DE69928862D1 - Zusammensetzung - Google Patents

Zusammensetzung

Info

Publication number
DE69928862D1
DE69928862D1 DE69928862T DE69928862T DE69928862D1 DE 69928862 D1 DE69928862 D1 DE 69928862D1 DE 69928862 T DE69928862 T DE 69928862T DE 69928862 T DE69928862 T DE 69928862T DE 69928862 D1 DE69928862 D1 DE 69928862D1
Authority
DE
Germany
Prior art keywords
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69928862T
Other languages
English (en)
Other versions
DE69928862T2 (de
Inventor
Morio Tominaga
Katsuya Arai
Soichi Hayashi
Kenichi Kato
Tsuyoshi Inoue
Hiroyuki Suzuki
Tetsuo Higewake
Hideaki Tomikawa
Takeshi Tokita
Norifumi Otsuka
Hiroshi Teranishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of DE69928862D1 publication Critical patent/DE69928862D1/de
Application granted granted Critical
Publication of DE69928862T2 publication Critical patent/DE69928862T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/534—Multiple station assembly or disassembly apparatus
    • Y10T29/53417—Means to fasten work parts together
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/306664—Milling including means to infeed rotary cutter toward work
    • Y10T409/307728—Milling including means to infeed rotary cutter toward work including gantry-type cutter-carrier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/30784—Milling including means to adustably position cutter
    • Y10T409/307952—Linear adjustment
    • Y10T409/308288—Linear adjustment including gantry-type cutter-carrier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/309576—Machine frame
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T483/00—Tool changing
    • Y10T483/16—Tool changing with means to transfer work
    • Y10T483/165—Plural machine tools, e.g., flexible manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T483/00—Tool changing
    • Y10T483/17—Tool changing including machine tool or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T483/00—Tool changing
    • Y10T483/17—Tool changing including machine tool or component
    • Y10T483/1733—Rotary spindle machine tool [e.g., milling machine, boring, machine, grinding machine, etc.]
    • Y10T483/179—Direct tool exchange between spindle and matrix
    • Y10T483/1793—Spindle comprises tool changer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
DE69928862T 1998-05-25 1999-05-24 Zusammensetzung Expired - Fee Related DE69928862T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10143211A JPH11340695A (ja) 1998-05-25 1998-05-25 組立装置
JP14321198 1998-05-25

Publications (2)

Publication Number Publication Date
DE69928862D1 true DE69928862D1 (de) 2006-01-19
DE69928862T2 DE69928862T2 (de) 2006-08-10

Family

ID=15333479

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69928862T Expired - Fee Related DE69928862T2 (de) 1998-05-25 1999-05-24 Zusammensetzung

Country Status (7)

Country Link
US (1) US6409642B2 (de)
EP (1) EP0961536B1 (de)
JP (1) JPH11340695A (de)
KR (1) KR100613736B1 (de)
CN (1) CN1247064C (de)
DE (1) DE69928862T2 (de)
SG (1) SG75957A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
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JPH11340695A (ja) * 1998-05-25 1999-12-10 Sony Corp 組立装置
WO2002095793A2 (de) * 2001-05-23 2002-11-28 Siemens Aktiengesellschaft Bestücksystem und verfahren zum bestücken von substraten mit bauelementen
JP4384439B2 (ja) 2002-11-21 2009-12-16 富士機械製造株式会社 対基板作業機、対基板作業システムおよび対基板作業機用作業ヘッド使用準備処理プログラム
CN101267728B (zh) * 2002-11-21 2011-09-21 富士机械制造株式会社 元件安装设备
JP4387727B2 (ja) * 2003-08-14 2009-12-24 富士通株式会社 部品実装組立セル
NL1029247C2 (nl) * 2005-06-14 2006-12-18 Assembleon Nv Werkwijze voor het instellen van ten minste een optionele instelling van een verwerkingseigenschap van de componentplaatsingsinrichting alsmede een dergelijke componentplaatsingsinrichting en elektronische sleutel.
US7950883B2 (en) * 2008-02-04 2011-05-31 Yuehting Chen Compact engraving machine
US8297892B2 (en) * 2008-06-17 2012-10-30 Sony Corportion Cutting apparatus
JP4893702B2 (ja) * 2008-07-01 2012-03-07 パナソニック株式会社 部品実装関連作業機
US7682113B2 (en) * 2008-08-08 2010-03-23 Hiwin Mikrosystems Corp. Extendable gantry
DE102009013356A1 (de) * 2009-03-16 2010-09-23 P + L Gmbh & Co. Kg Werkzeugmaschinenführungsschlittenanordnung
ATE539843T1 (de) * 2009-06-16 2012-01-15 Mag Ias Gmbh Werkzeugmaschine zur bearbeitung von werkstücken
WO2012006861A1 (zh) * 2010-07-12 2012-01-19 宁波工程学院 一种微颗粒捕获装置及应用该装置的微颗粒输运设备
CN102111990B (zh) * 2011-01-28 2012-07-25 浙江机电职业技术学院 Led插件装置
KR101516621B1 (ko) * 2011-03-24 2015-05-04 무라다기카이가부시끼가이샤 공작 기계 시스템
US20130078047A1 (en) * 2011-09-23 2013-03-28 Bor-Yann Chuang Fast changeable worktable of a carving machine
NL2007992C2 (nl) * 2011-12-16 2013-06-18 Leeuw Brouwn Victorine Gladys De Vloerplaat voor een strijkplank.
US8899887B2 (en) * 2013-02-13 2014-12-02 Interdyne Systems Inc. Drilling apparatus with a decoupled force frame and metrology frame for enhanced positioning
US9769930B2 (en) * 2013-03-19 2017-09-19 Muth Mirror Systems, Llc Module placement device and method
US11375651B2 (en) 2018-02-26 2022-06-28 Universal Instruments Corporation Dispensing head, nozzle and method
SE544249C2 (en) * 2018-02-26 2022-03-15 Universal Instruments Corp Pick-and-place spindle module, bank, and method
KR102561421B1 (ko) * 2019-09-10 2023-07-28 나럭스 컴퍼니 리미티드 조립 장치 및 조립 장치의 조정 방법
CN112743133A (zh) * 2021-01-21 2021-05-04 南京迪海智科精密机械有限公司 一种ic卡铣槽机器人及ic卡铣槽方法

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KR100262844B1 (ko) * 1996-04-01 2000-09-01 모리시타 요이찌 도전성 보올의 탑재장치 및 방법
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Also Published As

Publication number Publication date
US6409642B2 (en) 2002-06-25
SG75957A1 (en) 2000-10-24
KR100613736B1 (ko) 2006-08-22
EP0961536B1 (de) 2005-12-14
EP0961536A2 (de) 1999-12-01
JPH11340695A (ja) 1999-12-10
CN1237085A (zh) 1999-12-01
KR19990088536A (ko) 1999-12-27
EP0961536A3 (de) 2000-07-12
DE69928862T2 (de) 2006-08-10
CN1247064C (zh) 2006-03-22
US20010002380A1 (en) 2001-05-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee