DE69431828D1 - Verfahren zur Herstellung von gedruckten Schaltungskarten - Google Patents
Verfahren zur Herstellung von gedruckten SchaltungskartenInfo
- Publication number
- DE69431828D1 DE69431828D1 DE69431828T DE69431828T DE69431828D1 DE 69431828 D1 DE69431828 D1 DE 69431828D1 DE 69431828 T DE69431828 T DE 69431828T DE 69431828 T DE69431828 T DE 69431828T DE 69431828 D1 DE69431828 D1 DE 69431828D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- printed circuit
- circuit boards
- boards
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/142,997 US5394609A (en) | 1993-10-26 | 1993-10-26 | Method and apparatus for manufacture of printed circuit cards |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69431828D1 true DE69431828D1 (de) | 2003-01-16 |
DE69431828T2 DE69431828T2 (de) | 2003-09-04 |
Family
ID=22502127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69431828T Expired - Lifetime DE69431828T2 (de) | 1993-10-26 | 1994-09-16 | Verfahren zur Herstellung von gedruckten Schaltungskarten |
Country Status (3)
Country | Link |
---|---|
US (1) | US5394609A (de) |
EP (1) | EP0650314B1 (de) |
DE (1) | DE69431828T2 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19600928A1 (de) * | 1996-01-12 | 1997-07-24 | Ibm | Vorrichtung zur Handhabung von Leiterplatten und deren Herstellung |
US5678304A (en) * | 1996-07-24 | 1997-10-21 | Eastman Kodak Company | Method for manufacturing double-sided circuit assemblies |
US5988510A (en) * | 1997-02-13 | 1999-11-23 | Micron Communications, Inc. | Tamper resistant smart card and method of protecting data in a smart card |
JP3104906B2 (ja) * | 1997-05-13 | 2000-10-30 | 日本電産リード株式会社 | 基板位置ずれ検出装置および基板位置ずれ検出方法 |
JP2997231B2 (ja) * | 1997-09-12 | 2000-01-11 | 富士通株式会社 | マルチ半導体ベアチップ実装モジュールの製造方法 |
US6765652B1 (en) * | 1998-01-12 | 2004-07-20 | Micron Technology, Inc. | Forming thermally curable materials on a support structure in an electronic device |
DE19851868C1 (de) * | 1998-11-10 | 2001-10-31 | Tyco Electronics Logistics Ag | Elektrisches Leiterplatten-Bauteil und Verfahren zur automatischen Bestückung von Leiterplatten mit solchen Bauteilen |
US6248199B1 (en) | 1999-04-26 | 2001-06-19 | Soundcraft, Inc. | Method for the continuous fabrication of access control and identification cards with embedded electronics or other elements |
US6273339B1 (en) | 1999-08-30 | 2001-08-14 | Micron Technology, Inc. | Tamper resistant smart card and method of protecting data in a smart card |
GB2345453B (en) * | 1999-09-14 | 2000-12-27 | Lee John Robinson | Laminated reflow soldering |
JP2002092575A (ja) * | 2000-09-19 | 2002-03-29 | Mitsubishi Electric Corp | 小型カードとその製造方法 |
JP2002134847A (ja) * | 2000-10-20 | 2002-05-10 | Mitsubishi Electric Corp | 半導体装置モジュール用フレームおよびその群 |
US6892740B2 (en) * | 2002-01-22 | 2005-05-17 | Teh Kean Khoon | Method and apparatus for transferring chips |
US7250330B2 (en) * | 2002-10-29 | 2007-07-31 | International Business Machines Corporation | Method of making an electronic package |
KR20040061250A (ko) * | 2002-12-30 | 2004-07-07 | 삼성전자주식회사 | 핀 커넥터에 접합 가능한 인쇄 회로 기판 및 그 제조 방법 |
US6892646B1 (en) | 2003-07-11 | 2005-05-17 | Raytheon Company | Granular matter filled weapon guidance electronics unit |
US7422141B2 (en) * | 2004-01-22 | 2008-09-09 | Hrl Laboratories, Llc | Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale |
DE102006019250A1 (de) * | 2006-04-26 | 2007-10-31 | Robert Bosch Gmbh | Elektronische Baueinheit |
US7982137B2 (en) * | 2007-06-27 | 2011-07-19 | Hamilton Sundstrand Corporation | Circuit board with an attached die and intermediate interposer |
US9525548B2 (en) | 2010-10-21 | 2016-12-20 | Microsoft Technology Licensing, Llc | Provisioning techniques |
US8805434B2 (en) | 2010-11-23 | 2014-08-12 | Microsoft Corporation | Access techniques using a mobile communication device |
US20120143769A1 (en) * | 2010-12-02 | 2012-06-07 | Microsoft Corporation | Commerce card |
US9509686B2 (en) | 2010-12-03 | 2016-11-29 | Microsoft Technology Licensing, Llc | Secure element authentication |
DE102011108531A1 (de) * | 2011-07-26 | 2013-01-31 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines Kartenkörpers |
KR101605172B1 (ko) * | 2015-04-07 | 2016-03-22 | 삼성전자주식회사 | 패키지 기판 및 그 제조방법 |
CN109936912B (zh) * | 2017-12-18 | 2020-10-27 | 陈松佑 | 具有旁路电容的电子模块卡结构 |
KR102404058B1 (ko) | 2017-12-28 | 2022-05-31 | 삼성전자주식회사 | 반도체 패키지 |
CN113301726B (zh) * | 2021-05-25 | 2022-03-08 | 中国电子科技集团公司第二十九研究所 | 基于板间垂直互联印制板组件的设计方法及其焊接方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3916515A (en) * | 1974-09-26 | 1975-11-04 | Northern Electric Co | Method of producing printed circuit board in multiple units |
DE3113031A1 (de) * | 1981-04-01 | 1982-10-21 | Hagenuk GmbH, 2300 Kiel | "handhabungsvorrichtung fuer leiterplatten" |
US4582245A (en) * | 1984-12-18 | 1986-04-15 | At&T Technologies, Inc. | Method and apparatus for automated spring clip insertion and removal |
US4689103A (en) * | 1985-11-18 | 1987-08-25 | E. I. Du Pont De Nemours And Company | Method of manufacturing injection molded printed circuit boards in a common planar array |
US4779877A (en) * | 1986-04-22 | 1988-10-25 | Varian Associates, Inc. | Wafer support assembly |
DD267375A1 (de) * | 1987-12-24 | 1989-04-26 | Berlin Treptow Veb K | Aufnahmevorrichtung zum loeten von leiterplatten |
US4860439A (en) * | 1988-10-25 | 1989-08-29 | Riley Bryan R | Universal alignment fixture |
US5044615A (en) * | 1991-02-08 | 1991-09-03 | International Business Machines Corporation | Dual purpose work board holder |
-
1993
- 1993-10-26 US US08/142,997 patent/US5394609A/en not_active Expired - Lifetime
-
1994
- 1994-09-16 EP EP94114604A patent/EP0650314B1/de not_active Expired - Lifetime
- 1994-09-16 DE DE69431828T patent/DE69431828T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0650314A2 (de) | 1995-04-26 |
DE69431828T2 (de) | 2003-09-04 |
EP0650314A3 (de) | 1996-12-18 |
EP0650314B1 (de) | 2002-12-04 |
US5394609A (en) | 1995-03-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) |