EP0374505A3 - Metallizing process - Google Patents

Metallizing process Download PDF

Info

Publication number
EP0374505A3
EP0374505A3 EP89121600A EP89121600A EP0374505A3 EP 0374505 A3 EP0374505 A3 EP 0374505A3 EP 89121600 A EP89121600 A EP 89121600A EP 89121600 A EP89121600 A EP 89121600A EP 0374505 A3 EP0374505 A3 EP 0374505A3
Authority
EP
European Patent Office
Prior art keywords
metallizing process
metallizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP89121600A
Other languages
German (de)
Other versions
EP0374505B1 (en
EP0374505A2 (en
Inventor
Hilmar Dr. Esrom
Ulrich Dr. Kogelschatz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heraeus Noblelight GmbH
Original Assignee
ASEA BROWN BOVERI AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASEA BROWN BOVERI AG filed Critical ASEA BROWN BOVERI AG
Publication of EP0374505A2 publication Critical patent/EP0374505A2/en
Publication of EP0374505A3 publication Critical patent/EP0374505A3/en
Application granted granted Critical
Publication of EP0374505B1 publication Critical patent/EP0374505B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
EP89121600A 1988-11-29 1989-11-23 Metallizing process Expired - Lifetime EP0374505B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3840199 1988-11-29
DE3840199A DE3840199C2 (en) 1988-11-29 1988-11-29 Process for structuring metal layers that are catalytically active in electroless metallization by means of UV radiation

Publications (3)

Publication Number Publication Date
EP0374505A2 EP0374505A2 (en) 1990-06-27
EP0374505A3 true EP0374505A3 (en) 1990-07-04
EP0374505B1 EP0374505B1 (en) 1994-04-06

Family

ID=6368086

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89121600A Expired - Lifetime EP0374505B1 (en) 1988-11-29 1989-11-23 Metallizing process

Country Status (3)

Country Link
EP (1) EP0374505B1 (en)
JP (1) JPH03122287A (en)
DE (2) DE3840199C2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4035080A1 (en) * 1990-11-05 1992-05-07 Abb Patent Gmbh METHOD AND DEVICE FOR PRODUCING PARTIAL METAL LAYERS
JP3259310B2 (en) 1992-02-25 2002-02-25 株式会社デンソー Plating method and tubular coil obtained by this plating method
JP3153682B2 (en) * 1993-08-26 2001-04-09 松下電工株式会社 Circuit board manufacturing method
US6602653B1 (en) 2000-08-25 2003-08-05 Micron Technology, Inc. Conductive material patterning methods
US6451685B1 (en) 2001-02-05 2002-09-17 Micron Technology, Inc. Method for multilevel copper interconnects for ultra large scale integration
KR101507769B1 (en) 2013-10-10 2015-04-07 경기대학교 산학협력단 Reduction Method of Oxide and Apparatus for Reducing Oxide Using the Same
CN110091069B (en) * 2019-04-09 2021-09-24 大族激光科技产业集团股份有限公司 Laser deplating method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2070647A (en) * 1980-03-03 1981-09-09 Schering Ag Selective chemical deposition and/or electrodeposition of metal coatings, especially for the production of printed circuits
US4304849A (en) * 1980-05-16 1981-12-08 Western Electric Co., Inc. Methods of depositing metallic copper on substrates

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993491A (en) * 1973-12-07 1976-11-23 Surface Technology, Inc. Electroless plating
US4241105A (en) * 1979-12-17 1980-12-23 Western Electric Company, Inc. Method of plating the surface of a substrate
US4410569A (en) * 1980-06-13 1983-10-18 Minnesota Mining And Manufacturing Company Palladium (II) bis(hexafluoroacetylacetonate), adducts derived therefrom and uses thereof
DE3337856A1 (en) * 1983-10-18 1985-04-25 Bayer Ag, 5090 Leverkusen METHOD FOR ACTIVATING SUBSTRATES FOR CURRENT METALIZATION
EP0167326B1 (en) * 1984-06-29 1989-11-15 Hitachi Chemical Co., Ltd. Sensitizing agent for electroless plating and method for sensitizing substrate with the agent
DE58907207D1 (en) * 1988-07-02 1994-04-21 Heraeus Noblelight Gmbh Process for the production of metallic layers.

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2070647A (en) * 1980-03-03 1981-09-09 Schering Ag Selective chemical deposition and/or electrodeposition of metal coatings, especially for the production of printed circuits
US4304849A (en) * 1980-05-16 1981-12-08 Western Electric Co., Inc. Methods of depositing metallic copper on substrates

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, Band 123, Nr. 3, 1976, Seiten 348-351; B.K.W. BAYLIS et al.: "Tin (IV) chloride solution as a sensitizer in photoselective metal deposition" *

Also Published As

Publication number Publication date
DE58907402D1 (en) 1994-05-11
DE3840199C2 (en) 1994-12-01
DE3840199A1 (en) 1990-05-31
JPH03122287A (en) 1991-05-24
EP0374505B1 (en) 1994-04-06
EP0374505A2 (en) 1990-06-27

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