DE69917943D1 - Halbleiter-drucksensor - Google Patents

Halbleiter-drucksensor

Info

Publication number
DE69917943D1
DE69917943D1 DE69917943T DE69917943T DE69917943D1 DE 69917943 D1 DE69917943 D1 DE 69917943D1 DE 69917943 T DE69917943 T DE 69917943T DE 69917943 T DE69917943 T DE 69917943T DE 69917943 D1 DE69917943 D1 DE 69917943D1
Authority
DE
Germany
Prior art keywords
pressure sensor
semiconductor pressure
semiconductor
sensor
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69917943T
Other languages
English (en)
Other versions
DE69917943T2 (de
Inventor
Masayuki Yoneda
Nobuaki Honda
Takeshi Fukiura
Shoji Nagasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azbil Corp
Original Assignee
Azbil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Azbil Corp filed Critical Azbil Corp
Publication of DE69917943D1 publication Critical patent/DE69917943D1/de
Application granted granted Critical
Publication of DE69917943T2 publication Critical patent/DE69917943T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Aerials With Secondary Devices (AREA)
DE69917943T 1999-02-15 1999-02-15 Halbleiter-drucksensor Expired - Lifetime DE69917943T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1999/000643 WO2000047969A1 (en) 1999-02-15 1999-02-15 Semiconductor pressure sensor

Publications (2)

Publication Number Publication Date
DE69917943D1 true DE69917943D1 (de) 2004-07-15
DE69917943T2 DE69917943T2 (de) 2005-06-23

Family

ID=14234928

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69917943T Expired - Lifetime DE69917943T2 (de) 1999-02-15 1999-02-15 Halbleiter-drucksensor

Country Status (6)

Country Link
US (1) US6789430B1 (de)
EP (1) EP1152232B1 (de)
JP (1) JP3455235B2 (de)
CN (1) CN1334979A (de)
DE (1) DE69917943T2 (de)
WO (1) WO2000047969A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10206464A1 (de) * 2002-02-16 2003-08-28 Micronas Gmbh Verfahren zur Herstellung einer Sensor- oder Aktuatoranordnung sowie Sensor- oder Aktuatoranordnung
US6790699B2 (en) 2002-07-10 2004-09-14 Robert Bosch Gmbh Method for manufacturing a semiconductor device
US7210362B2 (en) * 2002-11-05 2007-05-01 Tanita Corporation Diaphragm type load detection sensor, load detection unit and electronic scale using same
US7211873B2 (en) * 2003-09-24 2007-05-01 Denso Corporation Sensor device having thin membrane and method of manufacturing the same
US20060030062A1 (en) * 2004-08-05 2006-02-09 Jun He Micromachined wafer strain gauge
JP5670005B2 (ja) * 2006-03-06 2015-02-18 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 半導体装置及びその製造方法
TWI416739B (zh) * 2006-05-01 2013-11-21 Tanita Seisakusho Kk 半導體型應變檢測器及其製造方法
WO2011010381A1 (ja) * 2009-07-23 2011-01-27 イビデン株式会社 半導体圧力センサ及びその製造方法
US8215177B2 (en) * 2009-11-16 2012-07-10 Freescale Semiconductor, Inc. Apparatus and methods for applying stress-induced offset compensation in sensor devices
EP2485028B1 (de) 2011-02-07 2015-04-01 ELMOS Semiconductor AG Druckempfindliche Verstärkerstufe
US8813580B2 (en) * 2012-03-05 2014-08-26 Honeywell International Inc. Apparatus and processes for silicon on insulator MEMS pressure sensors
JP2013229356A (ja) 2012-04-24 2013-11-07 Mitsubishi Electric Corp Ｓｏｉウェハおよびその製造方法、並びにｍｅｍｓデバイス
JP5845201B2 (ja) * 2013-03-21 2016-01-20 株式会社東芝 半導体装置および歪監視装置
EP3056865B1 (de) * 2015-02-13 2019-09-04 Sensirion AG Sensorenanordnung
CN116235022A (zh) * 2020-09-29 2023-06-06 森萨塔科技公司 结隔离半导体应变计

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4975390A (en) * 1986-12-18 1990-12-04 Nippondenso Co. Ltd. Method of fabricating a semiconductor pressure sensor
JPH03200335A (ja) * 1989-12-27 1991-09-02 Mitsubishi Electric Corp 半導体装置
JPH03238875A (ja) * 1990-02-15 1991-10-24 Mitsubishi Electric Corp 半導体圧力センサ
EP0567075B1 (de) * 1992-04-22 2001-10-24 Denso Corporation Verfahren zur Herstellung einer Halbleiteranordnung
JPH06216137A (ja) * 1993-01-20 1994-08-05 Matsushita Electron Corp 半導体装置およびその製造方法
US5445975A (en) 1994-03-07 1995-08-29 Advanced Micro Devices, Inc. Semiconductor wafer with enhanced pre-process denudation and process-induced gettering
JP3489309B2 (ja) * 1995-12-27 2004-01-19 株式会社デンソー 半導体力学量センサの製造方法および異方性エッチングマスク
DE19903380B4 (de) * 1998-02-02 2007-10-18 Denso Corp., Kariya Halbleitersensoren für eine physikalische Grösse und ihre Herstellungsverfahren

Also Published As

Publication number Publication date
WO2000047969A1 (en) 2000-08-17
EP1152232B1 (de) 2004-06-09
EP1152232A4 (de) 2002-03-27
EP1152232A1 (de) 2001-11-07
US6789430B1 (en) 2004-09-14
CN1334979A (zh) 2002-02-06
DE69917943T2 (de) 2005-06-23
JP3455235B2 (ja) 2003-10-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition