DE69706357T2 - Verfahren zum Montieren von Schaltungsteilen auf ein biegsames Substrat - Google Patents

Verfahren zum Montieren von Schaltungsteilen auf ein biegsames Substrat

Info

Publication number
DE69706357T2
DE69706357T2 DE69706357T DE69706357T DE69706357T2 DE 69706357 T2 DE69706357 T2 DE 69706357T2 DE 69706357 T DE69706357 T DE 69706357T DE 69706357 T DE69706357 T DE 69706357T DE 69706357 T2 DE69706357 T2 DE 69706357T2
Authority
DE
Germany
Prior art keywords
flexible substrate
circuit parts
mounting circuit
mounting
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69706357T
Other languages
English (en)
Other versions
DE69706357D1 (de
Inventor
Garth Annable
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PRESSAC INTERCONNECT Ltd
Original Assignee
PRESSAC INTERCONNECT Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PRESSAC INTERCONNECT Ltd filed Critical PRESSAC INTERCONNECT Ltd
Publication of DE69706357D1 publication Critical patent/DE69706357D1/de
Application granted granted Critical
Publication of DE69706357T2 publication Critical patent/DE69706357T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0186—Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69706357T 1996-04-30 1997-04-21 Verfahren zum Montieren von Schaltungsteilen auf ein biegsames Substrat Expired - Fee Related DE69706357T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9608847.1A GB9608847D0 (en) 1996-04-30 1996-04-30 Method of mounting circuit components on a flexible substrate

Publications (2)

Publication Number Publication Date
DE69706357D1 DE69706357D1 (de) 2001-10-04
DE69706357T2 true DE69706357T2 (de) 2002-06-13

Family

ID=10792826

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69706357T Expired - Fee Related DE69706357T2 (de) 1996-04-30 1997-04-21 Verfahren zum Montieren von Schaltungsteilen auf ein biegsames Substrat

Country Status (5)

Country Link
US (1) US5898992A (de)
EP (1) EP0804990B1 (de)
DE (1) DE69706357T2 (de)
ES (1) ES2163710T3 (de)
GB (1) GB9608847D0 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012007804A1 (de) * 2012-02-24 2013-08-29 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Verfahren zum technologisch optimierten Ausführen von Lötverbindungen

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US6198207B1 (en) * 1998-09-01 2001-03-06 Oceana Sensor Technologies High-volume production, low cost piezoelectric transducer using low-shrink solder of bismuth or antimony alloy
US6121576A (en) * 1998-09-02 2000-09-19 Micron Technology, Inc. Method and process of contact to a heat softened solder ball array
WO2001043269A2 (en) * 1999-12-06 2001-06-14 L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and apparatus for making an electrical device
US6357864B1 (en) 1999-12-16 2002-03-19 Lexmark International, Inc. Tab circuit design for simplified use with hot bar soldering technique
US6431432B1 (en) * 2000-06-15 2002-08-13 Lsi Logic Corporation Method for attaching solderballs by selectively oxidizing traces
WO2002028584A1 (en) * 2000-10-03 2002-04-11 Visteon Global Technologies, Inc. System and method for mounting electronic components onto flexible substrates
GB2372006B (en) * 2000-10-03 2004-04-21 Visteon Global Tech Inc System and method for mounting electronic components onto flexible substrates
JP2002158435A (ja) * 2000-11-16 2002-05-31 Yazaki Corp 回路ユニット及びその製造方法
US20040050915A1 (en) * 2001-10-03 2004-03-18 Goenka Lakhi Nandlal System and method for mounting electronic components onto flexible substrates
US6642485B2 (en) 2001-12-03 2003-11-04 Visteon Global Technologies, Inc. System and method for mounting electronic components onto flexible substrates
US6583385B1 (en) * 2001-12-19 2003-06-24 Visteon Global Technologies, Inc. Method for soldering surface mount components to a substrate using a laser
US6900411B2 (en) * 2003-02-06 2005-05-31 The Raymond Corporation Flexible heater for heating electrical components in operator control handle
US7026582B2 (en) * 2003-05-07 2006-04-11 Visteon Global Technologies, Inc. Vector transient reflow of lead free solder for controlling substrate warpage
DE102004023688B4 (de) * 2004-05-13 2007-01-18 Grundig Business Systems Gmbh Verfahren zur Bestückung einer flexiblen Leiterplatte
JP2006093438A (ja) * 2004-09-24 2006-04-06 Denso Corp プリント基板及びその製造方法
TW200829110A (en) * 2006-12-20 2008-07-01 Compal Electronics Inc Partial temperature control fixture applied to reflow process for circuit board
US20080241563A1 (en) * 2007-03-30 2008-10-02 Khamvong Thammasouk Polymer substrate for electronic components
US8023269B2 (en) 2008-08-15 2011-09-20 Siemens Energy, Inc. Wireless telemetry electronic circuit board for high temperature environments
AT12326U1 (de) 2009-04-20 2012-03-15 Austria Tech & System Tech Verfahren zum vorbehandeln eines rahmen- bzw. trägerelements für eine herstellung einer leiterplatte, sowie rahmen- bzw. trägerelement und verwendung hiefür
EP2675252A1 (de) 2012-06-13 2013-12-18 Polska Wytwornia Papierow Wartosciowych S.A. Verfahren zur Montage eines elektronischen Elements auf einem Substrat mit auf hohe Temperaturen empfindlichen Leitwegen
CN106392228A (zh) * 2016-10-25 2017-02-15 贸联电子(昆山)有限公司 元件引脚的焊接方法
FR3058610B1 (fr) * 2016-11-10 2018-11-16 Bioserenity Dispositif electronique textile pour vetements intelligents

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DE3242162A1 (de) * 1982-11-13 1984-05-17 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von verbundwerkstoffen
US4664366A (en) * 1986-04-16 1987-05-12 University Of Kansas Center For Research Fixture arrangement for machine tool work tables
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US4733462A (en) * 1986-06-24 1988-03-29 Sony Corporation Apparatus for positioning circuit components at predetermined positions and method therefor
US4967950A (en) * 1989-10-31 1990-11-06 International Business Machines Corporation Soldering method
US5205032A (en) * 1990-09-28 1993-04-27 Kabushiki Kaisha Toshiba Electronic parts mounting apparatus
US5116433A (en) * 1990-10-31 1992-05-26 Motorola, Inc. Solder paste having solder alloy/formate complexes as oxide scavengers, and method for preparing same
US5210939A (en) * 1992-04-17 1993-05-18 Intel Corporation Lead grid array integrated circuit
JPH05315734A (ja) * 1992-05-01 1993-11-26 Mitsubishi Electric Corp 電子部品の実装基板と実装方法
US5479319A (en) * 1992-12-30 1995-12-26 Interconnect Systems, Inc. Multi-level assemblies for interconnecting integrated circuits
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DE4405784A1 (de) * 1994-02-23 1995-08-24 Daimler Benz Aerospace Ag Verfahren zum Verlöten von Bauelementen mit einem Träger und Anordnung zur Durchführung des Verfahrens
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012007804A1 (de) * 2012-02-24 2013-08-29 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Verfahren zum technologisch optimierten Ausführen von Lötverbindungen
DE102012007804B4 (de) 2012-02-24 2022-06-02 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Verfahren zum technologisch optimierten Ausführen von bleifreien Lötverbindungen

Also Published As

Publication number Publication date
EP0804990B1 (de) 2001-08-29
ES2163710T3 (es) 2002-02-01
US5898992A (en) 1999-05-04
GB9608847D0 (en) 1996-07-03
DE69706357D1 (de) 2001-10-04
EP0804990A1 (de) 1997-11-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee