DE69504471D1 - Vorrichtung zur Verhinderung elektromagnetischer Störung - Google Patents

Vorrichtung zur Verhinderung elektromagnetischer Störung

Info

Publication number
DE69504471D1
DE69504471D1 DE69504471T DE69504471T DE69504471D1 DE 69504471 D1 DE69504471 D1 DE 69504471D1 DE 69504471 T DE69504471 T DE 69504471T DE 69504471 T DE69504471 T DE 69504471T DE 69504471 D1 DE69504471 D1 DE 69504471D1
Authority
DE
Germany
Prior art keywords
prevention device
electromagnetic interference
interference prevention
electromagnetic
prevention
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69504471T
Other languages
English (en)
Other versions
DE69504471T2 (de
Inventor
Robert F German
Xavier Soler
Andrew Frost
Richard Lewis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE69504471D1 publication Critical patent/DE69504471D1/de
Publication of DE69504471T2 publication Critical patent/DE69504471T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Noise Elimination (AREA)
DE69504471T 1995-02-24 1995-07-05 Vorrichtung zur Verhinderung elektromagnetischer Störung Expired - Lifetime DE69504471T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP95500019 1995-02-24
EP95500098A EP0729294B1 (de) 1995-02-24 1995-07-05 Vorrichtung zur Verhinderung elektromagnetischer Störung

Publications (2)

Publication Number Publication Date
DE69504471D1 true DE69504471D1 (de) 1998-10-08
DE69504471T2 DE69504471T2 (de) 1999-04-29

Family

ID=26140629

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69504471T Expired - Lifetime DE69504471T2 (de) 1995-02-24 1995-07-05 Vorrichtung zur Verhinderung elektromagnetischer Störung

Country Status (5)

Country Link
US (1) US5684340A (de)
EP (1) EP0729294B1 (de)
JP (1) JPH08250884A (de)
DE (1) DE69504471T2 (de)
ES (1) ES2122491T3 (de)

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DE19630720A1 (de) * 1996-07-30 1998-02-05 Bodenseewerk Geraetetech Filteranordnung zur Trennung eines HF-Felder enthaltenden Bereiches von einem gegen HF-Felder abgeschirmten Bereich
US5717577A (en) * 1996-10-30 1998-02-10 Ericsson, Inc. Gasketed shield can for shielding emissions of electromagnetic energy
DE19649848A1 (de) 1996-12-02 1998-06-04 Mannesmann Vdo Ag Elektronischer Schaltkreis mit einem hochfrequenzbedämpfenden Schirmgehäuse
JPH11101835A (ja) * 1997-09-26 1999-04-13 Sharp Corp Ｒｆ通信ユニットおよびその検査方法
US6255581B1 (en) * 1998-03-31 2001-07-03 Gore Enterprise Holdings, Inc. Surface mount technology compatible EMI gasket and a method of installing an EMI gasket on a ground trace
WO2000032022A1 (de) * 1998-11-24 2000-06-02 Continental Teves Ag & Co. Ohg Anordnung zum schutz von elektronischen funktionseinheiten und/oder funktionsgruppen
JP2000269678A (ja) * 1999-03-16 2000-09-29 Matsushita Electric Ind Co Ltd 高周波装置
US6116924A (en) * 1999-05-25 2000-09-12 3Com Corporation Electromagnetic emissions shielding structure for circuit board connector assembly
US6309742B1 (en) 2000-01-28 2001-10-30 Gore Enterprise Holdings, Inc. EMI/RFI shielding gasket
JP2002094689A (ja) * 2000-06-07 2002-03-29 Sony Computer Entertainment Inc プログラム実行システム、プログラム実行装置、中継装置、および記録媒体
CN100433952C (zh) * 2000-11-30 2008-11-12 神达电脑股份有限公司 抑制高速电路电磁干扰的抵消电路
US6376993B1 (en) * 2001-02-20 2002-04-23 Perkinelmer Optoelectronics, N.C., Inc. Power supply to xenon ARC lamp interface
US6900383B2 (en) * 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
US20050095410A1 (en) * 2001-03-19 2005-05-05 Mazurkiewicz Paul H. Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
US6743975B2 (en) 2001-03-19 2004-06-01 Hewlett-Packard Development Company, L.P. Low profile non-electrically-conductive component cover for encasing circuit board components to prevent direct contact of a conformal EMI shield
FR2840505A1 (fr) * 2002-05-31 2003-12-05 Thomson Multimedia Broadband F Dispositif de blindage pour cartes de circuits imprimes
DE10228633B4 (de) * 2002-06-26 2006-12-21 Fujitsu Siemens Computers Gmbh Vorrichtung zum Schutz vor elektrostatischer Entladung und elektromagnetischer Einflüsse
US7209368B2 (en) * 2003-01-30 2007-04-24 Endicott Interconnect Technologies, Inc. Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making
US7326862B2 (en) 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7478472B2 (en) * 2004-03-03 2009-01-20 Endicott Interconnect Technologies, Inc. Method of making circuitized substrate with signal wire shielding
US8538560B2 (en) 2004-04-29 2013-09-17 Rosemount Inc. Wireless power and communication unit for process field devices
US8787848B2 (en) 2004-06-28 2014-07-22 Rosemount Inc. RF adapter for field device with low voltage intrinsic safety clamping
US7679005B2 (en) * 2005-03-23 2010-03-16 Endicott Interconnect Technologies, Inc. Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same
NL1030295C2 (nl) 2005-10-28 2007-05-03 Fei Co Hermetisch afgesloten behuizing met elektrische doorvoer.
JP5289712B2 (ja) * 2007-01-30 2013-09-11 三菱電機株式会社 シールドカバー取付け構造および表示装置
EP2310918B1 (de) 2008-06-17 2014-10-08 Rosemount, Inc. Rf adapter für feldgerät mit variabeln spannungsabfall
US8929948B2 (en) 2008-06-17 2015-01-06 Rosemount Inc. Wireless communication adapter for field devices
US8694060B2 (en) 2008-06-17 2014-04-08 Rosemount Inc. Form factor and electromagnetic interference protection for process device wireless adapters
ES2354543B1 (es) * 2009-03-13 2012-02-23 Grin Grupo Ingenieros, S.L Mesa con protección electromagnética.
US9674976B2 (en) 2009-06-16 2017-06-06 Rosemount Inc. Wireless process communication adapter with improved encapsulation
US8626087B2 (en) 2009-06-16 2014-01-07 Rosemount Inc. Wire harness for field devices used in a hazardous locations
US10761524B2 (en) 2010-08-12 2020-09-01 Rosemount Inc. Wireless adapter with process diagnostics
US9310794B2 (en) 2011-10-27 2016-04-12 Rosemount Inc. Power supply for industrial process field device
WO2017142870A1 (en) * 2016-02-15 2017-08-24 Neocoil, Llc Magnetic resonance imaging compatible mobile computing device
DE102019219478A1 (de) * 2019-12-12 2021-06-17 Continental Automotive Gmbh Modular erweiterbares elektronisches steuergerät
JP7278233B2 (ja) * 2020-03-19 2023-05-19 株式会社ソニー・インタラクティブエンタテインメント 電子機器
EP3886551B1 (de) * 2020-03-27 2023-05-10 Hamilton Sundstrand Corporation Vorrichtung zur minderung elektromagnetischer interferenz in einem elektronischen steuergerät
JP7419963B2 (ja) * 2020-05-14 2024-01-23 株式会社デンソー 電力変換装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0627995Y2 (ja) * 1986-03-20 1994-07-27 株式会社東芝 シ−ルド構造
CH674288A5 (en) * 1987-12-02 1990-05-15 Oerlikon Buehrle Ag Screened electrical equipment with filters built into screen - has sealed opening in wall for connections which pass through screen between inner and outer wiring
DE3823469A1 (de) * 1988-07-11 1990-01-18 Bodenseewerk Geraetetech Filteranordnung
FR2669501B1 (fr) * 1990-11-16 1996-06-21 Telecommunications Sa Embase pour coffret blinde de cartes imprimees.
JP3087495B2 (ja) * 1993-03-05 2000-09-11 松下電器産業株式会社 コンデンサおよびシールドケース
CA2116995C (en) * 1993-03-05 1999-01-12 Kazunori Yamate Three-terminal capacitor and assembly
CA2137497A1 (en) * 1993-12-09 1995-06-10 Arno Muller Electro-magnetic field encapsulating shielding for a modular universal main logic board
DE4407492A1 (de) * 1994-03-07 1995-09-14 Bodenseewerk Geraetetech Einrichtung zur Abschirmung von auf einer Elektronikkarte angeordneten elektronischen Bauteilen gegen äußere, elektromagnetische Felder
US5428508A (en) * 1994-04-29 1995-06-27 Motorola, Inc. Method for providing electromagnetic shielding of an electrical circuit

Also Published As

Publication number Publication date
DE69504471T2 (de) 1999-04-29
EP0729294A1 (de) 1996-08-28
EP0729294B1 (de) 1998-09-02
JPH08250884A (ja) 1996-09-27
ES2122491T3 (es) 1998-12-16
US5684340A (en) 1997-11-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD CO. (N.D.GES.D.STAATES DELAWARE),

8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE