Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
  • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
  • H01R4/68—Connections to or between superconductive connectors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/484—Connecting portions
  • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
  • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
  • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
  • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S505/00—Superconductor technology: apparatus, material, process
  • Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
  • Y10S505/701—Coated or thin film device, i.e. active or passive
  • Y10S505/703—Microelectronic device with superconducting conduction line
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S505/00—Superconductor technology: apparatus, material, process
  • Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
  • Y10S505/704—Wire, fiber, or cable
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S505/00—Superconductor technology: apparatus, material, process
  • Y10S505/80—Material per se process of making same
  • Y10S505/812—Stock
  • Y10S505/813—Wire, tape, or film
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S505/00—Superconductor technology: apparatus, material, process
  • Y10S505/825—Apparatus per se, device per se, or process of making or operating same
  • Y10S505/917—Mechanically manufacturing superconductor
  • Y10S505/927—Metallurgically bonding superconductive members

Landscapes

• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing Of Electrical Connectors (AREA)
• Superconductors And Manufacturing Methods Therefor (AREA)
• Superconductor Devices And Manufacturing Methods Thereof (AREA)
• Coupling Device And Connection With Printed Circuit (AREA)
• Multi-Conductor Connections (AREA)
• Inorganic Compounds Of Heavy Metals (AREA)
• Containers, Films, And Cooling For Superconductive Devices (AREA)
• Manufacture Of Macromolecular Shaped Articles (AREA)
• Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
• Surgical Instruments (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=8530943

Family Applications (1)

Country Status (9)

Families Citing this family (5)

Family Cites Families (5)

• 1990
  • 1990-08-17 FI FI904071A patent/FI89643C/fi active IP Right Grant
• 1991
  • 1991-06-17 DE DE69113172T patent/DE69113172T2/de not_active Expired - Fee Related
  • 1991-06-17 AT AT91109870T patent/ATE128274T1/de not_active IP Right Cessation
  • 1991-06-17 DK DK91109870.5T patent/DK0471165T3/da active
  • 1991-06-17 ES ES91109870T patent/ES2077117T3/es not_active Expired - Lifetime
  • 1991-06-17 EP EP91109870A patent/EP0471165B1/en not_active Expired - Lifetime
  • 1991-06-21 CA CA002045239A patent/CA2045239C/en not_active Expired - Lifetime
  • 1991-07-01 US US07/723,934 patent/US5148262A/en not_active Expired - Lifetime
  • 1991-08-09 JP JP03200512A patent/JP3121382B2/ja not_active Expired - Lifetime

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