DE69328715D1 - Process for coating a synthetic resin molded body - Google Patents
Process for coating a synthetic resin molded bodyInfo
- Publication number
- DE69328715D1 DE69328715D1 DE69328715T DE69328715T DE69328715D1 DE 69328715 D1 DE69328715 D1 DE 69328715D1 DE 69328715 T DE69328715 T DE 69328715T DE 69328715 T DE69328715 T DE 69328715T DE 69328715 D1 DE69328715 D1 DE 69328715D1
- Authority
- DE
- Germany
- Prior art keywords
- coating
- synthetic resin
- molded body
- resin molded
- synthetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35743092A JPH06192842A (en) | 1992-12-24 | 1992-12-24 | Method for coating resin formed article |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69328715D1 true DE69328715D1 (en) | 2000-06-29 |
DE69328715T2 DE69328715T2 (en) | 2000-11-30 |
Family
ID=18454086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1993628715 Expired - Fee Related DE69328715T2 (en) | 1992-12-24 | 1993-12-17 | Process for coating a synthetic resin molded body |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0604131B1 (en) |
JP (1) | JPH06192842A (en) |
DE (1) | DE69328715T2 (en) |
ES (1) | ES2146220T3 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000015695A1 (en) * | 1998-09-14 | 2000-03-23 | H.B. Fuller Licensing & Financing, Inc. | Primer composition and method of use thereof |
DE10053681B4 (en) * | 2000-10-28 | 2004-08-26 | W.L. Gore & Associates Gmbh | Housing with at least one EMI shielding plastic body or ventilation element and method for producing such a plastic body |
JP4593036B2 (en) * | 2001-09-11 | 2010-12-08 | ダイセルポリマー株式会社 | Plating resin molding |
JP2006152337A (en) * | 2004-11-26 | 2006-06-15 | Okuno Chem Ind Co Ltd | Composition for etching resin molding |
JP4801362B2 (en) * | 2005-03-25 | 2011-10-26 | ダイセル化学工業株式会社 | Manufacturing method of plated resin molding |
JP4617445B2 (en) * | 2005-04-22 | 2011-01-26 | 奥野製薬工業株式会社 | Plating method for resin molding |
KR100856687B1 (en) * | 2007-11-29 | 2008-09-04 | 동진P&I산업(주) | Method of electroless plating for conductor circuit |
KR101258145B1 (en) * | 2013-01-23 | 2013-04-26 | 이도연 | A plating method for polycarbonate resin |
KR101608220B1 (en) * | 2014-01-20 | 2016-04-01 | 주식회사 부광피엘 | Method for metal plating on synthetic resin product |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4349421A (en) * | 1979-09-17 | 1982-09-14 | Allied Corporation | Preparation of metal plated polyamide thermoplastic articles having mirror-like metal finish |
US4552626A (en) * | 1984-11-19 | 1985-11-12 | Michael Landney, Jr. | Metal plating of polyamide thermoplastics |
JPH0723537B2 (en) * | 1986-12-12 | 1995-03-15 | 三菱瓦斯化学株式会社 | Method for plating polyamide resin |
JPH0238578A (en) * | 1988-07-27 | 1990-02-07 | Kizai Kk | Surface treatment of polyphenylene oxide/polyamide alloy resin molded product |
JPH04225869A (en) * | 1990-12-26 | 1992-08-14 | Art Kogyo Kk | Electrostatic coating method of non-electrolytic plating plastic molded article |
JPH06190333A (en) * | 1992-12-24 | 1994-07-12 | Nippon G Ii Plast Kk | Method for coating or resin molding |
-
1992
- 1992-12-24 JP JP35743092A patent/JPH06192842A/en active Pending
-
1993
- 1993-12-17 DE DE1993628715 patent/DE69328715T2/en not_active Expired - Fee Related
- 1993-12-17 ES ES93310217T patent/ES2146220T3/en not_active Expired - Lifetime
- 1993-12-17 EP EP93310217A patent/EP0604131B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0604131B1 (en) | 2000-05-24 |
JPH06192842A (en) | 1994-07-12 |
EP0604131A2 (en) | 1994-06-29 |
ES2146220T3 (en) | 2000-08-01 |
DE69328715T2 (en) | 2000-11-30 |
EP0604131A3 (en) | 1995-12-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |