, 17 of an IC 15 are connected.
  • the surface of the carrier layer 11 is plastically deformed in the region of coil turns 21, with adhesion between the coil 14 and the carrier layer 11 made of a thermoplastic material, such as PVC or polycarbonate.
  • the coil turns 21 are practically pressed into the surface of the carrier layer 11 and an adhesive effect is achieved.
  • FIG. 3 shows a highly schematic representation of a winding tool 22 which has a winding core 23 with a winding wire contact element 24 arranged thereon and a counter-holder 25.
  • the winding core 23 thus forms, together with the winding wire contact element 24 and the counter-holder 25, a winding matrix which, by rotating about a winding axis 26 as a result of a corresponding winding movement of the winding wire 13, enables the winding wire coil 14 to be formed.
  • the counter-holder 25 is connected to the winding core 23 in order to enable the orderly formation of the coil turns 21 shown in FIG. 3 .
  • the counterholder 25 can be dispensed with.
  • FIG. 6 illustrates in a top view of the winding wire contact element 24 of the winding tool 22 the formation of the winding coil 14 after the winding process has ended and the possibility of using the winding wire contact element 24 in addition to the formation of the winding coil 14 at the same time for producing the entire transponder unit 12.
  • the winding wire contact element 24 is provided on its circumferential edge 27 with two holding devices 28, 29 which serve for the clamping reception of the winding wire ends 18, 19 before or after the end of the actual winding process.
  • the winding wire end 18 is first guided through the holding device 28 by means of a suitable wire guide, not shown here, and clamped there.
  • the winding spool 14 is formed by rotating the winding tool 22 about the winding axis 26, the winding wire 13 being led out of the wire guide.
  • the second winding wire end 19 is finally clamped by passing the wire guide through the second holding device 29, so that the configuration shown in FIG. 6 is established.
  • a receiving device is located in the winding wire contact element 24 30 for receiving the IC 15, such that the pads 16, 17 of the IC 15 in an overlap position the winding wire ends 18, 19 are located.
  • the IC 15 can either inserted into the winding wire system element 24 before the winding process or after the wrapping process from behind through the approximately receiving device 30 designed as a through opening with its connecting surfaces 16, 17 against the winding wire ends 18 or 19 are pushed.
  • Connection tool can then connect the Winding wire ends 18, 19 with the pads 16, 17 and cutting the winding wire ends 18, 19 between the connection surfaces 16, 17 and the holding devices 28, 29 take place.
  • the transponder unit 12 formed from the winding coil 14 and the IC 15 can then, as shown in FIG. 4 , optionally after removal of the counter-holder 25, in the application configuration of the winding tool 22 on the carrier layer 11, which can be located on a receiving plane 31 of a carrier layer pressing device 32 are applied.
  • the carrier layer 11 which can be formed as an endless film passing the carrier layer pressing device 32 or as a sheet with IC card dimensions, is by means of the carrier layer pressing device 32, as indicated by the arrow 33 in FIG. 4 , with the winding coil 14 or the transponder unit interposed 12 pressed against the winding wire contact element 24.
  • the winding wire contact element 24 or the winding wire 13 can be heated in order to enable the plastic deformation of the surface of the carrier layer 11, as shown in FIG. 2 , under the action of pressure and temperature.
  • FIG. 5 also shows, as shown in FIG. 2 , how the coil turns 21 of the winding coil 14 are at least partially pressed into the surface of the carrier layer 11 during coil application.
  • the pressing movement (arrow 33) of the carrier layer pressing device 32 results in a return movement (arrow 34) of the winding core 23, which is movable relative to the winding wire contact element 24.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
EP96920698A 1995-07-17 1996-06-26 Verfahren und Vorrichtung zur Herstelliung eines IC-Kartenmoduls Expired - Lifetime EP0839360B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19525933A DE19525933C5 (de) 1995-07-17 1995-07-17 Verfahren und Vorrichtung zur Einbettung einer Spule in das Trägersubstrat einer IC-Karte
DE19525933 1995-07-17
PCT/DE1996/001121 WO1997004415A1 (de) 1995-07-17 1996-06-26 Ic-kartenmodul sowie verfahren und vorrichtung zu dessen herstellung

Publications (2)

Publication Number Publication Date
EP0839360A1 EP0839360A1 (de) 1998-05-06
EP0839360B1 true EP0839360B1 (de) 2003-08-20

Family

ID=7766991

Family Applications (1)

Application Number Title Priority Date Filing Date
EP96920698A Expired - Lifetime EP0839360B1 (de) 1995-07-17 1996-06-26 Verfahren und Vorrichtung zur Herstelliung eines IC-Kartenmoduls

Country Status (9)

Country Link
EP (1) EP0839360B1 (es)
JP (1) JPH11515120A (es)
CN (1) CN1098507C (es)
AT (1) ATE247853T1 (es)
AU (1) AU720773B2 (es)
CA (1) CA2227148A1 (es)
DE (2) DE19525933C5 (es)
ES (1) ES2202451T3 (es)
WO (1) WO1997004415A1 (es)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8413316B2 (en) 2007-09-18 2013-04-09 Hid Global Ireland Teoranta Method for bonding a wire conductor laid on a substrate

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DE19751043C2 (de) * 1997-11-18 2001-11-08 David Finn Gehäuste Transponderanordnung
DE19811577A1 (de) * 1998-03-17 1999-09-23 Siemens Ag Chipkarte mit Wickelspule
DE19813165A1 (de) 1998-03-25 1999-10-07 Kopp Werkzeugmasch Gmbh Verfahren und Vorrichtung zur spanenden Bearbeitung unrunder Innen- und Außenkonturen
DE19915765C2 (de) * 1999-04-08 2001-06-21 Cubit Electronics Gmbh Kontaktloser Transponder und Verfahren zu seiner Herstellung
DE19920399C1 (de) * 1999-05-04 2001-01-25 Cubit Electronics Gmbh Verfahren und Vorrichtung zur Herstellung von Leiterdrähten auf oder in einer elektrisch isolierenden Schicht
DE19962221A1 (de) * 1999-10-01 2001-05-23 Glatt Process Technology Gmbh Dispersionen für Depotapplikationen
US6628240B2 (en) * 2000-11-08 2003-09-30 American Pacific Technology Method and apparatus for rapid staking of antennae in smart card manufacture
DE10195846D2 (de) * 2001-01-15 2003-12-11 Cubit Electronics Gmbh Verfahren und Vorrichtung zum Anbringen von Leiterdrähten auf oder in einer Trageschicht
FR2820548A1 (fr) * 2001-02-02 2002-08-09 Schlumberger Systems & Service Objet portatif a puce et a antenne, module destine a former un objet portatif a puce et a antenne et leurs procedes de fabrication
DE10109030C2 (de) * 2001-02-24 2003-11-13 Cubit Electronics Gmbh Kontaktloser Transponder
JP4755360B2 (ja) * 2001-05-16 2011-08-24 日立マクセル株式会社 コイルの巻線装置、ｉｃチップとコイルの接続装置、フレキシブルｉｃモジュールの製造装置及び情報担体の製造装置
DE10160390A1 (de) * 2001-12-10 2003-06-18 Cubit Electronics Gmbh Spulenanordnung und Verfahren zu ihrer Herstellung
DE102004027787A1 (de) * 2004-06-08 2006-01-05 Infineon Technologies Ag Halbleiterbauteile mit Kunststoffgehäuse und Verfahren zur Herstellung derselben
DE102006030819A1 (de) 2006-06-30 2008-01-03 Smartrac Technology Ltd. Chipkarte und Verfahren zur Herstellung einer Chipkarte
US8608080B2 (en) 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US7546671B2 (en) 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
US7979975B2 (en) 2007-04-10 2011-07-19 Feinics Amatech Teavanta Methods of connecting an antenna to a transponder chip
US7581308B2 (en) 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip
US8322624B2 (en) 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US7980477B2 (en) 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
IL184260A0 (en) 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
US8028923B2 (en) 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
US8613132B2 (en) 2009-11-09 2013-12-24 Feinics Amatech Teoranta Transferring an antenna to an RFID inlay substrate
KR20130108068A (ko) 2010-05-04 2013-10-02 페이닉스 아마테크 테오란타 Ｒｆｉｄ 인레이의 제조
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
JP5672991B2 (ja) * 2010-11-09 2015-02-18 凸版印刷株式会社 非接触通信媒体の製造方法
EP3086208B1 (en) 2015-04-24 2019-03-06 Nxp B.V. Smart card with touch-based interface
CN105304320B (zh) * 2015-10-21 2018-04-13 深圳市有钢机电设备有限公司 绕线机、无线充电线圈及其制作工艺

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JPH04152191A (ja) * 1990-10-17 1992-05-26 Mitsubishi Electric Corp Ｔａｂ基板及びそれを用いた非接触ｉｃカード
FI89752C (fi) * 1992-04-01 1993-11-10 Picopak Oy Foerfarande foer anslutning av en mikrokrets till en induktiv spole i ett smartkort samt anordning vid ett induktivt smartkort
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CH688696A5 (fr) * 1993-03-17 1998-01-15 François Droz Procédé de fabrication d'une carte comprenant au moins un élément électronique.
DE4311493C2 (de) * 1993-04-07 2000-04-06 Amatech Advanced Micromechanic IC-Kartenmodul zur Herstellung einer IC-Karte
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DE4410732C2 (de) * 1994-03-28 1997-05-07 Amatech Gmbh & Co Kg Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit
DE4421607A1 (de) * 1994-06-21 1996-01-04 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8413316B2 (en) 2007-09-18 2013-04-09 Hid Global Ireland Teoranta Method for bonding a wire conductor laid on a substrate

Also Published As

Publication number Publication date
EP0839360A1 (de) 1998-05-06
DE19525933C2 (de) 1997-06-19
JPH11515120A (ja) 1999-12-21
CN1098507C (zh) 2003-01-08
CN1191029A (zh) 1998-08-19
ES2202451T3 (es) 2004-04-01
ATE247853T1 (de) 2003-09-15
CA2227148A1 (en) 1997-02-06
AU6187396A (en) 1997-02-18
DE19525933A1 (de) 1997-01-23
DE19525933C5 (de) 2004-02-19
DE59610675D1 (de) 2003-09-25
AU720773B2 (en) 2000-06-08
WO1997004415A1 (de) 1997-02-06

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