FR2686996B1 - Procede de fabrication d'une carte a memoire comprenant un micromodule equipe d'un capot, et carte a memoire ainsi obtenue. - Google Patents
Procede de fabrication d'une carte a memoire comprenant un micromodule equipe d'un capot, et carte a memoire ainsi obtenue.Info
- Publication number
- FR2686996B1 FR2686996B1 FR9201096A FR9201096A FR2686996B1 FR 2686996 B1 FR2686996 B1 FR 2686996B1 FR 9201096 A FR9201096 A FR 9201096A FR 9201096 A FR9201096 A FR 9201096A FR 2686996 B1 FR2686996 B1 FR 2686996B1
- Authority
- FR
- France
- Prior art keywords
- memory card
- micromodule
- manufacturing
- cover
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9201096A FR2686996B1 (fr) | 1992-01-31 | 1992-01-31 | Procede de fabrication d'une carte a memoire comprenant un micromodule equipe d'un capot, et carte a memoire ainsi obtenue. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9201096A FR2686996B1 (fr) | 1992-01-31 | 1992-01-31 | Procede de fabrication d'une carte a memoire comprenant un micromodule equipe d'un capot, et carte a memoire ainsi obtenue. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2686996A1 FR2686996A1 (fr) | 1993-08-06 |
FR2686996B1 true FR2686996B1 (fr) | 1996-02-02 |
Family
ID=9426212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9201096A Expired - Fee Related FR2686996B1 (fr) | 1992-01-31 | 1992-01-31 | Procede de fabrication d'une carte a memoire comprenant un micromodule equipe d'un capot, et carte a memoire ainsi obtenue. |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2686996B1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2721732B1 (fr) * | 1994-06-22 | 1996-08-30 | Solaic Sa | Carte à mémoire sans contact dont le circuit électronique comporte un module. |
FR2731132B1 (fr) * | 1995-02-24 | 1997-04-04 | Solaic Sa | Procede pour implanter un element electronique, notamment un microcircuit, dans un corps de carte electronique, et corps de carte electronique comportant un element electronique ainsi implante |
FR2758005B1 (fr) * | 1996-12-30 | 1999-05-07 | Solaic Sa | Module a circuit integre comportant un organe de conformation |
FR2872610B1 (fr) * | 2004-07-02 | 2007-06-08 | Commissariat Energie Atomique | Dispositif de securisation de composants |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4511796A (en) * | 1982-12-09 | 1985-04-16 | Seiichiro Aigo | Information card |
FR2625000B1 (fr) * | 1987-12-22 | 1991-08-16 | Sgs Thomson Microelectronics | Structure de carte a puce |
GB8901189D0 (en) * | 1989-01-19 | 1989-03-15 | Avery W & T Limited | Portable electronic token |
FR2636453B1 (fr) * | 1988-09-14 | 1992-01-17 | Sgs Thomson Microelectronics | Procede d'encapsulation de circuits-integres notamment pour cartes a puces |
-
1992
- 1992-01-31 FR FR9201096A patent/FR2686996B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2686996A1 (fr) | 1993-08-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20091030 |