DK178412B1 - Temperature Sensor as Flip Chip on a Printed Circuit Board - Google Patents
Temperature Sensor as Flip Chip on a Printed Circuit Board Download PDFInfo
- Publication number
- DK178412B1 DK178412B1 DK201270292A DKPA201270292A DK178412B1 DK 178412 B1 DK178412 B1 DK 178412B1 DK 201270292 A DK201270292 A DK 201270292A DK PA201270292 A DKPA201270292 A DK PA201270292A DK 178412 B1 DK178412 B1 DK 178412B1
- Authority
- DK
- Denmark
- Prior art keywords
- platinum
- fields
- contact
- circuit board
- temperature sensor
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201110103827 DE102011103827B4 (de) | 2011-06-01 | 2011-06-01 | Verfahren zur Herstellung eines Temperatursensors |
DE102011103827 | 2011-06-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
DK201270292A DK201270292A (en) | 2012-12-02 |
DK178412B1 true DK178412B1 (en) | 2016-02-08 |
Family
ID=47173412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK201270292A DK178412B1 (en) | 2011-06-01 | 2012-05-31 | Temperature Sensor as Flip Chip on a Printed Circuit Board |
Country Status (4)
Country | Link |
---|---|
CN (1) | CN102809441B (zh) |
AT (1) | AT511506B9 (zh) |
DE (1) | DE102011103827B4 (zh) |
DK (1) | DK178412B1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB201216861D0 (en) * | 2012-09-20 | 2012-11-07 | Univ Southampton | Apparatus for sensing at least one parameter in water |
CN107301919B (zh) * | 2017-08-10 | 2022-11-25 | 珠海格力新元电子有限公司 | 薄膜电容器 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6351884B1 (en) * | 1996-09-30 | 2002-03-05 | Heraeus Electro-Nite International N.V | Process for manufacturing printed circuit boards and process for connecting wires thereto |
US6437681B1 (en) * | 1999-10-27 | 2002-08-20 | Cyntec Company | Structure and fabrication process for an improved high temperature sensor |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3127727A1 (de) * | 1981-07-14 | 1983-02-03 | Robert Bosch Gmbh, 7000 Stuttgart | "vorrichtung zur messung der temperatur eines mediums" |
DE8716103U1 (de) * | 1987-12-05 | 1988-01-21 | Degussa Ag, 6000 Frankfurt | Meßwiderstand für Temperaturmessungen |
DE3939165C1 (en) * | 1989-11-27 | 1990-10-31 | Heraeus Sensor Gmbh, 6450 Hanau, De | Temp. sensor with measurement resistance - has ceramic disk with thin metallic coating as resistance layer, and plastic sheet conductor plate |
DE29504105U1 (de) * | 1995-03-09 | 1995-04-27 | Viessmann Werke Gmbh & Co, 35108 Allendorf | Temperaturfühler |
DE19621001A1 (de) * | 1996-05-24 | 1997-11-27 | Heraeus Sensor Nite Gmbh | Sensoranordnung zur Temperaturmessung und Verfahren zur Herstellung der Anordnung |
DE19742236C2 (de) * | 1997-09-25 | 2000-10-05 | Heraeus Electro Nite Int | Elektrischer Sensor, insbesondere Temperatur-Sensor, mit Leiterplatte |
DE19750123C2 (de) * | 1997-11-13 | 2000-09-07 | Heraeus Electro Nite Int | Verfahren zur Herstellung einer Sensoranordnung für die Temperaturmessung |
EP0973020B1 (de) * | 1998-07-16 | 2009-06-03 | EPIQ Sensor-Nite N.V. | Elektrischer Temperatur-Sensor mit Mehrfachschicht |
EP0987529A1 (de) * | 1998-09-14 | 2000-03-22 | Heraeus Electro-Nite International N.V. | Elektrischer Widerstand mit wenigstens zwei Anschlusskontaktfeldern auf einem Substrat mit wenigstens einer Ausnehmung sowie Verfahren zu dessen Herstellung |
DE19936924C1 (de) * | 1999-08-05 | 2001-06-13 | Georg Bernitz | Vorrichtung zur Hochtemperaturerfassung und Verfahren zur Herstellung derselben |
DE10215654A1 (de) * | 2002-04-09 | 2003-11-06 | Infineon Technologies Ag | Elektronisches Bauteil mit mindestens einem Halbleiterchip und Flip-Chip-Kontakten sowie Verfahren zu seiner Herstellung |
DE102004034185B3 (de) * | 2004-07-15 | 2006-01-05 | Zitzmann, Heinrich, Dr. | Temperaturfühler und Verfahren zu dessen Herstellung |
DK178446B1 (da) * | 2005-10-24 | 2016-02-29 | Heraeus Sensor Technology Gmbh | Fremgangsmåde til fremstilling af en temperatursensor |
DE102006004322A1 (de) * | 2006-01-31 | 2007-08-16 | Häusermann GmbH | Leiterplatte mit zusätzlichen funktionalen Elementen sowie Herstellverfahren und Anwendung |
DE102008014923A1 (de) * | 2008-03-19 | 2009-09-24 | Epcos Ag | Foliensensor und Verfahren zur Herstellung eines Foliensensors |
-
2011
- 2011-06-01 DE DE201110103827 patent/DE102011103827B4/de active Active
- 2011-07-07 CN CN201110193720.0A patent/CN102809441B/zh active Active
-
2012
- 2012-05-22 AT AT501922012A patent/AT511506B9/de active
- 2012-05-31 DK DK201270292A patent/DK178412B1/en active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6351884B1 (en) * | 1996-09-30 | 2002-03-05 | Heraeus Electro-Nite International N.V | Process for manufacturing printed circuit boards and process for connecting wires thereto |
US6437681B1 (en) * | 1999-10-27 | 2002-08-20 | Cyntec Company | Structure and fabrication process for an improved high temperature sensor |
Also Published As
Publication number | Publication date |
---|---|
AT511506B9 (de) | 2013-11-15 |
CN102809441A (zh) | 2012-12-05 |
AT511506B1 (de) | 2013-07-15 |
CN102809441B (zh) | 2015-11-25 |
DE102011103827A1 (de) | 2012-12-06 |
AT511506A3 (de) | 2013-04-15 |
DE102011103827B4 (de) | 2014-12-24 |
AT511506A2 (de) | 2012-12-15 |
DK201270292A (en) | 2012-12-02 |
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