DE69529252T2 - Verfahren zur Herstellung eines Substrats für eine IC-Karte - Google Patents

Verfahren zur Herstellung eines Substrats für eine IC-Karte

Info

Publication number
DE69529252T2
DE69529252T2 DE69529252T DE69529252T DE69529252T2 DE 69529252 T2 DE69529252 T2 DE 69529252T2 DE 69529252 T DE69529252 T DE 69529252T DE 69529252 T DE69529252 T DE 69529252T DE 69529252 T2 DE69529252 T2 DE 69529252T2
Authority
DE
Germany
Prior art keywords
card
substrate
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69529252T
Other languages
English (en)
Other versions
DE69529252D1 (de
Inventor
Masayoshi Onishi
Seiji Kegai
Koichi Ozaki
Kaname Tamada
Hiroyoshi Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Holdings Ltd
Maxell Seiki Ltd
Original Assignee
Maxell Seiki Ltd
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maxell Seiki Ltd, Hitachi Maxell Ltd filed Critical Maxell Seiki Ltd
Application granted granted Critical
Publication of DE69529252D1 publication Critical patent/DE69529252D1/de
Publication of DE69529252T2 publication Critical patent/DE69529252T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • B29C45/5675—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding for making orifices in or through the moulded article
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/006—Memory cards, chip cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
DE69529252T 1994-07-21 1995-07-20 Verfahren zur Herstellung eines Substrats für eine IC-Karte Expired - Fee Related DE69529252T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP19212694 1994-07-21
JP19212794 1994-07-21
JP7158561A JPH0885285A (ja) 1994-07-21 1995-05-31 セキュリティカード用基板の製造方法、およびセキュリティカード用基板

Publications (2)

Publication Number Publication Date
DE69529252D1 DE69529252D1 (de) 2003-02-06
DE69529252T2 true DE69529252T2 (de) 2003-11-13

Family

ID=27321371

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69529252T Expired - Fee Related DE69529252T2 (de) 1994-07-21 1995-07-20 Verfahren zur Herstellung eines Substrats für eine IC-Karte

Country Status (6)

Country Link
US (2) US5725819A (de)
EP (1) EP0693736B1 (de)
JP (1) JPH0885285A (de)
KR (1) KR100378426B1 (de)
DE (1) DE69529252T2 (de)
TW (1) TW330726U (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10248392B4 (de) * 2002-10-17 2016-02-04 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines kartenförmigen Datenträgers

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US5873751A (en) * 1995-12-07 1999-02-23 Methode Electronics, Inc. Circuitized insulator
DE19601389A1 (de) * 1996-01-16 1997-07-24 Siemens Ag Chipkartenkörper
EP0791448A3 (de) * 1996-02-26 1999-05-12 HERBST, Richard Verfahren und Vorrichtung zum Spritzgiessen von Kunststoffteilen
DE19637306C1 (de) * 1996-09-13 1998-05-20 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte
US6001672A (en) * 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
WO1998052772A1 (fr) * 1997-05-19 1998-11-26 Hitachi Maxell, Ltd. Module de circuit integre flexible et son procede de production, procede de production de support d'information comprenant ledit module
US6375081B1 (en) * 1999-02-02 2002-04-23 The Standard Register Company Business form including smart card and smart card reader
US6492717B1 (en) * 1999-08-03 2002-12-10 Motorola, Inc. Smart card module and method of assembling the same
US7220615B2 (en) * 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding
ATE313027T1 (de) * 2001-07-27 2005-12-15 Freni Brembo Spa Form und verfahren zur herstellung eines mit kühlkanälen versehenen bremsbandes aus verbundwerkstoff
JP2003078223A (ja) * 2001-09-03 2003-03-14 Nec Corp 基 板
NL1021421C2 (nl) * 2002-09-10 2004-03-11 Fountain Patents B V Inrichting en werkwijze voor het vervaardigen van producten uit een warm plastische massa.
US6994355B2 (en) * 2003-10-01 2006-02-07 Infiltrator Systems Inc. Pipe seal
JP4522150B2 (ja) * 2004-05-28 2010-08-11 京セラミタ株式会社 記録媒体装着構造
US7221277B2 (en) * 2004-10-05 2007-05-22 Tracking Technologies, Inc. Radio frequency identification tag and method of making the same
JP4535905B2 (ja) * 2005-02-23 2010-09-01 花王株式会社 装飾プレートの製造方法
TWI296564B (en) * 2005-07-29 2008-05-11 Delta Electronics Inc Gas exhausting and entering structure
US8072764B2 (en) * 2009-03-09 2011-12-06 Apple Inc. Multi-part substrate assemblies for low profile portable electronic devices
KR101089956B1 (ko) 2009-10-28 2011-12-05 삼성전기주식회사 플립칩 패키지 및 그의 제조방법
CN102487022B (zh) * 2010-12-06 2016-01-20 三星半导体(中国)研究开发有限公司 Cob模块的封装保护方法
EP2664437B1 (de) * 2012-05-18 2016-07-06 Gealan Formteile GmbH Werkzeug und Verfahren zur Herstellung von bindenahtoptimierten Formteilen
EP3362248B1 (de) 2015-10-14 2023-06-28 Capital One Services, LLC Geformte tasche in einer transaktionskartenkonstruktion
CN108430758B (zh) * 2015-11-13 2023-12-05 兰克森控股公司 用于制造包括窗口的多层结构的透光层的方法和具有这种透光层的多层
DE102016106698A1 (de) * 2016-04-12 2017-10-12 Infineon Technologies Ag Chipkarte und Verfahren zum Herstellen einer Chipkarte

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JPS56148533A (en) * 1980-04-21 1981-11-18 Hitachi Chem Co Ltd Gate cut-off device for die for injection molding
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink
JPS6135923A (ja) * 1984-07-30 1986-02-20 Dainichi Kanagata Seisakusho:Kk 樹脂成形装置
JP2502511B2 (ja) * 1986-02-06 1996-05-29 日立マクセル株式会社 半導体装置の製造方法
JPH0740423B2 (ja) 1986-03-01 1995-05-01 日立マクセル株式会社 デイスクカ−トリツジ
JPS62298143A (ja) 1986-06-18 1987-12-25 Hitachi Maxell Ltd 半導体装置
US4980115A (en) * 1987-05-28 1990-12-25 Yoshida Industry Co. Ltd. Method for making an injection-molded product having a partly thin portion
US4954308A (en) * 1988-03-04 1990-09-04 Citizen Watch Co., Ltd. Resin encapsulating method
FR2636453B1 (fr) * 1988-09-14 1992-01-17 Sgs Thomson Microelectronics Procede d'encapsulation de circuits-integres notamment pour cartes a puces
JPH0377333A (ja) * 1989-08-21 1991-04-02 Fujitsu Ltd パッケージ成形装置
EP0472768A1 (de) * 1990-08-30 1992-03-04 Siemens Aktiengesellschaft Verfahren zum Befestigen eines Chipmoduls auf einer Chipkarte
JPH04151222A (ja) * 1990-10-15 1992-05-25 Fujitsu Ltd プラスチック筐体構造及びその製造方法及び金型構造
US5405259A (en) * 1991-06-18 1995-04-11 Sumitomo Heavy Industries, Ltd. Injection molding machine using a pulsating pressing force
US5130889A (en) * 1991-06-28 1992-07-14 Digital Equipment Corporation Integrated circuit protection by liquid encapsulation
DE69223299T2 (de) * 1991-08-02 1998-04-09 Canon Kk Spritzgiessform aus Metall und Verwendung derselben zum Spritzgiessen eines Körpers
DE9110057U1 (de) * 1991-08-14 1992-02-20 Orga Kartensysteme GmbH, 6072 Dreieich Datenträgerkarte mit eingeklebtem Schaltkreisträger
JPH05228970A (ja) * 1992-02-21 1993-09-07 Sony Corp 射出圧縮成形法、これに用いる射出成形金型及び射出圧縮成形機
JP2774906B2 (ja) * 1992-09-17 1998-07-09 三菱電機株式会社 薄形半導体装置及びその製造方法
JP2638720B2 (ja) * 1992-10-07 1997-08-06 住友重機械プラスチックマシナリー株式会社 局部加圧式の射出成形機
US5439371A (en) * 1992-10-07 1995-08-08 Sumitomo Heavy Industries, Ltd. Locally pressurizing injection molding machine
CA2109441C (en) * 1992-10-29 1997-05-13 Yuhei Kosugi Composite microwave circuit module assembly and its connection structure
US5476629A (en) * 1992-12-25 1995-12-19 Citizen Watch Co. Ltd. Method for manufacturing IC card substrate
WO1994023926A1 (en) * 1993-04-20 1994-10-27 Sankyokasei Kabushiki Kaisha Apparatus for controlling gate cut and ejection for an injection molding machine and method for controlling the same
US5359488A (en) * 1993-06-21 1994-10-25 Westinghouse Electric Corporation Packaging system for a standard electronic module
JP2780909B2 (ja) * 1993-08-04 1998-07-30 住友重機械プラスチックマシナリー株式会社 局部加圧式射出成形機
US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10248392B4 (de) * 2002-10-17 2016-02-04 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines kartenförmigen Datenträgers

Also Published As

Publication number Publication date
JPH0885285A (ja) 1996-04-02
KR100378426B1 (ko) 2003-06-18
EP0693736A3 (de) 1997-07-30
KR960006719A (ko) 1996-02-23
DE69529252D1 (de) 2003-02-06
US6191366B1 (en) 2001-02-20
EP0693736A2 (de) 1996-01-24
TW330726U (en) 1998-04-21
EP0693736B1 (de) 2003-01-02
US5725819A (en) 1998-03-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee