DE69522993T2 - Flussmittel und Verfahren zum Weichlöten - Google Patents
Flussmittel und Verfahren zum WeichlötenInfo
- Publication number
- DE69522993T2 DE69522993T2 DE69522993T DE69522993T DE69522993T2 DE 69522993 T2 DE69522993 T2 DE 69522993T2 DE 69522993 T DE69522993 T DE 69522993T DE 69522993 T DE69522993 T DE 69522993T DE 69522993 T2 DE69522993 T2 DE 69522993T2
- Authority
- DE
- Germany
- Prior art keywords
- soldering flux
- soldering
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/251,806 US5615827A (en) | 1994-05-31 | 1994-05-31 | Flux composition and corresponding soldering method |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69522993D1 DE69522993D1 (de) | 2001-11-08 |
DE69522993T2 true DE69522993T2 (de) | 2002-05-16 |
Family
ID=22953502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69522993T Expired - Fee Related DE69522993T2 (de) | 1994-05-31 | 1995-02-20 | Flussmittel und Verfahren zum Weichlöten |
Country Status (6)
Country | Link |
---|---|
US (2) | US5615827A (de) |
EP (1) | EP0685294B1 (de) |
JP (1) | JP3132745B2 (de) |
CN (1) | CN1065798C (de) |
DE (1) | DE69522993T2 (de) |
MY (1) | MY124297A (de) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3120695B2 (ja) * | 1995-05-19 | 2000-12-25 | 株式会社日立製作所 | 電子回路の製造方法 |
US6217671B1 (en) | 1999-12-14 | 2001-04-17 | International Business Machines Corporation | Composition for increasing activity of a no-clean flux |
US6501663B1 (en) * | 2000-02-28 | 2002-12-31 | Hewlett Packard Company | Three-dimensional interconnect system |
JP3822040B2 (ja) * | 2000-08-31 | 2006-09-13 | 株式会社ルネサステクノロジ | 電子装置及びその製造方法 |
US6474536B1 (en) | 2000-09-28 | 2002-11-05 | Peter Kukanskis | Flux composition and corresponding soldering method |
US6585150B1 (en) * | 2000-10-12 | 2003-07-01 | International Business Machines Corporation | Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder |
US6969638B2 (en) * | 2003-06-27 | 2005-11-29 | Texas Instruments Incorporated | Low cost substrate for an integrated circuit device with bondpads free of plated gold |
US7740713B2 (en) | 2004-04-28 | 2010-06-22 | International Business Machines Corporation | Flux composition and techniques for use thereof |
US7780801B2 (en) | 2006-07-26 | 2010-08-24 | International Business Machines Corporation | Flux composition and process for use thereof |
CN103154081B (zh) | 2010-08-06 | 2015-11-25 | 普罗米鲁斯有限责任公司 | 用于微电子组装件的聚合物组合物 |
US8070047B1 (en) | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Flux composition and method of soldering |
US8070045B1 (en) | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable amine flux composition and method of soldering |
US8070046B1 (en) | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Amine flux composition and method of soldering |
US8070044B1 (en) | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Polyamine flux composition and method of soldering |
US8070043B1 (en) | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable flux composition and method of soldering |
US9815149B2 (en) | 2011-02-25 | 2017-11-14 | International Business Machines Corporation | Flux composition and techniques for use thereof |
US9579738B2 (en) | 2011-02-25 | 2017-02-28 | International Business Machines Corporation | Flux composition and techniques for use thereof |
US8434667B2 (en) | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Polyamine, carboxylic acid flux composition and method of soldering |
US8430294B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Amine, carboxylic acid flux composition and method of soldering |
US8434666B2 (en) | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Flux composition and method of soldering |
US8430295B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Curable flux composition and method of soldering |
US8430293B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Curable amine, carboxylic acid flux composition and method of soldering |
US20140165389A1 (en) * | 2012-12-14 | 2014-06-19 | Byung Tai Do | Integrated circuit packaging system with routable grid array lead frame |
JP6130417B2 (ja) * | 2015-02-26 | 2017-05-17 | 株式会社タムラ製作所 | 電子部品の接合方法、並びに、その方法に用いるはんだ組成物および前処理剤 |
JP6130418B2 (ja) * | 2015-03-10 | 2017-05-17 | 株式会社タムラ製作所 | 電子部品の接合方法、並びに、その方法に用いるはんだ組成物および前処理剤 |
JP6130421B2 (ja) * | 2015-03-24 | 2017-05-17 | 株式会社タムラ製作所 | 電子部品の接合方法、並びに、その方法に用いるはんだ組成物および前処理剤 |
JP6130422B2 (ja) * | 2015-03-24 | 2017-05-17 | 株式会社タムラ製作所 | 電子部品の接合方法、並びに、その方法に用いるはんだ組成物および前処理剤 |
US10037898B2 (en) * | 2016-04-01 | 2018-07-31 | Intel Corporation | Water soluble flux with modified viscosity |
JP7052320B2 (ja) * | 2017-11-28 | 2022-04-12 | 荒川化学工業株式会社 | はんだ付け用フラックス |
CN115719634B (zh) * | 2022-11-22 | 2023-09-29 | 深圳市汇健智慧医疗有限公司 | 一种复合手术室的能源能效规划管理方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2898255A (en) * | 1958-06-30 | 1959-08-04 | Ibm | Soldering flux composition |
US3424625A (en) * | 1965-11-09 | 1969-01-28 | Ernest G Tiegel | Process for welding lead onto lead utilizing a special flux composition |
US3597285A (en) * | 1969-05-02 | 1971-08-03 | Lake Chemical Co | Flux for use in soldering of stainless steels |
US4216035A (en) * | 1977-12-23 | 1980-08-05 | International Business Machines Corporation | Removable protective coating and process of using same |
US4419146A (en) * | 1981-07-15 | 1983-12-06 | International Standard Electric Corporation | Solder flux compositions |
US4896817A (en) * | 1988-10-17 | 1990-01-30 | International Business Machines Corp. | Flux composition and method of decreasing tin content in lead/tin solder joints |
US4988395A (en) * | 1989-01-31 | 1991-01-29 | Senju Metal Industry Co., Ltd. | Water-soluble soldering flux and paste solder using the flux |
US4940498A (en) * | 1989-08-14 | 1990-07-10 | Multicore Solders Limited | Flux composition |
US5004509A (en) * | 1990-05-04 | 1991-04-02 | Delco Electronics Corporation | Low residue soldering flux |
US5064481A (en) * | 1990-05-17 | 1991-11-12 | Motorola, Inc. | Use or organic acids in low residue solder pastes |
US5092943A (en) * | 1990-09-17 | 1992-03-03 | Motorola, Inc. | Method of cleaning printed circuit boards using water |
JPH084953B2 (ja) * | 1991-04-17 | 1996-01-24 | ユーホーケミカル株式会社 | フラックス又ははんだペースト用腐食防止剤 |
US5122201A (en) * | 1991-11-19 | 1992-06-16 | International Business Machines Corporation | Water-soluble solder flux |
US5281281A (en) * | 1993-02-05 | 1994-01-25 | Litton Systems, Inc. | No-clean, low-residue, volatile organic compound free soldering flux and method of use |
US5334260B1 (en) * | 1993-02-05 | 1995-10-24 | Litton Systems Inc | No-clean, low-residue, volatile organic conpound free soldering flux and method of use |
US5443660A (en) * | 1994-10-24 | 1995-08-22 | Ford Motor Company | Water-based no-clean flux formulation |
-
1994
- 1994-05-31 US US08/251,806 patent/US5615827A/en not_active Expired - Lifetime
-
1995
- 1995-02-20 DE DE69522993T patent/DE69522993T2/de not_active Expired - Fee Related
- 1995-02-20 EP EP95102321A patent/EP0685294B1/de not_active Expired - Lifetime
- 1995-04-26 CN CN95104237A patent/CN1065798C/zh not_active Expired - Fee Related
- 1995-04-27 MY MYPI95001116A patent/MY124297A/en unknown
- 1995-05-05 US US08/435,896 patent/US5531838A/en not_active Expired - Fee Related
- 1995-05-26 JP JP07128154A patent/JP3132745B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1122738A (zh) | 1996-05-22 |
DE69522993D1 (de) | 2001-11-08 |
EP0685294A1 (de) | 1995-12-06 |
EP0685294B1 (de) | 2001-10-04 |
JP3132745B2 (ja) | 2001-02-05 |
US5615827A (en) | 1997-04-01 |
CN1065798C (zh) | 2001-05-16 |
JPH07323390A (ja) | 1995-12-12 |
US5531838A (en) | 1996-07-02 |
MY124297A (en) | 2006-06-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |