DE69408189T2 - Kupferfolie für Leiterplatten und Verfahren zu ihrer Herstellung - Google Patents

Kupferfolie für Leiterplatten und Verfahren zu ihrer Herstellung

Info

Publication number
DE69408189T2
DE69408189T2 DE69408189T DE69408189T DE69408189T2 DE 69408189 T2 DE69408189 T2 DE 69408189T2 DE 69408189 T DE69408189 T DE 69408189T DE 69408189 T DE69408189 T DE 69408189T DE 69408189 T2 DE69408189 T2 DE 69408189T2
Authority
DE
Germany
Prior art keywords
manufacture
printed circuit
copper foil
circuit boards
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69408189T
Other languages
English (en)
Other versions
DE69408189D1 (de
Inventor
Yoshio Kawasumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Japan Energy Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP05091842A external-priority patent/JP3113445B2/ja
Priority claimed from JP5237181A external-priority patent/JPH0774464A/ja
Application filed by Japan Energy Corp filed Critical Japan Energy Corp
Publication of DE69408189D1 publication Critical patent/DE69408189D1/de
Application granted granted Critical
Publication of DE69408189T2 publication Critical patent/DE69408189T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y10T428/12618—Plural oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
DE69408189T 1993-03-29 1994-03-29 Kupferfolie für Leiterplatten und Verfahren zu ihrer Herstellung Expired - Lifetime DE69408189T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP05091842A JP3113445B2 (ja) 1993-03-29 1993-03-29 印刷回路用銅箔及びその製造方法
JP5237181A JPH0774464A (ja) 1993-08-31 1993-08-31 印刷回路用銅箔及びその製造方法

Publications (2)

Publication Number Publication Date
DE69408189D1 DE69408189D1 (de) 1998-03-05
DE69408189T2 true DE69408189T2 (de) 1998-09-03

Family

ID=26433275

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69408189T Expired - Lifetime DE69408189T2 (de) 1993-03-29 1994-03-29 Kupferfolie für Leiterplatten und Verfahren zu ihrer Herstellung

Country Status (4)

Country Link
US (1) US5552234A (de)
EP (1) EP0618755B1 (de)
CN (2) CN1067120C (de)
DE (1) DE69408189T2 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6086743A (en) * 1997-08-06 2000-07-11 Gould Electronics, Inc. Adhesion enhancement for metal foil
US5908544A (en) 1997-09-04 1999-06-01 Gould Electronics, Inc. Zinc-chromium stabilizer containing a hydrogen inhibiting additive
ES2367838T3 (es) 1998-09-10 2011-11-10 JX Nippon Mining & Metals Corp. Laminado que comprende una hoja de cobre tratada y procedimiento para su fabricación.
US6117536A (en) * 1998-09-10 2000-09-12 Ga-Tek Inc. Adhesion promoting layer for use with epoxy prepregs
US6132589A (en) * 1998-09-10 2000-10-17 Ga-Tek Inc. Treated copper foil and process for making treated copper foil
US6579568B2 (en) 1999-11-29 2003-06-17 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board having excellent chemical resistance and heat resistance
US6489034B1 (en) * 2000-02-08 2002-12-03 Gould Electronics Inc. Method of forming chromium coated copper for printed circuit boards
US6489035B1 (en) * 2000-02-08 2002-12-03 Gould Electronics Inc. Applying resistive layer onto copper
US6379487B1 (en) 2000-05-05 2002-04-30 Ga-Tek Inc. Component of printed circuit board
US6622374B1 (en) 2000-09-22 2003-09-23 Gould Electronics Inc. Resistor component with multiple layers of resistive material
CN100444365C (zh) * 2001-05-24 2008-12-17 弗莱氏金属公司 热界面材料
CA2547358C (en) * 2001-05-24 2013-08-06 Fry's Metals, Inc. Thermal interface material and solder preforms
US6852427B1 (en) 2003-09-02 2005-02-08 Olin Corporation Chromium-free antitarnish adhesion promoting treatment composition
TWI263461B (en) * 2003-12-26 2006-10-01 Ind Tech Res Inst Enhanced flexible copper foil structure and fabrication method thereof
JP2005344174A (ja) * 2004-06-03 2005-12-15 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔を用いて製造したフレキシブル銅張積層板並びにフィルムキャリアテープ
WO2006016473A1 (ja) * 2004-08-10 2006-02-16 Nippon Mining & Metals Co., Ltd. フレキシブル銅基板用バリア膜及びバリア膜形成用スパッタリングターゲット
TWI396779B (zh) * 2005-02-21 2013-05-21 Copper foil and its manufacturing method, and flexible printed circuit board
JP4626390B2 (ja) * 2005-05-16 2011-02-09 日立電線株式会社 環境保護を配慮したプリント配線板用銅箔
JP2009158382A (ja) * 2007-12-27 2009-07-16 Hitachi Cable Ltd 銅箔
JP4955106B2 (ja) 2008-12-26 2012-06-20 Ｊｘ日鉱日石金属株式会社 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法
CN102265711B (zh) 2008-12-26 2014-11-05 吉坤日矿日石金属株式会社 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法
EP2384101A4 (de) * 2009-01-29 2012-08-29 Jx Nippon Mining & Metals Corp Gewalzte kupferfolie oder elektrolyt-kupferfolie für elektronische schaltungen sowie verfahren zum aufbau einer elektronischen schaltung damit
EP2557204A1 (de) 2010-05-07 2013-02-13 JX Nippon Mining & Metals Corp. Kupferfolie für leiterplatten
JP5654416B2 (ja) * 2011-06-07 2015-01-14 Jx日鉱日石金属株式会社 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔
CN104404584A (zh) * 2014-12-22 2015-03-11 常熟市伟达电镀有限责任公司 一种锌镍合金电镀工艺
US9647272B1 (en) 2016-01-14 2017-05-09 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil
CN107164748A (zh) * 2017-05-17 2017-09-15 江西铜博科技有限公司 一种铜箔表面化学钝化处理方法
US10337115B1 (en) * 2018-01-05 2019-07-02 Chang Chun Petrochemical Co., Ltd. Surface treated copper foil for high speed printed circuit board products including the copper foil and methods of making
KR102394732B1 (ko) 2018-04-27 2022-05-09 제이엑스금속주식회사 표면 처리 동박, 동장 적층판 및 프린트 배선판
CN108848608B (zh) * 2018-07-11 2020-05-15 深圳市景旺电子股份有限公司 一种柔性电路板及其制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1531454A (en) * 1976-01-20 1978-11-08 Electrofoils Ltd Electroplated copper foil
JPS5687677A (en) * 1979-12-19 1981-07-16 Nippon Mining Co Ltd Method of producing copper foil for printed circuit
US4386139A (en) * 1980-10-31 1983-05-31 Furukawa Circuit Foil Co., Ltd. Copper foil for a printed circuit and a method for the production thereof
JPS587077A (ja) * 1981-07-02 1983-01-14 東急建設株式会社 サツシの取付方法
JPS6133908A (ja) * 1984-07-24 1986-02-18 株式会社ダイフク 物品の被覆装置
EP0181430A1 (de) * 1984-11-13 1986-05-21 Olin Corporation Systeme zur Herstellung einer elektroplattierten und/oder bearbeiteten Metallfolie
US4572768A (en) * 1985-06-28 1986-02-25 Square D Company Treatment for copper foil
US5057193A (en) * 1989-04-05 1991-10-15 Olin Corporation Anti-tarnish treatment of metal foil
US5262247A (en) * 1989-05-17 1993-11-16 Fukuda Kinzoku Hakufun Kogyo Kabushiki Kaisha Thin copper foil for printed wiring board
JPH07120564B2 (ja) * 1989-10-02 1995-12-20 日本電解株式会社 抵抗層付導電材料及び抵抗層付プリント回路基板
US5338619A (en) * 1991-05-16 1994-08-16 Fukuda Metal Foil And Powder Co., Ltd. Copper foil for printed circuits and method of producing same
JPH0521951A (ja) * 1991-07-16 1993-01-29 Cmk Corp 銅張積層板用銅箔
TW230290B (de) * 1991-11-15 1994-09-11 Nikko Guruder Foreer Kk
JPH0787270B2 (ja) * 1992-02-19 1995-09-20 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法

Also Published As

Publication number Publication date
DE69408189D1 (de) 1998-03-05
US5552234A (en) 1996-09-03
CN1295426A (zh) 2001-05-16
EP0618755A1 (de) 1994-10-05
EP0618755B1 (de) 1998-01-28
CN1173612C (zh) 2004-10-27
CN1093417A (zh) 1994-10-12
CN1067120C (zh) 2001-06-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NIKKO MATERIALS CO., LTD., TOKIO/TOKYO, JP

8327 Change in the person/name/address of the patent owner

Owner name: NIPPON MINING & METALS CO., LTD., TOKIO/TOKYO, JP

R082 Change of representative

Ref document number: 618755

Country of ref document: EP

Representative=s name: LUDERSCHMIDT, SCHUELER & PARTNER GBR, 65189 WIESBA