EA200100329A1 - Некруговые соединительные отверстия для печатных плат - Google Patents
Некруговые соединительные отверстия для печатных платInfo
- Publication number
- EA200100329A1 EA200100329A1 EA200100329A EA200100329A EA200100329A1 EA 200100329 A1 EA200100329 A1 EA 200100329A1 EA 200100329 A EA200100329 A EA 200100329A EA 200100329 A EA200100329 A EA 200100329A EA 200100329 A1 EA200100329 A1 EA 200100329A1
- Authority
- EA
- Eurasian Patent Office
- Prior art keywords
- pcb
- circuit connecting
- connecting openings
- created
- obtaining
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09354—Ground conductor along edge of main surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Созданы некруговые микроотверстия (102) для печатных плат и способ их получения.Международная заявка была опубликована вместе с отчетом о международном поиске.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US9973098P | 1998-09-10 | 1998-09-10 | |
PCT/US1999/020418 WO2000016443A1 (en) | 1998-09-10 | 1999-09-07 | Non-circular micro-via |
Publications (2)
Publication Number | Publication Date |
---|---|
EA200100329A1 true EA200100329A1 (ru) | 2001-10-22 |
EA003157B1 EA003157B1 (ru) | 2003-02-27 |
Family
ID=22276347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EA200100329A EA003157B1 (ru) | 1998-09-10 | 1999-09-07 | Некруговые соединительные отверстия для печатных плат |
Country Status (16)
Country | Link |
---|---|
EP (1) | EP1127387B1 (ru) |
JP (1) | JP2002525854A (ru) |
KR (3) | KR20010086372A (ru) |
CN (1) | CN1133240C (ru) |
AU (2) | AU5812099A (ru) |
BR (1) | BR9913588A (ru) |
CA (1) | CA2343445A1 (ru) |
DE (1) | DE69934814T2 (ru) |
EA (1) | EA003157B1 (ru) |
ES (1) | ES2281188T3 (ru) |
HK (1) | HK1042780A1 (ru) |
IL (1) | IL141826A0 (ru) |
NO (1) | NO20011219L (ru) |
PL (1) | PL346561A1 (ru) |
TR (1) | TR200100713T2 (ru) |
WO (2) | WO2000016443A1 (ru) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10052532C2 (de) * | 2000-10-23 | 2002-11-14 | Conducta Endress & Hauser | Leiterplatte mit einer Eingangsschaltung zur Aufnahme und Verarbeitung eines elektrischen Signals sowie Verwendung der Leiterplatte |
KR20030053466A (ko) * | 2001-01-24 | 2003-06-28 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 기판 위에 트랙을 제조하는 방법 |
DE10219388A1 (de) | 2002-04-30 | 2003-11-20 | Siemens Ag | Verfahren zur Erzeugung einer Grabenstruktur in einem Polymer-Substrat |
WO2007052396A1 (ja) * | 2005-10-31 | 2007-05-10 | Sharp Kabushiki Kaisha | 多層配線基板及び多層配線基板の製造方法 |
JP2009033114A (ja) * | 2007-06-29 | 2009-02-12 | Tdk Corp | 電子モジュール、及び電子モジュールの製造方法 |
DE102009019782A1 (de) | 2009-05-02 | 2010-11-04 | Valeo Schalter Und Sensoren Gmbh | Verfahren zur Herstellung von durchkontaktierbaren Leiterplatten |
JP2011061021A (ja) * | 2009-09-10 | 2011-03-24 | Kyokutoku Kagi Kofun Yugenkoshi | 非円柱ビア構造及びこのビア構造を有する伝熱促進基板 |
US8488329B2 (en) | 2010-05-10 | 2013-07-16 | International Business Machines Corporation | Power and ground vias for power distribution systems |
US8748750B2 (en) | 2011-07-08 | 2014-06-10 | Honeywell International Inc. | Printed board assembly interface structures |
WO2014108744A1 (en) * | 2013-01-09 | 2014-07-17 | Freescale Semiconductor, Inc. | Electronic high frequency device and manufacturing method |
KR102128508B1 (ko) * | 2013-10-08 | 2020-06-30 | 엘지이노텍 주식회사 | 인쇄회로기판 |
KR101507268B1 (ko) * | 2014-01-10 | 2015-03-30 | (주)인터플렉스 | 연성회로기판의 그라운드 확장 구조 |
US20170064821A1 (en) * | 2015-08-31 | 2017-03-02 | Kristof Darmawikarta | Electronic package and method forming an electrical package |
US10516207B2 (en) | 2017-05-17 | 2019-12-24 | Nxp B.V. | High frequency system, communication link |
FR3077158B1 (fr) * | 2018-01-25 | 2021-02-26 | Commissariat Energie Atomique | Puce electronique a face arriere protegee par une structure de fragilisation amelioree |
ES2884900T3 (es) * | 2018-06-13 | 2021-12-13 | Airbus Operations Slu | Procedimiento para instalar cables impresos en sistemas colectores de cables para aeronaves, y elemento compuesto con un sistema colector de cables integrado |
US11652039B2 (en) | 2019-03-12 | 2023-05-16 | Absolics Inc. | Packaging substrate with core layer and cavity structure and semiconductor device comprising the same |
JP7254930B2 (ja) | 2019-03-12 | 2023-04-10 | アブソリックス インコーポレイテッド | パッケージング基板及びこれを含む半導体装置 |
WO2020185020A1 (ko) | 2019-03-12 | 2020-09-17 | 에스케이씨 주식회사 | 유리를 포함하는 기판의 적재 카세트 및 이를 적용한 기판의 적재방법 |
JP7087205B2 (ja) | 2019-03-29 | 2022-06-20 | アブソリックス インコーポレイテッド | 半導体用パッケージングガラス基板、半導体用パッケージング基板及び半導体装置 |
EP3905323A4 (en) | 2019-08-23 | 2022-10-19 | Absolics Inc. | PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE WITH IT |
KR20220003342A (ko) | 2020-07-01 | 2022-01-10 | 삼성전기주식회사 | 전자 소자 패키지 및 이의 제조방법 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA939831A (en) * | 1969-03-27 | 1974-01-08 | Frederick W. Schneble (Jr.) | Plated through hole printed circuit boards |
US5347086A (en) * | 1992-03-24 | 1994-09-13 | Microelectronics And Computer Technology Corporation | Coaxial die and substrate bumps |
US5304743A (en) * | 1992-05-12 | 1994-04-19 | Lsi Logic Corporation | Multilayer IC semiconductor package |
JP3241139B2 (ja) * | 1993-02-04 | 2001-12-25 | 三菱電機株式会社 | フィルムキャリア信号伝送線路 |
US5401912A (en) * | 1993-06-07 | 1995-03-28 | St Microwave Corp., Arizona Operations | Microwave surface mount package |
US5359767A (en) * | 1993-08-26 | 1994-11-01 | International Business Machines Corporation | Method of making multilayered circuit board |
JPH07235775A (ja) * | 1994-02-21 | 1995-09-05 | Mitsubishi Electric Corp | 多層プリント配線基板 |
US5773195A (en) * | 1994-12-01 | 1998-06-30 | International Business Machines Corporation | Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap |
EP0916237B1 (de) * | 1996-07-31 | 2001-01-17 | Dyconex Patente | Verfahren zur herstellung von verbindungsleitern |
US5724727A (en) * | 1996-08-12 | 1998-03-10 | Motorola, Inc. | Method of forming electronic component |
-
1999
- 1999-09-07 EP EP99945538A patent/EP1127387B1/en not_active Expired - Lifetime
- 1999-09-07 PL PL99346561A patent/PL346561A1/xx unknown
- 1999-09-07 EA EA200100329A patent/EA003157B1/ru active IP Right Revival
- 1999-09-07 AU AU58120/99A patent/AU5812099A/en not_active Abandoned
- 1999-09-07 BR BR9913588-4A patent/BR9913588A/pt not_active IP Right Cessation
- 1999-09-07 ES ES99945538T patent/ES2281188T3/es not_active Expired - Lifetime
- 1999-09-07 IL IL14182699A patent/IL141826A0/xx unknown
- 1999-09-07 CN CN998107409A patent/CN1133240C/zh not_active Expired - Fee Related
- 1999-09-07 DE DE69934814T patent/DE69934814T2/de not_active Expired - Fee Related
- 1999-09-07 TR TR2001/00713T patent/TR200100713T2/xx unknown
- 1999-09-07 WO PCT/US1999/020418 patent/WO2000016443A1/en active IP Right Grant
- 1999-09-07 KR KR1020017002973A patent/KR20010086372A/ko active Application Filing
- 1999-09-07 JP JP2000570871A patent/JP2002525854A/ja active Pending
- 1999-09-07 CA CA002343445A patent/CA2343445A1/en not_active Abandoned
- 1999-09-09 AU AU58209/99A patent/AU5820999A/en not_active Withdrawn
- 1999-09-09 WO PCT/US1999/020830 patent/WO2000014771A2/en unknown
-
2001
- 2001-03-09 NO NO20011219A patent/NO20011219L/no not_active Application Discontinuation
-
2002
- 2002-02-28 HK HK02101572A patent/HK1042780A1/xx not_active IP Right Cessation
-
2003
- 2003-08-25 KR KR10-2003-0058610A patent/KR100455021B1/ko not_active IP Right Cessation
- 2003-08-25 KR KR10-2003-0058608A patent/KR20030074544A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
AU5820999A (en) | 2000-03-27 |
HK1042780A1 (en) | 2002-08-23 |
KR20030074545A (ko) | 2003-09-19 |
EP1127387A1 (en) | 2001-08-29 |
ES2281188T3 (es) | 2007-09-16 |
NO20011219L (no) | 2001-05-04 |
CN1133240C (zh) | 2003-12-31 |
IL141826A0 (en) | 2002-03-10 |
NO20011219D0 (no) | 2001-03-09 |
DE69934814D1 (de) | 2007-02-22 |
AU5812099A (en) | 2000-04-03 |
JP2002525854A (ja) | 2002-08-13 |
BR9913588A (pt) | 2001-06-05 |
WO2000016443A1 (en) | 2000-03-23 |
EP1127387A4 (en) | 2004-05-26 |
KR100455021B1 (ko) | 2004-11-06 |
DE69934814T2 (de) | 2007-10-11 |
TR200100713T2 (tr) | 2001-10-22 |
PL346561A1 (en) | 2002-02-11 |
KR20010086372A (ko) | 2001-09-10 |
EA003157B1 (ru) | 2003-02-27 |
WO2000014771A2 (en) | 2000-03-16 |
CA2343445A1 (en) | 2000-03-23 |
EP1127387B1 (en) | 2007-01-10 |
KR20030074544A (ko) | 2003-09-19 |
CN1317163A (zh) | 2001-10-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s) |
Designated state(s): BY KZ MD |
|
NF4A | Restoration of lapsed right to a eurasian patent |
Designated state(s): BY KZ MD |