EP0791227A4 - Formen einer ebenen oberfläche über einem substrat durch modifizierung der topographie des substrats - Google Patents
Formen einer ebenen oberfläche über einem substrat durch modifizierung der topographie des substratsInfo
- Publication number
- EP0791227A4 EP0791227A4 EP95940684A EP95940684A EP0791227A4 EP 0791227 A4 EP0791227 A4 EP 0791227A4 EP 95940684 A EP95940684 A EP 95940684A EP 95940684 A EP95940684 A EP 95940684A EP 0791227 A4 EP0791227 A4 EP 0791227A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- topography
- modifying
- forming
- planar surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
- B26D7/088—Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/002—Precutting and tensioning or breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/08—Label feeding
- B65C9/18—Label feeding from strips, e.g. from rolls
- B65C9/1896—Label feeding from strips, e.g. from rolls the labels being torn or burst from a strip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
- B65H35/10—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with devices for breaking partially-cut or perforated webs, e.g. bursters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76229—Concurrent filling of a plurality of trenches having a different trench shape or dimension, e.g. rectangular and V-shaped trenches, wide and narrow trenches, shallow and deep trenches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Element Separation (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US337000 | 1989-04-12 | ||
US33700094A | 1994-11-10 | 1994-11-10 | |
PCT/US1995/014681 WO1996015552A1 (en) | 1994-11-10 | 1995-11-13 | Forming a planar surface over a substrate by modifying the topography of the substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0791227A1 EP0791227A1 (de) | 1997-08-27 |
EP0791227A4 true EP0791227A4 (de) | 1998-04-01 |
Family
ID=23318670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP95940684A Withdrawn EP0791227A4 (de) | 1994-11-10 | 1995-11-13 | Formen einer ebenen oberfläche über einem substrat durch modifizierung der topographie des substrats |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0791227A4 (de) |
JP (1) | JPH10512098A (de) |
KR (1) | KR970707582A (de) |
CN (1) | CN1171166A (de) |
AU (1) | AU4235196A (de) |
TW (1) | TW299458B (de) |
WO (1) | WO1996015552A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5665633A (en) * | 1995-04-06 | 1997-09-09 | Motorola, Inc. | Process for forming a semiconductor device having field isolation |
US5885856A (en) * | 1996-08-21 | 1999-03-23 | Motorola, Inc. | Integrated circuit having a dummy structure and method of making |
DE19703611A1 (de) * | 1997-01-31 | 1998-08-06 | Siemens Ag | Anwendungsspezifisches integriertes Halbleiterprodukt mit Dummy-Elementen |
JP3638778B2 (ja) | 1997-03-31 | 2005-04-13 | 株式会社ルネサステクノロジ | 半導体集積回路装置およびその製造方法 |
JP5600280B2 (ja) * | 1997-03-31 | 2014-10-01 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
JP2006128709A (ja) * | 1997-03-31 | 2006-05-18 | Renesas Technology Corp | 半導体集積回路装置およびその製造方法 |
EP0939432A1 (de) * | 1998-02-17 | 1999-09-01 | Siemens Aktiengesellschaft | Verfahren zum Entwurf einer Maske zur Herstellung eines Dummygebiets in einem Isolationsgrabengebiet zwischen elektrisch aktiven Gebieten einer mikroelektronischen Vorrichtung |
JP2000124305A (ja) | 1998-10-15 | 2000-04-28 | Mitsubishi Electric Corp | 半導体装置 |
JP2000340529A (ja) * | 1999-05-31 | 2000-12-08 | Mitsubishi Electric Corp | 半導体装置 |
US6396158B1 (en) | 1999-06-29 | 2002-05-28 | Motorola Inc. | Semiconductor device and a process for designing a mask |
JP4307664B2 (ja) | 1999-12-03 | 2009-08-05 | 株式会社ルネサステクノロジ | 半導体装置 |
US6459156B1 (en) | 1999-12-22 | 2002-10-01 | Motorola, Inc. | Semiconductor device, a process for a semiconductor device, and a process for making a masking database |
JP4767390B2 (ja) * | 2000-05-19 | 2011-09-07 | エルピーダメモリ株式会社 | Dram |
US6614062B2 (en) * | 2001-01-17 | 2003-09-02 | Motorola, Inc. | Semiconductor tiling structure and method of formation |
US6611045B2 (en) | 2001-06-04 | 2003-08-26 | Motorola, Inc. | Method of forming an integrated circuit device using dummy features and structure thereof |
US6989229B2 (en) | 2003-03-27 | 2006-01-24 | Freescale Semiconductor, Inc. | Non-resolving mask tiling method for flare reduction |
JP4987254B2 (ja) | 2005-06-22 | 2012-07-25 | 株式会社東芝 | 半導体装置の製造方法 |
FR2923914B1 (fr) * | 2007-11-21 | 2010-01-08 | Commissariat Energie Atomique | Dispositif pour mesures d'epaisseur et de resistivite carree de lignes d'interconnexions |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6392042A (ja) * | 1986-10-06 | 1988-04-22 | Nec Corp | 半導体装置の製造方法 |
JPH0382053A (ja) * | 1989-08-24 | 1991-04-08 | Nec Corp | 半導体装置 |
EP0545263A2 (de) * | 1991-11-29 | 1993-06-09 | Sony Corporation | Verfahren zur Herstellung einer Isolationsprobe mittels einer Polierschritt |
JPH05258017A (ja) * | 1992-03-11 | 1993-10-08 | Fujitsu Ltd | 半導体集積回路装置及び半導体集積回路装置の配線レイアウト方法 |
US5278105A (en) * | 1992-08-19 | 1994-01-11 | Intel Corporation | Semiconductor device with dummy features in active layers |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59186342A (ja) * | 1983-04-06 | 1984-10-23 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JPS6015944A (ja) * | 1983-07-08 | 1985-01-26 | Hitachi Ltd | 半導体装置 |
JPS63240045A (ja) * | 1987-03-27 | 1988-10-05 | Matsushita Electric Ind Co Ltd | 半導体装置 |
US5225358A (en) * | 1991-06-06 | 1993-07-06 | Lsi Logic Corporation | Method of forming late isolation with polishing |
US5229316A (en) * | 1992-04-16 | 1993-07-20 | Micron Technology, Inc. | Semiconductor processing method for forming substrate isolation trenches |
US5265378A (en) * | 1992-07-10 | 1993-11-30 | Lsi Logic Corporation | Detecting the endpoint of chem-mech polishing and resulting semiconductor device |
-
1995
- 1995-10-20 TW TW084111123A patent/TW299458B/zh active
- 1995-11-13 KR KR1019970703143A patent/KR970707582A/ko not_active Application Discontinuation
- 1995-11-13 WO PCT/US1995/014681 patent/WO1996015552A1/en not_active Application Discontinuation
- 1995-11-13 JP JP8516234A patent/JPH10512098A/ja active Pending
- 1995-11-13 AU AU42351/96A patent/AU4235196A/en not_active Abandoned
- 1995-11-13 CN CN95197102A patent/CN1171166A/zh active Pending
- 1995-11-13 EP EP95940684A patent/EP0791227A4/de not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6392042A (ja) * | 1986-10-06 | 1988-04-22 | Nec Corp | 半導体装置の製造方法 |
JPH0382053A (ja) * | 1989-08-24 | 1991-04-08 | Nec Corp | 半導体装置 |
EP0545263A2 (de) * | 1991-11-29 | 1993-06-09 | Sony Corporation | Verfahren zur Herstellung einer Isolationsprobe mittels einer Polierschritt |
JPH05258017A (ja) * | 1992-03-11 | 1993-10-08 | Fujitsu Ltd | 半導体集積回路装置及び半導体集積回路装置の配線レイアウト方法 |
US5278105A (en) * | 1992-08-19 | 1994-01-11 | Intel Corporation | Semiconductor device with dummy features in active layers |
Non-Patent Citations (4)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 012, no. 328 (E - 654) 6 September 1988 (1988-09-06) * |
PATENT ABSTRACTS OF JAPAN vol. 015, no. 254 (E - 1083) 27 June 1991 (1991-06-27) * |
PATENT ABSTRACTS OF JAPAN vol. 018, no. 024 (P - 1675) 14 January 1994 (1994-01-14) * |
See also references of WO9615552A1 * |
Also Published As
Publication number | Publication date |
---|---|
KR970707582A (ko) | 1997-12-01 |
CN1171166A (zh) | 1998-01-21 |
AU4235196A (en) | 1996-06-06 |
TW299458B (de) | 1997-03-01 |
JPH10512098A (ja) | 1998-11-17 |
EP0791227A1 (de) | 1997-08-27 |
WO1996015552A1 (en) | 1996-05-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0791227A4 (de) | Formen einer ebenen oberfläche über einem substrat durch modifizierung der topographie des substrats | |
GB2326191B (en) | Surface fastener | |
AU4242393A (en) | Method of enhancing the visibility of diffraction pattern surface embossment | |
TW325656U (en) | Mold making surface fastener | |
GB9310820D0 (en) | Surface modification | |
TW365118U (en) | Apparatus for manufacturing surface fastener | |
AU6355996A (en) | Surface pattern | |
TW312917U (en) | Surface fastener | |
GR3026689T3 (en) | Process for the galvanic application of a surface coating | |
EP0598230A3 (en) | Method of cleaning the surface of a silicon substrate. | |
HK1028619A1 (en) | Process for the preparation of a polyamide-polyurethane micro-blend | |
PL337830A1 (en) | Surface coating material | |
GB9625363D0 (en) | Method for planarizing the surface of a wafer | |
GB9414145D0 (en) | Forming a layer | |
GB2295842B (en) | Temporary vehicle-bearing surface | |
EP0460901A3 (en) | Surfacing a convex substrate | |
GB9321283D0 (en) | Actuators for operating below the surface of a liquid | |
GB2341813B (en) | Surface modifying process | |
GB8922629D0 (en) | Method of modifying the surface of a substrate | |
USD367717S (en) | Resilient tile | |
GB9505779D0 (en) | Surface box | |
GB9704001D0 (en) | Quantifying the playability of a surface | |
AU5854090A (en) | Forming fabric having a nonwoven surface coating | |
GB9401873D0 (en) | Method of forming a reproduction of the topography of a given surface | |
GB9202745D0 (en) | Forming a layer |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 19970602 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR GB IT |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 19980213 |
|
AK | Designated contracting states |
Kind code of ref document: A4 Designated state(s): DE FR GB IT |
|
18W | Application withdrawn |
Withdrawal date: 19980216 |