DE69403890D1 - Zusammenbau-/Ausbau-Einrichtung für abdichtbaren unter Druck stehenden Transportbehälter - Google Patents

Zusammenbau-/Ausbau-Einrichtung für abdichtbaren unter Druck stehenden Transportbehälter

Info

Publication number
DE69403890D1
DE69403890D1 DE69403890T DE69403890T DE69403890D1 DE 69403890 D1 DE69403890 D1 DE 69403890D1 DE 69403890 T DE69403890 T DE 69403890T DE 69403890 T DE69403890 T DE 69403890T DE 69403890 D1 DE69403890 D1 DE 69403890D1
Authority
DE
Germany
Prior art keywords
assembly
transport containers
disassembly device
pressurized transport
sealable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69403890T
Other languages
English (en)
Other versions
DE69403890T2 (de
Inventor
Andre Lafond
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69403890D1 publication Critical patent/DE69403890D1/de
Publication of DE69403890T2 publication Critical patent/DE69403890T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53096—Means to assemble or disassemble including means to provide a controlled environment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53539—Means to assemble or disassemble including work conveyor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Vacuum Packaging (AREA)
  • Warehouses Or Storage Devices (AREA)
DE69403890T 1994-01-14 1994-01-14 Zusammenbau-/Ausbau-Einrichtung für abdichtbaren unter Druck stehenden Transportbehälter Expired - Fee Related DE69403890T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP94480005A EP0663686B1 (de) 1994-01-14 1994-01-14 Zusammenbau-/Ausbau-Einrichtung für abdichtbaren unter Druck stehenden Transportbehälter

Publications (2)

Publication Number Publication Date
DE69403890D1 true DE69403890D1 (de) 1997-07-24
DE69403890T2 DE69403890T2 (de) 1998-01-08

Family

ID=8218109

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69403890T Expired - Fee Related DE69403890T2 (de) 1994-01-14 1994-01-14 Zusammenbau-/Ausbau-Einrichtung für abdichtbaren unter Druck stehenden Transportbehälter

Country Status (6)

Country Link
US (1) US6026561A (de)
EP (1) EP0663686B1 (de)
JP (1) JP2618210B2 (de)
KR (1) KR0141546B1 (de)
DE (1) DE69403890T2 (de)
TW (1) TW306049B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115351543A (zh) * 2022-09-19 2022-11-18 宁波慧锋自动化科技有限公司 一种密封堵头组件自动装配设备

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US6415843B1 (en) 2001-01-10 2002-07-09 Anadigics, Inc. Spatula for separation of thinned wafer from mounting carrier
US20040081546A1 (en) 2002-08-31 2004-04-29 Applied Materials, Inc. Method and apparatus for supplying substrates to a processing tool
US7258520B2 (en) 2002-08-31 2007-08-21 Applied Materials, Inc. Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
US7684895B2 (en) 2002-08-31 2010-03-23 Applied Materials, Inc. Wafer loading station that automatically retracts from a moving conveyor in response to an unscheduled event
US7234584B2 (en) * 2002-08-31 2007-06-26 Applied Materials, Inc. System for transporting substrate carriers
US7506746B2 (en) 2002-08-31 2009-03-24 Applied Materials, Inc. System for transporting substrate carriers
US6955197B2 (en) 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
US20050095110A1 (en) * 2002-08-31 2005-05-05 Lowrance Robert B. Method and apparatus for unloading substrate carriers from substrate carrier transport system
US7243003B2 (en) * 2002-08-31 2007-07-10 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
US7930061B2 (en) 2002-08-31 2011-04-19 Applied Materials, Inc. Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback
US7221993B2 (en) 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US7578647B2 (en) * 2003-01-27 2009-08-25 Applied Materials, Inc. Load port configurations for small lot size substrate carriers
US20090308030A1 (en) * 2003-01-27 2009-12-17 Applied Materials, Inc. Load port configurations for small lot size substrate carriers
US7778721B2 (en) 2003-01-27 2010-08-17 Applied Materials, Inc. Small lot size lithography bays
US7611318B2 (en) * 2003-01-27 2009-11-03 Applied Materials, Inc. Overhead transfer flange and support for suspending a substrate carrier
US7235806B2 (en) * 2003-05-16 2007-06-26 Asm America, Inc. Wafer edge with light sensor
US6823753B1 (en) * 2003-05-16 2004-11-30 Asm America, Inc. Sensor signal transmission from processing system
US7218983B2 (en) * 2003-11-06 2007-05-15 Applied Materials, Inc. Method and apparatus for integrating large and small lot electronic device fabrication facilities
US7720557B2 (en) 2003-11-06 2010-05-18 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US20050209721A1 (en) * 2003-11-06 2005-09-22 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
TW200524803A (en) 2003-11-13 2005-08-01 Applied Materials Inc Stabilizing substrate carriers during overhead transport
TWI290875B (en) 2004-02-28 2007-12-11 Applied Materials Inc Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility
US7274971B2 (en) 2004-02-28 2007-09-25 Applied Materials, Inc. Methods and apparatus for electronic device manufacturing system monitoring and control
TWI316044B (en) 2004-02-28 2009-10-21 Applied Materials Inc Methods and apparatus for material control system interface
US7611319B2 (en) 2004-06-16 2009-11-03 Applied Materials, Inc. Methods and apparatus for identifying small lot size substrate carriers
US7409263B2 (en) 2004-07-14 2008-08-05 Applied Materials, Inc. Methods and apparatus for repositioning support for a substrate carrier
EP1803151B1 (de) * 2004-08-23 2011-10-05 Murata Machinery, Ltd. Werkzeuglade- und pufferungssystem auf liftbasis
US20060046376A1 (en) * 2004-08-31 2006-03-02 Hofer Willard L Rotating gripper wafer flipper
US7720558B2 (en) 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
US20080107507A1 (en) * 2005-11-07 2008-05-08 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
US8267634B2 (en) * 2005-11-07 2012-09-18 Brooks Automation, Inc. Reduced capacity carrier, transport, load port, buffer system
US20070201967A1 (en) * 2005-11-07 2007-08-30 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
KR20140091768A (ko) * 2005-11-07 2014-07-22 브룩스 오토메이션 인코퍼레이티드 반도체 작업대상물 공정처리 시스템
JP5105334B2 (ja) 2006-01-11 2012-12-26 アプライド マテリアルズ インコーポレイテッド 基板キャリヤをパージするための方法及び装置
US20070258796A1 (en) * 2006-04-26 2007-11-08 Englhardt Eric A Methods and apparatus for transporting substrate carriers
JP2009537075A (ja) * 2006-05-11 2009-10-22 ブルックス オートメーション インコーポレイテッド 低減容量キャリア、搬送機、積載ポート、緩衝装置システム
KR101841753B1 (ko) 2006-08-18 2018-03-23 브룩스 오토메이션 인코퍼레이티드 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템
US20090067905A1 (en) * 2007-09-12 2009-03-12 Xerox Corporation Document management system and method
KR101489963B1 (ko) * 2007-12-13 2015-02-04 한국에이에스엠지니텍 주식회사 박막 증착 장치 및 이를 이용한 증착 방법
US8273178B2 (en) * 2008-02-28 2012-09-25 Asm Genitech Korea Ltd. Thin film deposition apparatus and method of maintaining the same
US8956098B2 (en) * 2011-05-02 2015-02-17 Murata Machinery, Ltd. Automated warehouse
US10865006B2 (en) 2018-06-04 2020-12-15 Express Scripts Strategic Development, Inc. Pharmacy order processing system workstations and related methods
US10695902B2 (en) * 2018-06-04 2020-06-30 Express Scripts Strategic Development, Inc. Pharmacy order processing system
CN109309037A (zh) * 2018-08-30 2019-02-05 陈凯辉 一种同时支持多个半导体材料加工设备的自动传送***
CN110304300B (zh) * 2019-07-10 2021-05-04 绍兴市越森木业有限公司 一种上模具和下模具组合的成品打包装置
US11772838B1 (en) 2019-09-09 2023-10-03 Express Scripts Strategic Development, Inc. Systems and methods for pharmaceutical container processing
CN116472121A (zh) * 2021-01-12 2023-07-21 Abb瑞士股份有限公司 生产线、小车及加工方法
CN114777490B (zh) * 2022-06-21 2022-09-09 上海陛通半导体能源科技股份有限公司 可实现自动全向开合的半导体设备

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115351543A (zh) * 2022-09-19 2022-11-18 宁波慧锋自动化科技有限公司 一种密封堵头组件自动装配设备

Also Published As

Publication number Publication date
JP2618210B2 (ja) 1997-06-11
JPH07221170A (ja) 1995-08-18
EP0663686B1 (de) 1997-06-18
KR950024295A (ko) 1995-08-21
DE69403890T2 (de) 1998-01-08
TW306049B (de) 1997-05-21
EP0663686A1 (de) 1995-07-19
US6026561A (en) 2000-02-22
KR0141546B1 (ko) 1998-07-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee