DE69834771D1 - Verbundkörper aus Keramik und Verfahren zu seiner Herstellung - Google Patents

Verbundkörper aus Keramik und Verfahren zu seiner Herstellung

Info

Publication number
DE69834771D1
DE69834771D1 DE69834771T DE69834771T DE69834771D1 DE 69834771 D1 DE69834771 D1 DE 69834771D1 DE 69834771 T DE69834771 T DE 69834771T DE 69834771 T DE69834771 T DE 69834771T DE 69834771 D1 DE69834771 D1 DE 69834771D1
Authority
DE
Germany
Prior art keywords
production
ceramic composite
composite body
ceramic
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69834771T
Other languages
English (en)
Other versions
DE69834771T2 (de
Inventor
Ryusuke Ushikoshi
Hideyoshi Tsuruta
Tomoyuki Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15795918&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69834771(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Application granted granted Critical
Publication of DE69834771D1 publication Critical patent/DE69834771D1/de
Publication of DE69834771T2 publication Critical patent/DE69834771T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Products (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69834771T 1997-06-20 1998-06-15 Verbundkörper aus Keramik und Verfahren zu seiner Herstellung Expired - Lifetime DE69834771T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16458297A JP3746594B2 (ja) 1997-06-20 1997-06-20 セラミックスの接合構造およびその製造方法
JP16458297 1997-06-20

Publications (2)

Publication Number Publication Date
DE69834771D1 true DE69834771D1 (de) 2006-07-20
DE69834771T2 DE69834771T2 (de) 2007-05-16

Family

ID=15795918

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69834771T Expired - Lifetime DE69834771T2 (de) 1997-06-20 1998-06-15 Verbundkörper aus Keramik und Verfahren zu seiner Herstellung

Country Status (6)

Country Link
US (1) US6617514B1 (de)
EP (1) EP0886312B1 (de)
JP (1) JP3746594B2 (de)
KR (1) KR100283600B1 (de)
DE (1) DE69834771T2 (de)
TW (1) TW407298B (de)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4005268B2 (ja) 1999-06-01 2007-11-07 日本碍子株式会社 セラミックスと金属との接合構造およびこれに使用する中間挿入材
JP2001110878A (ja) * 1999-06-09 2001-04-20 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
JP2001110879A (ja) * 1999-06-09 2001-04-20 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
SG89286A1 (en) * 1999-07-12 2002-06-18 Mitsubishi Electric Corp Insulating operating rod and manufacturing method therefor
US20020022403A1 (en) * 1999-08-06 2002-02-21 Wing L. Cheng Connectors for an eletrostatic chuck
US6603650B1 (en) * 1999-12-09 2003-08-05 Saint-Gobain Ceramics And Plastics, Inc. Electrostatic chuck susceptor and method for fabrication
US6723274B1 (en) 1999-12-09 2004-04-20 Saint-Gobain Ceramics & Plastics, Inc. High-purity low-resistivity electrostatic chucks
WO2001043184A2 (en) 1999-12-09 2001-06-14 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chucks with flat film electrode
US6607843B2 (en) * 2000-02-02 2003-08-19 Quallion Llc Brazed ceramic seal for batteries with titanium-titanium-6A1-4V cases
US6887316B2 (en) 2000-04-14 2005-05-03 Ibiden Co., Ltd. Ceramic heater
JP2002226281A (ja) * 2001-01-25 2002-08-14 Sumitomo Electric Ind Ltd 接合構造とその製造方法
US7252872B2 (en) 2003-01-29 2007-08-07 Ngk Insulators, Ltd. Joined structures of ceramics
JP4542485B2 (ja) * 2004-12-14 2010-09-15 日本碍子株式会社 アルミナ部材及びその製造方法
JP2006236867A (ja) * 2005-02-25 2006-09-07 Ngk Insulators Ltd プラズマ処理部材
JP4510745B2 (ja) * 2005-10-28 2010-07-28 日本碍子株式会社 セラミックス基材と電力供給用コネクタの接合構造
JP2007258610A (ja) 2006-03-24 2007-10-04 Ngk Insulators Ltd アルミナ焼成体
US20070251938A1 (en) * 2006-04-26 2007-11-01 Watlow Electric Manufacturing Company Ceramic heater and method of securing a thermocouple thereto
JP4762208B2 (ja) 2006-07-19 2011-08-31 日本碍子株式会社 静電チャックヒータ
US7848075B2 (en) 2006-07-19 2010-12-07 Ngk Insulators, Ltd. Electrostatic chuck with heater
JP4394667B2 (ja) 2006-08-22 2010-01-06 日本碍子株式会社 ヒータ付き静電チャックの製造方法
JP5029257B2 (ja) 2007-01-17 2012-09-19 東京エレクトロン株式会社 載置台構造及び処理装置
WO2008087983A1 (ja) * 2007-01-17 2008-07-24 Tokyo Electron Limited 載置台構造及び処理装置
JP4858319B2 (ja) * 2007-06-07 2012-01-18 住友電気工業株式会社 ウェハ保持体の電極接続構造
JP5174582B2 (ja) * 2007-08-30 2013-04-03 日本碍子株式会社 接合構造体
KR100932233B1 (ko) * 2007-11-06 2009-12-16 주식회사 메카로닉스 히터 제조방법
JP5143029B2 (ja) * 2008-01-08 2013-02-13 日本碍子株式会社 接合構造及び半導体製造装置
US8480806B2 (en) * 2008-01-08 2013-07-09 Ngk Insulators, Ltd. Bonding structure and semiconductor device manufacturing apparatus
TWI450353B (zh) * 2008-01-08 2014-08-21 Ngk Insulators Ltd A bonding structure and a semiconductor manufacturing apparatus
US8414704B2 (en) * 2008-01-08 2013-04-09 Ngk Insulators, Ltd. Bonding structure and semiconductor device manufacturing apparatus
JP5214414B2 (ja) * 2008-11-21 2013-06-19 日本特殊陶業株式会社 半導体製造装置用接続部及び半導体製造装置用接続部の形成方法
JP5717248B2 (ja) * 2011-03-30 2015-05-13 黒崎播磨株式会社 静電チャックの給電部及びその製造方法
JP5968651B2 (ja) * 2011-03-31 2016-08-10 日本碍子株式会社 半導体製造装置用部材
KR101339981B1 (ko) * 2011-11-29 2013-12-11 (주)티티에스 기판 지지 모듈
JP5642722B2 (ja) * 2012-02-06 2014-12-17 日本特殊陶業株式会社 半導体製造装置用接続部及び半導体製造装置用接続部の形成方法
KR102037920B1 (ko) * 2012-12-05 2019-10-29 세메스 주식회사 가열유닛
JP6235226B2 (ja) * 2013-04-09 2017-11-22 日本特殊陶業株式会社 接合構造体及び半導体素子収納用パッケージ
KR101727255B1 (ko) * 2015-02-23 2017-04-14 주식회사 케이에스엠컴포넌트 세라믹 히터 결합구조
JP6666717B2 (ja) * 2015-12-28 2020-03-18 日本特殊陶業株式会社 セラミックス部材
US20170211185A1 (en) * 2016-01-22 2017-07-27 Applied Materials, Inc. Ceramic showerhead with embedded conductive layers
JP6693832B2 (ja) * 2016-07-29 2020-05-13 日本特殊陶業株式会社 セラミックス部材
KR102583758B1 (ko) * 2016-08-19 2023-10-04 엘지이노텍 주식회사 세라믹 히터 및 이를 이용한 전기 자동차의 난방 장치
JP2018203581A (ja) * 2017-06-07 2018-12-27 日本特殊陶業株式会社 セラミックス構造体
JP7010750B2 (ja) * 2018-04-04 2022-01-26 日本特殊陶業株式会社 セラミックス部材および緩衝部材の製造方法
JP7025268B2 (ja) * 2018-04-04 2022-02-24 日本特殊陶業株式会社 セラミックス構造体
KR102054732B1 (ko) 2018-04-09 2019-12-11 (주)티티에스 히터의 로드 접속 구조
KR102054733B1 (ko) 2018-04-09 2019-12-11 (주)티티에스 히터의 단자접합 구조
KR102331072B1 (ko) * 2018-04-27 2021-11-29 엔지케이 인슐레이터 엘티디 웨이퍼 지지대
JP7227806B2 (ja) * 2019-03-18 2023-02-22 日本特殊陶業株式会社 保持装置
KR102527439B1 (ko) * 2019-03-26 2023-04-28 니뽄 도쿠슈 도교 가부시키가이샤 전극 매설 부재 및 그 제조 방법, 정전 척, 세라믹스제 히터
JP7143256B2 (ja) * 2019-07-01 2022-09-28 日本碍子株式会社 ウエハ載置台及びその製法
KR102254204B1 (ko) * 2020-10-12 2021-05-21 주식회사 미코세라믹스 세라믹 히터
KR20220147395A (ko) 2021-04-27 2022-11-03 주성엔지니어링(주) 단자대, 히터블록 및 히터블록 제조방법
KR102597592B1 (ko) * 2021-10-08 2023-11-02 (주)엘오티씨이에스 전력 공급 유닛, 그리고 이를 포함하는 기판 지지 척
CN115464302A (zh) * 2022-10-14 2022-12-13 中国航发北京航空材料研究院 一种多活性组元钎料及原位生成高熵陶瓷相接头的方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02302381A (ja) 1989-05-13 1990-12-14 Shinko Electric Ind Co Ltd セラミック体とモリブデン線の接合方法
US4996116A (en) 1989-12-21 1991-02-26 General Electric Company Enhanced direct bond structure
CA2134340A1 (en) 1992-05-12 1993-11-25 Michael A. Tenhover Thin film metallization and brazing of aluminum nitride
JP3813654B2 (ja) 1995-02-09 2006-08-23 日本碍子株式会社 セラミックスの接合構造およびその製造方法
JP3866320B2 (ja) 1995-02-09 2007-01-10 日本碍子株式会社 接合体、および接合体の製造方法
JP3368725B2 (ja) 1995-06-30 2003-01-20 株式会社豊田中央研究所 粘土複合材料及びその製造方法，並びにブレンド材料
EP0753494B1 (de) 1995-07-14 2002-03-20 Ngk Insulators, Ltd. Verfahren zum Verbinden von Keramik
JP3790000B2 (ja) 1997-01-27 2006-06-28 日本碍子株式会社 セラミックス部材と電力供給用コネクターとの接合構造
JP3954177B2 (ja) 1997-01-29 2007-08-08 日本碍子株式会社 金属部材とセラミックス部材との接合構造およびその製造方法

Also Published As

Publication number Publication date
EP0886312A2 (de) 1998-12-23
EP0886312A3 (de) 1999-11-03
US6617514B1 (en) 2003-09-09
JPH1112053A (ja) 1999-01-19
KR100283600B1 (ko) 2001-03-02
DE69834771T2 (de) 2007-05-16
JP3746594B2 (ja) 2006-02-15
EP0886312B1 (de) 2006-06-07
TW407298B (en) 2000-10-01
KR19990006874A (ko) 1999-01-25

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Legal Events

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