DK2655698T3 - Hovedelektrode til ecpr samt fremgangsmåder til fremstilling af denne - Google Patents
Hovedelektrode til ecpr samt fremgangsmåder til fremstilling af denneInfo
- Publication number
- DK2655698T3 DK2655698T3 DK10793274.1T DK10793274T DK2655698T3 DK 2655698 T3 DK2655698 T3 DK 2655698T3 DK 10793274 T DK10793274 T DK 10793274T DK 2655698 T3 DK2655698 T3 DK 2655698T3
- Authority
- DK
- Denmark
- Prior art keywords
- ecpr
- procedures
- manufacturing
- main electrode
- electrode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2010/070644 WO2012084045A1 (en) | 2010-12-23 | 2010-12-23 | Master electrode for ecpr and manufacturing methods thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
DK2655698T3 true DK2655698T3 (da) | 2019-08-12 |
Family
ID=43799694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK10793274.1T DK2655698T3 (da) | 2010-12-23 | 2010-12-23 | Hovedelektrode til ecpr samt fremgangsmåder til fremstilling af denne |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2655698B1 (da) |
DK (1) | DK2655698T3 (da) |
WO (1) | WO2012084045A1 (da) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5722933B2 (ja) * | 2013-02-04 | 2015-05-27 | 株式会社豊田中央研究所 | 積層電極 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57154829A (en) * | 1981-03-20 | 1982-09-24 | Internatl Rectifier Corp Japan Ltd | Forming method for electrode metal of semiconductor device |
SE523309E (sv) | 2001-06-15 | 2009-10-26 | Replisaurus Technologies Ab | Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt |
US6787450B2 (en) * | 2002-05-29 | 2004-09-07 | Micron Technology, Inc. | High aspect ratio fill method and resulting structure |
JP2009516388A (ja) * | 2005-11-18 | 2009-04-16 | レプリソールス テクノロジーズ アーベー | 多層構造の形成方法 |
-
2010
- 2010-12-23 EP EP10793274.1A patent/EP2655698B1/en active Active
- 2010-12-23 DK DK10793274.1T patent/DK2655698T3/da active
- 2010-12-23 WO PCT/EP2010/070644 patent/WO2012084045A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2012084045A1 (en) | 2012-06-28 |
EP2655698A1 (en) | 2013-10-30 |
EP2655698B1 (en) | 2019-05-15 |
WO2012084045A8 (en) | 2019-02-07 |
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