EP0396098A2 - Method of manufacturing base of electromagnetic relay - Google Patents

Method of manufacturing base of electromagnetic relay Download PDF

Info

Publication number
EP0396098A2
EP0396098A2 EP19900108259 EP90108259A EP0396098A2 EP 0396098 A2 EP0396098 A2 EP 0396098A2 EP 19900108259 EP19900108259 EP 19900108259 EP 90108259 A EP90108259 A EP 90108259A EP 0396098 A2 EP0396098 A2 EP 0396098A2
Authority
EP
European Patent Office
Prior art keywords
terminal portion
base
electromagnetic relay
molded item
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19900108259
Other languages
German (de)
English (en)
French (fr)
Inventor
Katsumi Kawashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Publication of EP0396098A2 publication Critical patent/EP0396098A2/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/023—Details concerning sealing, e.g. sealing casing with resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H49/00—Apparatus or processes specially adapted to the manufacture of relays or parts thereof

Definitions

  • the present invention relates to a method of manufacturing a base of an electromagnetic relay.
  • the terminals are press fitted into holes formed on the base or are integrally molded with the base so as to be fixed to the base.
  • an essential object of the present invention is to provide, with a view to eliminating the above mentioned disadvantages inherent in the conventional electromagnetic relays, a method of manufacturing a base of an electromagnetic relay.
  • a method of manufacturing a base of an electro­magnetic relay comprises the step of: treating a surface of a resinous molded item to a state enabling plating on the surface of the resinous molded item such that the resinous molded item has an upper terminal portion, a lower terminal portion and a side terminal portion connecting the upper terminal portion and the lower terminal portion; molding integrally with the resinous molded item, resin disabling plating thereon such that at least surfaces of the upper terminal portion, the lower terminal portion and the side terminal portion are exposed outwardly; and plating an electrically conductive film on only the surfaces of the upper terminal portion, the lower terminal portion and the side terminal portion.
  • an outer member 1 of an electromagnetic relay manufactured by a method according to a first embodiment of the present invention is constituted by a cover 2 and a base 3.
  • the cover 2 is made of electrically nonconductive resin.
  • the base 3 is constituted by a terminal frame 4 and a base body 6.
  • the terminal frame 4 includes a plurality of terminal supports 5 which are integrally coupled with each other.
  • liquid crystal polymer having excellent plating characteristics for example, "VECTRA C810" (name used in trade and manufactured by POLY PLASTICS CO, LTD of Japan) is integrally molded in a mold.
  • a molded item taken out of the mold is subjected to various treatment processes such as degreasing by degreaser of surface-active agent, etching by aqueous solution of potassium hydroxide, catalytic treatment by palladium series colloidal catalyst, etc., whereby it becomes possible to plate on surface of the molded item.
  • resin having ordinary heat resistance and disabling plating thereon for example, "VECTRA C130" (name used in trade and manufactured by POLY PLASTICS CO, LTD of Japan) is molded integrally with the surface treated terminal frame 4 so as to form the base body 6 integrally with the terminal frame 4.
  • This integral molding is performed such that only an upper face 5a, an outer side face 5b and a lower face 5c of each of the terminal supports 5 are exposed outwardly.
  • the terminal frame 4 having the base body 6 attached thereto is dipped in electroless copper plating solution such that an electrically conductive film is formed only on the exposed upper face 5a, outer side face 5b and lower face 5c of each of the terminal supports 5.
  • the electrically conductive film formed on the upper face 5a, the outer side face 5b and the lower face 5c of each of the terminal supports acts as a terminal.
  • inner electric parts of the electromagnetic relay are disposed at predetermined positions of the base body 6 and electric connectors such as an electromagnetic coil, a contact member, etc. are electrically connected to the electrically conductive film on the upper face 5a.
  • the base 3 having the inner electric parts mounted thereon is covered by the cover 2 and contact portions between the base 3 and the cover 2 are sealed by sealing compound (not shown) such that inner space of the cover 2 is filled with the sealing compound.
  • the electromagnetic relay is placed on a substrate and the electrically conductive film on the lower face 5c of the base 3 is connected to electric connec­tors on the substrate by using electrically conductive bonding agent or by soldering.
  • soldering even if heat of molten solder is transferred to the electri­cally conductive film so as to fuse the sealing compound held in contact with the electrically conductive film, the cover 2 and the base 3 are held immovably through contact of the base body 6 of the base 3 with the cover 2 and thus, sealing of the sealing compound is not disrupted.
  • Figs. 3 to 6 show an electromagnetic relay manu­factured by a method according to a second embodiment of the present invention.
  • the electromagnetic relay includes a base 13, a terminal frame 14 and a plurality of terminal supports 15 each having an upper face 15a, an outer side face 15b and a lower face 15c and a base body 16.
  • a recess 17 is formed on the upper face 15a.
  • a connecting portion of an inner electric part is press fitted into the recess 17 so as to be electrically connected to the electrically conductive film on the upper face 15a. Since other constructions of the electromagnetic relay of Figs. 3 to 6 are similar to those of the electromagnetic relay of Figs. 1 and 2, description thereof is abbreviated for the sake of brevity.
  • the sealed electromagnetic relay can preserve satisfactory performance for a long period.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Switches (AREA)
  • Switch Cases, Indication, And Locking (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
EP19900108259 1989-05-02 1990-04-30 Method of manufacturing base of electromagnetic relay Withdrawn EP0396098A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP113226/89 1989-05-02
JP1113226A JP2781890B2 (ja) 1989-05-02 1989-05-02 電磁継電器のベースの製造方法

Publications (1)

Publication Number Publication Date
EP0396098A2 true EP0396098A2 (en) 1990-11-07

Family

ID=14606764

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19900108259 Withdrawn EP0396098A2 (en) 1989-05-02 1990-04-30 Method of manufacturing base of electromagnetic relay

Country Status (2)

Country Link
EP (1) EP0396098A2 (ja)
JP (1) JP2781890B2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2284566A (en) * 1993-12-09 1995-06-14 Methode Electronics Inc Printed polymer circuits and contacts
WO2000068963A1 (de) * 1999-05-07 2000-11-16 Tyco Electronics Logistics Ag Elektromagnetisches relais und verfahren zu dessen herstellung

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2284566A (en) * 1993-12-09 1995-06-14 Methode Electronics Inc Printed polymer circuits and contacts
FR2713830A1 (fr) * 1993-12-09 1995-06-16 Methode Electronics Inc Composant conducteur pour transporter des signaux électriques et procédé pour la réalisation d'un tel composant.
US5599595A (en) * 1993-12-09 1997-02-04 Methode Electronics, Inc. Printed plastic circuits and contacts and method for making same
GB2284566B (en) * 1993-12-09 1998-05-06 Methode Electronics Inc Printed plastic circuits and contacts and method for making the same
WO2000068963A1 (de) * 1999-05-07 2000-11-16 Tyco Electronics Logistics Ag Elektromagnetisches relais und verfahren zu dessen herstellung

Also Published As

Publication number Publication date
JPH02291625A (ja) 1990-12-03
JP2781890B2 (ja) 1998-07-30

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 19900525

AK Designated contracting states

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Effective date: 19910405