DK178412B1 - Temperature Sensor as Flip Chip on a Printed Circuit Board - Google Patents

Temperature Sensor as Flip Chip on a Printed Circuit Board Download PDF

Info

Publication number
DK178412B1
DK178412B1 DK201270292A DKPA201270292A DK178412B1 DK 178412 B1 DK178412 B1 DK 178412B1 DK 201270292 A DK201270292 A DK 201270292A DK PA201270292 A DKPA201270292 A DK PA201270292A DK 178412 B1 DK178412 B1 DK 178412B1
Authority
DK
Denmark
Prior art keywords
platinum
fields
contact
circuit board
temperature sensor
Prior art date
Application number
DK201270292A
Other languages
Danish (da)
English (en)
Inventor
Karlheinz Wienand
Gernot Hacker
Stefan Dietmann
Original Assignee
Heraeus Sensor Technology Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=47173412&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK178412(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Heraeus Sensor Technology Gmbh filed Critical Heraeus Sensor Technology Gmbh
Publication of DK201270292A publication Critical patent/DK201270292A/da
Application granted granted Critical
Publication of DK178412B1 publication Critical patent/DK178412B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
DK201270292A 2011-06-01 2012-05-31 Temperature Sensor as Flip Chip on a Printed Circuit Board DK178412B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201110103827 DE102011103827B4 (de) 2011-06-01 2011-06-01 Verfahren zur Herstellung eines Temperatursensors
DE102011103827 2011-06-01

Publications (2)

Publication Number Publication Date
DK201270292A DK201270292A (en) 2012-12-02
DK178412B1 true DK178412B1 (en) 2016-02-08

Family

ID=47173412

Family Applications (1)

Application Number Title Priority Date Filing Date
DK201270292A DK178412B1 (en) 2011-06-01 2012-05-31 Temperature Sensor as Flip Chip on a Printed Circuit Board

Country Status (4)

Country Link
CN (1) CN102809441B (zh)
AT (1) AT511506B9 (zh)
DE (1) DE102011103827B4 (zh)
DK (1) DK178412B1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201216861D0 (en) * 2012-09-20 2012-11-07 Univ Southampton Apparatus for sensing at least one parameter in water
CN107301919B (zh) * 2017-08-10 2022-11-25 珠海格力新元电子有限公司 薄膜电容器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6351884B1 (en) * 1996-09-30 2002-03-05 Heraeus Electro-Nite International N.V Process for manufacturing printed circuit boards and process for connecting wires thereto
US6437681B1 (en) * 1999-10-27 2002-08-20 Cyntec Company Structure and fabrication process for an improved high temperature sensor

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3127727A1 (de) * 1981-07-14 1983-02-03 Robert Bosch Gmbh, 7000 Stuttgart "vorrichtung zur messung der temperatur eines mediums"
DE8716103U1 (de) * 1987-12-05 1988-01-21 Degussa Ag, 6000 Frankfurt Meßwiderstand für Temperaturmessungen
DE3939165C1 (en) * 1989-11-27 1990-10-31 Heraeus Sensor Gmbh, 6450 Hanau, De Temp. sensor with measurement resistance - has ceramic disk with thin metallic coating as resistance layer, and plastic sheet conductor plate
DE29504105U1 (de) * 1995-03-09 1995-04-27 Viessmann Werke Gmbh & Co, 35108 Allendorf Temperaturfühler
DE19621001A1 (de) * 1996-05-24 1997-11-27 Heraeus Sensor Nite Gmbh Sensoranordnung zur Temperaturmessung und Verfahren zur Herstellung der Anordnung
DE19742236C2 (de) * 1997-09-25 2000-10-05 Heraeus Electro Nite Int Elektrischer Sensor, insbesondere Temperatur-Sensor, mit Leiterplatte
DE19750123C2 (de) * 1997-11-13 2000-09-07 Heraeus Electro Nite Int Verfahren zur Herstellung einer Sensoranordnung für die Temperaturmessung
EP0973020B1 (de) * 1998-07-16 2009-06-03 EPIQ Sensor-Nite N.V. Elektrischer Temperatur-Sensor mit Mehrfachschicht
EP0987529A1 (de) * 1998-09-14 2000-03-22 Heraeus Electro-Nite International N.V. Elektrischer Widerstand mit wenigstens zwei Anschlusskontaktfeldern auf einem Substrat mit wenigstens einer Ausnehmung sowie Verfahren zu dessen Herstellung
DE19936924C1 (de) * 1999-08-05 2001-06-13 Georg Bernitz Vorrichtung zur Hochtemperaturerfassung und Verfahren zur Herstellung derselben
DE10215654A1 (de) * 2002-04-09 2003-11-06 Infineon Technologies Ag Elektronisches Bauteil mit mindestens einem Halbleiterchip und Flip-Chip-Kontakten sowie Verfahren zu seiner Herstellung
DE102004034185B3 (de) * 2004-07-15 2006-01-05 Zitzmann, Heinrich, Dr. Temperaturfühler und Verfahren zu dessen Herstellung
DK178446B1 (da) * 2005-10-24 2016-02-29 Heraeus Sensor Technology Gmbh Fremgangsmåde til fremstilling af en temperatursensor
DE102006004322A1 (de) * 2006-01-31 2007-08-16 Häusermann GmbH Leiterplatte mit zusätzlichen funktionalen Elementen sowie Herstellverfahren und Anwendung
DE102008014923A1 (de) * 2008-03-19 2009-09-24 Epcos Ag Foliensensor und Verfahren zur Herstellung eines Foliensensors

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6351884B1 (en) * 1996-09-30 2002-03-05 Heraeus Electro-Nite International N.V Process for manufacturing printed circuit boards and process for connecting wires thereto
US6437681B1 (en) * 1999-10-27 2002-08-20 Cyntec Company Structure and fabrication process for an improved high temperature sensor

Also Published As

Publication number Publication date
AT511506B9 (de) 2013-11-15
CN102809441A (zh) 2012-12-05
AT511506B1 (de) 2013-07-15
CN102809441B (zh) 2015-11-25
DE102011103827A1 (de) 2012-12-06
AT511506A3 (de) 2013-04-15
DE102011103827B4 (de) 2014-12-24
AT511506A2 (de) 2012-12-15
DK201270292A (en) 2012-12-02

Similar Documents

Publication Publication Date Title
JP2926079B2 (ja) 接続導体用接触フィールドを有する回路板、その製造方法およびその使用方法
KR101811084B1 (ko) 저전류 퓨즈
US6241146B1 (en) Process for manufacturing a sensor arrangement for temperature measurement
US6082609A (en) Process for producing a sensor arrangement for measuring temperature
US10901003B2 (en) Current measuring device
DK178412B1 (en) Temperature Sensor as Flip Chip on a Printed Circuit Board
US5442145A (en) Input/output terminal for electronic circuit device
JP3652647B2 (ja) 高温検出器及びその製造方法
JPS61154152A (ja) 電子装置用ハウジング
JP5579180B2 (ja) センサ装置及びその製造方法
JPH10117063A (ja) 少なくとも一つの金属層を有する回路板の製造方法および回路板ならびにその使用方法
JP2002184601A (ja) 抵抗器
JP7394214B2 (ja) センサ素子及びセンサ素子の製造方法
US8558556B2 (en) Planar-axial thermistor for bolometry
DK179268B1 (en) Mass production of small temperature sensors with flip chips
JPH0595071U (ja) 厚膜回路基板
JP2008227055A (ja) 回路基板
JP2022541367A (ja) コンプライアント端子を備える表面実装薄膜ヒューズ
JP2006080322A (ja) チップ型複合電子部品
WO2006032836A1 (en) Thick-film hybrid production process
DK200400310U3 (da) Elektrisk sensor, navnlig temperatursensor med kredslöbsplade
JP2013197104A (ja) 外部接続導体付き回路基板及びその製造方法
JP2002232104A (ja) 配線モジュール
JP2593646B2 (ja) 電子部品
JP3890850B2 (ja) 電子回路装置