DE69326609T2 - Testsondenanordnung mit Knicknadeln - Google Patents

Testsondenanordnung mit Knicknadeln

Info

Publication number
DE69326609T2
DE69326609T2 DE69326609T DE69326609T DE69326609T2 DE 69326609 T2 DE69326609 T2 DE 69326609T2 DE 69326609 T DE69326609 T DE 69326609T DE 69326609 T DE69326609 T DE 69326609T DE 69326609 T2 DE69326609 T2 DE 69326609T2
Authority
DE
Germany
Prior art keywords
articulation
needles
test probe
probe arrangement
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69326609T
Other languages
English (en)
Other versions
DE69326609D1 (de
Inventor
Wolfram Brandt
Bernd Marquart
Roland R Stoehr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69326609D1 publication Critical patent/DE69326609D1/de
Publication of DE69326609T2 publication Critical patent/DE69326609T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
DE69326609T 1993-07-23 1993-07-23 Testsondenanordnung mit Knicknadeln Expired - Fee Related DE69326609T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP93111786A EP0635723B1 (de) 1993-07-23 1993-07-23 Testsondenanordnung mit Knicknadeln

Publications (2)

Publication Number Publication Date
DE69326609D1 DE69326609D1 (de) 1999-11-04
DE69326609T2 true DE69326609T2 (de) 2000-04-27

Family

ID=8213101

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69326609T Expired - Fee Related DE69326609T2 (de) 1993-07-23 1993-07-23 Testsondenanordnung mit Knicknadeln

Country Status (4)

Country Link
US (1) US5488314A (de)
EP (1) EP0635723B1 (de)
JP (1) JP2568046B2 (de)
DE (1) DE69326609T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19538792C2 (de) * 1995-10-18 2000-08-03 Ibm Kontaktsonden-Anordnung zum elektrischen Verbinden einer Prüfeinrichtung mit den kreisförmigen Anschlußflächen eines Prüflings
FR2748813B1 (fr) * 1996-05-14 1998-07-10 Chasserieau Claude Dispositif de test, notamment d'un composant electronique a multicontacts
DE19625493C1 (de) * 1996-06-26 1997-11-20 Ibm Kontaktsonden-Anordnung für den elektronischen Funktionstest
US5977787A (en) * 1997-06-16 1999-11-02 International Business Machines Corporation Large area multiple-chip probe assembly and method of making the same
US6023171A (en) * 1997-08-13 2000-02-08 International Business Machines Corporation Dual-contact probe tip for flying probe tester
US6724203B1 (en) * 1997-10-30 2004-04-20 International Business Machines Corporation Full wafer test configuration using memory metals
US6411112B1 (en) * 1998-02-19 2002-06-25 International Business Machines Corporation Off-axis contact tip and dense packing design for a fine pitch probe
US6429672B2 (en) * 1998-06-30 2002-08-06 International Business Machines Corporation Contamination-tolerant electrical test probe
JP4124520B2 (ja) * 1998-07-30 2008-07-23 日本発条株式会社 導電性接触子のホルダ及びその製造方法
US6243655B1 (en) * 1998-08-05 2001-06-05 International Business Machines Corporation Circuit trace probe and method
US6297657B1 (en) * 1999-01-11 2001-10-02 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6424164B1 (en) * 2000-06-13 2002-07-23 Kulicke & Soffa Investment, Inc. Probe apparatus having removable beam probes
US6650133B1 (en) 2000-10-25 2003-11-18 Intel Corporation Method and apparatus for buckling beam testing
DE10057457A1 (de) * 2000-11-20 2002-05-23 Test Plus Electronic Gmbh Testadapter zum Testen einer Leiterplatine
US6788085B2 (en) 2001-07-11 2004-09-07 International Business Machines Corporation Self-aligning wafer burn-in probe
CN100535676C (zh) * 2005-04-21 2009-09-02 株式会社光阳科技 检查夹具及检查装置
JP2007322179A (ja) * 2006-05-30 2007-12-13 Nidec-Read Corp 基板検査用治具及びこの治具を備える基板検査装置
KR101649521B1 (ko) * 2011-05-13 2016-08-22 리노공업주식회사 프로브 및 그 제조방법
JP6706079B2 (ja) * 2016-01-18 2020-06-03 新光電気工業株式会社 プローブガイド板及びプローブ装置とそれらの製造方法
IT201800021253A1 (it) * 2018-12-27 2020-06-27 Technoprobe Spa Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3273554D1 (en) * 1981-06-30 1986-11-06 Ibm Contact probe assembly for integrated circuits
EP0233511A1 (de) * 1986-01-27 1987-08-26 Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung Prüfeinrichtung zur Wafer-Prüfung
US4816754A (en) * 1986-04-29 1989-03-28 International Business Machines Corporation Contactor and probe assembly for electrical test apparatus
EP0283545B1 (de) * 1987-03-27 1991-10-16 Ibm Deutschland Gmbh Kontaktsonden-Anordnung zur elektrischen Verbindung einer Prüfeinrichtung mit den kreisförmigen Anschlussflächen eines Prüflings
US4901013A (en) * 1988-08-19 1990-02-13 American Telephone And Telegraph Company, At&T Bell Laboratories Apparatus having a buckling beam probe assembly
JPH02281165A (ja) * 1989-04-21 1990-11-16 Tokyo Electron Ltd 半導体検査装置
DE4012839B4 (de) * 1989-04-26 2004-02-26 Atg Test Systems Gmbh & Co.Kg Verfahren und Prüfvorrichtung zum Prüfen von elektrischen oder elektronischen Prüflingen
US5066907A (en) * 1990-02-06 1991-11-19 Cerprobe Corporation Probe system for device and circuit testing
US5175496A (en) * 1990-08-31 1992-12-29 Cray Research, Inc. Dual contact beam assembly for an IC test fixture

Also Published As

Publication number Publication date
JPH0758169A (ja) 1995-03-03
EP0635723B1 (de) 1999-09-29
US5488314A (en) 1996-01-30
EP0635723A1 (de) 1995-01-25
JP2568046B2 (ja) 1996-12-25
DE69326609D1 (de) 1999-11-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee