DE69917688D1 - Flammenhemmendes Expoxidharz für Leiterplatte, sowie dieses verwendedes Prepreg und Metallfolien-Schichtstoff - Google Patents

Flammenhemmendes Expoxidharz für Leiterplatte, sowie dieses verwendedes Prepreg und Metallfolien-Schichtstoff

Info

Publication number
DE69917688D1
DE69917688D1 DE69917688T DE69917688T DE69917688D1 DE 69917688 D1 DE69917688 D1 DE 69917688D1 DE 69917688 T DE69917688 T DE 69917688T DE 69917688 T DE69917688 T DE 69917688T DE 69917688 D1 DE69917688 D1 DE 69917688D1
Authority
DE
Germany
Prior art keywords
well
printed circuit
epoxy resin
flame retardant
metal foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69917688T
Other languages
English (en)
Other versions
DE69917688T2 (de
Inventor
Nozomu Takano
Michitoshi Arata
Hikari Murai
Yoshiyuki Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of DE69917688D1 publication Critical patent/DE69917688D1/de
Publication of DE69917688T2 publication Critical patent/DE69917688T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
DE1999617688 1998-01-29 1999-01-15 Flammhemmendes Expoxidharz für eine gedruckte Leiterplatte, Prepreg und Metallfolienschichtstoff unter Verwendung dieses Harzes Expired - Lifetime DE69917688T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1683998A JPH11209456A (ja) 1998-01-29 1998-01-29 印刷配線板用難燃性エポキシ樹脂組成物及びこれを用いたプリプレグ、金属箔張り積層板
JP1683998 1998-01-29

Publications (2)

Publication Number Publication Date
DE69917688D1 true DE69917688D1 (de) 2004-07-08
DE69917688T2 DE69917688T2 (de) 2005-06-30

Family

ID=11927384

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1999617688 Expired - Lifetime DE69917688T2 (de) 1998-01-29 1999-01-15 Flammhemmendes Expoxidharz für eine gedruckte Leiterplatte, Prepreg und Metallfolienschichtstoff unter Verwendung dieses Harzes

Country Status (6)

Country Link
US (1) US6214468B1 (de)
EP (1) EP0933385B1 (de)
JP (1) JPH11209456A (de)
DE (1) DE69917688T2 (de)
SG (1) SG85102A1 (de)
TW (1) TW513465B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4608709B2 (ja) * 1999-08-30 2011-01-12 Ｄｉｃ株式会社 エポキシ樹脂組成物
US7931830B2 (en) * 2004-03-31 2011-04-26 Endicott Interconnect Technologies, Inc. Dielectric composition for use in circuitized substrates and circuitized substrate including same
US20060135710A1 (en) * 2004-12-17 2006-06-22 Resolution Performance Products Llc Epoxy resin compositions, methods of preparing and articles made therefrom
PT1989220E (pt) * 2006-02-02 2012-03-23 Trimeris Inc Péptidos inibidores de fusão de hiv com propriedades biológicas melhoradas
JP4961903B2 (ja) * 2006-04-27 2012-06-27 日立化成工業株式会社 エポキシ樹脂組成物、エポキシ樹脂プリプレグ、金属張積層板および印刷配線板
US8173745B2 (en) 2009-12-16 2012-05-08 Momentive Specialty Chemicals Inc. Compositions useful for preparing composites and composites produced therewith
JP5858277B2 (ja) * 2011-10-19 2016-02-10 Dic株式会社 エポキシ樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60260627A (ja) * 1984-06-07 1985-12-23 Hitachi Chem Co Ltd 印刷配線板用プリプレグの製造方法
JPS61233013A (ja) 1985-04-08 1986-10-17 Shikoku Chem Corp ポリエポキシ樹脂の硬化方法
JPS6336621A (ja) * 1986-07-31 1988-02-17 Nec Corp 監視制御方式
JPH0717736B2 (ja) * 1987-02-17 1995-03-01 油化シエルエポキシ株式会社 エポキシ樹脂組成物
EP0394965A3 (de) * 1989-04-25 1991-12-18 Mitsubishi Denki Kabushiki Kaisha Harzzusammensetzung für Laminate
JPH0776282B2 (ja) * 1989-10-06 1995-08-16 日立化成工業株式会社 印刷配線板用プリプレグの製造方法
JPH03237120A (ja) * 1990-02-15 1991-10-23 Mitsubishi Electric Corp 積層板用樹脂組成物
JPH04198231A (ja) * 1990-11-27 1992-07-17 Hitachi Chem Co Ltd 印刷配線板用プリプレグ及び銅張積層板の製造方法
JP3106407B2 (ja) * 1991-02-06 2000-11-06 油化シエルエポキシ株式会社 電気積層板用エポキシ樹脂組成物
JP2898809B2 (ja) * 1991-12-13 1999-06-02 住友ベークライト株式会社 積層板の製造方法
JPH05178963A (ja) * 1991-12-27 1993-07-20 Yuka Shell Epoxy Kk エポキシ樹脂組成物
JP3047593B2 (ja) * 1992-02-13 2000-05-29 日立化成工業株式会社 印刷配線板用プリプレグの製造方法及びそれを用いた金属芯入り銅張積層板
JPH05286075A (ja) * 1992-04-10 1993-11-02 Toshiba Chem Corp 銅張積層板の製造方法
JPH05309789A (ja) * 1992-05-13 1993-11-22 Toshiba Chem Corp コンポジット銅張積層板の製造方法
DE69332098T2 (de) * 1992-09-22 2003-03-13 Sumitomo Chemical Co., Ltd. Halogen enthaltende Epoxidharzzusammensetzung und kupferkaschiertes Laminat
TW251298B (de) * 1993-01-12 1995-07-11 Shell Internat Res Schappej Bv
EP0835892B1 (de) * 1995-06-27 2000-10-25 Hitachi Chemical Company, Ltd. Epoxidharzzusammensetzung für gedrückte leiterplatten und damit hergestellte schichtstoffplatten
JPH0912677A (ja) * 1995-06-27 1997-01-14 Hitachi Chem Co Ltd 印刷配線板用エポキシ樹脂組成物

Also Published As

Publication number Publication date
US6214468B1 (en) 2001-04-10
TW513465B (en) 2002-12-11
SG85102A1 (en) 2001-12-19
EP0933385A2 (de) 1999-08-04
DE69917688T2 (de) 2005-06-30
EP0933385B1 (de) 2004-06-02
JPH11209456A (ja) 1999-08-03
EP0933385A3 (de) 2002-05-15

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Legal Events

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