EP0188386A3 - Gold electroplating bath - Google Patents

Gold electroplating bath Download PDF

Info

Publication number: EP0188386A3
Authority: EP; European Patent Office
Prior art keywords: electroplating bath; gold; additive; gold electroplating; hydrogen
Prior art date: 1985-01-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP86300301A

Other languages

German (de)

English (en)

French (fr)

Other versions

EP0188386A2 (en

Inventor

Peter Wilkinson

Julia Mary Mayne

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

BASF Catalysts LLC

Original Assignee

Engelhard Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1985-01-18

Filing date

1986-01-17

Publication date

1986-10-08

1986-01-17 Application filed by Engelhard Corp filed Critical Engelhard Corp

1986-07-23 Publication of EP0188386A2 publication Critical patent/EP0188386A2/en

1986-10-08 Publication of EP0188386A3 publication Critical patent/EP0188386A3/en

Status Withdrawn legal-status Critical Current

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)

EP86300301A 1985-01-18 1986-01-17 Gold electroplating bath Withdrawn EP0188386A3 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
GB8501245		1985-01-18
GB858501245A GB8501245D0 (en)	1985-01-18	1985-01-18	Gold electroplating bath

Publications (2)

Publication Number	Publication Date
EP0188386A2 EP0188386A2 (en)	1986-07-23
EP0188386A3 true EP0188386A3 (en)	1986-10-08

Family

ID=10573027

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP86300301A Withdrawn EP0188386A3 (en)	1985-01-18	1986-01-17	Gold electroplating bath

Country Status (6)

Country	Link
EP (1)	EP0188386A3 (da)
JP (1)	JPS61204391A (da)
CN (1)	CN86100895A (da)
DK (1)	DK23686A (da)
GB (1)	GB8501245D0 (da)
IE (1)	IE860142L (da)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS637390A (ja) *	1986-06-26	1988-01-13	Nippon Engeruharudo Kk	金−コバルト合金めつき液
GB2242200B (en) *	1990-02-20	1993-11-17	Omi International	Plating compositions and processes
CN102105623B (zh) *	2008-06-11	2013-10-02	日本高纯度化学株式会社	电镀金液和使用该电镀金液而得的金皮膜
JP2011122192A (ja) *	2009-12-09	2011-06-23	Ne Chemcat Corp	電解硬質金めっき液及びこれを用いるめっき方法
JP5731802B2 (ja) *	2010-11-25	2015-06-10	ローム・アンド・ハース電子材料株式会社	金めっき液
ITFI20120103A1 (it) *	2012-06-01	2013-12-02	Bluclad Srl	Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni.
CN103741180B (zh) *	2014-01-10	2015-11-25	哈尔滨工业大学	无氰光亮电镀金添加剂及其应用
CN105350035B (zh) *	2015-11-25	2018-11-09	广东致卓环保科技有限公司	有机胺体系无氰电镀金镀液及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2249979A1 (da) *	1973-11-07	1975-05-30	Degussa
FR2465798A1 (fr) *	1979-09-24	1981-03-27	Rohco Inc	Bains de revetement de cadmium et procedes pour deposer par electrolyse des couches de cadmium brillant
DD216260A1 (de) *	1983-06-27	1984-12-05	Robotron Elektronik	Elektrolyt zur abscheidung halbglaenzender goldlegierungsschichten
EP0150439A1 (en) *	1983-12-22	1985-08-07	LeaRonal (UK) plc	An acid bath for electrodeposition of gold or gold alloys, an electroplating method and the use of said bath

1985
- 1985-01-18 GB GB858501245A patent/GB8501245D0/en active Pending
1986
- 1986-01-17 JP JP659686A patent/JPS61204391A/ja active Pending
- 1986-01-17 EP EP86300301A patent/EP0188386A3/en not_active Withdrawn
- 1986-01-17 IE IE14286A patent/IE860142L/xx unknown
- 1986-01-17 CN CN198686100895A patent/CN86100895A/zh active Pending
- 1986-01-17 DK DK23686A patent/DK23686A/da not_active Application Discontinuation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2249979A1 (da) *	1973-11-07	1975-05-30	Degussa
FR2465798A1 (fr) *	1979-09-24	1981-03-27	Rohco Inc	Bains de revetement de cadmium et procedes pour deposer par electrolyse des couches de cadmium brillant
DD216260A1 (de) *	1983-06-27	1984-12-05	Robotron Elektronik	Elektrolyt zur abscheidung halbglaenzender goldlegierungsschichten
EP0150439A1 (en) *	1983-12-22	1985-08-07	LeaRonal (UK) plc	An acid bath for electrodeposition of gold or gold alloys, an electroplating method and the use of said bath

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
CHEMICAL ABSTRACTS, vol. 83, no. 22, 1st December 1975, page 414, abstract no. 185393k, Columbus, Ohio, US; Y. SHIMIZU et al.: "Effects of pyridine derivatives on the properties of electroplated nickel", & KINZOKU HYOMEN FIJUTSU 1975, 6(6), 258-63 *
GALVANOTECHNIK, vol. 64, no. 10, 1973, pages 905-910; A. KOLEV et al.: "Zur galvanischen Vergoldung" *

Also Published As

Publication number	Publication date
CN86100895A (zh)	1986-07-16
JPS61204391A (ja)	1986-09-10
DK23686D0 (da)	1986-01-17
EP0188386A2 (en)	1986-07-23
GB8501245D0 (en)	1985-02-20
DK23686A (da)	1986-07-19
IE860142L (en)	1986-07-18

Similar Documents

Publication	Publication Date	Title
JPS55161091A (en)	1980-12-15	Electroplating of plastics which can be directly plated by nickelliron alloy strike
AU2465084A (en)	1984-09-06	Plating of zinc plated steel
GB2144451B (en)	1986-08-20	Zinc/iron alloy electroplating
EP0188386A3 (en)	1986-10-08	Gold electroplating bath
DE3572013D1 (en)	1989-09-07	An acid copper electroplating solution as well as a method of electroplating
GB2021643B (en)	1982-09-02	Acid zinc plating baths and methods for electro-depositingzinc deposits
ATE68835T1 (de)	1991-11-15	Gold-elektroplattierungsbad.
ES8702826A1 (es)	1987-01-16	Perfeccionamientos aportados a la fabricacion de elementos de acero para reforzar el caucho
AU1435183A (en)	1983-12-01	Zinc alloy plating bath
AT341850B (de)	1978-02-27	Wasseriges ammoniakalisches bad zur galvanischen abscheidung von palladium-nickel-legierungen
DE3475535D1 (en)	1989-01-12	Aqueous alcaline bath for chemically plating copper or nickel
Wilkinson et al.	1986	Gold Electroplating Bath
AU535304B2 (en)	1984-03-15	Palladium-nickel alloy electrodeposition bath
GB8400009D0 (en)	1984-02-08	Cyanide free copper plating and alloy anode
GB1534452A (en)	1978-12-06	Electroplating palladium
AU535263B2 (en)	1984-03-08	Palladium-nickel alloy electrodeposition bath
JPS5524997A (en)	1980-02-22	Electrodeposition of iron nickel alloy
JPS5367745A (en)	1978-06-16	Cathodic electrodepositing of polyamine resin
JPS5794590A (en)	1982-06-12	High corrosion resistant zinc plating method
GB1507096A (en)	1978-04-12	Electro-deposition of zinc
AU7351781A (en)	1983-02-03	Ammonia-free electroless nickel plating bath
JPS54128947A (en)	1979-10-05	Electrodeposition solution and electroplating of silverrtin alloy
Edner	1985	Increase in the Quality of Electroplated Coatings by Vibration
JPS52148439A (en)	1977-12-09	Method of adjusting ph of electrolytic nickel plating solution
BAI et al.	1987	Analysis of nickel sulphamate bath using charging current compensated D. C. polarography

Legal Events

Date	Code	Title	Description
1986-06-07	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
1986-07-23	AK	Designated contracting states	Kind code of ref document: A2 Designated state(s): AT BE CH DE FR GB IT LI LU NL SE
1986-08-19	PUAL	Search report despatched	Free format text: ORIGINAL CODE: 0009013
1986-10-08	AK	Designated contracting states	Kind code of ref document: A3 Designated state(s): AT BE CH DE FR GB IT LI LU NL SE
1987-06-03	17P	Request for examination filed	Effective date: 19870406
1989-01-18	17Q	First examination report despatched	Effective date: 19881130
1989-11-08	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
1989-12-27	18D	Application deemed to be withdrawn	Effective date: 19890611
2007-08-08	RIN1	Information on inventor provided before grant (corrected)	Inventor name: MAYNE, JULIA MARY Inventor name: WILKINSON, PETER