DK0780486T3 - Method and plant for forming a coating on a substrate - Google Patents

Method and plant for forming a coating on a substrate

Info

Publication number
DK0780486T3
DK0780486T3 DK96203211T DK96203211T DK0780486T3 DK 0780486 T3 DK0780486 T3 DK 0780486T3 DK 96203211 T DK96203211 T DK 96203211T DK 96203211 T DK96203211 T DK 96203211T DK 0780486 T3 DK0780486 T3 DK 0780486T3
Authority
DK
Denmark
Prior art keywords
substrate
target
coating
surface layer
chamber
Prior art date
Application number
DK96203211T
Other languages
Danish (da)
Inventor
Brande Pierre Vanden
Stephane Lucas
Alain Weymeersch
Original Assignee
Cockerill Rech & Dev
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cockerill Rech & Dev filed Critical Cockerill Rech & Dev
Application granted granted Critical
Publication of DK0780486T3 publication Critical patent/DK0780486T3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

In forming a coating of an element, especially a metal, on a substrate moving through an evaporation chamber, the novelty is that (a) the chamber is equipped with a target which has a substrate-facing surface layer containing the element; (b) the coating is formed by vapour deposition and simultaneous cathodic sputtering of the element from the target; and (c) the ratio of the amounts of evaporated and sputtered element is regulated by the energy supply to the target. Also claimed is a coating apparatus especially for carrying out the above process, the apparatus having (i) a chamber (3) equipped with a target (4) having a surface layer (5) facing the substrate (1) and containing one or more of the elements of the coating (2); (ii) a transport system for moving the substrate (1) preferably continuously past the target (4); (iii) a heat regulating system (9) for holding the surface layer (5) optionally in the liquid state and for controlled evaporation of the element; and (iv) a system (6, 8, 10, 11) for cathodic sputtering of the element from the target (4) towards the substrate (1).
DK96203211T 1995-12-20 1996-11-19 Method and plant for forming a coating on a substrate DK0780486T3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE9501052A BE1009838A3 (en) 1995-12-20 1995-12-20 Method and device for forming a coating on a substrate.
EP96203211A EP0780486B1 (en) 1995-12-20 1996-11-19 Process and apparatus for coating a substrate

Publications (1)

Publication Number Publication Date
DK0780486T3 true DK0780486T3 (en) 2005-04-25

Family

ID=3889362

Family Applications (1)

Application Number Title Priority Date Filing Date
DK96203211T DK0780486T3 (en) 1995-12-20 1996-11-19 Method and plant for forming a coating on a substrate

Country Status (7)

Country Link
EP (1) EP0780486B1 (en)
AT (1) ATE285484T1 (en)
BE (1) BE1009838A3 (en)
DE (1) DE69634071T2 (en)
DK (1) DK0780486T3 (en)
ES (1) ES2235178T3 (en)
PT (1) PT780486E (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6432281B2 (en) 1995-12-20 2002-08-13 Recherche Et Developpement Due Groupe Cockerill Sambre Process for formation of a coating on a substrate
PT908924E (en) * 1997-10-08 2003-09-30 Cockerill Rech & Dev DEVICE FOR FORMING A COATING ON A CONDENSATION SUBSTRATE
EP1182272A1 (en) * 2000-08-23 2002-02-27 Cold Plasma Applications C.P.A. Process and apparatus for continuous cold plasma deposition of metallic layers
EP1947210A1 (en) 2007-01-16 2008-07-23 ARCELOR France Method of coating a substrate, installation for implementing the method and device for supplying metal to such an installation
KR102214385B1 (en) 2014-04-04 2021-02-09 아르셀러미탈 Multi-layer substrate and fabrication method
US11459651B2 (en) 2017-02-07 2022-10-04 Applied Materials, Inc. Paste method to reduce defects in dielectric sputtering

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3799862A (en) * 1971-11-19 1974-03-26 United Aircraft Corp Apparatus for sputtering
DE2528108B2 (en) * 1975-06-24 1977-11-03 Siemens AG, 1000 Berlin und 8000 München METHOD FOR APPLYING ELECTRICALLY CONDUCTIVE LAYERS TO A SURFACE
JPH0219466A (en) * 1988-07-07 1990-01-23 Matsushita Electric Ind Co Ltd Continuous vapor-deposition device for fiber and film
US5211824A (en) * 1991-10-31 1993-05-18 Siemens Solar Industries L.P. Method and apparatus for sputtering of a liquid
US5507931A (en) 1993-12-30 1996-04-16 Deposition Technologies, Inc. Sputter deposition process
BE1008303A3 (en) * 1994-06-02 1996-04-02 Cockerill Rech & Dev Method and device for forming a coating on a substrate by sputtering.

Also Published As

Publication number Publication date
EP0780486A1 (en) 1997-06-25
EP0780486B1 (en) 2004-12-22
DE69634071D1 (en) 2005-01-27
PT780486E (en) 2005-04-29
ES2235178T3 (en) 2005-07-01
BE1009838A3 (en) 1997-10-07
ATE285484T1 (en) 2005-01-15
DE69634071T2 (en) 2005-12-08

Similar Documents

Publication Publication Date Title
US6982005B2 (en) Multiple-nozzle thermal evaporation source
WO2000028103A3 (en) Vapor source having linear aperture and coating process
JPS57134558A (en) Production of organic vapor deposited thin film
DE59914510D1 (en) Apparatus and method for coating substrates by vapor deposition by means of a PVD process
EP0931853A3 (en) Method of depositing barrier coatings by plasma assisted chemical vapour deposition
EP0629715A1 (en) Process and apparatus for continuous reactive metal deposition in vacuum
EP0740710B1 (en) Magnetron sputtering apparatus for compound thin films
KR20100052429A (en) Method and arrangement for providing chalcogens
JPS56156762A (en) Precipitation depositing method of hard metal coating , target therefor and hard metal coated decorative segment
ATE155613T1 (en) METHOD FOR PRODUCING THIN FILM BY PULSED EXCIMER LASER EVAPORATION
DK0780486T3 (en) Method and plant for forming a coating on a substrate
DE3884831D1 (en) Method and device for controlling the reactive layer deposition on substrates by means of magnetron cathodes.
US4406252A (en) Inductive heating arrangement for evaporating thin film alloy onto a substrate
FI900082A0 (en) Plant and method of coating a substrate
WO2005106071A3 (en) Continuous thermal vacuum deposition device and method
Fancey et al. Coating thickness fall-off with source to substrate distance in PVD processes
DK0685571T3 (en) Method and apparatus for coating a substrate by cathode sputtering
EP0736612A3 (en) Process for coating solar collectors
Bunshah PVD and CVD coatings
Schiller et al. Plasma-activated high-rate electron-beam evaporation for coating metal strips
JPS5537429A (en) Production of optical thin film
DK0908924T3 (en) Device for forming a coating on a substrate by condensation
ES2107786T3 (en) PROCEDURE FOR THE FORMATION OF A COATING ON A SUBSTRATE BY REACTIVE CATHODIC SPRAYING.
AU2826089A (en) Method of sputtering
JPS5462984A (en) Masking deposition method