EP0048579A1 - Verfahren zur galvanischen Abscheidung von Bleilegierungen - Google Patents

Verfahren zur galvanischen Abscheidung von Bleilegierungen Download PDF

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Publication number
EP0048579A1
EP0048579A1 EP81304194A EP81304194A EP0048579A1 EP 0048579 A1 EP0048579 A1 EP 0048579A1 EP 81304194 A EP81304194 A EP 81304194A EP 81304194 A EP81304194 A EP 81304194A EP 0048579 A1 EP0048579 A1 EP 0048579A1
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EP
European Patent Office
Prior art keywords
lead
solution
anode
tin
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP81304194A
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English (en)
French (fr)
Other versions
EP0048579B1 (de
Inventor
William John Waterman
Miachel Gordon Brook
Lita Elizabeth Jenni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Federal Mogul Shoreham Ltd
Dana Inc
Original Assignee
GKN Vandervell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GKN Vandervell Ltd filed Critical GKN Vandervell Ltd
Priority to AT81304194T priority Critical patent/ATE10862T1/de
Publication of EP0048579A1 publication Critical patent/EP0048579A1/de
Application granted granted Critical
Publication of EP0048579B1 publication Critical patent/EP0048579B1/de
Expired legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms

Definitions

  • This invention relates to a method and apparatus for the electro-deposition of an alloy coating on to a backing member, such a process being of particular interest to the coating of a load carrying bearing surface on to the backing member of a plain bearing.
  • Such a bearing may comprise for example a half shell backing member of steel with a bronze substrate bonded thereto and on to which is electro-deposited a bearing surface coating of lead-indium or lead-antimony-tin.
  • Binary and ternary alloys can be co-deposited electrolytically as is described for example in British Patents 577335 and 628459 and in U.S.A Patent 2605149. In British Patent 577335 it is stated, and has been verified in tests, "that coatings of ternary alloys such as lead-antimony-tin or lead-tin-copper can replace the more usual lead-tin or lead- indium binary alloy coatings as bearing surfaces.
  • apparatus for the electro-deposition of an alloy on to a cathode comprising a first chamber within which the cathode is located and which contains a catholyte solution; a second chamber within which the anode is located and which contains an anolyte solution, and said first and second chambers communicating with one another only through the medium of a cation exchange membrane.
  • a method of electro-depositing an alloy on to a metal cathode comprising the steps of immersing the cathode in a first chamber containing a catholyte solution; immersing a metal anode in a second chamber containing an anolyte solution communicating with said catholyte solution only through the medium of a cation exchange membrane and applying a direct current between the anode and cathode.
  • the anolyte will not contain elements capable of immersion plating on to the anode.
  • the catholyte comprises a lead-antimony-tin plating solution then the anolyte will not contain any antimony.
  • the catholyte comprises a lead-tin-copper plating solution then the anolyte will not contain copper.
  • metal ions arising from the anode pass through the cation exchange membrane towards the cathode under the influence of the plating potential. Since the anolyte contains no metal capable of immersion plating on to the anode the anode will remain clean.
  • the antimony or copper or arsenic in the catholyte (depending on what alloy is being co-deposited) is prevented from entering the anolyte by the physical barrier of the cation exchange membrane. That is to say, metal ions can pass in one direction only, i.e towards the cathode, and then only under the influence of the plating potential applied between the anode and cathode.
  • the anolyte solution in the second chamber remains free of ions capable of immersion plating on to the anode.
  • a further advantage of the use of a cation exchange membrane to physically separate the catholyte and anolyte solutions is that the composition of the catholyte may be controlled more readily since metal is not lost therefrom by immersion plating which in turn means that the electro-deposited alloys have more consistent compositions.
  • first chamber 10 within which is locatable a member 12 to be plated and which comprises the cathode; such member may comprise a steel backing member with a bronze substrate bonded thereto and on to which is to be co-deposited a ternary alloy as a bearing surface.
  • This first chamber 10 is capable of being filled with the catholyte solution.
  • a second chamber 14 wholely contained within the first chamber and communicating therewith only through the medium of a cation exchange membrane 16.
  • This second chamber 14 is conveniently of box like rectangular configuration having an open top and an open front across which is secured the exchange membrane 16 by means of detachable clamping plates and gaskets.
  • a sheet 1 8 of porous polyethylene may be sealingly located by the gaskets on one or both sides of the membrane 16 the polyethylene sheeting 18 being provided to prevent physical damage to the exchange membrane 16 and also providing support against sag or swelling of the exchange membrane which may occur in use.
  • the cation exchange membrane is a proprietary item and may be of the type available from Permutit-Boby of Brentford, Middlesex, England.
  • the anode 20 is locatable within the second chamber 14 and the chamber 14 is capable of being filled with an anolyte solution to at least the same level as that of the catholyte solution in the first chamber 10. It may be preferable for the level of the anolyte solution to be above that of the catholyte solution to provide a slight hydrostatic pressure in favour of the anolyte.
  • the apparatus was used for the electro-deposition of a ternary alloy of lead-antimony-tin to give a coating having a basis of lead and containing between 9.5% and 10.5% by weight of antimony and between 5.5% and 6.5% by weight of tin in the deposited alloy.
  • the anode was a lead-tin anode containing 5% to 25% by weight of tin
  • the cathode comprised a steel backing member on to which was bonded a bronze substrate. It is preferable to electroplate a base coating of cobalt or nickel on to the bronze substrate thereby to give a better surface for the deposition of the required ternary alloy particularly for the prevention of dispersal of tin into the bronze.
  • the catholyte solution in the first chamber was as follows:-
  • the temperature of the catholyte was maintained at 40°C and a cathode current density of 30 amperes per square foot was utilised for approximately 20 minutes to give a deposited alloy thickness of 25 um.
  • the second chamber was filled with an anolyte solution of the following composition
  • the temperature of the anolyte solution was maintained at 40°C
  • the temperature of the catholyte solution was maintained at 25 0 C and cathode current density of 20 amperes per square foot was utilised for approximately 20 minutes to give a deposited ternary alloy of 25 um thickness.
  • the anolyte solution was identical in all respects with the catholyte solution with the exception that no copper fluoroborate was present in the anolyte.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Conductive Materials (AREA)
EP81304194A 1980-09-23 1981-09-14 Verfahren zur galvanischen Abscheidung von Bleilegierungen Expired EP0048579B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT81304194T ATE10862T1 (de) 1980-09-23 1981-09-14 Verfahren zur galvanischen abscheidung von bleilegierungen.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8030638A GB2084191A (en) 1980-09-23 1980-09-23 Electro-deposition of alloys
GB8030638 1980-09-23

Publications (2)

Publication Number Publication Date
EP0048579A1 true EP0048579A1 (de) 1982-03-31
EP0048579B1 EP0048579B1 (de) 1984-12-19

Family

ID=10516222

Family Applications (1)

Application Number Title Priority Date Filing Date
EP81304194A Expired EP0048579B1 (de) 1980-09-23 1981-09-14 Verfahren zur galvanischen Abscheidung von Bleilegierungen

Country Status (6)

Country Link
EP (1) EP0048579B1 (de)
AT (1) ATE10862T1 (de)
BR (1) BR8106041A (de)
CA (1) CA1172599A (de)
DE (1) DE3167841D1 (de)
GB (1) GB2084191A (de)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0218772A1 (de) * 1984-08-22 1987-04-22 MIBA Gleitlager Aktiengesellschaft Galvanisch abgeschiedene Laufschicht für ein Gleitlager
WO1997031138A1 (de) * 1996-02-24 1997-08-28 Glyco-Metall-Werke, Glyco B.V. & Co. Kg Verfahren zur herstellung von schichtwerkstoff fur gleitlager sowie ein galvanisierbad zur durchführung dieses verfahrens
US6740221B2 (en) 2001-03-15 2004-05-25 Applied Materials Inc. Method of forming copper interconnects
WO2005003411A1 (en) * 2003-06-06 2005-01-13 Taskem, Inc. Tin alloy electroplating system
FR2864553A1 (fr) * 2003-12-31 2005-07-01 Coventya Installation de depot de zinc ou d'alliages de zinc
US7239747B2 (en) 2002-01-24 2007-07-03 Chatterbox Systems, Inc. Method and system for locating position in printed texts and delivering multimedia information
US20130334052A1 (en) * 2012-06-05 2013-12-19 Novellus Systems, Inc. Protecting anodes from passivation in alloy plating systems
CN103849915A (zh) * 2012-12-06 2014-06-11 北大方正集团有限公司 电镀装置和pcb板导通孔镀铜的方法
US9139927B2 (en) 2010-03-19 2015-09-22 Novellus Systems, Inc. Electrolyte loop with pressure regulation for separated anode chamber of electroplating system
US9404194B2 (en) 2010-12-01 2016-08-02 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
RU2739899C1 (ru) * 2020-07-27 2020-12-29 Алексей Игоревич Буянов Кислый электролит для нанесения антифрикционного покрытия сплавом свинец-олово-медь
US10927475B2 (en) 2017-11-01 2021-02-23 Lam Research Corporation Controlling plating electrolyte concentration on an electrochemical plating apparatus
CN113195798A (zh) * 2019-11-28 2021-07-30 油研工业股份有限公司 抑制镀覆液的锌浓度上升的方法以及锌系镀覆构件的制造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3335716A1 (de) * 1983-10-01 1985-05-02 Glyco-Metall-Werke Daelen & Loos Gmbh, 6200 Wiesbaden Gleitlager und verfahren zu seiner herstellung
CA2034568C (en) * 1990-01-19 1995-08-29 Yoshikazu Fujisawa Slide member
CA2069988C (en) * 1991-05-31 1997-03-04 Yoshikazu Fujisawa Slide member with surface composed of pyramidal microprojections
CA2070932C (en) * 1991-06-11 1995-11-07 Yoshikazu Fujisawa Slide bearing
CA2074114C (en) * 1991-07-18 1999-01-19 Yoshikazu Fujisawa Slide member
GB2324805A (en) * 1997-04-30 1998-11-04 Platt Electromeck Limited Electroplating
CN105350063B (zh) * 2015-11-09 2018-10-30 科文特亚环保电镀技术（江苏）有限公司 一种电镀液分离的阳极***

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB577335A (en) * 1944-02-10 1946-05-14 Vandervell Products Ltd Improvements in and relating to bearings and bearing surfaces
GB628459A (en) * 1945-07-10 1949-08-30 Cleveland Graphite Bronze Co Electrodeposition of lead-antimony-tin alloys
GB679947A (en) * 1950-06-09 1952-09-24 Cleveland Graphite Bronze Co Improvements in bearings
US2793990A (en) * 1952-06-04 1957-05-28 Silvercrown Ltd Electrodeposition of alloys containing copper and tin
US3616305A (en) * 1967-01-18 1971-10-26 Eugene Arbez Ets Process for depositing lead
GB2007713A (en) * 1977-10-21 1979-05-23 Dipsol Chem Method for stabilizing tin or tin alloy electroplating baths
US4217198A (en) * 1979-03-23 1980-08-12 Olin Corporation Coated perfluorosulfonic acid resin membranes and a method for their preparation

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB577335A (en) * 1944-02-10 1946-05-14 Vandervell Products Ltd Improvements in and relating to bearings and bearing surfaces
GB628459A (en) * 1945-07-10 1949-08-30 Cleveland Graphite Bronze Co Electrodeposition of lead-antimony-tin alloys
GB679947A (en) * 1950-06-09 1952-09-24 Cleveland Graphite Bronze Co Improvements in bearings
US2793990A (en) * 1952-06-04 1957-05-28 Silvercrown Ltd Electrodeposition of alloys containing copper and tin
US3616305A (en) * 1967-01-18 1971-10-26 Eugene Arbez Ets Process for depositing lead
GB2007713A (en) * 1977-10-21 1979-05-23 Dipsol Chem Method for stabilizing tin or tin alloy electroplating baths
US4217198A (en) * 1979-03-23 1980-08-12 Olin Corporation Coated perfluorosulfonic acid resin membranes and a method for their preparation

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
METAL FINISHING, vol. 74, no. 1, January 1976, METALS AND PLASTICS PUBLICATIONS, INC., Hackensach, N.J. USA Pages 30-34 * Page 34, especially "Lead Alloy Deposition " * *

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0218772A1 (de) * 1984-08-22 1987-04-22 MIBA Gleitlager Aktiengesellschaft Galvanisch abgeschiedene Laufschicht für ein Gleitlager
WO1997031138A1 (de) * 1996-02-24 1997-08-28 Glyco-Metall-Werke, Glyco B.V. & Co. Kg Verfahren zur herstellung von schichtwerkstoff fur gleitlager sowie ein galvanisierbad zur durchführung dieses verfahrens
US6086742A (en) * 1996-02-24 2000-07-11 Glyco-Metall-Werke, Glyco B.V. & Co. Kg Method of producing layered material for sliding bearings and an electroplating bath for carrying out this method
US6740221B2 (en) 2001-03-15 2004-05-25 Applied Materials Inc. Method of forming copper interconnects
US7239747B2 (en) 2002-01-24 2007-07-03 Chatterbox Systems, Inc. Method and system for locating position in printed texts and delivering multimedia information
WO2005003411A1 (en) * 2003-06-06 2005-01-13 Taskem, Inc. Tin alloy electroplating system
US7195702B2 (en) 2003-06-06 2007-03-27 Taskem, Inc. Tin alloy electroplating system
FR2864553A1 (fr) * 2003-12-31 2005-07-01 Coventya Installation de depot de zinc ou d'alliages de zinc
WO2005073438A1 (fr) * 2003-12-31 2005-08-11 Coventya Sas Installation de depot de zinc ou d’alliages de zinc
US9139927B2 (en) 2010-03-19 2015-09-22 Novellus Systems, Inc. Electrolyte loop with pressure regulation for separated anode chamber of electroplating system
US9404194B2 (en) 2010-12-01 2016-08-02 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
TWI585823B (zh) * 2010-12-01 2017-06-01 諾菲勒斯系統公司 電鍍裝置及晶圓級封裝製程
US10309024B2 (en) 2010-12-01 2019-06-04 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
US9982357B2 (en) 2010-12-01 2018-05-29 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
US9534308B2 (en) 2012-06-05 2017-01-03 Novellus Systems, Inc. Protecting anodes from passivation in alloy plating systems
US20170137960A1 (en) * 2012-06-05 2017-05-18 Novellus Systems, Inc. Protecting anodes from passivation in alloy plating systems
US10106907B2 (en) 2012-06-05 2018-10-23 Novellus Systems, Inc. Protecting anodes from passivation in alloy plating systems
US20130334052A1 (en) * 2012-06-05 2013-12-19 Novellus Systems, Inc. Protecting anodes from passivation in alloy plating systems
US10954605B2 (en) 2012-06-05 2021-03-23 Novellus Systems, Inc. Protecting anodes from passivation in alloy plating systems
CN103849915A (zh) * 2012-12-06 2014-06-11 北大方正集团有限公司 电镀装置和pcb板导通孔镀铜的方法
CN103849915B (zh) * 2012-12-06 2016-08-31 北大方正集团有限公司 电镀装置和pcb板导通孔镀铜的方法
US10927475B2 (en) 2017-11-01 2021-02-23 Lam Research Corporation Controlling plating electrolyte concentration on an electrochemical plating apparatus
US11401623B2 (en) 2017-11-01 2022-08-02 Lam Research Corporation Controlling plating electrolyte concentration on an electrochemical plating apparatus
CN113195798A (zh) * 2019-11-28 2021-07-30 油研工业股份有限公司 抑制镀覆液的锌浓度上升的方法以及锌系镀覆构件的制造方法
US20220298668A1 (en) * 2019-11-28 2022-09-22 Yuken Industry Co., Ltd. Method for suppressing increase in zinc concentration of plating solution and method for manufacturing zinc-based plating member
RU2739899C1 (ru) * 2020-07-27 2020-12-29 Алексей Игоревич Буянов Кислый электролит для нанесения антифрикционного покрытия сплавом свинец-олово-медь

Also Published As

Publication number Publication date
CA1172599A (en) 1984-08-14
BR8106041A (pt) 1982-06-08
EP0048579B1 (de) 1984-12-19
ATE10862T1 (de) 1985-01-15
GB2084191A (en) 1982-04-07
DE3167841D1 (en) 1985-01-31

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