DE69809694T2 - Halbleiteranordnung - Google Patents
HalbleiteranordnungInfo
- Publication number
- DE69809694T2 DE69809694T2 DE69809694T DE69809694T DE69809694T2 DE 69809694 T2 DE69809694 T2 DE 69809694T2 DE 69809694 T DE69809694 T DE 69809694T DE 69809694 T DE69809694 T DE 69809694T DE 69809694 T2 DE69809694 T2 DE 69809694T2
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27713397A JP4054093B2 (ja) | 1997-10-09 | 1997-10-09 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69809694D1 DE69809694D1 (de) | 2003-01-09 |
DE69809694T2 true DE69809694T2 (de) | 2003-07-10 |
Family
ID=17579260
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69809694T Expired - Fee Related DE69809694T2 (de) | 1997-10-09 | 1998-04-17 | Halbleiteranordnung |
Country Status (6)
Country | Link |
---|---|
US (1) | US6274908B1 (de) |
EP (2) | EP1267407A3 (de) |
JP (1) | JP4054093B2 (de) |
KR (1) | KR100298983B1 (de) |
DE (1) | DE69809694T2 (de) |
TW (1) | TW388128B (de) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6137143A (en) * | 1998-06-30 | 2000-10-24 | Intel Corporation | Diode and transistor design for high speed I/O |
FR2803099B1 (fr) * | 1999-12-22 | 2002-08-16 | St Microelectronics Sa | Dispositif de protection d'une structure soi |
DE10014384B4 (de) * | 2000-03-23 | 2005-11-03 | Infineon Technologies Ag | Mittels Feldeffekt steuerbare Halbleiteranordnung mit lateral verlaufender Kanalzone |
TW441074B (en) * | 2000-04-15 | 2001-06-16 | United Microelectronics Corp | Electrostatic discharge protection circuit structure for high voltage device |
TW446192U (en) * | 2000-05-04 | 2001-07-11 | United Microelectronics Corp | Electrostatic discharge protection circuit |
DE10022367C2 (de) * | 2000-05-08 | 2002-05-08 | Micronas Gmbh | ESD-Schutzstruktur und Verfahren zur Herstellung |
WO2002061841A2 (en) * | 2001-01-31 | 2002-08-08 | Advanced Micro Devices, Inc. | Partially silicide diode and method of manufacture |
US6462381B1 (en) * | 2001-02-22 | 2002-10-08 | Advanced Micro Devices, Inc. | Silicon-on-insulator (SOI) electrostatic discharge (ESD) protection device with backside contact opening |
US6589823B1 (en) | 2001-02-22 | 2003-07-08 | Advanced Micro Devices, Inc. | Silicon-on-insulator (SOI)electrostatic discharge (ESD) protection device with backside contact plug |
JP2003031669A (ja) | 2001-07-13 | 2003-01-31 | Ricoh Co Ltd | 半導体装置 |
US6611025B2 (en) * | 2001-09-05 | 2003-08-26 | Winbond Electronics Corp. | Apparatus and method for improved power bus ESD protection |
US6693783B2 (en) * | 2002-04-08 | 2004-02-17 | Exar Corporation | Bounce tolerant fuse trimming circuit with controlled timing |
US6582997B1 (en) * | 2002-05-17 | 2003-06-24 | Taiwan Semiconductor Manufacturing Company | ESD protection scheme for outputs with resistor loading |
CN100570872C (zh) * | 2002-05-24 | 2009-12-16 | 独立行政法人产业技术综合研究所 | 电信号传输线 |
DE10314505B4 (de) * | 2003-03-31 | 2009-05-07 | Advanced Micro Devices, Inc., Sunnyvale | Verbesserte Diodenstruktur für Soi-Schaltungen |
DE10344849B3 (de) * | 2003-09-26 | 2005-07-21 | Infineon Technologies Ag | Integrierte Schaltung mit Schutz vor elektrostatischer Entladung |
US7067883B2 (en) * | 2003-10-31 | 2006-06-27 | Lattice Semiconductor Corporation | Lateral high-voltage junction device |
JP2005191161A (ja) * | 2003-12-25 | 2005-07-14 | Oki Electric Ind Co Ltd | 半導体装置 |
JP5154000B2 (ja) * | 2005-05-13 | 2013-02-27 | ラピスセミコンダクタ株式会社 | 半導体装置 |
US7863610B2 (en) * | 2007-08-22 | 2011-01-04 | Qimonda North America Corp. | Integrated circuit including silicide region to inhibit parasitic currents |
JP2009283610A (ja) * | 2008-05-21 | 2009-12-03 | Elpida Memory Inc | Esd保護回路 |
CN102110671B (zh) * | 2009-12-29 | 2013-01-02 | 中芯国际集成电路制造(上海)有限公司 | 静电放电保护装置 |
JP2014056972A (ja) * | 2012-09-13 | 2014-03-27 | Ricoh Co Ltd | 静電破壊保護回路及び半導体集積回路 |
JP6243720B2 (ja) * | 2013-02-06 | 2017-12-06 | エスアイアイ・セミコンダクタ株式会社 | Esd保護回路を備えた半導体装置 |
JP6146165B2 (ja) * | 2013-07-01 | 2017-06-14 | セイコーエプソン株式会社 | 静電気保護回路、電気光学装置、及び電子機器 |
CN103944154A (zh) * | 2013-12-11 | 2014-07-23 | 厦门天马微电子有限公司 | 一种静电保护电路及液晶显示器 |
JP6300659B2 (ja) * | 2014-06-19 | 2018-03-28 | 株式会社東芝 | 半導体装置 |
FR3051969A1 (fr) | 2016-05-31 | 2017-12-01 | Stmicroelectronics Rousset | Procede de fabrication de diodes de puissance, en particulier pour former un pont de graetz, et dispositif correspondant |
KR20190140216A (ko) * | 2018-06-11 | 2019-12-19 | 에스케이하이닉스 주식회사 | Esd 보호 회로를 포함하는 반도체 집적 회로 장치 |
JP7396774B2 (ja) * | 2019-03-26 | 2023-12-12 | ラピスセミコンダクタ株式会社 | 論理回路 |
TWI713279B (zh) | 2019-05-17 | 2020-12-11 | 明基電通股份有限公司 | 過電流保護系統 |
US10971633B2 (en) | 2019-09-04 | 2021-04-06 | Stmicroelectronics (Rousset) Sas | Structure and method of forming a semiconductor device |
KR20230102030A (ko) | 2021-12-29 | 2023-07-07 | 삼성디스플레이 주식회사 | 정전기 방전 회로 및 이를 포함하는 표시 장치 |
CN114582282B (zh) * | 2022-03-30 | 2023-07-25 | 武汉华星光电半导体显示技术有限公司 | Esd保护电路及显示装置 |
KR20230143662A (ko) | 2022-04-05 | 2023-10-13 | 삼성디스플레이 주식회사 | 표시 패널 및 그것을 포함하는 표시 장치 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0758734B2 (ja) * | 1987-02-23 | 1995-06-21 | 株式会社東芝 | 絶縁ゲ−ト型セミカスタム集積回路 |
US4989057A (en) | 1988-05-26 | 1991-01-29 | Texas Instruments Incorporated | ESD protection for SOI circuits |
JPH02260459A (ja) | 1989-03-30 | 1990-10-23 | Ricoh Co Ltd | 入力保護回路 |
KR940004449B1 (ko) | 1990-03-02 | 1994-05-25 | 가부시키가이샤 도시바 | 반도체장치 |
US5283449A (en) | 1990-08-09 | 1994-02-01 | Nec Corporation | Semiconductor integrated circuit device including two types of MOSFETS having source/drain region different in sheet resistance from each other |
JP3244581B2 (ja) | 1993-12-29 | 2002-01-07 | 株式会社リコー | デュアルゲート型cmos半導体装置 |
JPH0837284A (ja) | 1994-07-21 | 1996-02-06 | Nippondenso Co Ltd | 半導体集積回路装置 |
JPH08195443A (ja) | 1995-01-18 | 1996-07-30 | Fujitsu Ltd | 半導体装置及びその製造方法 |
US5610790A (en) * | 1995-01-20 | 1997-03-11 | Xilinx, Inc. | Method and structure for providing ESD protection for silicon on insulator integrated circuits |
US5629544A (en) * | 1995-04-25 | 1997-05-13 | International Business Machines Corporation | Semiconductor diode with silicide films and trench isolation |
JPH098331A (ja) * | 1995-06-23 | 1997-01-10 | Mitsubishi Electric Corp | Soi入力保護回路 |
JP3717227B2 (ja) | 1996-03-29 | 2005-11-16 | 株式会社ルネサステクノロジ | 入力/出力保護回路 |
US5818086A (en) * | 1996-06-11 | 1998-10-06 | Winbond Electronics Corporation | Reinforced ESD protection for NC-pin adjacent input pin |
-
1997
- 1997-10-09 JP JP27713397A patent/JP4054093B2/ja not_active Expired - Fee Related
-
1998
- 1998-04-04 TW TW087105145A patent/TW388128B/zh not_active IP Right Cessation
- 1998-04-08 US US09/056,634 patent/US6274908B1/en not_active Expired - Lifetime
- 1998-04-17 EP EP02013736A patent/EP1267407A3/de not_active Withdrawn
- 1998-04-17 DE DE69809694T patent/DE69809694T2/de not_active Expired - Fee Related
- 1998-04-17 EP EP98107063A patent/EP0923132B1/de not_active Expired - Lifetime
- 1998-04-29 KR KR1019980015348A patent/KR100298983B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH11121750A (ja) | 1999-04-30 |
JP4054093B2 (ja) | 2008-02-27 |
EP0923132A1 (de) | 1999-06-16 |
EP0923132B1 (de) | 2002-11-27 |
TW388128B (en) | 2000-04-21 |
EP1267407A3 (de) | 2005-05-11 |
KR19990036477A (ko) | 1999-05-25 |
KR100298983B1 (ko) | 2001-10-19 |
US6274908B1 (en) | 2001-08-14 |
EP1267407A2 (de) | 2002-12-18 |
DE69809694D1 (de) | 2003-01-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |