DE69907346D1 - Kompositwerkstoff auf Siliciumcarbidbasis und Herstellungsverfahren dafür - Google Patents
Kompositwerkstoff auf Siliciumcarbidbasis und Herstellungsverfahren dafürInfo
- Publication number
- DE69907346D1 DE69907346D1 DE69907346T DE69907346T DE69907346D1 DE 69907346 D1 DE69907346 D1 DE 69907346D1 DE 69907346 T DE69907346 T DE 69907346T DE 69907346 T DE69907346 T DE 69907346T DE 69907346 D1 DE69907346 D1 DE 69907346D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- composite material
- silicon carbide
- material based
- process therefor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title 1
- 229910010271 silicon carbide Inorganic materials 0.000 title 1
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- C04B35/632—Organic additives
- C04B35/634—Polymers
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- Ceramic Engineering (AREA)
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP26000398 | 1998-09-14 | ||
JP26000398 | 1998-09-14 |
Publications (2)
Publication Number | Publication Date |
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DE69907346D1 true DE69907346D1 (de) | 2003-06-05 |
DE69907346T2 DE69907346T2 (de) | 2004-03-25 |
Family
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Application Number | Title | Priority Date | Filing Date |
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DE69907346T Expired - Fee Related DE69907346T2 (de) | 1998-09-14 | 1999-09-14 | Kompositwerkstoff auf Siliciumcarbidbasis und Herstellungsverfahren dafür |
Country Status (3)
Country | Link |
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US (1) | US6280496B1 (de) |
EP (2) | EP0987231B1 (de) |
DE (1) | DE69907346T2 (de) |
Families Citing this family (39)
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JP4080030B2 (ja) * | 1996-06-14 | 2008-04-23 | 住友電気工業株式会社 | 半導体基板材料、半導体基板、半導体装置、及びその製造方法 |
JP4314675B2 (ja) * | 1999-05-28 | 2009-08-19 | 住友電気工業株式会社 | 炭化珪素粉末とそれを用いた複合材料およびそれらの製造方法 |
DE10047525B4 (de) * | 2000-09-22 | 2005-06-30 | Curamik Electronics Gmbh | Verfahren zum Herstellen eines Formkörpers unter Verwendung eines Ausgangsmaterials, welches Siliziumcarbid in Pulver- oder Partikelform sowie Kupfer enthält und so hergestellte Formkörper |
EP1205573A1 (de) | 2000-11-10 | 2002-05-15 | Shipley Company LLC | Siliziumkarbid mit hoher Wärmeleitfähigkeit |
DE10058018A1 (de) * | 2000-11-23 | 2002-05-29 | Daimler Chrysler Ag | Ausgangsmenge für eine spätere organische Beschichtung |
US7553373B2 (en) | 2001-06-15 | 2009-06-30 | Bridgestone Corporation | Silicon carbide single crystal and production thereof |
US20020189536A1 (en) * | 2001-06-15 | 2002-12-19 | Bridgestone Corporation | Silicon carbide single crystal and production thereof |
JP2003201528A (ja) * | 2001-10-26 | 2003-07-18 | Ngk Insulators Ltd | ヒートシンク材 |
GB2395360B (en) * | 2001-10-26 | 2005-03-16 | Ngk Insulators Ltd | Heat sink material |
US6972109B1 (en) * | 2002-01-29 | 2005-12-06 | The United States Of America As Represented By The Secretary Of The Air Force | Method for improving tensile properties of AlSiC composites |
JP4113971B2 (ja) | 2002-07-30 | 2008-07-09 | 株式会社豊田自動織機 | 低膨張材料及びその製造方法 |
JP4133170B2 (ja) * | 2002-09-27 | 2008-08-13 | Dowaホールディングス株式会社 | アルミニウム−セラミックス接合体 |
US7173334B2 (en) * | 2002-10-11 | 2007-02-06 | Chien-Min Sung | Diamond composite heat spreader and associated methods |
US7364692B1 (en) * | 2002-11-13 | 2008-04-29 | United States Of America As Represented By The Secretary Of The Air Force | Metal matrix composite material with high thermal conductivity and low coefficient of thermal expansion |
US20040238794A1 (en) * | 2003-05-30 | 2004-12-02 | Karandikar Prashant G. | Microwave processing of composite bodies made by an infiltration route |
US20050002818A1 (en) * | 2003-07-04 | 2005-01-06 | Hitachi Powdered Metals Co., Ltd. | Production method for sintered metal-ceramic layered compact and production method for thermal stress relief pad |
DE10336657B4 (de) * | 2003-08-09 | 2007-04-12 | M.Pore Gmbh | Verbundwerkstoff, insbesondere für Wärmetauscher, Wärmeleiter und Wärmespeicher |
US20050118482A1 (en) * | 2003-09-17 | 2005-06-02 | Tiax Llc | Electrochemical devices and components thereof |
JP2006100770A (ja) * | 2004-09-01 | 2006-04-13 | Toyota Industries Corp | 回路基板のベース板の製造方法及び回路基板のベース板並びにベース板を用いた回路基板 |
EP2017886A4 (de) * | 2006-05-09 | 2012-10-17 | Denki Kagaku Kogyo Kk | Aluminium-siliciumcarbit-verbundkörper und verfahren zu seiner verarbeitung |
CN100448572C (zh) * | 2006-11-09 | 2009-01-07 | 上海交通大学 | 点焊电极用表面改性颗粒增强铜基复合材料的制备方法 |
CN100462184C (zh) * | 2006-11-09 | 2009-02-18 | 上海交通大学 | 用于点焊电极的表面改性的颗粒增强铜基复合材料 |
US7791188B2 (en) | 2007-06-18 | 2010-09-07 | Chien-Min Sung | Heat spreader having single layer of diamond particles and associated methods |
CN102197168B (zh) * | 2008-08-29 | 2014-03-12 | 新日铁住金株式会社 | SiC单晶膜的制造方法及装置 |
JP5540937B2 (ja) * | 2009-07-03 | 2014-07-02 | 信越化学工業株式会社 | 高熱伝導性熱定着ロール又は高熱伝導性熱定着ベルト用シリコーンゴム組成物並びに定着ロール及び定着ベルト |
JP5730521B2 (ja) * | 2010-09-08 | 2015-06-10 | 株式会社日立ハイテクノロジーズ | 熱処理装置 |
US8778784B2 (en) | 2010-09-21 | 2014-07-15 | Ritedia Corporation | Stress regulated semiconductor devices and associated methods |
US9006086B2 (en) | 2010-09-21 | 2015-04-14 | Chien-Min Sung | Stress regulated semiconductor devices and associated methods |
CN103221180A (zh) | 2010-09-21 | 2013-07-24 | 铼钻科技股份有限公司 | 具有基本平坦颗粒尖端的超研磨工具及其相关方法 |
WO2012071353A1 (en) | 2010-11-22 | 2012-05-31 | Saint-Gobain Ceramics & Plastics, Inc. | Infiltrated silicon carbide bodies and methods of making |
EP2735391A4 (de) * | 2011-07-15 | 2015-03-25 | Nippon Light Metal Co | Verbundmaterial für ein wärmeableitendes substrat und verfahren zur herstellung des verbundmaterials für ein wärmeableitendes substrat |
KR101854731B1 (ko) * | 2011-07-28 | 2018-05-04 | 엘지이노텍 주식회사 | 잉곳 제조 방법 |
TW201321331A (zh) * | 2011-11-16 | 2013-06-01 | Tse Jie Entpr Ltd | 陶瓷散熱基材的製造方法 |
CN102812801B (zh) * | 2012-08-31 | 2015-01-14 | 永州市农业机械研究所 | 多功能耕作收获机 |
JP6533716B2 (ja) * | 2015-08-06 | 2019-06-19 | 信越化学工業株式会社 | SiC単結晶の製造方法 |
US10253833B2 (en) | 2017-06-30 | 2019-04-09 | Honda Motor Co., Ltd. | High performance disc brake rotor |
US11187290B2 (en) | 2018-12-28 | 2021-11-30 | Honda Motor Co., Ltd. | Aluminum ceramic composite brake assembly |
DE102019131592A1 (de) * | 2019-07-11 | 2021-01-14 | ESK-SIC GmbH | Verfahren zum Aufreinigen von Siliciumcarbid |
CN117165802B (zh) * | 2023-11-02 | 2024-01-16 | 国网山东省电力公司烟台供电公司 | 一种多尺度颗粒增强耐磨铝基复合材料的制备方法 |
Family Cites Families (10)
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US5259436A (en) * | 1991-04-08 | 1993-11-09 | Aluminum Company Of America | Fabrication of metal matrix composites by vacuum die casting |
US5561829A (en) * | 1993-07-22 | 1996-10-01 | Aluminum Company Of America | Method of producing structural metal matrix composite products from a blend of powders |
JP3183090B2 (ja) * | 1995-04-06 | 2001-07-03 | 住友金属工業株式会社 | パッケージ用セラミックスリッド |
JPH0995745A (ja) * | 1995-10-03 | 1997-04-08 | Hitachi Metals Ltd | 低熱膨張・高熱伝導性銅複合材料及びその製造方法 |
JPH09157773A (ja) * | 1995-10-03 | 1997-06-17 | Hitachi Metals Ltd | 低熱膨張・高熱伝導性アルミニウム複合材料及びその製造方法 |
EP0798393B1 (de) * | 1996-03-29 | 2001-11-21 | Hitachi Metals, Ltd. | Verfahren zur Herstellung von Aluminium-Verbundmaterial mit niedrigem thermischen Ausdehnungskoeffizient und hoher Wärmeleitfähigkeit |
JP4080030B2 (ja) * | 1996-06-14 | 2008-04-23 | 住友電気工業株式会社 | 半導体基板材料、半導体基板、半導体装置、及びその製造方法 |
EP0826646B1 (de) * | 1996-08-27 | 2003-06-18 | Asahi Glass Company Ltd. | Hoch korrosionsbeständiges Siliziumcarbidprodukt |
JPH1129379A (ja) * | 1997-02-14 | 1999-02-02 | Ngk Insulators Ltd | 半導体ヒートシンク用複合材料及びその製造方法 |
US5770324A (en) * | 1997-03-03 | 1998-06-23 | Saint-Gobain Industrial Ceramics, Inc. | Method of using a hot pressed silicon carbide dummy wafer |
-
1999
- 1999-09-08 US US09/392,093 patent/US6280496B1/en not_active Expired - Fee Related
- 1999-09-14 DE DE69907346T patent/DE69907346T2/de not_active Expired - Fee Related
- 1999-09-14 EP EP99307292A patent/EP0987231B1/de not_active Expired - Lifetime
- 1999-09-14 EP EP02025593A patent/EP1284250A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP0987231B1 (de) | 2003-05-02 |
EP1284250A1 (de) | 2003-02-19 |
EP0987231A1 (de) | 2000-03-22 |
DE69907346T2 (de) | 2004-03-25 |
US6280496B1 (en) | 2001-08-28 |
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