DE69422351D1 - Teilchenanalyse von gekerbten Scheiben - Google Patents

Teilchenanalyse von gekerbten Scheiben

Info

Publication number
DE69422351D1
DE69422351D1 DE69422351T DE69422351T DE69422351D1 DE 69422351 D1 DE69422351 D1 DE 69422351D1 DE 69422351 T DE69422351 T DE 69422351T DE 69422351 T DE69422351 T DE 69422351T DE 69422351 D1 DE69422351 D1 DE 69422351D1
Authority
DE
Germany
Prior art keywords
particle analysis
notched disks
notched
disks
particle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69422351T
Other languages
English (en)
Other versions
DE69422351T2 (de
Inventor
Yuri S Uritsky
Harry Q Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69422351D1 publication Critical patent/DE69422351D1/de
Publication of DE69422351T2 publication Critical patent/DE69422351T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/252—Tubes for spot-analysing by electron or ion beams; Microanalysers
    • H01J37/256—Tubes for spot-analysing by electron or ion beams; Microanalysers using scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69422351T 1993-08-31 1994-07-08 Teilchenanalyse von gekerbten Scheiben Expired - Fee Related DE69422351T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/115,482 US5381004A (en) 1993-08-31 1993-08-31 Particle analysis of notched wafers

Publications (2)

Publication Number Publication Date
DE69422351D1 true DE69422351D1 (de) 2000-02-03
DE69422351T2 DE69422351T2 (de) 2000-07-06

Family

ID=22361689

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69422351T Expired - Fee Related DE69422351T2 (de) 1993-08-31 1994-07-08 Teilchenanalyse von gekerbten Scheiben

Country Status (5)

Country Link
US (1) US5381004A (de)
EP (1) EP0641021B1 (de)
JP (1) JPH07181125A (de)
KR (1) KR950007047A (de)
DE (1) DE69422351T2 (de)

Families Citing this family (44)

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US5631733A (en) * 1995-01-20 1997-05-20 Photon Dynamics, Inc. Large area defect monitor tool for manufacture of clean surfaces
US5497007A (en) * 1995-01-27 1996-03-05 Applied Materials, Inc. Method for automatically establishing a wafer coordinate system
JP2813147B2 (ja) * 1995-02-14 1998-10-22 三菱電機株式会社 微小異物の分析方法、分析装置およびこれらを用いる半導体素子もしくは液晶表示素子の製法
JP3130222B2 (ja) * 1995-02-14 2001-01-31 三菱電機株式会社 微小異物の分析方法、分析装置およびこれらを用いる半導体素子もしくは液晶表示素子の製法
US5825913A (en) * 1995-07-18 1998-10-20 Cognex Corporation System for finding the orientation of a wafer
US5801824A (en) * 1996-11-25 1998-09-01 Photon Dynamics, Inc. Large area defect monitor tool for manufacture of clean surfaces
US5870187A (en) * 1997-08-08 1999-02-09 Applied Materials, Inc. Method for aligning semiconductor wafer surface scans and identifying added and removed particles resulting from wafer handling or processing
US5985680A (en) * 1997-08-08 1999-11-16 Applied Materials, Inc. Method and apparatus for transforming a substrate coordinate system into a wafer analysis tool coordinate system
US6051845A (en) * 1998-03-25 2000-04-18 Applied Materials, Inc. Method and apparatus for selectively marking a semiconductor wafer
US7295314B1 (en) * 1998-07-10 2007-11-13 Nanometrics Incorporated Metrology/inspection positioning system
US6320609B1 (en) * 1998-07-10 2001-11-20 Nanometrics Incorporated System using a polar coordinate stage and continuous image rotation to compensate for stage rotation
JP2000164658A (ja) * 1998-11-26 2000-06-16 Tokyo Seimitsu Co Ltd 半導体ウェハのレビューステーション及び外観検査装置
US6205364B1 (en) * 1999-02-02 2001-03-20 Creo Ltd. Method and apparatus for registration control during processing of a workpiece particularly during producing images on substrates in preparing printed circuit boards
US6410927B1 (en) * 1999-04-21 2002-06-25 Advanced Micro Devices, Inc Semiconductor wafer alignment method using an identification scribe
US6369888B1 (en) * 1999-11-17 2002-04-09 Applied Materials, Inc. Method and apparatus for article inspection including speckle reduction
JP3934854B2 (ja) * 2000-05-29 2007-06-20 株式会社日立製作所 走査電子顕微鏡
KR20020031608A (ko) * 2000-10-19 2002-05-03 이응세 항균효과가 우수한 황금 추출물, 그의 제조방법 및 그를포함하는 약학적 조성물
JPWO2002061367A1 (ja) * 2001-01-31 2004-06-03 株式会社ニコン 位置検出方法及び装置、露光方法及び装置、並びにプログラム及び情報記録媒体
US6593066B2 (en) 2001-02-28 2003-07-15 Creo Il. Ltd. Method and apparatus for printing patterns on substrates
US6493064B2 (en) 2001-02-28 2002-12-10 Creo Il, Ltd. Method and apparatus for registration control in production by imaging
US20060100730A1 (en) * 2002-07-12 2006-05-11 Parkes Alan S Method for detection and relocation of wafer defects
US6892013B2 (en) * 2003-01-15 2005-05-10 Negevtech Ltd. Fiber optical illumination system
US7525659B2 (en) * 2003-01-15 2009-04-28 Negevtech Ltd. System for detection of water defects
US7486861B2 (en) * 2003-01-15 2009-02-03 Negevtech Ltd. Fiber optical illumination system
EP1766363A2 (de) * 2004-07-12 2007-03-28 Negevtech Ltd. Mehrfachmodus-inspektionsverfahren und vorrichtung
US20060012781A1 (en) * 2004-07-14 2006-01-19 Negevtech Ltd. Programmable spatial filter for wafer inspection
US7804993B2 (en) * 2005-02-28 2010-09-28 Applied Materials South East Asia Pte. Ltd. Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images
US7813541B2 (en) * 2005-02-28 2010-10-12 Applied Materials South East Asia Pte. Ltd. Method and apparatus for detecting defects in wafers
US7639861B2 (en) * 2005-09-14 2009-12-29 Cognex Technology And Investment Corporation Method and apparatus for backlighting a wafer during alignment
JP4533306B2 (ja) * 2005-12-06 2010-09-01 株式会社日立ハイテクノロジーズ 半導体ウェハ検査方法及び欠陥レビュー装置
US8031931B2 (en) * 2006-04-24 2011-10-04 Applied Materials South East Asia Pte. Ltd. Printed fourier filtering in optical inspection tools
US8162584B2 (en) * 2006-08-23 2012-04-24 Cognex Corporation Method and apparatus for semiconductor wafer alignment
DE112007002770A5 (de) * 2006-09-12 2009-08-20 Vistec Electron Beam Gmbh Verfahren zur Bestimmung der Laage eines scheibenförmigen Substrates relativ zu einem anlageninternen Koordinatensystem einer Elektronenstrahl-Belichtungsanlage
JP4809744B2 (ja) * 2006-09-19 2011-11-09 東京エレクトロン株式会社 ウエハの中心検出方法及びその方法を記録した記録媒体
US7719674B2 (en) * 2006-11-28 2010-05-18 Applied Materials South East Asia Pte. Ltd. Image splitting in optical inspection systems
US7714998B2 (en) * 2006-11-28 2010-05-11 Applied Materials South East Asia Pte. Ltd. Image splitting in optical inspection systems
US8139231B2 (en) * 2008-05-01 2012-03-20 Cognex Corporation Machine vision technique for manufacturing semiconductor wafers
US8570516B2 (en) * 2008-09-12 2013-10-29 Cognex Corporation Infrared direct illumination machine vision technique for semiconductor processing equipment
US8189194B2 (en) * 2008-09-12 2012-05-29 Cognex Corporation Direct illumination machine vision technique for processing semiconductor wafers
CN106030772B (zh) 2014-02-12 2020-04-14 科磊股份有限公司 晶片缺口检测
CN104979257B (zh) * 2014-04-14 2021-03-09 睿励科学仪器（上海）有限公司 用于无图案硅片测量的定位方法
CN106340482B (zh) * 2015-07-09 2020-01-14 睿励科学仪器（上海）有限公司 基于晶圆边角和缺口定位的自动校正定标方法
JP6721468B2 (ja) * 2016-09-14 2020-07-15 株式会社ディスコ 加工装置
US11626305B2 (en) * 2019-06-25 2023-04-11 Applied Materials, Inc. Sensor-based correction of robot-held object

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4037941A (en) * 1975-06-30 1977-07-26 International Business Machines Corporation Inspection tool
US4611292A (en) * 1982-10-06 1986-09-09 Hitachi, Ltd. Robot vision system
US4659220A (en) * 1984-10-22 1987-04-21 International Business Machines Corporation Optical inspection system for semiconductor wafers
EP0237601B1 (de) * 1986-03-19 1989-05-31 Rollei Fototechnic GmbH Verfahren zur photogrammetrischen Erfassung eines Objektes mit Hilfe zumindest eines opto-elektrischen Festkörper-Flächensensors
US4900695A (en) * 1986-12-17 1990-02-13 Hitachi, Ltd. Semiconductor integrated circuit device and process for producing the same
JP3027241B2 (ja) * 1991-07-30 2000-03-27 株式会社堀場製作所 異物検査装置
US5267017A (en) * 1992-05-20 1993-11-30 Applied Materials, Inc. Method of particle analysis on a mirror wafer

Also Published As

Publication number Publication date
US5381004A (en) 1995-01-10
DE69422351T2 (de) 2000-07-06
JPH07181125A (ja) 1995-07-21
EP0641021B1 (de) 1999-12-29
EP0641021A3 (de) 1995-07-26
KR950007047A (ko) 1995-03-21
EP0641021A2 (de) 1995-03-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee