ES2077117T3 - Conexion superconductora fiable para componentes superconductores de pelicula delgada y metodo para fabricar los contactos. - Google Patents
Conexion superconductora fiable para componentes superconductores de pelicula delgada y metodo para fabricar los contactos.Info
- Publication number
- ES2077117T3 ES2077117T3 ES91109870T ES91109870T ES2077117T3 ES 2077117 T3 ES2077117 T3 ES 2077117T3 ES 91109870 T ES91109870 T ES 91109870T ES 91109870 T ES91109870 T ES 91109870T ES 2077117 T3 ES2077117 T3 ES 2077117T3
- Authority
- ES
- Spain
- Prior art keywords
- union
- thin film
- contacts
- plate
- superconducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/68—Connections to or between superconductive connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
- Y10S505/701—Coated or thin film device, i.e. active or passive
- Y10S505/703—Microelectronic device with superconducting conduction line
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
- Y10S505/704—Wire, fiber, or cable
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/80—Material per se process of making same
- Y10S505/812—Stock
- Y10S505/813—Wire, tape, or film
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/825—Apparatus per se, device per se, or process of making or operating same
- Y10S505/917—Mechanically manufacturing superconductor
- Y10S505/927—Metallurgically bonding superconductive members
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Surgical Instruments (AREA)
Abstract
UN CONTACTO SUPERCONDUCTOR FIDEDIGNO PARA COMPONENTES DE PELICULA DELGADA SUPERCONDUCTORA, BASADOS EN MATERIALES SUPERCONDUCTORES BLANDOS, Y UN METODO PARA HACER LOS CONTACTOS. LA JUNTA, SEGUN LA INVENCION, CONSISTE EN UNA PLANCHA DE UNION DELGADA QUE TIENE SU EXTREMO CORTADO LONGITUDINALMENTE DE MODO QUE SE PUEDEN HACER JUNTAS PARALELAS DOBLES O MULTIPLES. EN EL METODO, SE COMPRIME UN ALAMBRE PARA HACER TORNILLOS HASTA FORMAR UNA PLACA DELGADA Y DESPUES ESTA PLACA SE CORTA PARA FORMAR PLANCHAS QUE LUEGO SE UTILIZAN EN LA UNION. EL CARACTER A MODO DE CINTA Y LA DELGADEZ DE LA PLANCHA DE UNION PERMITEN UN CONTROL PRECISO DE LA TEMPERATURA DE UNION Y REDUCEN LAS FUERZAS DE TENSION Y DE FLEXION ORIGINADAS POR LA CONTRACCION TERMICA, EVITANDO QUE EL CONTACTO SE DESCORRECE MIENTRAS SE ENFRIA EL COMPONENTE SUPERCONDUCTOR HASTA ALCANZAR LA TEMPERATURA OPERACIONAL. LOS METODOS UTILIZADOS ANTERIORMENTE HAN RESULTADO SER POCO FIDEDIGNOS ESPECIALMENTE EN APLICACIONES DE ESTE TIPO DONDE EL FUNCIONAMIENTO SIN FALLAS SIMULTANEO DE MUCHAS DECENAS DE CONTACTOS ES ESENCIAL.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI904071A FI89643C (fi) | 1990-08-17 | 1990-08-17 | Supraledande fog foer tunnfilmkomponenter och metod foer dess tillverkning |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2077117T3 true ES2077117T3 (es) | 1995-11-16 |
Family
ID=8530943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES91109870T Expired - Lifetime ES2077117T3 (es) | 1990-08-17 | 1991-06-17 | Conexion superconductora fiable para componentes superconductores de pelicula delgada y metodo para fabricar los contactos. |
Country Status (9)
Country | Link |
---|---|
US (1) | US5148262A (es) |
EP (1) | EP0471165B1 (es) |
JP (1) | JP3121382B2 (es) |
AT (1) | ATE128274T1 (es) |
CA (1) | CA2045239C (es) |
DE (1) | DE69113172T2 (es) |
DK (1) | DK0471165T3 (es) |
ES (1) | ES2077117T3 (es) |
FI (1) | FI89643C (es) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2678432B1 (fr) * | 1991-06-27 | 1993-09-03 | Alsthom Gec | Procede de liaison entre une ceramique supraconductrice a haute temperature critique et un conducteur supraconducteur a base de niobium-titane. |
DE19928324A1 (de) * | 1999-06-16 | 2000-12-21 | Siemens Ag | Stromtragende Verbindungselemente für Plattenleiter aus hochtemperatur-supraleitenden Dünnschichten |
DE102006025867A1 (de) * | 2006-06-02 | 2007-12-06 | Robert Bosch Gmbh | Bondverbindung sowie Verfahren zum Bonden zweier Kontaktflächen |
USD857420S1 (en) | 2016-12-23 | 2019-08-27 | Few Fahrzeugelektrikwerk Gmbh & Co. Kg | Mounting device |
DE102016125781A1 (de) * | 2016-12-28 | 2018-06-28 | Few Fahrzeugelektrikwerk Gmbh & Co. Kg | Elektrisches Anschlusselement |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2054506B1 (es) * | 1969-07-18 | 1975-08-22 | Thomson Csf | |
US3855693A (en) * | 1973-04-18 | 1974-12-24 | Honeywell Inf Systems | Method for assembling microelectronic apparatus |
JPS5449066A (en) * | 1977-09-27 | 1979-04-18 | Nec Corp | Semiconductor device |
US4660061A (en) * | 1983-12-19 | 1987-04-21 | Sperry Corporation | Intermediate normal metal layers in superconducting circuitry |
US4963523A (en) * | 1987-11-06 | 1990-10-16 | The United States Of America As Represented By The Secretary Of The Commerce | High-Tc superconducting unit having low contact surface resistivity and method of making. |
-
1990
- 1990-08-17 FI FI904071A patent/FI89643C/fi active IP Right Grant
-
1991
- 1991-06-17 DE DE69113172T patent/DE69113172T2/de not_active Expired - Fee Related
- 1991-06-17 AT AT91109870T patent/ATE128274T1/de not_active IP Right Cessation
- 1991-06-17 DK DK91109870.5T patent/DK0471165T3/da active
- 1991-06-17 ES ES91109870T patent/ES2077117T3/es not_active Expired - Lifetime
- 1991-06-17 EP EP91109870A patent/EP0471165B1/en not_active Expired - Lifetime
- 1991-06-21 CA CA002045239A patent/CA2045239C/en not_active Expired - Lifetime
- 1991-07-01 US US07/723,934 patent/US5148262A/en not_active Expired - Lifetime
- 1991-08-09 JP JP03200512A patent/JP3121382B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DK0471165T3 (da) | 1995-11-06 |
US5148262A (en) | 1992-09-15 |
DE69113172T2 (de) | 1996-02-15 |
EP0471165B1 (en) | 1995-09-20 |
EP0471165A2 (en) | 1992-02-19 |
FI89643B (fi) | 1993-07-15 |
FI89643C (fi) | 1993-10-25 |
CA2045239A1 (en) | 1992-02-18 |
CA2045239C (en) | 2002-04-09 |
ATE128274T1 (de) | 1995-10-15 |
FI904071A0 (fi) | 1990-08-17 |
FI904071A (fi) | 1992-02-18 |
DE69113172D1 (de) | 1995-10-26 |
JP3121382B2 (ja) | 2000-12-25 |
EP0471165A3 (en) | 1992-03-04 |
JPH0696807A (ja) | 1994-04-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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