DK1611468T3 - Pakning af optoelektronisk komponent på waferniveau - Google Patents
Pakning af optoelektronisk komponent på waferniveauInfo
- Publication number
- DK1611468T3 DK1611468T3 DK04758439T DK04758439T DK1611468T3 DK 1611468 T3 DK1611468 T3 DK 1611468T3 DK 04758439 T DK04758439 T DK 04758439T DK 04758439 T DK04758439 T DK 04758439T DK 1611468 T3 DK1611468 T3 DK 1611468T3
- Authority
- DK
- Denmark
- Prior art keywords
- wafer
- optoelectronic component
- optoelectronic device
- component packing
- layer
- Prior art date
Links
- 230000005693 optoelectronics Effects 0.000 title abstract 4
- 238000012856 packing Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 4
- 230000003287 optical effect Effects 0.000 abstract 3
- 238000007789 sealing Methods 0.000 abstract 2
- 125000006850 spacer group Chemical group 0.000 abstract 2
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Optical Couplings Of Light Guides (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US45766403P | 2003-03-26 | 2003-03-26 | |
PCT/US2004/009383 WO2004088380A2 (fr) | 2003-03-26 | 2004-03-26 | Chassis optique monte sur plaquette et procedes associes |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1611468T3 true DK1611468T3 (da) | 2008-09-08 |
Family
ID=33131703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK04758439T DK1611468T3 (da) | 2003-03-26 | 2004-03-26 | Pakning af optoelektronisk komponent på waferniveau |
Country Status (6)
Country | Link |
---|---|
EP (2) | EP1953577B1 (fr) |
AT (1) | ATE396418T1 (fr) |
CA (1) | CA2523418C (fr) |
DE (1) | DE602004013945D1 (fr) |
DK (1) | DK1611468T3 (fr) |
WO (1) | WO2004088380A2 (fr) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4873566A (en) * | 1985-10-28 | 1989-10-10 | American Telephone And Telegraph Company | Multilayer ceramic laser package |
US5011256A (en) * | 1988-10-28 | 1991-04-30 | E. I. Du Pont De Nemours And Company | Package for an opto-electronic component |
TW272311B (fr) * | 1994-01-12 | 1996-03-11 | At & T Corp | |
US5912872A (en) * | 1996-09-27 | 1999-06-15 | Digital Optics Corporation | Integrated optical apparatus providing separated beams on a detector and associated methods |
US6096155A (en) | 1996-09-27 | 2000-08-01 | Digital Optics Corporation | Method of dicing wafer level integrated multiple optical elements |
US5886971A (en) * | 1996-09-27 | 1999-03-23 | Digital Optics Corporation | Optical head structures including support substrates adjacent transparent substrates and related methods |
US6981804B2 (en) * | 1998-06-08 | 2006-01-03 | Arrayed Fiberoptics Corporation | Vertically integrated optical devices coupled to optical fibers |
EP1047970B1 (fr) | 1998-08-31 | 2014-10-29 | FLIR Systems Trading Belgium BVBA | Controleur de puissance et systeme a diffraction pour laser a cavite verticale et a emission par la surface |
US6249136B1 (en) * | 1999-06-28 | 2001-06-19 | Advanced Micro Devices, Inc. | Bottom side C4 bumps for integrated circuits |
US6351027B1 (en) * | 2000-02-29 | 2002-02-26 | Agilent Technologies, Inc. | Chip-mounted enclosure |
US6492699B1 (en) * | 2000-05-22 | 2002-12-10 | Amkor Technology, Inc. | Image sensor package having sealed cavity over active area |
US6798931B2 (en) * | 2001-03-06 | 2004-09-28 | Digital Optics Corp. | Separating of optical integrated modules and structures formed thereby |
-
2004
- 2004-03-26 DK DK04758439T patent/DK1611468T3/da active
- 2004-03-26 WO PCT/US2004/009383 patent/WO2004088380A2/fr active Application Filing
- 2004-03-26 EP EP08009231.5A patent/EP1953577B1/fr not_active Expired - Lifetime
- 2004-03-26 AT AT04758439T patent/ATE396418T1/de not_active IP Right Cessation
- 2004-03-26 EP EP04758439A patent/EP1611468B1/fr not_active Expired - Lifetime
- 2004-03-26 CA CA2523418A patent/CA2523418C/fr not_active Expired - Lifetime
- 2004-03-26 DE DE602004013945T patent/DE602004013945D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO2004088380A2 (fr) | 2004-10-14 |
EP1953577A2 (fr) | 2008-08-06 |
DE602004013945D1 (de) | 2008-07-03 |
EP1611468B1 (fr) | 2008-05-21 |
EP1611468A2 (fr) | 2006-01-04 |
EP1953577B1 (fr) | 2013-07-17 |
CA2523418C (fr) | 2011-05-03 |
ATE396418T1 (de) | 2008-06-15 |
CA2523418A1 (fr) | 2004-10-14 |
WO2004088380A3 (fr) | 2005-04-21 |
EP1953577A3 (fr) | 2010-06-16 |
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