EP0355862A1 - Ink jet printer - Google Patents
Ink jet printer Download PDFInfo
- Publication number
- EP0355862A1 EP0355862A1 EP89117232A EP89117232A EP0355862A1 EP 0355862 A1 EP0355862 A1 EP 0355862A1 EP 89117232 A EP89117232 A EP 89117232A EP 89117232 A EP89117232 A EP 89117232A EP 0355862 A1 EP0355862 A1 EP 0355862A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- channel
- nozzle
- liquid
- nozzle member
- meniscus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims abstract description 52
- 230000005499 meniscus Effects 0.000 claims abstract description 31
- 230000005684 electric field Effects 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 27
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 7
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 5
- 230000001846 repelling effect Effects 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 229910001506 inorganic fluoride Inorganic materials 0.000 claims description 2
- 239000002245 particle Substances 0.000 abstract description 4
- 238000009826 distribution Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 32
- 239000011521 glass Substances 0.000 description 27
- 238000000034 method Methods 0.000 description 27
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 22
- 238000005530 etching Methods 0.000 description 21
- 229920002120 photoresistant polymer Polymers 0.000 description 21
- 230000008569 process Effects 0.000 description 16
- 230000005855 radiation Effects 0.000 description 9
- 239000006089 photosensitive glass Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- -1 polytetrafluoroethylene Polymers 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- PYVHTIWHNXTVPF-UHFFFAOYSA-N F.F.F.F.C=C Chemical compound F.F.F.F.C=C PYVHTIWHNXTVPF-UHFFFAOYSA-N 0.000 description 2
- 229910008656 Li2O—SiO2 Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000002301 combined effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000108 silver(I,III) oxide Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920001780 ECTFE Polymers 0.000 description 1
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 238000010000 carbonizing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- QLOAVXSYZAJECW-UHFFFAOYSA-N methane;molecular fluorine Chemical compound C.FF QLOAVXSYZAJECW-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920009441 perflouroethylene propylene Polymers 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1606—Coating the nozzle area or the ink chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/02—Air-assisted ejection
Definitions
- the present invention relates generally to ink jet printers, and more specifically to an ink jet print head of the type wherein liquid is discharged through axially aligned rear and front channels under the combined effects of electric field and air pressure gradients
- An ink jet print head of the type as shown and described in United States Patent 4,403,234 comprises a front nozzle member secured to a housing to define a laminar airflow chamber.
- the housing is formed with a rear channel axially aligned with a front channel provided in the front nozzle member.
- the rear channel is connected by an electrically conductive pipe to a liquid supply to create a meniscus at the exit end of the rear channel.
- the conductive pipe is connected to a signal source to charge the liquid in the rear channel with respect to the front channel so that an electric field gradient is established between the meniscus and the front channel.
- the airflow chamber is connected to a pressurized air supply to produce an air pressure gradient between the exit ends of the rear and front channels. Owing to the combined effects of the field and pressure gradients, the meniscus is pulled forward and ejected through the front channel to a writing surface.
- the meniscus is very sensitive to disturbance generated when the print head scans across the writing surface and becomes unstable when it returns to the original shape after ejection of a droplet.
- Patents Abstracts of Japan, Vol. 9, No. 57 shows an ink jet printer of the type concerned in the present application where an air supply is turned sharply prior to passage through an outlet and an electric field is in use applied in the region where the ink drop meniscus is formed.
- EP-A-109755 is concerned with manufacture of a nozzle for an ink jet printing head using etching techniques.
- an ink jet printer comprising a source of pressurized air, a liquid container, an ink jet print head comprising a front nozzle member with a front channel, a housing secured to said front nozzle member, a rear nozzle member having a forwardly projecting nozzle substantially corresponding in radial dimensions to said front channel and defining with said housing a liquid chamber which is connected to said container and further defining with said front nozzle member a laminar airflow chamber, said rear nozzle member having a rear channel extending forwardly from the liquid chamber in axial alignment with said front channel to form a meniscus at the front end thereof, said airflow chamber being connected to said air source for directing air to a point between said front and rear channels so that it makes a sharp turn at the entry into said front channel creating a sharp pressure gradient along a path between the exit ends of said front and rear channels and a dead air region adjacent the exit end of said rear channel, an annular electrode attached to the front surface of said front nozzle member, means for applying an electric
- the nozzle member can be made by a method involving the steps of:
- the formation of the dead air region in the nozzle of the printer of the invention causes the meniscus to convex, producing a high concentration of electric field and reducing the minimum voltage required to tear it apart into a droplet.
- the two-step etching process is advantageous in reducing the time taken to produce the projecting nozzle since it minimizes deviations in nozzle-opening size which might occur as a result of the tendency of the substrate material to erode sideways on a single substrate.
- the bore at the rear of the nozzle opening can be appropriately dimensioned so that its transverse cross-section is larger than that of the nozzle opening and hence to reduce the resistance it offers to liquid passing therethrough.
- the print head 1 comprises a front nozzle panel 2 having a front channel 3.
- the front nozzle plate 2 is formed of insulative material and secured to a rear housing 4 of insulative material.
- the rear housing is formed with a liquid chamber 5 to hold ink therein supplied from an ink container 6 through electrically conductive pipe 6a.
- the liquid chamber 5 is defined at the front with a rear nozzle plate 7 having a projecting nozzle 8.
- a rear channel 9 extends from the liquid chamber 5 through the projecting nozzle 8 in axial alignment with the front channel 3 to allow ink in liquid chamber 5 to lead therethrough to form a meniscus at the extreme end.
- Front nozzle plate 2 defines with rear nozzle plate 7 a disc-like, laminar airflow chamber 10a of an air chamber 10 and defines with rear housing 4 an annular portion 10b.
- a ring electrode 11 encircling the front channel 3 is secured to the outer surface of front nozzle plate 2.
- a voltage is applied across electrode 11 and pipe 6a from a signal source 12 to establish an electric field gradient between electrode 11 and the liquid in rear channel 9.
- a pressurized air supply source 13 is connected by a pipe 14 to the air chamber 10 to generate an airflow in the annular air chamber portion 10b to cause it to spiral in a laminar flow through the disk-like chamber portion 10a to front channel 3 and thence to the outside.
- the airstream makes a sharp turn at the entry to front channel 3 creating a sharp pressure gradient along a path between the front ends of rear channel 9 and front channel 3.
- Pressurized air is also supplied through a regulator valve 15 to the ink container 6. Valve 15 is adjusted so that in the absence of a voltage on electrode 11 the liquid pressure in rear channel 9 is statically balanced with the combined forces of air pressure acting on the meniscus and its surface tension.
- the liquid in rear channel 9 is electrostatically charged and pulled forward under the influence of electric field gradient.
- the liquid is elongated into a pencil-like shape under the pressure of air ejected through the front channel 3 and ejected to a writing surface.
- the projecting nozzle 8 has an outer diameter slightly smaller than the diameter of front channel 3 and extends forward from the nozzle plate 7 by a distance B. Airstream is narrowed as it passes through the space between the front and rear channels and creates a dead air region immediately adjacent the front end of rear channel 9.
- the liquid in rear channel 9 wets the front surface of the nozzle 8 and tends to disperse outward. However, further dispersion of the liquid beyond the outer edge of rear nozzle 8 is prevented by a force exerted thereupon by the airstream moving past that outer edge, causing the liquid to slightly bulge forward.
- the high pressure in the dead air region causes the meniscus at the front end of rear channel 9 to assume a convexed shape as shown at 8a and stabilizes it against external disturbance.
- the meniscus When the ring electrode 11 is impressed with a voltage, the meniscus is elongated rapidly, forming a slope portion 8b extending from the outer edge of rear nozzle 8 to a narrow, pencil-like portion 8c, as shown at Fig. 3.
- the formation of convexed meniscus 8a concentrates the electric field thereon and reduces the minimum voltage required to tear it apart into droplets. Because of the presence of the dead air region, the meniscus quickly returns to the original state after ejection of ink.
- the front surface of the nozzle 8 is roughened to present a small angle of wet to liquid to allow the meniscus to easily wet the front surface of nozzle 8.
- the small wet angle reduces the response time of the print head and increases the amount of liquid to be ejected per unit time.
- the print head of the present invention operates with a minimum pulse duration which is 1/10 of the minimum pulse duration of the prior art and is immune to vibrations in a range which is ten times greater than the prior art.
- FIGs. 4A to 4F Various preferred forms of the rear nozzle plate are shown in Figs. 4A to 4F.
- the variations shown at Figs. 4A to 4D are advantageous to further increase meniscus stability and improve meniscus response characteristic. This is accomplished by increasing the contact area of the rear nozzle front end face with liquid.
- the rear channel 9 has a front portion passing through nozzle 8 and a rear portion passing through nozzle plate 7.
- the rear channel 9 has a front portion 9A′ having a part-spherical surface and a cylindrical rear portion 9A ⁇ .
- the rear channel 9 in Fig. 4B has a frusto-conically shaped front portion 9B′ and a rear portion 9B ⁇ .
- rear channel 9 in Fig. 4C has a front portion 9C′ having a larger transverse cross-sectional area than a rear portion 9C ⁇ . This increases the amount of liquid to be contained in the nozzle 8.
- the rear channel 9, Fig. 4D has a front portion 9D′ having a staircase cross-section and a cylindrical rear portion 9D ⁇ , the staircase portion increasing its diameter with distance away from the rear portion 9D ⁇ .
- the liquid being ejected forms a large angle of wet contact with the surface of the front portions 9A′, 9B′ as compared with the embodiment of Fig. 1 and is thus given a greater liquid retaining force with which the meniscus is more stabilized against external vibrations which might otherwise cause it to break.
- front portions 9C′ and 9D′ serve as reservoirs to hold a greater amount of liquid therein to increase liquid ejection capability.
- rear nozzle 8 is formed with an annular groove 80 to entrap liquid which might spill over the edge of the nozzle if an excessive amount of force is externally applied to the print head.
- the annular groove may be provided around the nozzle 8 as shown at 81 in of Fig. 4F.
- Illustrated at 21 in Fig. 5A is a photosensitive glass which is composed of a SiO2-Al2O3-Li2O glass containing CeO2 and Ag2O.
- a photomask 22 having a plurality of ring-shaped opaque portions 22a (only one of which is shown for simplicity) in a transparent area 22b is placed on the upper surface of the glass 21.
- the photosensitive glass 21 is subject to an imagewise radiation of ultraviolet light through the mask 22 to cause portions 21b underlying the transparent portion 22b to provide the following reaction: Ce3+ + A+ + ultraviolet light ⁇ Ce4+ + Ag0
- the glass is then subject to a primary heat treatment so that the silver content of the compound becomes colloidal and then subject to a secondary heat treatment to form crystals Li2O-SiO2 around silver colloids.
- the Li2O-SiO2 crystals are etched away to a predetermined depth. This leaves an upper portion of the amorphous region to serve as a rear nozzle 21a as shown in Fig. 5B.
- This etching process is preferably accomplished by applying a layer of hydrofluoric acid resistant material to the lower surface of the glass and submerging it into an aqueous hydrofluoric acid solution.
- Suitable material for the hydrofluoric acid resistant layer is a paraffin-containing material available from Sou Denshi Kogyo Kabushi Kaisha under the trademark of "Electron Wax”. The wax is applied at a temperature of 70°C and removed by immersing it in a trichloroethylene solution agitated at an ultrasonic frequency.
- a photoresist layer 24 is coated on the lower surface of the glass 21 and a photomask 25 having a plurality of opaque portions 25a is placed on the photoresist 24 so that opaque portion 25 aligns with corresponding the nozzle 21a.
- the diameter of the opaque portion 25a is greater than the inner diameter of, but smaller than the outer diameter of, the nozzle 21a.
- the photoresist is exposed to ultraviolet imagewise radiation through the mask 25.
- Unexposed portions are etched to form a plurality of holes 24a each being concentrical with the nozzle 21a as shown at Fig. 5D.
- a hydrofluoric acid resistant layer 26 is then formed over the entire upper surface of the glass 21 so that it fills the space within the projecting nozzle 21a as shown in Fig. 5D.
- the glass substrate is immersed in an aqueous hydrofluoric acid solution to etch the portions of the glass above the hole 24a to thereby produce a bore 27 extending across the thickness of the glass 21.
- the photoresist 24 is removed after it is carbonized in a plasma and the layer 26 is removed by immersing the glass in a trichloroethylene solution agitated at an ultrasonic frequency (Fig. 5E).
- the glass be flooded with ultraviolet light and heat-treated in a manner similar to that described in connection with the step of Fig. 5A to crystallize the amorphous channel portions 21a. This crystallization process causes the whole glass 21 to homogenize as shown at Fig. 5G and increases its mechanical strength. The glass 21 is then cut into individual nozzle plates.
- nozzle portion 21a and hole 27 are created by etching the glass in opposite directions.
- the amorphous region of the glass has a tendency to erode at a rate substantially 1/20 of the rate at which the crystalline region erodes
- the method of the invention keeps the glass 21 from being subject to a prolonged single etching process and thus prevents it from being excessively eroded sideways.
- the hole 27 has a depth of 130 micrometers.
- the nozzle 21a has a sufficient rigidity to retain its shape for an extended period of time.
- the glass-formed nozzle plate 7 has another advantage in that it is chemically resistant to ink and free from swelling.
- a light-shielding layer 16 is provided between the lower surface of glass 21 and photoresist 24 as shown in Fig. 6.
- the light-shielding layer 16 is formed by vacuum-evaporating a hydrofluoric acid resistant material such as gold on the glass until it attains a thickness of 1 to 2 micrometers.
- the photoresist 24 is removed followed by the removal of gold layer 16 using aqua regia.
- the lower surface of glass 21 is roughened by etching as shown in Fig. 7A.
- the photoresist layer 24 is applied on the roughened surface (Fig. 7B). Most of the ultraviolet light penetrating the photoresist 24 is reflected at the roughened surface, whereby the light entering the undesired portion of the photoresist 24 is negligible.
- the roughened surface presents an increase in contact area between the glass 21 and photoresist 24 so that the latter is firmly adhered to glass 21.
- Figs. 8A to 8F are illustrations of a second preferred method of fabricating the rear nozzle plate 7.
- an insulative substrate 31 of ceramic or glass is prepared (Fig. 8A).
- Suitable materials for the layer 32 are copper, aluminum, gold, platinum, chrome, molybdenum, photosensitive glass as mentioned previously, and photosensitive resin.
- Such metal is deposited by electroplating and the nonmetal material can be deposited using a suitable adhesive.
- a photoresist layer 33 is applied on the layer 32.
- the photoresist 33 is exposed to ultraviolt imagewise radiation through a photomask 34 having transparent portion 34a in the shape of a ring in the opaque background.
- the unexposed portions of the photoresist 33 are removed to create a photoresist ring 33a on the layer 32 as shown in Fig. 8B.
- An etching resistant coat 35 is applied on the lower surface of substrate 31.
- the substrate 31 is then immersed in an etching solution to remove the portions of the layer 32 which are unoccupied by the photoresist ring 33a. If the layer 32 is composed of gold or platinum, aqua regia can be used as the etching solution.
- the photoresist ring 33a is then removed by carbonizing it in a plasma followed by the removal of the etching resistant layer 35 to thereby form a nozzle 32a (Fig. 8C).
- Fig. 8D photoresist is applied to the lower surface of substrate 31 to form a layer 36 which is flooded with an ultraviolet imagewise radiation through a photomask 37 having an opaque portion 37a masking the portion directly below the nozzle 32a in a manner similar to the step shown in Fig. 5C.
- a hydrofluoric acid resistant layer 38 of the material as used in the layer 26, Fig. 5D is applied entirely over the upper surface of substrate 31 so that the space within the nozzle 32a is filled (Fig. 8D), which is followed by the immersion of the substrate into a photoresist etching solution to remove the unexposed portion of photoresist layer 36 to form a hole 36a (Fig. 8E).
- Figs. 8A to 8F The substrate is then immersed in an aqueous hydrofluoric acid solution to form a hole 31a, Fig. 8F, that extends through the thickness of substrate 31, followed by the removal of layers 36 and 38.
- the method of Figs. 8A to 8F is advantageous for applications in which it is desired to select a suitable material for the projecting nozzle portion 32a having a sufficient surface roughness to retain the meniscus which may be different from the surface roughness of the substrate 31.
- Figs. 9A to 9F illustrate a further manufacturing process in which the steps of Fig. 5A is initially performed to crystallize portions of a glass substrate 41 that surround a cylindical amorphous portion.
- the step shown at Fig. 9A follows. This step is similar to the step of Fig. 5B with the exception that the etching process is carried out on opposite surfaces of the glass substrate 41 to form a pair of nozzles 41a and 41b. Since the upper nozzle 41a is produced out of the region which is located closer to the photomask than is the lower nozzle 41b, the former has a more sharply defined boundary with the sourrounding area than the latter.
- Fig. 9A illustrate a further manufacturing process in which the steps of Fig. 5A is initially performed to crystallize portions of a glass substrate 41 that surround a cylindical amorphous portion.
- the step shown at Fig. 9A follows. This step is similar to the step of Fig. 5B with the exception that the etching
- the upper surface of substrate 41 is entirely coated with a hydrofluoric acid resistant layer 42 so that it fills the space within the nozzle 41a.
- the lower surface is coated with a layer 43 over areas outside of the lower nozzle 41b.
- the layer 43 may be formed of the same wax as used in Fig. 5D.
- the lower nozzle portion 41b has a greater surface roughness on its side wall than on its upper face. The difference in surface roughness prevents the paraffin layer 43 from spreading beyond the upper edge of the nozzle portion 41b.
- the substrate is then immersed in an aqueous hydrofluoric acid solution of 5% concentration which is maintained at a temperature lower than 34°C to create a hole 41c within the amorphous cylinder that extends between nozzles 41a and 41b (Fig.
- etching solution tends to permeate through the boundary between the nozzle 41b and surrounding layer 43 to cause erosion to occur along that boundary.
- the substrate can be etched for a period of 35 minutes at a solution temperature of 20°C to remove a volume to a depth of 170 micrometers with a diameter of about 50 micrometers. Due to sideways erosion, the hole 41c is tapered upward.
- Layers 42 and 43 are removed in a solution of trichloroethylene agitated at ultrasonic frequency (Fig. 9D).
- the lower surface of the substrate is lapped to present a flat surface (Fig. 9E).
- the substrate 41 is then subject to ultraviolet radiation and then heated in the same manner as in Fig. 5G to crystallize the amorphous region (Fig. 9F).
- the hydrofluoric acid resistant layer 43 may alternatively be formed of epoxy resin adhesive which is a mixture of Epicoat 828 as a principal component and Epicure Z as a curing agent (both being the trademarks of Shell Chemicals).
- the photosensitive glass substrate 41 is heated to a temperature of 40°C to apply Epicoat 828 to a thickness of 5 micrometers and then allowed to half-cure for a period of 50 hours at room temperature to prevent intrusion of Epicoat into the nozzle 41b. This is followed by a full curing process in which the substrate is maintained at a temperature of 70°C for a period of 60 minutes.
- the epoxy resin layer 43 can be removed in an oxygen plasma environment. In comparison with the method involving the use of the wax, the epoxy resin layer 43 is favored in terms of its excellent adherence to the underlying glass substrate and strength. Due to the high strength, undesired erosion around the nozzle 41b can be minimized.
- the ultraviolet imagewise radiation process is performed only on one surface of the photosensitive glass substrate, whereas in the previous methods the radiation process is performed on opposite sides of a substrate.
- the process of Figs. 9A to 9E eliminates misregistration which might occur between the two photomasks used on opposite sides of the substrate.
- the method of the present invention ensures quantity manufacture of nozzle plates with a precisely dimensioned nozzle opening. Furthermore, the second etching process can be effected for a desired length of time to take advantage of the sideway etching tendency of the photosensitive glass substrate so that the transverse cross-section of the rear hole 41c can be made greater than that of the nozzle 8 opening 41d to reduce its flow resistance to liquid.
- the configuration of the ink meniscus on the projecting nozzle 8 is affected by the electric field distribution, the viscosity of the ink of typically oily material, the transient pressure variations in the projecting nozzle 8 and in the air chamber 10 and the size of the meniscus which is affected by the voltages applied to the electrodes.
- the ink tends to be deflected out of the intended trajectory as it is discharged from the projecting nozzle 8. This results in a buildup of an ink layer on the walls adjacent to the projecting nozzle 8. Since the ink is conductive, the electric field will be seriously deformed to worsen the out-of-the-path deflection problem.
- portions of the adjacent walls where the ink particles are likely to hit be rendered ink-repellant. Since the tendency of a material to become wet depends on the roughness of its surface, it is effective to polish a portion 2a of the front nozzle plate 2 surrounding the front channel 3 to a mirror-finish.
- Figs. 11A to 11C are illustrations of preferred embodiments for eliminating the deflection problem.
- the inner surface of the front nozzle plate 2 is coated with a thin layer 50 of an ink-repellant material (which is also oil-repellant) such as ethylene tetrafluoride resin which is typically available as Teflon, a trademark of Du Pont, or a fluoride-containing polymer available as a mixture of liquids known under the trademark Fluorad FC-721 and FC-77 of 3M Corporation. Due to the reduced wetness, any amount of ink deposited on layer 50 is expelled to the outside by the air passing over the surface of the layer 50.
- an ink-repellant material which is also oil-repellant
- ethylene tetrafluoride resin which is typically available as Teflon, a trademark of Du Pont
- fluoride-containing polymer available as a mixture of liquids known under the trademark Fluorad FC-721 and FC-77 of 3M Corporation. Due to the reduced wetness,
- Fig. 11B the fluoride-containing polymer liquid mentioned above is sprayed on the inner surface of the front nozzle member 2 so that an ink-repellant layer 51 is formed on the inner wall of a forwardly tapered front channel 3 as well as on the inner surface of the member 2. Since Fluorad has a surface tension of 11 to 12 dynes/cm, a satisfactory level of repulsiveness can be obtained.
- an ink-repellant layer 52 formed of a mixture of fluoride-containing diamine and epoxy resin. Specifically, after forming a coat, the mixture is cured by heating it at 150°C for 1 to 5 hours.
- the same level of repulsiveness as ethylene tetrafluoride can be obtained. Since the outer wall of the projecting nozzle 8 and the area surrounding the foot of the nozzle 8 have a surface roughness greater than that of the front end of the projecting nozzle 8 due to the etching process mentioned previously, the repellant layer 52 can be easily formed excepting the front end of the nozzle. In the emodiment of Fig. 11B, the ink tends to extend to the perimetry of the front end face of the projecting nozzle 8 due to the low wet contact angle with glass with which it is formed. Therefore, a relatively large meniscus 53 will thus be formed. An electrode 54 may be provided on the rear surface of the rear nozzle member 7.
- An ink-repellant layer 55 may also be formed on the front end face of the projecting nozzle 8 as shown in Fig. 11C. This layer is formed by spraying the fluoride-containing polymer liquid mentioned above. Due to repelling action, the ink is confined within the inner perimetry of the coat on the front end face, a relatively small meniscus 56 will be formed. Because of an increased field concentration on the meniscus 56 a lower threshold voltage is required for dischaging the ink through nozzle 8 than is required with the previous embodiment.
- Front nozzle member 2 is preferably coated with an ink-repellant layer 57 which extends outwardly to enclose the electrode 11. The front-wall coating is to repel the ink particles which might return to the front member 2 by turbulence caused by the air ejected at high speeds from the channel 3.
- Ink-repellant material is successfully deposited on the front and rear nozzle plates by means of apparatus shown in Figs. 12A and 12B.
- a mount 60 includes an annular groove 61 on the upper surface in which a seal 62 is fitted.
- Mount 60 is formed with a negative pressure chamber 63 which communicates through a pipe 64 to a suction pump 65.
- Nozzle member 2 or 7 is placed on the mount 60.
- Seal 62 provides an air-tight sealing contact to allow air to be admitted into the chamber 63 exclusively through the channel 3 (or 9).
- the speed of the air passing through the channel is controlled by a pressure regulator 66 located in the pipe 64.
- Ink-repellant material is sprayed by a spray gun 67 to the nozzle member to form an ink-repellant layer 69 thereon. Due to the air flowing in the same direction as the direction of movement of the sprayed particles, the latter is carried by the air and forms a thin film on the inner wall of the channel. Otherwise, the sprayed material would clog the channel.
- a mount 70 has an annular groove 71 in which is provided a seal 72 and a positive pressure chamber 73.
- a holding member 74 is detachably secured to the mount 70 by screws 75 to hold the nozzle plate in between. Holding member 74 is formed with a window 76.
- Chamber 73 is connected by a pipe 77 to a pressure pump 78 to produce a positive pressure in the chamber 73 and eject air to the outside through the channel of the nozzle member, the speed of airflow in the channel being controlled by a pressure regulator 79.
- Ink-repellant material is sprayed by a spray gun 80 to form an ink-repellant layer 81 within the window 76. Since the direction of movement of air through the channel is opposite to the direction of movement of the sprayed material, the latter is deposited only on the surface portion of the nozzle plate and is prevented from clogging the channel.
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Abstract
Description
- The present invention relates generally to ink jet printers, and more specifically to an ink jet print head of the type wherein liquid is discharged through axially aligned rear and front channels under the combined effects of electric field and air pressure gradients
- An ink jet print head of the type as shown and described in United States Patent 4,403,234 comprises a front nozzle member secured to a housing to define a laminar airflow chamber. The housing is formed with a rear channel axially aligned with a front channel provided in the front nozzle member. The rear channel is connected by an electrically conductive pipe to a liquid supply to create a meniscus at the exit end of the rear channel. The conductive pipe is connected to a signal source to charge the liquid in the rear channel with respect to the front channel so that an electric field gradient is established between the meniscus and the front channel. The airflow chamber is connected to a pressurized air supply to produce an air pressure gradient between the exit ends of the rear and front channels. Owing to the combined effects of the field and pressure gradients, the meniscus is pulled forward and ejected through the front channel to a writing surface.
- However, the meniscus is very sensitive to disturbance generated when the print head scans across the writing surface and becomes unstable when it returns to the original shape after ejection of a droplet.
- Patents Abstracts of Japan, Vol. 9, No. 57 (M-363) (1780) shows an ink jet printer of the type concerned in the present application where an air supply is turned sharply prior to passage through an outlet and an electric field is in use applied in the region where the ink drop meniscus is formed.
- EP-A-109755 is concerned with manufacture of a nozzle for an ink jet printing head using etching techniques.
- According to the present invention there is provided an ink jet printer comprising a source of pressurized air, a liquid container, an ink jet print head comprising a front nozzle member with a front channel, a housing secured to said front nozzle member, a rear nozzle member having a forwardly projecting nozzle substantially corresponding in radial dimensions to said front channel and defining with said housing a liquid chamber which is connected to said container and further defining with said front nozzle member a laminar airflow chamber, said rear nozzle member having a rear channel extending forwardly from the liquid chamber in axial alignment with said front channel to form a meniscus at the front end thereof, said airflow chamber being connected to said air source for directing air to a point between said front and rear channels so that it makes a sharp turn at the entry into said front channel creating a sharp pressure gradient along a path between the exit ends of said front and rear channels and a dead air region adjacent the exit end of said rear channel, an annular electrode attached to the front surface of said front nozzle member, means for applying an electric potential between said electrode and the liquid in said liquid chamber to establish an electric field gradient between said front channel and said meniscus to cause it to extend to and be partially expelled through said front channel, means for connecting said liquid container to said air source so that in the absence of said electric field liquid pressure in said rear channel is statically balanced with combined forces of air pressure acting on said meniscus and the surface tension of the liquid, characterised in that a portion of said electrode, inner walls of said front channel and a portion of the rear surface of said front nozzle member which surrounds the entrance of said front channel comprises a material having a liquid repellant characteristic for repelling said liquid.
- The nozzle member can be made by a method involving the steps of:
- a) etching a first surface of a substrate to a predetermined depth according to a first pattern to form a projecting nozzle having a nozzle opening therein, said substrate being composed of a photosensitive glass or a laminate of an insulator and a layer of a material dissimilar to said insulator, said layer forming said first surface;
and - b) etching a second, opposite surface of said substrate to a predetermined depth to form a channel extending to and axially aligned with said nozzle opening.
- The formation of the dead air region in the nozzle of the printer of the invention causes the meniscus to convex, producing a high concentration of electric field and reducing the minimum voltage required to tear it apart into a droplet.
- The two-step etching process is advantageous in reducing the time taken to produce the projecting nozzle since it minimizes deviations in nozzle-opening size which might occur as a result of the tendency of the substrate material to erode sideways on a single substrate. Furthermore, the bore at the rear of the nozzle opening can be appropriately dimensioned so that its transverse cross-section is larger than that of the nozzle opening and hence to reduce the resistance it offers to liquid passing therethrough.
- The present invention will be described in further detail by way of example, with reference to the accompanying drawings, in which:
- Fig. 1 is a block diagram of an ink jet printer incorporating a print head of the present invention;
- Fig. 2 is an illustration of details of a portion of the print head of Fig. 1;
- Fig. 3 is an illustration useful for describing the advantageous effect of the projecting nozzle of the invention;
- Figs. 4A to 4F are illustrations of various modifications of the rear nozzle plate;
- Figs. 5A to 5G are illustrations of steps for fabricating a rear nozzle plate of the print head according to the invention;
- Fig. 6 is an illustration of a modified step of Fig. 5C;
- Figs. 7A and 7B are illustrations of a further modification of Fig. 5C;
- Figs. 8A to 8F are illustrations of a second method for fabricating the rear nozzle plate;
- Figs. 9A to 9F are illustrations of a third method for fabricating the rear nozzle plate;
- Fig. 10 is a cross-sectional view of a rear nozzle plate manufactured according to the present invention.
- Figs. 11A to 11C are cross-sectional views of embodiments in which ink-repellant layers are formed on the nozzle members; and
- Figs. 12A and 12B are illustrations of apparatus for depositing an ink-repellant layer on a nozzle member.
- Referring now to Fig. 1, there is shown an ink jet print head and its associated devices according to a preferred embodiment of the invention. The
print head 1 comprises afront nozzle panel 2 having afront channel 3. Thefront nozzle plate 2 is formed of insulative material and secured to arear housing 4 of insulative material. The rear housing is formed with a liquid chamber 5 to hold ink therein supplied from an ink container 6 through electricallyconductive pipe 6a. The liquid chamber 5 is defined at the front with arear nozzle plate 7 having a projectingnozzle 8. Arear channel 9 extends from the liquid chamber 5 through the projectingnozzle 8 in axial alignment with thefront channel 3 to allow ink in liquid chamber 5 to lead therethrough to form a meniscus at the extreme end.Front nozzle plate 2 defines with rear nozzle plate 7 a disc-like,laminar airflow chamber 10a of anair chamber 10 and defines withrear housing 4 anannular portion 10b. - A
ring electrode 11 encircling thefront channel 3 is secured to the outer surface offront nozzle plate 2. A voltage is applied acrosselectrode 11 andpipe 6a from asignal source 12 to establish an electric field gradient betweenelectrode 11 and the liquid inrear channel 9. - A pressurized
air supply source 13 is connected by apipe 14 to theair chamber 10 to generate an airflow in the annularair chamber portion 10b to cause it to spiral in a laminar flow through the disk-like chamber portion 10a tofront channel 3 and thence to the outside. The airstream makes a sharp turn at the entry tofront channel 3 creating a sharp pressure gradient along a path between the front ends ofrear channel 9 andfront channel 3. Pressurized air is also supplied through aregulator valve 15 to the ink container 6. Valve 15 is adjusted so that in the absence of a voltage onelectrode 11 the liquid pressure inrear channel 9 is statically balanced with the combined forces of air pressure acting on the meniscus and its surface tension. In response to the application of a voltage toelectrode 11, the liquid inrear channel 9 is electrostatically charged and pulled forward under the influence of electric field gradient. The liquid is elongated into a pencil-like shape under the pressure of air ejected through thefront channel 3 and ejected to a writing surface. - As best seen in Fig. 2, the projecting
nozzle 8 has an outer diameter slightly smaller than the diameter offront channel 3 and extends forward from thenozzle plate 7 by a distance B. Airstream is narrowed as it passes through the space between the front and rear channels and creates a dead air region immediately adjacent the front end ofrear channel 9. On the other hand, the liquid inrear channel 9 wets the front surface of thenozzle 8 and tends to disperse outward. However, further dispersion of the liquid beyond the outer edge ofrear nozzle 8 is prevented by a force exerted thereupon by the airstream moving past that outer edge, causing the liquid to slightly bulge forward. In the absence of electric field, the high pressure in the dead air region causes the meniscus at the front end ofrear channel 9 to assume a convexed shape as shown at 8a and stabilizes it against external disturbance. - When the
ring electrode 11 is impressed with a voltage, the meniscus is elongated rapidly, forming a slope portion 8b extending from the outer edge ofrear nozzle 8 to a narrow, pencil-like portion 8c, as shown at Fig. 3. The formation of convexedmeniscus 8a concentrates the electric field thereon and reduces the minimum voltage required to tear it apart into droplets. Because of the presence of the dead air region, the meniscus quickly returns to the original state after ejection of ink. - In a preferred embodiment, the front surface of the
nozzle 8 is roughened to present a small angle of wet to liquid to allow the meniscus to easily wet the front surface ofnozzle 8. The small wet angle reduces the response time of the print head and increases the amount of liquid to be ejected per unit time. - It is preferable that the axial dimension B of the
rear nozzle 8 and the outer diameter Dr ofrear nozzle 8 satisfy the following relations:
4L/5 < B < L/20
Df < Dr < Df/4
where, L = spacing between front andrear nozzle plates front channel 3. - Experiments confirmed that under like operating factors the print head of the present invention operates with a minimum pulse duration which is 1/10 of the minimum pulse duration of the prior art and is immune to vibrations in a range which is ten times greater than the prior art.
- Various preferred forms of the rear nozzle plate are shown in Figs. 4A to 4F. The variations shown at Figs. 4A to 4D are advantageous to further increase meniscus stability and improve meniscus response characteristic. This is accomplished by increasing the contact area of the rear nozzle front end face with liquid. In these variations, the
rear channel 9 has a front portion passing throughnozzle 8 and a rear portion passing throughnozzle plate 7. - In Fig. 4A, the
rear channel 9 has afront portion 9A′ having a part-spherical surface and a cylindricalrear portion 9A˝. Therear channel 9 in Fig. 4B has a frusto-conically shapedfront portion 9B′ and arear portion 9B˝. In Fig. 4C,rear channel 9 has a front portion 9C′ having a larger transverse cross-sectional area than a rear portion 9C˝. This increases the amount of liquid to be contained in thenozzle 8. Therear channel 9, Fig. 4D, has a front portion 9D′ having a staircase cross-section and a cylindrical rear portion 9D˝, the staircase portion increasing its diameter with distance away from the rear portion 9D˝. - In the embodiments of Figs. 4A and 4B, the liquid being ejected forms a large angle of wet contact with the surface of the
front portions 9A′, 9B′ as compared with the embodiment of Fig. 1 and is thus given a greater liquid retaining force with which the meniscus is more stabilized against external vibrations which might otherwise cause it to break. In the embodiments of Figs. 4C and 4D, front portions 9C′ and 9D′ serve as reservoirs to hold a greater amount of liquid therein to increase liquid ejection capability. - In Fig. 4E,
rear nozzle 8 is formed with anannular groove 80 to entrap liquid which might spill over the edge of the nozzle if an excessive amount of force is externally applied to the print head. The annular groove may be provided around thenozzle 8 as shown at 81 in of Fig. 4F. - Description will now be given to a method for fabricating a rear nozzle plate with reference to Figs. 5A to 5G.
- Illustrated at 21 in Fig. 5A is a photosensitive glass which is composed of a SiO₂-Aℓ₂O₃-Li₂O glass containing CeO₂ and Ag₂O. A
photomask 22 having a plurality of ring-shapedopaque portions 22a (only one of which is shown for simplicity) in atransparent area 22b is placed on the upper surface of theglass 21. Thephotosensitive glass 21 is subject to an imagewise radiation of ultraviolet light through themask 22 to cause portions 21b underlying thetransparent portion 22b to provide the following reaction:
Ce³⁺ + A⁺ + ultraviolet light ― Ce⁴⁺ + Ag⁰
The glass is then subject to a primary heat treatment so that the silver content of the compound becomes colloidal and then subject to a secondary heat treatment to form crystals Li₂O-SiO₂ around silver colloids. The Li₂O-SiO₂ crystals are etched away to a predetermined depth. This leaves an upper portion of the amorphous region to serve as arear nozzle 21a as shown in Fig. 5B. This etching process is preferably accomplished by applying a layer of hydrofluoric acid resistant material to the lower surface of the glass and submerging it into an aqueous hydrofluoric acid solution. Suitable material for the hydrofluoric acid resistant layer is a paraffin-containing material available from Sou Denshi Kogyo Kabushi Kaisha under the trademark of "Electron Wax". The wax is applied at a temperature of 70°C and removed by immersing it in a trichloroethylene solution agitated at an ultrasonic frequency. - In Fig. 5C, a
photoresist layer 24 is coated on the lower surface of theglass 21 and aphotomask 25 having a plurality ofopaque portions 25a is placed on thephotoresist 24 so thatopaque portion 25 aligns with corresponding thenozzle 21a. The diameter of theopaque portion 25a is greater than the inner diameter of, but smaller than the outer diameter of, thenozzle 21a. The photoresist is exposed to ultraviolet imagewise radiation through themask 25. Unexposed portions are etched to form a plurality ofholes 24a each being concentrical with thenozzle 21a as shown at Fig. 5D. - A hydrofluoric acid
resistant layer 26 is then formed over the entire upper surface of theglass 21 so that it fills the space within the projectingnozzle 21a as shown in Fig. 5D. The glass substrate is immersed in an aqueous hydrofluoric acid solution to etch the portions of the glass above thehole 24a to thereby produce abore 27 extending across the thickness of theglass 21. Thephotoresist 24 is removed after it is carbonized in a plasma and thelayer 26 is removed by immersing the glass in a trichloroethylene solution agitated at an ultrasonic frequency (Fig. 5E). Since thenozzle 21a remains amorphous, it is preferable that the glass be flooded with ultraviolet light and heat-treated in a manner similar to that described in connection with the step of Fig. 5A to crystallize theamorphous channel portions 21a. This crystallization process causes thewhole glass 21 to homogenize as shown at Fig. 5G and increases its mechanical strength. Theglass 21 is then cut into individual nozzle plates. - It is seen that
nozzle portion 21a andhole 27 are created by etching the glass in opposite directions. Although the amorphous region of the glass has a tendency to erode at a rate substantially 1/20 of the rate at which the crystalline region erodes, the method of the invention keeps theglass 21 from being subject to a prolonged single etching process and thus prevents it from being excessively eroded sideways. It is possible to produce a rear nozzle plate with anozzle 21a having an outer diameter of 100 micrometers with an error of ± 2 micrometers, an inner diameter (at the forward end) of 40 micrometers with an error of ± 2 micrometers and an axial dimension of 35 micrometers. In this case, thehole 27 has a depth of 130 micrometers. Although it has a small thickness in radial directions, thenozzle 21a has a sufficient rigidity to retain its shape for an extended period of time. The glass-formednozzle plate 7 has another advantage in that it is chemically resistant to ink and free from swelling. - In the process step shown in Fig. 5C, incident ultraviolet light that penetrates the
photoresist 24 is reflected irregularly at different depths of the crystallized portions of the glass and part of the reflected light enters undesired portions of thephotoresist 24, causing the boundary between the light-exposed and non-exposed areas to blur. For this reason, a light-shielding layer 16 is provided between the lower surface ofglass 21 andphotoresist 24 as shown in Fig. 6. The light-shielding layer 16 is formed by vacuum-evaporating a hydrofluoric acid resistant material such as gold on the glass until it attains a thickness of 1 to 2 micrometers. After being exposed to ultraviolet imagewise radiation, thephotoresist 24 is removed followed by the removal ofgold layer 16 using aqua regia. Alternatively, the lower surface ofglass 21 is roughened by etching as shown in Fig. 7A. Thephotoresist layer 24 is applied on the roughened surface (Fig. 7B). Most of the ultraviolet light penetrating thephotoresist 24 is reflected at the roughened surface, whereby the light entering the undesired portion of thephotoresist 24 is negligible. The roughened surface presents an increase in contact area between theglass 21 andphotoresist 24 so that the latter is firmly adhered toglass 21. - Figs. 8A to 8F are illustrations of a second preferred method of fabricating the
rear nozzle plate 7. In the first step, aninsulative substrate 31 of ceramic or glass is prepared (Fig. 8A). On thesubstrate 31 is deposited alayer 32 of a material which is dissimilar to the underlying substrate. This material is chemically resistant to ink but can easily be eroded by an etchant. Suitable materials for thelayer 32 are copper, aluminum, gold, platinum, chrome, molybdenum, photosensitive glass as mentioned previously, and photosensitive resin. Such metal is deposited by electroplating and the nonmetal material can be deposited using a suitable adhesive. Aphotoresist layer 33 is applied on thelayer 32. Thephotoresist 33 is exposed to ultraviolt imagewise radiation through aphotomask 34 havingtransparent portion 34a in the shape of a ring in the opaque background. The unexposed portions of thephotoresist 33 are removed to create aphotoresist ring 33a on thelayer 32 as shown in Fig. 8B. An etchingresistant coat 35 is applied on the lower surface ofsubstrate 31. Thesubstrate 31 is then immersed in an etching solution to remove the portions of thelayer 32 which are unoccupied by thephotoresist ring 33a. If thelayer 32 is composed of gold or platinum, aqua regia can be used as the etching solution. Thephotoresist ring 33a is then removed by carbonizing it in a plasma followed by the removal of the etchingresistant layer 35 to thereby form anozzle 32a (Fig. 8C). - In Fig. 8D, photoresist is applied to the lower surface of
substrate 31 to form alayer 36 which is flooded with an ultraviolet imagewise radiation through a photomask 37 having an opaque portion 37a masking the portion directly below thenozzle 32a in a manner similar to the step shown in Fig. 5C. A hydrofluoric acidresistant layer 38 of the material as used in thelayer 26, Fig. 5D, is applied entirely over the upper surface ofsubstrate 31 so that the space within thenozzle 32a is filled (Fig. 8D), which is followed by the immersion of the substrate into a photoresist etching solution to remove the unexposed portion ofphotoresist layer 36 to form a hole 36a (Fig. 8E). The substrate is then immersed in an aqueous hydrofluoric acid solution to form ahole 31a, Fig. 8F, that extends through the thickness ofsubstrate 31, followed by the removal oflayers nozzle portion 32a having a sufficient surface roughness to retain the meniscus which may be different from the surface roughness of thesubstrate 31. - Figs. 9A to 9F illustrate a further manufacturing process in which the steps of Fig. 5A is initially performed to crystallize portions of a glass substrate 41 that surround a cylindical amorphous portion. The step shown at Fig. 9A follows. This step is similar to the step of Fig. 5B with the exception that the etching process is carried out on opposite surfaces of the glass substrate 41 to form a pair of
nozzles upper nozzle 41a is produced out of the region which is located closer to the photomask than is thelower nozzle 41b, the former has a more sharply defined boundary with the sourrounding area than the latter. In Fig. 9B, the upper surface of substrate 41 is entirely coated with a hydrofluoric acidresistant layer 42 so that it fills the space within thenozzle 41a. The lower surface is coated with alayer 43 over areas outside of thelower nozzle 41b. Thelayer 43 may be formed of the same wax as used in Fig. 5D. Thelower nozzle portion 41b has a greater surface roughness on its side wall than on its upper face. The difference in surface roughness prevents theparaffin layer 43 from spreading beyond the upper edge of thenozzle portion 41b. The substrate is then immersed in an aqueous hydrofluoric acid solution of 5% concentration which is maintained at a temperature lower than 34°C to create ahole 41c within the amorphous cylinder that extends betweennozzles nozzle 41b and surroundinglayer 43 to cause erosion to occur along that boundary. The substrate can be etched for a period of 35 minutes at a solution temperature of 20°C to remove a volume to a depth of 170 micrometers with a diameter of about 50 micrometers. Due to sideways erosion, thehole 41c is tapered upward. -
Layers - The hydrofluoric acid
resistant layer 43 may alternatively be formed of epoxy resin adhesive which is a mixture of Epicoat 828 as a principal component and Epicure Z as a curing agent (both being the trademarks of Shell Chemicals). The photosensitive glass substrate 41 is heated to a temperature of 40°C to apply Epicoat 828 to a thickness of 5 micrometers and then allowed to half-cure for a period of 50 hours at room temperature to prevent intrusion of Epicoat into thenozzle 41b. This is followed by a full curing process in which the substrate is maintained at a temperature of 70°C for a period of 60 minutes. Theepoxy resin layer 43 can be removed in an oxygen plasma environment. In comparison with the method involving the use of the wax, theepoxy resin layer 43 is favored in terms of its excellent adherence to the underlying glass substrate and strength. Due to the high strength, undesired erosion around thenozzle 41b can be minimized. - In the process of Figs. 9A to 9F just described, the ultraviolet imagewise radiation process is performed only on one surface of the photosensitive glass substrate, whereas in the previous methods the radiation process is performed on opposite sides of a substrate. The process of Figs. 9A to 9E eliminates misregistration which might occur between the two photomasks used on opposite sides of the substrate.
- As seen in Fig. 10, typical dimensions of a rear nozzle manufactured according to Figs. 9A to 9E measure F=170 µm, E=30 µm, D1=45 µm, D2= 50 µm and D3= 90 µm. Due to the single imagewise radiation, the
nozzle opening 41c is precisely aligned with thenozzle opening 41d in thenozzle 41a. - Since the first etching process involved in forming the rear nozzle openings on one surface of the substrate is performed in a much smaller period of time than is taken to perform the second etching process on the opposite side and since dimensional variations between different nozzles increase as a function of time taken to perform the etching process, the method of the present invention ensures quantity manufacture of nozzle plates with a precisely dimensioned nozzle opening. Furthermore, the second etching process can be effected for a desired length of time to take advantage of the sideway etching tendency of the photosensitive glass substrate so that the transverse cross-section of the
rear hole 41c can be made greater than that of thenozzle 8opening 41d to reduce its flow resistance to liquid. - It is found that the configuration of the ink meniscus on the projecting
nozzle 8 is affected by the electric field distribution, the viscosity of the ink of typically oily material, the transient pressure variations in the projectingnozzle 8 and in theair chamber 10 and the size of the meniscus which is affected by the voltages applied to the electrodes. As a result, the ink tends to be deflected out of the intended trajectory as it is discharged from the projectingnozzle 8. This results in a buildup of an ink layer on the walls adjacent to the projectingnozzle 8. Since the ink is conductive, the electric field will be seriously deformed to worsen the out-of-the-path deflection problem. - It is therefore preferable that portions of the adjacent walls where the ink particles are likely to hit be rendered ink-repellant. Since the tendency of a material to become wet depends on the roughness of its surface, it is effective to polish a portion 2a of the
front nozzle plate 2 surrounding thefront channel 3 to a mirror-finish. - Figs. 11A to 11C are illustrations of preferred embodiments for eliminating the deflection problem. In Fig. 11A, the inner surface of the
front nozzle plate 2 is coated with athin layer 50 of an ink-repellant material (which is also oil-repellant) such as ethylene tetrafluoride resin which is typically available as Teflon, a trademark of Du Pont, or a fluoride-containing polymer available as a mixture of liquids known under the trademark Fluorad FC-721 and FC-77 of 3M Corporation. Due to the reduced wetness, any amount of ink deposited onlayer 50 is expelled to the outside by the air passing over the surface of thelayer 50. - In Fig. 11B, the fluoride-containing polymer liquid mentioned above is sprayed on the inner surface of the
front nozzle member 2 so that an ink-repellant layer 51 is formed on the inner wall of a forwardly taperedfront channel 3 as well as on the inner surface of themember 2. Since Fluorad has a surface tension of 11 to 12 dynes/cm, a satisfactory level of repulsiveness can be obtained. On the surface of therear nozzle member 7 is preferably deposited an ink-repellant layer 52 formed of a mixture of fluoride-containing diamine and epoxy resin. Specifically, after forming a coat, the mixture is cured by heating it at 150°C for 1 to 5 hours. The same level of repulsiveness as ethylene tetrafluoride can be obtained. Since the outer wall of the projectingnozzle 8 and the area surrounding the foot of thenozzle 8 have a surface roughness greater than that of the front end of the projectingnozzle 8 due to the etching process mentioned previously, therepellant layer 52 can be easily formed excepting the front end of the nozzle. In the emodiment of Fig. 11B, the ink tends to extend to the perimetry of the front end face of the projectingnozzle 8 due to the low wet contact angle with glass with which it is formed. Therefore, a relativelylarge meniscus 53 will thus be formed. Anelectrode 54 may be provided on the rear surface of therear nozzle member 7. - An ink-repellant layer 55 may also be formed on the front end face of the projecting
nozzle 8 as shown in Fig. 11C. This layer is formed by spraying the fluoride-containing polymer liquid mentioned above. Due to repelling action, the ink is confined within the inner perimetry of the coat on the front end face, a relativelysmall meniscus 56 will be formed. Because of an increased field concentration on the meniscus 56 a lower threshold voltage is required for dischaging the ink throughnozzle 8 than is required with the previous embodiment.Front nozzle member 2 is preferably coated with an ink-repellant layer 57 which extends outwardly to enclose theelectrode 11. The front-wall coating is to repel the ink particles which might return to thefront member 2 by turbulence caused by the air ejected at high speeds from thechannel 3. - Ink-repellant materials that can be advantageously employed in the present invention include:
- (a) fluoride-containing polymer such as polytetrafluoroethylene, fluorinated ethylene-propylene copolymer, polychlorotrifluoroethylene, polyvinylfluoride, tetrafluoroethylene perfluoroalkylvinylether copolymer, polyvinylidene fluoride, ethylene-tetrafluoroethylene copolymer, ethylene-chlorotrifluoroethylene copolymer, epoxy resin mixed with fluoride-containing diamine, or fluoride-containing alkyl silane;
- (b) inorganic fluoride-containing compound such as calcium fluoride and graphite fluoride;
- (3) silicone polymer of the type which is composed of a Si-O bond and is capable of being cured at room temperatures or silicone polymer of the type which is cured at elevated temperatures; and
- (4) a copolymer of fluoride-containing polymer and silicone polymer such as:
- Ink-repellant material is successfully deposited on the front and rear nozzle plates by means of apparatus shown in Figs. 12A and 12B.
- In Fig. 12A, a
mount 60 includes anannular groove 61 on the upper surface in which aseal 62 is fitted.Mount 60 is formed with anegative pressure chamber 63 which communicates through apipe 64 to asuction pump 65.Nozzle member mount 60.Seal 62 provides an air-tight sealing contact to allow air to be admitted into thechamber 63 exclusively through the channel 3 (or 9). The speed of the air passing through the channel is controlled by apressure regulator 66 located in thepipe 64. Ink-repellant material is sprayed by a spray gun 67 to the nozzle member to form an ink-repellant layer 69 thereon. Due to the air flowing in the same direction as the direction of movement of the sprayed particles, the latter is carried by the air and forms a thin film on the inner wall of the channel. Otherwise, the sprayed material would clog the channel. - Apparatus shown in Fig. 12B is useful for forming the ink-repellant layer only on the surface portion of the nozzle member. A mount 70 has an
annular groove 71 in which is provided aseal 72 and apositive pressure chamber 73. A holdingmember 74 is detachably secured to the mount 70 byscrews 75 to hold the nozzle plate in between. Holdingmember 74 is formed with awindow 76.Chamber 73 is connected by apipe 77 to apressure pump 78 to produce a positive pressure in thechamber 73 and eject air to the outside through the channel of the nozzle member, the speed of airflow in the channel being controlled by apressure regulator 79. Ink-repellant material is sprayed by aspray gun 80 to form an ink-repellant layer 81 within thewindow 76. Since the direction of movement of air through the channel is opposite to the direction of movement of the sprayed material, the latter is deposited only on the surface portion of the nozzle plate and is prevented from clogging the channel.
Claims (3)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP203406/84 | 1984-09-28 | ||
JP20340684A JPS6179668A (en) | 1984-09-28 | 1984-09-28 | Ink jet recording head |
JP16240385A JPS6221551A (en) | 1985-07-23 | 1985-07-23 | Ink jet recording head |
JP162403/85 | 1985-07-23 | ||
JP177911/85 | 1985-08-13 | ||
JP17791185A JPS6239252A (en) | 1985-08-13 | 1985-08-13 | Surface treating method of nozzle plate for ink jet recording |
JP196290/85 | 1985-09-05 | ||
JP19629085A JPS6255154A (en) | 1985-09-05 | 1985-09-05 | Ink jet recording head |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP85306956.5 Division | 1985-09-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0355862A1 true EP0355862A1 (en) | 1990-02-28 |
EP0355862B1 EP0355862B1 (en) | 1993-01-13 |
Family
ID=27473797
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP85306956A Expired - Lifetime EP0177316B1 (en) | 1984-09-28 | 1985-09-30 | Method for fabricating an ink jet printer nozzle member |
EP19890117232 Expired - Lifetime EP0355862B1 (en) | 1984-09-28 | 1985-09-30 | Ink jet printer |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP85306956A Expired - Lifetime EP0177316B1 (en) | 1984-09-28 | 1985-09-30 | Method for fabricating an ink jet printer nozzle member |
Country Status (2)
Country | Link |
---|---|
EP (2) | EP0177316B1 (en) |
DE (2) | DE3586998T2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6243112B1 (en) | 1996-07-01 | 2001-06-05 | Xerox Corporation | High density remote plasma deposited fluoropolymer films |
CN104853923A (en) * | 2012-12-20 | 2015-08-19 | 惠普发展公司,有限责任合伙企业 | Fluid ejection device with particle tolerant layer extension |
US9895885B2 (en) | 2012-12-20 | 2018-02-20 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with particle tolerant layer extension |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1329341C (en) * | 1988-10-19 | 1994-05-10 | Rosemary Bridget Albinson | Method of forming adherent fluorosilane layer on a substrate and ink jet recording head containing such a layer |
GB8906379D0 (en) * | 1989-03-20 | 1989-05-04 | Am Int | Providing a surface with solvent-wettable and solvent-non wettable zones |
DE3918472A1 (en) * | 1989-06-06 | 1990-12-13 | Siemens Ag | HYDROPHOBIC AGENTS AND APPLICATION METHOD, ESPECIALLY FOR INK JET PRINT HEADS |
US5574486A (en) * | 1993-01-13 | 1996-11-12 | Tektronix, Inc. | Ink jet print heads and methos for preparing them |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4403234A (en) * | 1981-01-21 | 1983-09-06 | Matsushita Electric Industrial Company, Limited | Ink jet printing head utilizing pressure and potential gradients |
US4454519A (en) * | 1981-07-24 | 1984-06-12 | Fuji Photo Film Co., Ltd. | Ink jet head with slit nozzles |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3921916A (en) * | 1974-12-31 | 1975-11-25 | Ibm | Nozzles formed in monocrystalline silicon |
DE3048259A1 (en) * | 1980-12-20 | 1982-07-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | "NOZZLE FOR INK JET PRINTER" |
US4528577A (en) * | 1982-11-23 | 1985-07-09 | Hewlett-Packard Co. | Ink jet orifice plate having integral separators |
JPS59192576A (en) * | 1983-04-18 | 1984-10-31 | Matsushita Electric Ind Co Ltd | Ink jet recorder |
-
1985
- 1985-09-30 DE DE19853586998 patent/DE3586998T2/en not_active Expired - Fee Related
- 1985-09-30 DE DE8585306956T patent/DE3583275D1/en not_active Expired - Lifetime
- 1985-09-30 EP EP85306956A patent/EP0177316B1/en not_active Expired - Lifetime
- 1985-09-30 EP EP19890117232 patent/EP0355862B1/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4403234A (en) * | 1981-01-21 | 1983-09-06 | Matsushita Electric Industrial Company, Limited | Ink jet printing head utilizing pressure and potential gradients |
US4454519A (en) * | 1981-07-24 | 1984-06-12 | Fuji Photo Film Co., Ltd. | Ink jet head with slit nozzles |
Non-Patent Citations (2)
Title |
---|
IBM TECHNICAL DISCLOSURE BULLETIN, vol. 26, no. 3A, August 1983, page 1041, New York, US; G.J. RATCHFORD: "Nozzle plate" * |
PATENT ABSTRACTS OF JAPAN, vol. 6, no. 201 (M-163)[1079], 13th October 1982; & JP-A-57 107 848 (RICOH K.K.) 05-07-1982 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6243112B1 (en) | 1996-07-01 | 2001-06-05 | Xerox Corporation | High density remote plasma deposited fluoropolymer films |
US6444275B1 (en) | 1996-07-01 | 2002-09-03 | Xerox Corporation | Method for remote plasma deposition of fluoropolymer films |
CN104853923A (en) * | 2012-12-20 | 2015-08-19 | 惠普发展公司,有限责任合伙企业 | Fluid ejection device with particle tolerant layer extension |
CN104853923B (en) * | 2012-12-20 | 2016-08-24 | 惠普发展公司,有限责任合伙企业 | There is the fluid ejection apparatus of granule resistance layer extension |
US9707754B2 (en) | 2012-12-20 | 2017-07-18 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with particle tolerant layer extension |
US9895885B2 (en) | 2012-12-20 | 2018-02-20 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with particle tolerant layer extension |
Also Published As
Publication number | Publication date |
---|---|
EP0177316A3 (en) | 1987-06-16 |
DE3586998D1 (en) | 1993-02-25 |
EP0177316A2 (en) | 1986-04-09 |
EP0355862B1 (en) | 1993-01-13 |
DE3586998T2 (en) | 1993-07-22 |
EP0177316B1 (en) | 1991-06-19 |
DE3583275D1 (en) | 1991-07-25 |
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