DE69733682D1 - Mehrstrahllichtquelle und optisches Mehrstrahlabtastsystem unter Verwendung dieser Quelle - Google Patents

Mehrstrahllichtquelle und optisches Mehrstrahlabtastsystem unter Verwendung dieser Quelle

Info

Publication number
DE69733682D1
DE69733682D1 DE69733682T DE69733682T DE69733682D1 DE 69733682 D1 DE69733682 D1 DE 69733682D1 DE 69733682 T DE69733682 T DE 69733682T DE 69733682 T DE69733682 T DE 69733682T DE 69733682 D1 DE69733682 D1 DE 69733682D1
Authority
DE
Germany
Prior art keywords
source
optical scanning
scanning system
light source
beam light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69733682T
Other languages
English (en)
Other versions
DE69733682T2 (de
Inventor
Shin Mogi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69733682D1 publication Critical patent/DE69733682D1/de
Application granted granted Critical
Publication of DE69733682T2 publication Critical patent/DE69733682T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/47—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
    • B41J2/471—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror
    • B41J2/473—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror using multiple light beams, wavelengths or colours
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Laser Beam Printer (AREA)
  • Facsimile Scanning Arrangements (AREA)
DE69733682T 1996-11-21 1997-11-20 Mehrstrahllichtquelle und optisches Mehrstrahlabtastsystem unter Verwendung dieser Quelle Expired - Fee Related DE69733682T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8325962A JPH10153742A (ja) 1996-11-21 1996-11-21 複数ビーム光源装置
JP32596296 1996-11-21

Publications (2)

Publication Number Publication Date
DE69733682D1 true DE69733682D1 (de) 2005-08-11
DE69733682T2 DE69733682T2 (de) 2005-12-29

Family

ID=18182547

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69733682T Expired - Fee Related DE69733682T2 (de) 1996-11-21 1997-11-20 Mehrstrahllichtquelle und optisches Mehrstrahlabtastsystem unter Verwendung dieser Quelle

Country Status (4)

Country Link
US (1) US6038243A (de)
EP (1) EP0844707B1 (de)
JP (1) JPH10153742A (de)
DE (1) DE69733682T2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69913592T2 (de) * 1998-03-31 2004-06-24 Fuji Photo Film Co. Ltd. Bildaufzeichnungsgerät
US7003241B1 (en) 1998-07-31 2006-02-21 Ricoh Printing Systems, Ltd. Image recording device and an image recording system
JP2000311611A (ja) 1999-02-25 2000-11-07 Canon Inc 画像形成装置の製造方法および、該製造方法により製造された画像形成装置
JP4902044B2 (ja) * 1999-09-24 2012-03-21 シャープ株式会社 半導体レーザ装置、光伝送装置、光伝送システム、電子機器、制御装置、接続コネクタ、通信装置、ならびに光伝送方法、データ送受信方法
US6410904B1 (en) * 1999-11-22 2002-06-25 Brother Kogyo Kabushiki Kaisha Multi-beam emitting device
AU5061001A (en) * 2000-04-10 2001-10-23 Jtc 2000 Development (Delaware), Inc. Input configuration for shearing processor
US6728280B1 (en) * 2001-03-12 2004-04-27 Honeywell International Inc. Apparatus and method providing a balancing load to a laser differential drive circuit
JP2005241686A (ja) * 2004-02-24 2005-09-08 Canon Inc 走査光学装置及び画像形成装置
JP2006128602A (ja) * 2004-03-30 2006-05-18 Sanyo Electric Co Ltd 半導体レーザ装置およびその製造方法
JP4671728B2 (ja) * 2005-03-25 2011-04-20 三洋電機株式会社 半導体レーザ装置および光ピックアップ装置
JP2006301482A (ja) * 2005-04-25 2006-11-02 Ricoh Co Ltd 画像形成装置
JP4530922B2 (ja) * 2005-06-20 2010-08-25 株式会社リコー 光走査装置および画像形成装置
TW200947895A (en) * 2008-05-08 2009-11-16 Truelight Corp Tri-wavelength bi-directional fiber communication system
TW200947893A (en) * 2008-05-08 2009-11-16 Truelight Corp Dual-wavelength laser element for fiber communication
JP5883623B2 (ja) * 2011-11-22 2016-03-15 スタンレー電気株式会社 レーザ光源装置
TWI816830B (zh) * 2018-07-08 2023-10-01 美商光程研創股份有限公司 發光裝置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4796964A (en) * 1988-03-09 1989-01-10 Xerox Corporation Method of utilizing a multiple emitter solid state laser in a raster output scanner (ROS)
JP2780981B2 (ja) * 1988-06-27 1998-07-30 三菱電機株式会社 多点発光型半導体レーザ及びその製造方法
DE69230566T2 (de) * 1991-05-14 2000-06-15 Seiko Epson Corp Bilderzeugungsvorrichtung
JPH05152683A (ja) * 1991-06-28 1993-06-18 Fuji Xerox Co Ltd マルチビーム半導体レーザーアレイ
US5745153A (en) * 1992-12-07 1998-04-28 Eastman Kodak Company Optical means for using diode laser arrays in laser multibeam printers and recorders
US5631918A (en) * 1993-11-22 1997-05-20 Xerox Corporation Laser diode arrays with close beam offsets
JPH0878778A (ja) * 1994-09-07 1996-03-22 Mitsubishi Electric Corp 半導体レーザ装置，及びその製造方法
US5883385A (en) * 1995-11-09 1999-03-16 Kabushiki Kaisha Toshiba Multibeam scanning method and apparatus with positional adjustment features
DE69722951T2 (de) * 1996-10-31 2004-05-19 Sanyo Electric Co., Ltd., Moriguchi Optische abtastvorrichtung

Also Published As

Publication number Publication date
JPH10153742A (ja) 1998-06-09
DE69733682T2 (de) 2005-12-29
EP0844707A3 (de) 2002-10-23
EP0844707A2 (de) 1998-05-27
EP0844707B1 (de) 2005-07-06
US6038243A (en) 2000-03-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee