DE69604018D1 - Herstellungsverfahren für Mikromaschine - Google Patents
Herstellungsverfahren für MikromaschineInfo
- Publication number
- DE69604018D1 DE69604018D1 DE69604018T DE69604018T DE69604018D1 DE 69604018 D1 DE69604018 D1 DE 69604018D1 DE 69604018 T DE69604018 T DE 69604018T DE 69604018 T DE69604018 T DE 69604018T DE 69604018 D1 DE69604018 D1 DE 69604018D1
- Authority
- DE
- Germany
- Prior art keywords
- micromachine
- manufacturing process
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/488,879 US5567332A (en) | 1995-06-09 | 1995-06-09 | Micro-machine manufacturing process |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69604018D1 true DE69604018D1 (de) | 1999-10-07 |
DE69604018T2 DE69604018T2 (de) | 2000-05-25 |
Family
ID=23941487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69604018T Expired - Fee Related DE69604018T2 (de) | 1995-06-09 | 1996-06-07 | Herstellungsverfahren für Mikromaschine |
Country Status (4)
Country | Link |
---|---|
US (1) | US5567332A (de) |
EP (1) | EP0747711B1 (de) |
JP (1) | JPH09102483A (de) |
DE (1) | DE69604018T2 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2682510B2 (ja) * | 1995-05-09 | 1997-11-26 | 日本電気株式会社 | 半導体装置の製造方法 |
US5880032A (en) * | 1995-07-31 | 1999-03-09 | Kabushiki Kaisha Toshiba | Method and apparatus for manufacturing a semiconductor device |
KR0170902B1 (ko) * | 1995-12-29 | 1999-03-30 | 김주용 | 반도체 소자의 제조방법 |
US5966591A (en) * | 1997-08-07 | 1999-10-12 | Read-Rite Corporation | Method and tool for handling micro-mechanical structures |
US6126847A (en) * | 1997-11-24 | 2000-10-03 | Micron Technology Inc. | High selectivity etching process for oxides |
US6054379A (en) * | 1998-02-11 | 2000-04-25 | Applied Materials, Inc. | Method of depositing a low k dielectric with organo silane |
US6082208A (en) * | 1998-04-01 | 2000-07-04 | Sandia Corporation | Method for fabricating five-level microelectromechanical structures and microelectromechanical transmission formed |
US6561382B2 (en) | 2001-06-15 | 2003-05-13 | S.I.P. Technologies, L.L.C. | Method and apparatus for disinfecting a water cooler reservoir and its dispensing spigot(s) |
US7748233B2 (en) | 1998-12-23 | 2010-07-06 | S.I.P. Technologies L.L.C. | Sanitized water dispenser |
US6085540A (en) | 1998-12-23 | 2000-07-11 | Davis; Kenneth A. | Method and apparatus for disinfecting a water cooler reservoir |
US7175054B2 (en) * | 1998-12-23 | 2007-02-13 | S.I.P. Technologies, Llc | Method and apparatus for disinfecting a refrigerated water cooler reservoir |
US6532760B2 (en) | 1998-12-23 | 2003-03-18 | S.I.P. Technologies, L.L.C. | Method and apparatus for disinfecting a water cooler reservoir |
US6740247B1 (en) | 1999-02-05 | 2004-05-25 | Massachusetts Institute Of Technology | HF vapor phase wafer cleaning and oxide etching |
US7640766B2 (en) | 2002-06-17 | 2010-01-05 | S.I.P. Technologies L.L.C. | Method and apparatus for disinfecting a refrigerated water cooler reservoir |
US7422684B1 (en) | 2003-10-16 | 2008-09-09 | S.I.P. Technologies, L.L.C. | Method and apparatus for sanitizing water dispensed from a water dispenser having a reservoir |
US20090025636A1 (en) * | 2007-07-27 | 2009-01-29 | Applied Materials, Inc. | High profile minimum contact process kit for hdp-cvd application |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4372803A (en) * | 1980-09-26 | 1983-02-08 | The United States Of America As Represented By The Secretary Of The Navy | Method for etch thinning silicon devices |
US4749440A (en) * | 1985-08-28 | 1988-06-07 | Fsi Corporation | Gaseous process and apparatus for removing films from substrates |
US5177661A (en) * | 1989-01-13 | 1993-01-05 | Kopin Corporation | SOI diaphgram sensor |
US5093594A (en) * | 1990-06-22 | 1992-03-03 | Massachusetts Institute Of Technology | Microfabricated harmonic side-drive motors |
US5043043A (en) * | 1990-06-22 | 1991-08-27 | Massachusetts Institute Of Technology | Method for fabricating side drive electrostatic micromotor |
US5314572A (en) * | 1990-08-17 | 1994-05-24 | Analog Devices, Inc. | Method for fabricating microstructures |
US5294568A (en) * | 1990-10-12 | 1994-03-15 | Genus, Inc. | Method of selective etching native oxide |
US5089084A (en) * | 1990-12-03 | 1992-02-18 | Micron Technology, Inc. | Hydrofluoric acid etcher and cascade rinser |
US5258097A (en) * | 1992-11-12 | 1993-11-02 | Ford Motor Company | Dry-release method for sacrificial layer microstructure fabrication |
DE4317274A1 (de) * | 1993-05-25 | 1994-12-01 | Bosch Gmbh Robert | Verfahren zur Herstellung oberflächen-mikromechanischer Strukturen |
-
1995
- 1995-06-09 US US08/488,879 patent/US5567332A/en not_active Expired - Fee Related
-
1996
- 1996-06-07 JP JP8145474A patent/JPH09102483A/ja active Pending
- 1996-06-07 DE DE69604018T patent/DE69604018T2/de not_active Expired - Fee Related
- 1996-06-07 EP EP96109211A patent/EP0747711B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69604018T2 (de) | 2000-05-25 |
US5567332A (en) | 1996-10-22 |
JPH09102483A (ja) | 1997-04-15 |
EP0747711A1 (de) | 1996-12-11 |
EP0747711B1 (de) | 1999-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |