DK440085D0 - Epoxyharpiksmateriale og fremgangsmaade til fremstilling af laminater deraf - Google Patents

Epoxyharpiksmateriale og fremgangsmaade til fremstilling af laminater deraf

Info

Publication number
DK440085D0
DK440085D0 DK440085A DK440085A DK440085D0 DK 440085 D0 DK440085 D0 DK 440085D0 DK 440085 A DK440085 A DK 440085A DK 440085 A DK440085 A DK 440085A DK 440085 D0 DK440085 D0 DK 440085D0
Authority
DK
Denmark
Prior art keywords
epoxy resin
laminates
procedures
production
resin materials
Prior art date
Application number
DK440085A
Other languages
English (en)
Other versions
DK440085A (da
Inventor
Raymond Koenig
Dieter H Klein
Robert Urscheler
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of DK440085A publication Critical patent/DK440085A/da
Publication of DK440085D0 publication Critical patent/DK440085D0/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C08G14/10—Melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C08G59/623—Aminophenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Processing Of Terminals (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DK440085A 1984-01-31 1985-09-27 Epoxyharpiksmateriale og fremgangsmaade til fremstilling af laminater deraf DK440085D0 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3403172 1984-01-31
PCT/EP1985/000026 WO1985003515A1 (en) 1984-01-31 1985-01-30 Epoxy resin composition and process for preparing laminates therefrom

Publications (2)

Publication Number Publication Date
DK440085A DK440085A (da) 1985-09-27
DK440085D0 true DK440085D0 (da) 1985-09-27

Family

ID=6226300

Family Applications (1)

Application Number Title Priority Date Filing Date
DK440085A DK440085D0 (da) 1984-01-31 1985-09-27 Epoxyharpiksmateriale og fremgangsmaade til fremstilling af laminater deraf

Country Status (18)

Country Link
US (1) US4661568A (da)
EP (2) EP0155469B1 (da)
JP (1) JPS61501154A (da)
KR (2) KR920002615B1 (da)
AT (1) ATE35817T1 (da)
AU (1) AU557131B2 (da)
BR (1) BR8505172A (da)
CA (1) CA1276358C (da)
DE (1) DE3563852D1 (da)
DK (1) DK440085D0 (da)
ES (1) ES8608020A1 (da)
FI (1) FI853743A0 (da)
IE (1) IE57890B1 (da)
IL (1) IL74199A (da)
IN (1) IN164123B (da)
NO (1) NO161266C (da)
SG (1) SG87488G (da)
WO (1) WO1985003515A1 (da)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8519290D0 (en) * 1985-07-31 1985-09-04 Dow Chemical Rheinwerk Gmbh Resin composition
IL80277A0 (en) * 1985-10-15 1987-01-30 President Eng Corp Process for the production of prepregs and metal-laminated base material for circuit boards,and apparatus for carrying out this process
US4808652A (en) * 1988-06-08 1989-02-28 Monsanto Company Crosslinker compositions comprising amino resins, epoxies and styrene allyl alcohol copolymers
US5210157A (en) * 1989-08-15 1993-05-11 Akzo N.V. Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom
MY131084A (en) * 1991-04-03 2007-07-31 Dow Chemical Co Epoxy resin compositions for use in electrical laminates.
US5364925A (en) * 1992-01-27 1994-11-15 The Dow Chemical Company Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
JPH10505376A (ja) * 1994-09-08 1998-05-26 アクゾ ノーベル ナムローゼ フェンノートシャップ エチレン性不飽和無水物とビニル化合物との共重合体を含む、アリルを含むエポキシ樹脂組成物
WO1996028490A1 (fr) * 1995-03-14 1996-09-19 Nissan Chemical Industries, Ltd. Composition refractaire a base de resine epoxy
ES2168615T3 (es) 1996-10-29 2002-06-16 Isola Laminate Systems Corp Copolimero de estireno y de anhidrido maleico que comprende una composicion de resina epoxidica y un agente de co-reticulacion.
JPH11279376A (ja) * 1998-03-27 1999-10-12 Hitachi Chem Co Ltd 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板
US6855738B2 (en) 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
DE112011103312T5 (de) * 2010-09-29 2013-08-22 Nippon Carbide Industries Co., Inc. Melamin-Epoxidharzmonomer und -Harzzusammensetzung
CN104837645A (zh) 2012-10-12 2015-08-12 高压制图公司 柔性可热封装饰性制品及其制造方法
CN104755532B (zh) * 2012-10-31 2017-05-03 英派尔科技开发有限公司 多官能三聚氰胺环氧树脂、羟甲基和胺
US9890130B2 (en) 2013-02-15 2018-02-13 Empire Technology Development Llc Phenolic epoxy compounds
CN105408411B (zh) 2013-06-13 2018-04-06 英派尔科技开发有限公司 多官能酚醛树脂
US10106494B2 (en) 2013-12-02 2018-10-23 Empire Technology Development Llc Gemini surfactant and their use
US9526185B2 (en) * 2014-04-08 2016-12-20 Finisar Corporation Hybrid PCB with multi-unreinforced laminate
US11325326B2 (en) 2015-02-27 2022-05-10 Huntsman International Llc Process for manufacturing a fiber reinforced composite article, the composite article obtained and the use thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB622675A (en) * 1946-10-02 1949-05-05 Donald Atherton Manufacture of new synthetic resinous condensation products
US3449228A (en) * 1965-04-01 1969-06-10 Ppg Industries Inc Aqueous compositions adapted for electrodeposition
US4499268A (en) * 1982-02-23 1985-02-12 Ciba Geigy Corporation Process for the preparation of isomelamines
US4467070A (en) * 1982-09-30 1984-08-21 Ford Motor Company Thermosetting coating composition comprising polymeric catalyst - III
US4393181A (en) * 1982-06-30 1983-07-12 Shell Oil Company Polyfunctional phenolic-melamine epoxy resin curing agents

Also Published As

Publication number Publication date
BR8505172A (pt) 1986-01-21
EP0169865A1 (en) 1986-02-05
NO161266C (no) 1989-07-26
WO1985003515A1 (en) 1985-08-15
NO161266B (no) 1989-04-17
US4661568A (en) 1987-04-28
DE3563852D1 (en) 1988-08-25
FI853743L (fi) 1985-09-27
FI853743A0 (fi) 1985-09-27
KR920002615B1 (ko) 1992-03-30
DK440085A (da) 1985-09-27
IE57890B1 (en) 1993-05-05
SG87488G (en) 1989-06-16
EP0155469B1 (en) 1988-07-20
IN164123B (da) 1989-01-14
IL74199A (en) 1988-07-31
CA1276358C (en) 1990-11-13
IL74199A0 (en) 1985-04-30
EP0155469A1 (en) 1985-09-25
NO853822L (no) 1985-09-27
JPH0369364B2 (da) 1991-10-31
KR850700252A (ko) 1985-12-26
ES8608020A1 (es) 1986-04-16
JPS61501154A (ja) 1986-06-12
IE850224L (en) 1985-07-31
ATE35817T1 (de) 1988-08-15
AU557131B2 (en) 1986-12-04
ES539962A0 (es) 1986-04-16
AU3934285A (en) 1985-08-27

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Legal Events

Date Code Title Description
AHB Application shelved due to non-payment