DE69626371D1 - Halbleiterschaltung - Google Patents
HalbleiterschaltungInfo
- Publication number
- DE69626371D1 DE69626371D1 DE69626371T DE69626371T DE69626371D1 DE 69626371 D1 DE69626371 D1 DE 69626371D1 DE 69626371 T DE69626371 T DE 69626371T DE 69626371 T DE69626371 T DE 69626371T DE 69626371 D1 DE69626371 D1 DE 69626371D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor circuit
- semiconductor
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6644—Packaging aspects of high-frequency amplifiers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Inverter Devices (AREA)
- Electronic Switches (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33310195A JP3476612B2 (ja) | 1995-12-21 | 1995-12-21 | 半導体装置 |
JP33310195 | 1995-12-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69626371D1 true DE69626371D1 (de) | 2003-04-03 |
DE69626371T2 DE69626371T2 (de) | 2004-02-05 |
Family
ID=18262298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69626371T Expired - Lifetime DE69626371T2 (de) | 1995-12-21 | 1996-08-14 | Halbleiterschaltung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5767579A (de) |
EP (1) | EP0780899B1 (de) |
JP (1) | JP3476612B2 (de) |
DE (1) | DE69626371T2 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6281579B1 (en) * | 1997-02-14 | 2001-08-28 | International Rectifier Corporation | Insert-molded leadframe to optimize interface between powertrain and driver board |
US6049470A (en) * | 1997-05-30 | 2000-04-11 | Dalsa, Inc. | Package with reticulated bond shelf |
TW473882B (en) * | 1998-07-06 | 2002-01-21 | Hitachi Ltd | Semiconductor device |
US7525813B2 (en) * | 1998-07-06 | 2009-04-28 | Renesas Technology Corp. | Semiconductor device |
US6160311A (en) * | 1999-06-14 | 2000-12-12 | First International Computer Inc. | Enhanced heat dissipating chip scale package method and devices |
JP4209070B2 (ja) * | 2000-05-23 | 2009-01-14 | 三菱電機株式会社 | 半導体装置 |
US6646521B1 (en) * | 2000-09-15 | 2003-11-11 | Hei, Inc. | Connection for conducting high frequency signal between a circuit and a discrete electric component |
DE102004061908B4 (de) * | 2004-12-22 | 2009-07-30 | Siemens Ag | Verfahren zum Herstellen einer Schaltungsanordnung auf einem Substrat |
JP2007329387A (ja) | 2006-06-09 | 2007-12-20 | Mitsubishi Electric Corp | 半導体装置 |
JP2008010618A (ja) * | 2006-06-29 | 2008-01-17 | Mitsubishi Electric Corp | 電力用半導体装置 |
US8259765B2 (en) * | 2006-12-06 | 2012-09-04 | Google Inc. | Passive phase control in an external cavity laser |
DE112008000229B4 (de) * | 2007-01-22 | 2014-10-30 | Mitsubishi Electric Corp. | Leistungshalbleitervorrichtung |
US8227908B2 (en) | 2008-07-07 | 2012-07-24 | Infineon Technologies Ag | Electronic device having contact elements with a specified cross section and manufacturing thereof |
JP4658268B2 (ja) * | 2008-11-26 | 2011-03-23 | 三菱電機株式会社 | 電力用半導体モジュール |
US8241925B2 (en) * | 2009-11-24 | 2012-08-14 | Atmel Corporation | Calibration of temperature sensitive circuits with heater elements |
CN104380463B (zh) * | 2012-06-19 | 2017-05-10 | Abb 技术有限公司 | 用于将多个功率晶体管安装在其上的衬底和功率半导体模块 |
KR20150060036A (ko) * | 2013-11-25 | 2015-06-03 | 삼성전기주식회사 | 전력 반도체 모듈 및 그 제조 방법 |
DE112017001953B4 (de) | 2016-09-01 | 2021-08-19 | Hitachi Metals, Ltd. | Isolierendes Substrat und Halbleitervorrichtung, die dieses verwendet |
JP6958274B2 (ja) * | 2017-11-16 | 2021-11-02 | 富士電機株式会社 | 電力用半導体装置 |
JP6893169B2 (ja) | 2017-12-26 | 2021-06-23 | 株式会社日立製作所 | パワーモジュールおよび電力変換装置 |
JP7099027B2 (ja) * | 2018-04-19 | 2022-07-12 | 富士電機株式会社 | 半導体装置 |
CN113994464A (zh) * | 2019-06-19 | 2022-01-28 | 三菱电机株式会社 | 半导体装置以及电力变换装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8800140A (nl) * | 1988-01-22 | 1989-08-16 | Philips Nv | Laserdiode module. |
US4941067A (en) * | 1989-04-07 | 1990-07-10 | Motorola Inc. | Thermal shunt for electronic circuits |
US5075759A (en) * | 1989-07-21 | 1991-12-24 | Motorola, Inc. | Surface mounting semiconductor device and method |
US5537074A (en) * | 1993-08-24 | 1996-07-16 | Iversen; Arthur H. | Power semiconductor packaging |
JP2656416B2 (ja) * | 1991-12-16 | 1997-09-24 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法、並びに半導体装置に用いられる複合基板および複合基板の製造方法 |
JP2864841B2 (ja) * | 1992-02-04 | 1999-03-08 | 三菱電機株式会社 | 高周波高出力トランジスタ |
JPH05275608A (ja) * | 1992-03-27 | 1993-10-22 | Kyocera Corp | 半導体素子収納用パッケージ |
JPH05347377A (ja) * | 1992-06-16 | 1993-12-27 | Fuji Electric Co Ltd | 半導体装置 |
TW238419B (de) * | 1992-08-21 | 1995-01-11 | Olin Corp | |
JPH06165570A (ja) * | 1992-11-19 | 1994-06-10 | Nippon Densan Corp | 直流モータ用混成集積回路 |
JP2973799B2 (ja) * | 1993-04-23 | 1999-11-08 | 富士電機株式会社 | パワートランジスタモジュール |
JP3157362B2 (ja) * | 1993-09-03 | 2001-04-16 | 株式会社東芝 | 半導体装置 |
US5519253A (en) * | 1993-09-07 | 1996-05-21 | Delco Electronics Corp. | Coaxial switch module |
JPH07161925A (ja) * | 1993-12-09 | 1995-06-23 | Mitsubishi Electric Corp | パワーモジュール |
US5539254A (en) * | 1994-03-09 | 1996-07-23 | Delco Electronics Corp. | Substrate subassembly for a transistor switch module |
-
1995
- 1995-12-21 JP JP33310195A patent/JP3476612B2/ja not_active Expired - Fee Related
-
1996
- 1996-08-02 US US08/691,318 patent/US5767579A/en not_active Expired - Lifetime
- 1996-08-14 EP EP96113105A patent/EP0780899B1/de not_active Expired - Lifetime
- 1996-08-14 DE DE69626371T patent/DE69626371T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69626371T2 (de) | 2004-02-05 |
US5767579A (en) | 1998-06-16 |
EP0780899A2 (de) | 1997-06-25 |
JPH09172140A (ja) | 1997-06-30 |
JP3476612B2 (ja) | 2003-12-10 |
EP0780899A3 (de) | 1998-11-11 |
EP0780899B1 (de) | 2003-02-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69529042D1 (de) | Halbleiterschaltung | |
DE69614953T2 (de) | Schaltungsanordnung | |
DE69607773D1 (de) | Schaltkreis | |
DE69636269D1 (de) | Schaltkreis | |
DE69529013T2 (de) | Halbleiter-Spannungserhöhungsschaltung | |
DE69626371D1 (de) | Halbleiterschaltung | |
KR970004347A (ko) | 반도체 집적회로 장치 | |
DE69616479T2 (de) | Schaltungsanordnung | |
DE69408362D1 (de) | Halbleiterintegrierte Schaltung | |
DE69616982T2 (de) | Schaltungsanordnung | |
KR960015828A (ko) | 반도체 집적 회로 | |
DE69617616D1 (de) | Schaltungsanordnung | |
DE69616483T2 (de) | Schaltungsanordnung | |
DE69517759D1 (de) | Integrierte Halbleiterschaltung | |
KR960015898A (ko) | 반도체 집적회로 | |
DE69621576T2 (de) | Integrierte Halbleiterschaltung | |
DE69630427D1 (de) | Bus-Halteschaltung | |
DE69628919D1 (de) | Halbleiterfunktionsschaltung | |
DE69622394D1 (de) | Halbleiterfunktionsschaltung | |
DE59706321D1 (de) | Integrierte halbleiterschaltung | |
DE69622172D1 (de) | Integrierte schaltungsanordnung | |
ATA75996A (de) | Schaltungsanordnung | |
DE59608801D1 (de) | Integrierte schaltung | |
DE69616495T2 (de) | Schaltungsanordnung | |
KR970019554U (ko) | 캠셀 회로 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) |