EP0006442B1 - Résistance en couche mince ajustable - Google Patents
Résistance en couche mince ajustable Download PDFInfo
- Publication number
- EP0006442B1 EP0006442B1 EP79101562A EP79101562A EP0006442B1 EP 0006442 B1 EP0006442 B1 EP 0006442B1 EP 79101562 A EP79101562 A EP 79101562A EP 79101562 A EP79101562 A EP 79101562A EP 0006442 B1 EP0006442 B1 EP 0006442B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- thin film
- thin
- film resistor
- resistor
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/23—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by opening or closing resistor geometric tracks of predetermined resistive values, e.g. snapistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/006—Thin film resistors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49099—Coating resistive material on a base
Definitions
- the invention relates to a matchable thin-film resistor with a thin film in a rectangular configuration, the length of which is determined by the distance between two electrodes extending over the width of this configuration, and which is matched by making cuts in the thin film.
- a thin-film resistor according to the first part of claim 1 is known from DE-A-2123283.
- Film resistors are generally used in printed circuits and include so-called thick film resistors, which are conventionally produced by screen printing a resistive material on an insulating substrate, and so-called thin film resistors, which are conventionally realized by sputtering or evaporation of a resistive material on an insulating substrate .
- thick film resistors which are conventionally produced by screen printing a resistive material on an insulating substrate
- thin film resistors which are conventionally realized by sputtering or evaporation of a resistive material on an insulating substrate .
- a cut is made along the electrical current path, through which the effective width of the resistor becomes smaller and thus the resistance value increases.
- the cut can be made mechanically or chemically or also by evaporation of the resistance material by laser radiation.
- the advantages of a comparison with a laser beam are a higher production output, greater flexibility in the comparison and closer tolerances of the resistance values achieved
- a thin-film pattern is generated that contains lines connected in series and in parallel. With the help of a laser beam, certain lines are interrupted, so that the length of the thin layer changes.
- This method has the advantage that, starting from a given thin-film structure, it guarantees a wide range of variation with regard to the achievable resistance values. It is disadvantageous that the thin-film resistors produced in this way require a very large area.
- metallized ceramic modules are used, which are arranged on a printed circuit board and carry at least one integrated semiconductor die.
- a large number of so-called terminating resistors are arranged on a metallized, ceramic substrate with a side length of 25.04 mm.
- the resistors connect the die to input / output terminals.
- resistors of 750 ohms and also resistors of 7500 ohms are required.
- thick-film resistors with a thickness of the order of 24 ⁇ m have been tried.
- Each of the ceramic pastes used to produce these resistors has a certain resistance value, so that it is necessary to mix several such pastes at a time.
- the invention as characterized in the claims, therefore solves the problem of specifying a trimmable thin-film resistor, in which its surface configuration and suitable selection of the trimming points ensure that a maximum range of variation for the resistance values is achieved with a minimal area requirement becomes.
- the trimmable thin-film resistor is manufactured in particular by Ver Use of a ceramic-metal connection (CrSiO) as a material for the thin layer.
- the thickness of the thin layer is of the order of 100 nm, which ensures good stability and at the same time only thin laser cuts are required for the adjustment.
- the adjustment is carried out by means of a laser beam, through which the material evaporates in sharply delimited areas and thus an increase in the resistance value is brought about.
- the areal configuration of the resistor and the adjustment points are now selected so that a maximum adjustment area is achieved with a minimum area requirement of the resistor. For this reason, a flat configuration determined by a low ratio of length to width is selected for the thin layer.
- the sheet resistance of the material used is preferably 1000 ohms / square.
- the material is applied to an insulating substrate and connected to suitable electrodes.
- the number of square squares results from the ratio of length to width of the thin layer.
- laser cuts are carried out, which change the area-related configuration and make it possible to generate many area squares. In this way, an extremely wide adjustment range is obtained, so that, based on a basic resistance value, a wide range of variation with regard to the resistance values is achieved. This range of variation makes it possible for many applications that require different resistance values to provide a common basic structure for the thin-film resistor, so that only one part number is required in each case.
- the adjustable thin-film resistor according to the invention has the desired surface configuration with a small ratio of length to width of the thin film.
- the resistance is in the unbalanced state.
- the material of the thin layer of the resistor 10 preferably consists of a composition of 62% Cr and 38% SiO.
- the sheet resistance of this ceramic-metal compound depends on the composition, the resistance increasing with an increasing proportion of SiO. Suitable compositions range from 70% Cr - 30% SiO to 50% Cr - 50% SiO. The greatest flexibility for the adjustment of the resistance is achieved with a composition of 62% Cr - 38% SiO.
- the thin layer 10 is applied to a ceramic substrate 11 having a side length of 25.4 mm, which at the same time forms the basis for a metallized ceramic module.
- a complete module (not shown) then contains an integrated semiconductor die, a metallic line pattern, a plurality of input / output connections and a plurality of thin-film resistors, which serve, for example, as terminating resistors between semiconductor dies and the input / output connections.
- the thin layer 10 is preferably applied to the ceramic substrate 11 by sputtering as a continuous layer, since this method is quick and inexpensive.
- the thickness of the thin layer can be, for example, in the range from 50 to 150 nm. In the exemplary embodiment under consideration, the thickness is 100 nm.
- the sheet resistance of the material can vary from 700 to 3000 ohms / square. By using a conventional four-point measurement method, the atomization process can be controlled so that a resistance value of 1000 ohms / square area is achieved.
- the resistance layer has a length of 0.508 mm, which corresponds to the current path between the electrodes, and a width of 2.032 mm. This corresponds to a surface geometry with a length-to-width ratio of 1 to 4.
- the resistance layer itself is preferably defined by plasma etching, since narrower tolerances and greater long-term constancy can be achieved. With the thin-film resistor according to the invention, tolerances of ⁇ 2% are possible.
- the resistance value of the thin film depends on the number of square squares, which varies with the ratio of length to width. Since the resistor according to FIG. 1 should have a sheet resistance of 1000 ohms / square and the ratio of length to width before the adjustment is 1 to 4, the resistance in the original state has a resistance value corresponding to 1 ⁇ 4 square, which results in 250 ohms.
- it is an object of the invention is set at a resistance base structure by matching over a wide area distributed resistance values' to be able to be without thereby determine that an influence on the area expense.
- These different resistances can be produced by the configuration and matching method according to the invention, which is characterized by a change in the number of square squares.
- the unbalanced resistor has a length of 0.508mm and a width of 2.032mm, which gives% area square with a resistance of 250 ohms.
- the in Figs. 3 to 5 shown matched resistors have a different number of square squares, which are arranged in parallel between the electrodes. The resistance value is increased by this different number of surface squares.
- a laser cut 14 is provided, by means of which a ratio of length to width in the size of 0.508 mm to 1.524 mm is achieved. This creates a '/ 3 square, which corresponds to 333 ohms.
- a laser cut 15 in FIG. 4 produces 1 ⁇ 2 square area, which results in 500 ohms.
- the laser cut 16 provided in FIG. 5 generates a 1 square area, which results in 1000 ohms.
- the adjustment changes the number of square squares that lie serially between the electrodes, thereby increasing the resistance value.
- the laser cut 17 brings about a ratio of length to width of 0.508 mm to 0.254 mm.
- laser cuts 18 and 19 generate a current path of 9 square squares between the electrodes, so that a resistance value of 9000 ohms results.
- the laser cuts 20, 21 and 22 provide a current path comprising 16 square squares and thus a resistance value of 16000 ohms.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/921,291 US4191938A (en) | 1978-07-03 | 1978-07-03 | Cermet resistor trimming method |
US921291 | 1986-10-20 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0006442A2 EP0006442A2 (fr) | 1980-01-09 |
EP0006442A3 EP0006442A3 (en) | 1980-01-23 |
EP0006442B1 true EP0006442B1 (fr) | 1983-01-12 |
Family
ID=25445215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP79101562A Expired EP0006442B1 (fr) | 1978-07-03 | 1979-05-22 | Résistance en couche mince ajustable |
Country Status (3)
Country | Link |
---|---|
US (1) | US4191938A (fr) |
EP (1) | EP0006442B1 (fr) |
DE (1) | DE2964466D1 (fr) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56106159A (en) * | 1980-01-28 | 1981-08-24 | Hitachi Ltd | Production of sensor for detecting flow speed and flow rate |
US4381441A (en) * | 1980-10-30 | 1983-04-26 | Western Electric Company, Inc. | Methods of and apparatus for trimming film resistors |
US5243319A (en) * | 1991-10-30 | 1993-09-07 | Analog Devices, Inc. | Trimmable resistor network providing wide-range trims |
US5387776A (en) * | 1993-05-11 | 1995-02-07 | General Electric Company | Method of separation of pieces from super hard material by partial laser cut and pressure cleavage |
US5548486A (en) * | 1994-01-21 | 1996-08-20 | International Business Machines Corporation | Pinned module |
US5878483A (en) * | 1995-06-01 | 1999-03-09 | International Business Machines Corporation | Hammer for forming bulges in an array of compliant pin blanks |
JPH10242394A (ja) * | 1997-02-27 | 1998-09-11 | Matsushita Electron Corp | 半導体装置の製造方法 |
US5859581A (en) * | 1997-06-20 | 1999-01-12 | International Resistive Company, Inc. | Thick film resistor assembly for fan controller |
US6664500B2 (en) | 2000-12-16 | 2003-12-16 | Anadigics, Inc. | Laser-trimmable digital resistor |
US6585904B2 (en) * | 2001-02-15 | 2003-07-01 | Peter Kukanskis | Method for the manufacture of printed circuit boards with plated resistors |
JP4428329B2 (ja) * | 2005-05-30 | 2010-03-10 | エプソンイメージングデバイス株式会社 | 電気光学装置及びその製造方法並びに電子機器 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1363702A (fr) * | 1963-07-18 | 1964-06-12 | Gen Mills Inc | Procédé de fabrication d'une résistance électrique pelliculaire |
US3308528A (en) * | 1963-11-06 | 1967-03-14 | Ibm | Fabrication of cermet film resistors to close tolerances |
US3398032A (en) * | 1964-11-27 | 1968-08-20 | Ibm | Method of making cermet resistors by etching |
US3573816A (en) * | 1966-04-25 | 1971-04-06 | Sprague Electric Co | Production of electric circuit elements |
US3607386A (en) * | 1968-06-04 | 1971-09-21 | Robert T Galla | Method of preparing resistive films |
US3573703A (en) * | 1969-05-09 | 1971-04-06 | Darnall P Burks | Resistor and method of adjusting resistance |
US3768150A (en) * | 1970-02-13 | 1973-10-30 | B Sloan | Integrated circuit process utilizing orientation dependent silicon etch |
DE2123283A1 (de) * | 1971-05-11 | 1972-11-23 | Siemens AG, 1000 Berlin u. 8000 München | Verfahren zum Abgleichen von Dünnschichtwiderständen und -kondensatoren |
US3864825A (en) * | 1972-06-12 | 1975-02-11 | Microsystems Int Ltd | Method of making thin-film microelectronic resistors |
DE2319899C3 (de) * | 1973-04-19 | 1979-02-01 | Draloric Electronic Gmbh, 8500 Nuernberg | Verfahren zum Abgleich von Schichtwiderständen |
US3947801A (en) * | 1975-01-23 | 1976-03-30 | Rca Corporation | Laser-trimmed resistor |
DE2724498C2 (de) * | 1977-05-31 | 1982-06-03 | Siemens AG, 1000 Berlin und 8000 München | Elektrischer Schichtwiderstand und Verfahren zu seiner Herstellung |
FR2404902A1 (fr) * | 1977-09-29 | 1979-04-27 | Electro Resistance | Procede pour la fabrication de resistances electriques planes de haute precision et resistances s'y rapportant |
-
1978
- 1978-07-03 US US05/921,291 patent/US4191938A/en not_active Expired - Lifetime
-
1979
- 1979-05-22 EP EP79101562A patent/EP0006442B1/fr not_active Expired
- 1979-05-22 DE DE7979101562T patent/DE2964466D1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0006442A2 (fr) | 1980-01-09 |
US4191938A (en) | 1980-03-04 |
DE2964466D1 (en) | 1983-02-17 |
EP0006442A3 (en) | 1980-01-23 |
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